HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
TEAC DW-224E-V83/-V93 CD-RW/DVD-ROM DRIVE HARDWARE SPECIFICATION (PRELIMINARY)

Pre-Rev. B

35 sheets in Total

8084pb

Copyright 2007 TEAC Corporation, All rights reserved.
TABLE OF CONTENTS Title Page 1. SCOPE..... 1 2. OUTLINE..... 1 3. CONSTRUCTION.... 2 3.1 External Construction.... 2 3.2 Installation..... 4 4. DISC SPECIFICATION.... 5 4.1 Applicable Disc Format.... 5 4.2 Rotational Speed.... 5 4.3 Data Capacity.... 6 4.4 Write methods.... 6 4.5 Readable disc.... 6 4.6 Recordable Disc (Recording Speed)... 6 5. PERFORMANCE.... 7 5.1 Operating Performance.... 7 5.2 Audio.... 7 5.3 Acoustic Noise..... 7 6. ENVIRONMENTAL CONDITIONS.... 8 7. RELIABILITY.... 9 8. SAFETY STANDARDS.... 9 9. FRONT INDICATOR.... 9 10. DRIVE CONFIGURATION.... 9 11. INTERFACE CONNECTOR.... 11 12. AUDIO INTERFACE.... 12 13. POWER INTERFACE.... 12 14. IDE HARDWARE INTERFACE.... 13 14.1 Outline..... 13 14.2 Electrical Characteristics.... 13 14.3 Input/Output Signals.... 14 14.4 Interface Timing.... 15 14.5 COMMAND SET..... 27 14.5.1 ATA COMMAND.... 27 14.5.2 ATAPI COMMAND... 28 15. POWER MANAGEMENT SPECIFICATION... 30 15.1 Power Management Modes.... 30 15.1.1 Transition in power management mode.. 30 15.2 Active Mode.... 31 15.3 Idle Mode.... 31 15.4 Standby Mode.... 32 15.5 Sleep Mode.... 32 15.5.1 Tray ejection/insertion in the sleep mode... 32 16. OTHERS..... 32 16.1 Using the Lens Cleaner.... 32 16.2 RoHS Compliance.... 32 16.3 Safety of Laser Products... 33

1. SCOPE

This is hardware specification of the TEAC DW-224E-V83/-V93 built-in type CD-RW/DVD-ROM drive (hereinafter referred to as drive). As for the software specification, refer to "DW-224E-V Software Specification".

2. OUTLINE

The outline of this drive is given in Table 2-1. (Table 2-1) Outline of the specification Model name TEAC P/N Applicable safety standards Data transfer rate (burst) Average access time Disc speed (24X CAV speed mode) Host interface IDE input/output signal Power source Starting time Readable discs CD DVD Recordable disc Applicable format DW-224E-V83 1977098V83 UL, CSA, TV, CE 33.3MBytes/sec max DW-224E-V93 1977098V93
90msec (CD-ROM)/110msec (DVD-ROM), average by TEAC standards 5,090min-1 (Approx) IDE (ATAPI) CSEL CSEL +5VDC 19sec max CD-DA, CD-ROM, CD-R, CD-RW DVD-ROM, DVD-R, DVD-R DL, DVD-RW, DVD+R, DVD+R DL, DVD+RW, DVD-RAM CD-R, CD-RW (Refer to item 4.6) CD-DA, CD-ROM (Mode1, Mode2) CD-ROM XA Mode2 (Form1, Form2), Photo CD (Single/Multi-session) CD-i, Video-CD, CD-Extra (CD-Plus), CD-Text DVD-ROM, DVD-Video, DVD-R (Single/Multi-border) DVD-R DL (Single/Multi-border), DVD-RW (Single/Multi-border) DVD+R (Single/Multi-session), DVD+R DL (Single/Multi-session) DVD+RW (Single/Multi-session), DVD-RAM (4.7GB, 2.6GB) Disc at once, Session at once, Packet write, Track at once Black Black Green Class 1 laser product Complies with

CD DVD

Write methods Front bezel Eject button Access indicator Laser class RoHS directive

3. CONSTRUCTION

3.1 External Construction (1) Dimensions (a) Height : 12.7mm (excluding the front bezel) (b) Width : 128mm (excluding the front bezel) (c) Depth : 129.4mm (excluding the eject button) (2) Mass : 178g or less (3) Disc clamp system : Ball clamp (4) Loading : Manual loading using the tray (5) Ejection (a) Manual eject using the eject button (b) Automatically eject using the command (c) Eject distance : 10mm or more (6) External view : Refer to Fig. 3.1-1.

( 0.4 ) (Unit : mm) (Fig. 3.1-1) External view of the drive
3.2 Installation (1) Installation direction (2) Tilt (3) Installation method
: Refer to Fig. 3.2-1 : Refer to Fig. 3.2-1 below. : The fixing holes in the side of the unit are used. Separate discussions and arrangements are required when the installation holes are not used. 30 or less 30 or less 30 or less

30 or less

0 or less
30 or less 30 or less 30 or less
0 or less 30 or less 30 or less
(Fig. 3.2-1) Tilt of the drive

4. DISC SPECIFICATION

4.1 Applicable Disc Format
(Table 4.1-1) Applicable disc format CD CD-DA CD-ROM (Mode1, Mode2) CD-ROM XA Mode2 (Form1, Form2) Photo CD (Single/Multi-session) CD-i Video-CD CD-Extra (CD-Plus) CD-Text DVD-ROM DVD-Video DVD-R (Single/Multi-border) DVD-R DL (Single/Multi-border) DVD-RW(Single/Multi-border) DVD+R (Single/Multi-session) DVD+R DL (Single/Multi-session) DVD+RW (Single/Multi-session) DVD-RAM (4.7GB, 2.6GB)
4.2 Rotational Speed Refer to Table 4.2-1 for the rotational speed.
(Table 4.2-1) Rotational speed (read mode) Read speed/Disc speed Idle mode (DVD) 4x CAV 2,297rpm Idle mode (CD) 10x CAV 2,140rpm Read (DVD-ROM) 8x CAV 4,594rpm Read (DVD-Video) 4x CAV 2,297rpm Read (CD-ROM Model) 24x CAV 5,137rpm Read (DVD-RAM, 4.7GB) 5x CAV 3,246rpm Read (DVD-RAM, 2.6GB) 2.5x CAV 1,626rpm Read (CD-ROM Mode2form2) 20x CAV 4,280rpm Read (CD-DA) 20x CAV 4,280rpm Play Audio 4x CLV 856 - 1,984rpm Read (Mixed, CD-ROM Model and Mode2form2 or CD-DA) 20x CAV 4,280rpm Read (Mixed, DVD-ROM and DVD-Video) 8x CAV 4,594rpm Read (CD-RW) 24x CAV 5,137rpm Read (DVD-R, DVD-RW, DVD+R, DVD+RW) 8x CAV 4,594rpm Operation/Disc format
(Table 4.2-2) Rotational speed (write mode) Disc Read speed/ Disc speed 24x CAV 5,137rpm 16x CAV 3,425rpm 10x CLV 2,140 - 4,954rpm 4x CLV 856 - 1,984rpm 4x CLV 856 - 1,984rpm 10x CLV 2,140 - 4,954rpm 10x CAV 2,140rpm 4x CLV 856 - 1,984rpm 24x CAV 5,137rpm 10x CLV 2,140 - 4,954rpm

Multi speed High speed

Ultra speed
4.3 Data Capacity 650MB/700MB
738MB/795MB 74min/79min 4.7GB/side 8.5GB/side 2.6GB/side
CD-ROM Mode1 CD-ROM XA Mode2 Form1 CD-ROM XA Mode2 Form2 CD-DA DVD-ROM, DVD-Video, DVD-R, DVD-RW, DVD-RAM, DVD+R, DVD+RW : DVD-ROM, DVD-Video DL : DVD-RAM

: : : : :

4.4 Write methods Disc at once, Track at once, Session at once, and Packet write 4.5 Readable disc CD-DA, CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-R, DVD-R DL, DVD-RW, DVD+R, DVD+R DL, DVD+RW, DVD-RAM 4.6 Recordable Disc (Recording Speed) Recommended as the recordable disc to be used in this drive is a 79-minute disc for 8x speed manufactured by Taiyo Yuden Co., Ltd. (TEAC Part No.: T0006613, CD-R80-BULK). The use of other recordable discs is conditional on mutual understanding between TEAC and specific users. With the recommended type of discs, the following speeds of recording are available: 4x speed, 10x speed, 16x speed and 24x speed

5. PERFORMANCE

5.1 Operating Performance (1) Average random access time : 90msec average (CD-ROM, 24x), 110msec average (DVD-ROM, 8x) (2) Disc speed : Refer to 4.2 (3) Data transfer rate (a) Read sustained : 1,545 to 3,600kB/sec (CD-ROM model) 4,469 to 10,816kB/sec (DVD-ROM) (b) Programmed I/O : 16.7MB/sec max (Mode 0 to 4) (c) Multi-word DMA : 16.7MB/sec max (Mode 0 to 2) (d) Ultra DMA : 33.3MB/sec max (4) Starting time (a) When power is switched on/when disc is loaded : 19sec max (excluding the multi-session CD) (b) Return time from the standby mode : 4sec or less (5) Data buffer capacity : 2MB 5.2 Audio (1) Line output The following specifications apply during audio play. (a) Number of channels : 2 channels (stereo) (b) Frequency response : 20 to 20kHz (3dB) (c) Dynamic range : 83dB or more (IHF A, 1kHz, LPF 20kHz) (d) S/N : 85dB or more (IHF A, 1kHz, LPF 20kHz) (e) Distortion factor : 0.05% or less (1kHz, 20kHz LPF) (f) Channel separation : 70dB or more (1kHz, 20kHz LPF) (g) Output level : 0.8Vrms 3dB (load = 47k ATT = 0dB) (h) Muting : each channel independent (using the ATAPI command) (i) Volume : Software volume using the ATAPI command; 255 steps from volume level 0 to (infinity) dB; variable for each channel independently. 5.3 Acoustic Noise (1) Operating (2) Ejecting
: 45dBA or less (during seek/read/write/Active/Idle, distance 0.5m) : 65dBA or less (distance 0.5m)
6. ENVIRONMENTAL CONDITIONS
The environmental conditions as specified here do not include the environmental conditions of the disc. The environmental conditions of the disc should follow the specifications of the applicable disc. (1) Ambient temperature (a) During operation : 5 to 45C (Surface temperature on the top cover; 5 to 50C) (b) During non-operation : 20 to 60C (c) During transportation (packaged) : 40 to 65C (2) Temperature gradient (a) During operation : 11C/hour or less (noncondensing) (b) During non-operation/transportation : 20C/hour or less (noncondensing) (3) Relative humidity (a) During operation : 8 to 80% (noncondensing) provided that the maximum wet-bulb temperature is 29.4C or less. (b) During non-operation/transportation : 5 to 95% (noncondensing) provided that the maximum wet-bulb temperature is 29.4C or less. (c) During transportation (packaged) : 5 to 95% (noncondensing) provided that the maximum wet-bulb temperature is 29.4C or less. (4) Vibrations (a) During operation: When installed horizontally: 2.9m/s2 (0.3G) or less When installed vertically : 1.96m/s2 (0.2G) or less provided that the sweep frequency is 5 to 500Hz and sweep rate, 1oct/min. excepting recording mode. (b) Transportation (packaged) : 19.6m/s2 (2G) or less provided that the sweep frequency is 5 to 500Hz and sweep rate, 1oct/min. (5) Shock (a) During operation (free from malfunction) When installed horizontally: 68.6m/s2 (7G) or less (half-sine shock pulse; 11msec, intervals; 10sec) When installed vertically : 49m/s2 (5G) or less (half-sine shock pulse; 11msec, intervals; 10sec) excepting recording mode and CD-DA play mode. (b) During operation (while the CD-DA is playing) : 19.6m/s2 (2G) or less (half-sine shock pulse; 11msec., intervals; 10sec) (c) During non-operation/transportation : 588m/s2 (60G) or less (half-sine shock pulse; 11msec) 1,960m/s2 (200G) or less (half-sine shock pulse; 2msec) However, tray ejection is allowed. (6) Dust : office environment (7) Cooling : natural air cooling

7. RELIABILITY

(1) Mean time between failures (MTBF) : 60,000POH or more (the frequency of use should be 10% at normal temperature and humidity) (2) Mean time to repair (MTTR) : 30minutes (3) Loading/ejecting life : 10,000times or more (4) Power ON/OFF life : 60,000 times or more (5) Laser diode life : MTTF 9,000 hours (Duty 50% pulse 83mW, 60C) (6) Seeking life : times or more (random access, 25C, duty; 20% or less) (7) Error rate (a) Read error rate DVD : Once per 1012 bits or less CD : MODE 1 and MODE 2 (FORM 1) : Once per 1012 bits or less MODE 2 (FORM 2) and CDDA : Once per 109 bits or less (b) Seek error rate : Once per 106 seeks or less (c) Seek error rate : Once per 106 seeks or less (8) Self-diagnosis (a) When power is switched ON: Various controllers, ROM, RAM, buffer, ECC circuit, etc. (b) When disc is inserted : Servo circuit, signal processors, etc.

8. SAFETY STANDARDS

The drive complies with the following safety standards: (1) UL standard (2) CSA standard (3) TV standard (4) CE standard

9. FRONT INDICATOR

(1) Location : Refer to Fig. 3.1-1. (2) Color : Green (3) Lighting conditions (a) Continuous on During seek Transfer of the read data to the host is under way. (b) Flashing with a period of 3 second (Duty 50%) During write While audio is being played (c) Flashing with a period of 1 second (Duty 50%) From POR or tray loading to the end of TOC read (when the disc is present) From POR or tray loading to the end of detecting the disc (when the disc is not present). If an error which is considered to arise from the disc occurs, flashing continues until the disc is ejected. If an error which seems to rest with the drives hardware, flashing continues until the power is switched OFF.

10. DRIVE CONFIGURATION

The setting to master or slave is determined by the CSEL signal (interface connector 47 pin). DV-224E-V83: If the signal is at low level, the drive is set to the master, and if it is open or at high level, it is set to the
slave. DV-224E-V93: If the signal is at low level, the drive is set to the slave, and if it is open or at high level, it is set to the master.

11. INTERFACE CONNECTOR

(1) Connector on the drive : JAE KX15-50KLDLE or equivalent (2) Applicable connector on the host : JAE KX14-50K5D1 or equivalent (3) Pin assignment : Refer to Table 11-1, Fig. 11-1. (Table 11-1) Interface connector pin assignment No. SIGNAL 1 LOUT 3 AGND 5 RESET 7 DDDDDDDDDDDDDDDDGROUND 25 DIOW (STOP) 27 IORDY (DDMARDY/DSTROBE) 29 INTRQ 31 DADACSDASP 39 +5V 41 +5V 43 GROUND 45 GROUND 47 CSEL 49 RESERVED No. SIGNAL 2 ROUT 4 N.C 6 DDDDDDDDDDDDDDDDDMARQ 24 DIOR (HDMARDY/HSTROBE) 26 GROUND 28 DMACK 30 IOCSPDIAG (CBLID) 34 DACS+5V 40 +5V 42 +5V 44 GROUND 46 GROUND 48 GROUND 50 RESERVED

Pin No. 1

Pin No. 50 (Fig. 11-1) Interface connector assignment

12. AUDIO INTERFACE

(1) LOUT : Line output of the left channel (unbalanced) (2) ROUT : Line output of the right channel (unbalanced) (3) AGND : Ground of audio line output. For the electrical specification of the line output, refer to 5.2.

13. POWER INTERFACE

The following specifications apply to the interface connector terminals of the drive. The power should be supplied from a power supply unit with reinforced insulation or double insulation. (1) Allowable supply voltage range : +5VDC 5% (4.75 to 5.25V) There should be no abnormal operations by DC +5V 10%. (2) Allowable ripple voltage : 100mVp-p or less, 50 to 20MHz (including the spike noise) (3) Current consumption : Refer to Table 13-1. (Table 13-1) Current consumption Mode Standby/Sleep Write 24x Active Random access (Duty 100%) During starting/seek During eject Average current max (A) 0.025 1.0 0.9 1.2 Peak current max (A)

1.5 1.5 1.5

Remarks: 1. The supply voltage should be 5V+5%. 2. For each of the sleep, standby, and active modes, refer to "15. POWER MANAGEMENT SPECIFICATION". 3. Does not include pulse-like current below 1msec.
14. IDE HARDWARE INTERFACE
14.1 Outline (1) Applicable standard ANSI standard SFFC
: X3T13/1321D (ATA-5) : SFF-8020i Rev. 2.6 and SFF-8090v3
14.2 Electrical Characteristics The following specifications apply to the interface connector terminal for the IDE signal of the drive. The input signals refer to the signals input to the drive whereas the output signals refer to the signals output from the drive.
(1) Tri-state input/output signals (DD0 to DD15, PDIAG) (a) Input signal level Low level : 0 to 0.8VDC High level : 2.0 to 5.25VDC Hysteresis : possessed Maximum input current : 25A (b) Output signal level Low level : 0 to 0.4VDC (output sink current 12mA) High level : 2.7 to 3.3VDC (output source current 1mA) Maximum output current at high impedance : 25A (c) Termination (DD0 to DD15) Pull-up resistance : Not equipped Series resistance : 33 (d) Termination (PDIAG) Pull-up resistance : 10k Series resistance : 0 (2) Open drain input/output signals (DASP) (a) Input signal level Low level : 0 to 0.8VDC High level : 2.0 to 5.25VDC Hysteresis : possessed Maximum input current : 25A (excluding the pull-up resistance) (b) Output signal level Low level : 0 to 0.4VDC (output sink current 12mA) Maximum output current at high impedance : 25A (c) Termination Pull-up resistance : 10k Series resistance : 0 (3) Tri-state output signals (DMARQ, INTRQ, IORDY) Low level : 0 to 0.4VDC (output sink current 12mA) High level : 2.7 to 3.3VDC (output source current 1mA) Maximum output current at high impedance : 25A Series resistance : 22

(4) Open-drain output signals ( IOCS16) Low level : 0 to 0.4VDC (output sink current 12mA) Maximum output current at high impedance : 25A (5) Input signals (RESET, DIOW, DIOR, CSEL, DMACK, DA0 to DA2, CS0, CS1) (a) Input signal level Low level : 0 to 0.8VDC High level : 2.0 to 5.25VDC Hysteresis (excluding RESET, CSEL) : possessed Maximum input current : 25A (excluding the pull-up resistance) Pull-up resistance RESET : 10k CSEL : 47k Series resistance (RESET, DIOW, DIOR, DMACK, DA0 to DA2, CS0, CS1) : 82
14.3 Input/Output Signals Refer to Table 14.3-1. Among the following signals, the input signal refers to the signal input to the drive and the output signal refers to the signal output from the drive and the input/output signal refers to the bidirectional signal.
(Table 14.3-1) IDE Interface signal summary (Sheet 1 of 2) Signal CSEL CS0 CS1 DD0 DD1 DD2 DD3 DD4 DD5 DD6 DD7 DD8 DD9 DD10 DD11 DD12 DD13 DD14 DD15 DASP Description Cable select Chip select0 Chip select1 Data bus bit 0 Data bus bit 1 Data bus bit 2 Data bus bit 3 Data bus bit 4 Data bus bit 5 Data bus bit 6 Data bus bit 7 Data bus bit 8 Data bus bit 9 Data bus bit 10 Data bus bit 11 Data bus bit 12 Data bus bit 13 Data bus bit 14 Data bus bit 15 Device active/Slave present Direction IN IN IN IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT IN/OUT
(Table 14.3-1) IDE Interface signal summary (Sheet 2 of 2) Signal DA0 DA1 DA2 DMACK DMARQ INTRQ IOCS16 Description Device address bit 0 Device address bit 1 Device address bit 2 DMA acknowledge DMA request Interupt request Drive 16 bit I/O Direction IN IN IN IN OUT OUT OUT IN IN IN
IOR I/O read HDMARDY DMA ready during Ultra DMA data in bursts HSTROBE Data strobe during Ultra DMA data out bursts
IORDY I/O ready OUT DDMARDY DMA ready during Ultra DMA data out bursts OUT DSTROBE Data strobe during Ultra DMA data in bursts OUT DIOW STOP PDIAG CBLID RESET I/O write Stop during Ultra DMA data bursts Passed diagnostics Cable assembly type identifier Reset IN IN IN/OUT IN
14.4 Interface Timing The following specifications all apply to the signal interface connector terminal of the drive. In timing description, H indicates high level (false) and L low level (true). (1) Reset timing (master/slave) : Fig. 14.4-1 (2) Reset timing (slave) : Fig. 14.4-2 (3) PIO write cycle timing : Fig. 14.4-3 (4) PIO read cycle timing : Fig. 14.4-4 (5) DMA single word transfer timing : Fig. 14.4-5 (6) DMA multi word transfer timing : Fig. 14.4-6 (7) Ultra DMA transfer timing (Data in burst) : Fig. 14.4-7 (8) Ultra DMA transfer timing (Data out burst) : Fig. 14.4-8

RESET DASP PDIAG

H L H L H L Item Min 25 Typ Max Unit s t1
Symbol t1 HRST pulse width
(Fig. 14.4-1) Reset timing (master)

H L H L H L

Symbol Item t2 DASP assert time t4 PDIAG assert start

Typ 70 0.2

Max 400 30

Unit ms s

(Fig. 14.4-2) Reset timing (slave)
H CS0, CS1 DA0 ~ DA2 L DIOW IORDY H L H L

t6 t10 t11 t12

t7 t14

H DD0 ~ DD15 L

Symbol t5 t6 t7 t8 t9 t10 t11 t12 t14
Item Address setup time IOW pulse width Address hold time IOW interactive pulse width IORDY delay time IORDY pulse width Write data setup time Write data hold time Write cycle time

Min 10 25

35 1,10 120
Unit ns ns ns ns ns ns ns ns ns
(Fig. 14.4-3) PIO write cycle timing
H CS0, CS1 DA0 ~ DA2 L DIOR IORDY H L H L

t15 t19

t16 t20 t22

t17 t24

Symbol t15 t16 t17 t18 t19 t20 t22 t24
Item Address setup time DIOR pulse width Address hold time DIOR interactive pulse width IORDY delay time IORDY pulse width Read data hold time Read cycle time

Min 120

35 1,250
Unit ns ns ns ns ns ns ns ns
(Fig. 14.4-4) PIO read cycle timing
DMARQ DMACK DIOW DD0 ~ DD15 DIOR DD0 ~ DD15

H L H L H L H L H L H L

t26 t27 t28 t30

t34 t36

Symbol t26 t27 t28 t30 t31 t32 t33 t34 t36
Item From DMACK assert to DMAREQ negate From DMACK assert to DIOW low DIOW, DIOR pulse width Write data setup time Write data hold time Read data delay time Read data hold time From DIOW, DIOR high to DMACK negate Cycle time

Min 35 20

Max 80
(Fig. 14.4-5) DMA single word transfer timing

DMARQ DMACK DIOW

H L H L H L t48

t45 t38 t39 t40 t46

H DD0 ~ DD15 L DIOR DD0 ~ DD15 H L H L

t41 t42

Symbol t38 t39 t40 t41 t42 t43 t44 t45 t46 t48 t49
Item From DMACK assert to DIOW low DIOW, DIOR pulse width DIOW, DIOR interactive pulse width Write data setup time Write data hold time Read data delay time Read data hold time From DIOW, DIOR low to DMARQ negate From DIOW, DIOR high to DMACK negate Write cycle time Read cycle time

Min 10 5

Unit ns ns ns ns ns ns ns ns ns ns ns
(Fig. 14.4-6) DMA multi word transfer timing
Initiating an Ultra DMA data in burst DMARQ (device) DMACK (host) STOP (host) HDMARDY (host) DSTROBE (device) DD(15:0) (device) H L H L
t51 t52 t50 t53 t56 t53 t56

H L H L H L H L

t51 t52

t54 t55 t51 t51 t57 t58

DA0, DA1, DA2 H L (host) CS0, CS1 (host) H L
Sustained Ultra DMA data in burst

t60 t59 t59

DSTROBE (device) DD(15:0) (device)

H L H L

t60 t57 t58
Host pausing an Ultra DMA data in burst DMARQ (device) DMACK (host) STOP (host) HDMARDY (host) DSTROBE (device) DD(15:0) (device) H L H L H L H L H L H L (Fig. 14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 1 of 3)

t61 t62

Device terminating an Ultra DMA data in burst DMARQ (device) DMACK (host) STOP (host) HDMARDY (host) DSTROBE (device) H L H L

t64 t64

t63 t51 t51 t65
t67 t55 t68 CRC t51 t51 t69

DD(15:0) (device)

Host terminating an Ultra DMA data in burst DMARQ (device) DMACK (host) STOP (host) HDMARDY (host) DSTROBE (device) DD(15:0) (device) H L H L H L H L H L

t68 t69 t65

t64 t67

t51 t51

CRC t51 t51
(Fig.14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 2 of 3)
Symbol Item t50 Unlimited interlock time t51 Setup time/Hold time (to DMACK ) t52 Envelope time (DMACK to STOP/ HDMARDY ) t53 DSTROSE negate start time (STOP/HDMARDY to DSTROBE ) t54 DSTROBE drive delay time (to DMACK ) t55 Output data, release delay time (to DMACK ) t56 Output data, drive start time (to STOP / HDMARDY ) t57 Valid data, setup time (to DSTROBE edge) t58 Valid data, hold time (to DSTROBE edge) t59 DSTROBE cycle time Mode 2 Mode 1 Mode 0 t60 DSTROBE x 2-cycle time Mode 2 Mode 1 Mode 0 DSTROBE Average x 2-cycle time Mode 2 Mode 1 Mode 0 t61 DSTROBE stop shift time (DSTROBE Mode 2 edge to HDMARDY ) Mode 1 Mode 0 t62 Final DSTROBE stop time (to HDMARDY ) t63 DSTROBE to DMACK delay time t64 Limited interlock time t65 DSTROBE release time (to DMACK ) t66 DSTROBE edge to HDMARQ delay time t67 HDMARQ to CRC data output delay time t68 Data setup time (to DMACK ) t69 Data hold time (to DMACK )

70 170

Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
(Fig.14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 3 of 3)
Initiating an Ultra DMA data out burst DMARQ (device) DMACK (host) STOP (host) DDMARDY (device) HSTROBE (host) DD(15:0) (host) H L H L H L

t73 t74 t70

t70 t71 t72

t75 t71 t71

Sustained Ultra DMA data out burst

t78 t77 t77 t78 t75 t76

HSTROBE (host) DD(15:0) (host)

t75 t76

Device pausing an Ultra DMA data out burst DMARQ (device) DMACK (host) STOP (host) DDMARDY (device) HSTROBE (host) DD(15:0) (host) H L H L H L H L H L H L (Fig. 14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 1 of 3)

t79 t80

Host terminating an Ultra DMA data out burst
DMARQ (device) DMACK (host) STOP (host) DDMARDY (device) HSTROBE (host) DD(15:0) (host)

t74 t83 t74

t81 t71 t82

t75 CRC

DA0, DA1, DA2 H L (host) H CS0, CS1 L (host) Device terminating an Ultra DMA data DMARQ (device) DMACK (host) STOP (host) DDMARDY (device) HSTROBE (host) DD(15:0) (host) H L H L H L H L H L H L

t74 t80 t74 t81 t81 t82

t71 t71
(Fig.14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 2 of 3)
Symbol t70 t71 t72 t73 t74 t75 t76 t77

t80 t81 t82 t83

Item Unlimited interlock time Setup time/Hold time (to DMACK ) Envelope time(DMACK to STOP ) DDMARDY drive delay time (to DMACK ) Limited interlock time Data setup time (to HSTROBE edge/to DMACK ) Data hold time (to HSTORE edge/ to DMACK ) HSTORE cycle time Mode 2 Mode 1 Mode 0 HSTROBE x 2-cycle time Mode 2 Mode 1 Mode 0 HSTROBE Average x 2-cycle time Mode 2 Mode 1 Mode 0 Receipt stop shift time (HSTROBE edge Mode 2 to DDMARDY ) Mode 1 Mode 0 DDMARDY to DMARQ delay time HSTROBE to DMACK delay time DDMARDY release time (to DMACK ) HSTROBE edge to STOP delay time

Min 160 240

70 150
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
(Fig.14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 3 of 3)

14.5 COMMAND SET

14.5.1 ATA COMMAND Refer to table 14.5.1-1. (Table 14.5.1-1) ATA COMMAND CODE 08 EE3 EA0 A1 EF E6 E2 E0 A2 COMMAND ATAPI SOFT RESET CHECK POWER MODE EXECUTE DRIVE DIAGNOSTIC IDLE IDLE IMMEDIATE NOP ATAPI PKT. ATAPI IDENTIFY DEVICE SET FEATURE SLEEP STANDBY STANDBY IMMEDIATE SERVICE
14.5.2 ATAPI COMMAND Refer to table 14.5.2-1. (Table 14.5.2-1) List of the ATAPI commands (Sheet 1 of 2) CODE A1 5B 04 4A 12 BD 55 5A 4B 45 A49 A9 1E 28 A8 5C 25 BE B01 BA 2B 5D 54 BB 1B 4E 35 COMMAND BLANK CLOSE TRACK/SESSION FORMAT UNIT GET EVENT STATUS NOTIFICATION INQUIRY MECHANISM STATUS MODE SELECT MODE SENSE PAUSE/RESUME PLAY AUDIO (10) PLAY AUDIO (12) PLAY AUDIO MSF PLAY TRACK RELATIVE (10) PLAY TRACK RELATIVE (12) PREVENT/ALLOW MEDIUM REMOVAL READ (10) READ (12) READ BUFFER CAPACITY READ CD/DVD CAPACITY READ CD READ CD MSF READ DISC INFORMATION READ HEADER READ SUB-CHANNEL READ TOC READ TRACK/RZONE INFORMATION REQUEST SENSE RESERVE TRACK REZERO UNIT SCAN SEEK SEND CUE SHEET SEND OPC INFORMATION SET CD-ROM SPEED START/STOP UNIT STOP PLAY/SCAN SYNCHRONIZE CACHE

(Table 14.5.2-1) List of the ATAPI commands (Sheet 2 of 2) CODE 00 2A AA AD 23 A4 A3 AAC A2 COMMAND TEST UNIT READY WRITE (10) WRITE (12) READ DVD STRUCTURE READ FORMATTED CAPACITIES REPORT KEY SEND KEY SET READ AHEAD GET CONFIGURATION GET PERFORMANCE SEND EVENT
15. POWER MANAGEMENT SPECIFICATION
This drive has a power management function to reduce power consumption.
15.1 Power Management Modes The drive has the following four power management modes. The transition between these modes is performed by the timer within the drive or a command issued by the host. Active mode Idle mode Standby mode Sleep mode
15.1.1 Transition in power management mode The transition in the power management mode is shown in Fig. 15.1.1-1. POWER ON (1)

SELF DIAGNOSTIC

DISK PRESENCE ? (2) YES

(3) (9)

ACTIVE MODE (4) (5) IDLE MODE (5) STANDBY MODE (8) TRAY LOADING (7) SLEEP MODE (12) NO (13) (Fig. 15.1.1-1) Transition in power management mode DISK PRESENCE ? YES (10) (11) (6) TRAY EJECT

(1) (2) (3) (4)

When the RESET signal is released, the disc detection is performed after self-diagnostics are completed. If the disc is loaded, the mode will switch to the active mode and starting operation will begin. If the disc is not loaded, the mode will switch to the standby mode. Using the power management command (IDLE, IDLE IMMEDIATE, STANDBY, STANDBY IMMEDIATE, SLEEP), the transition from the active mode to the idle, standby or sleep mode, from the idle mode to the standby or sleep mode, or from the standby mode to the idle or sleep mode is possible. (5) The transition from the active mode to the idle mode or from the idle mode to the standby mode is also performed by the timer the has. The timer will be initialized to the specified value when disc detection operation is under way or when a command which requires disc access is executed. The timer will not be initialized when a command which does not require disc access is executed in the active mode. (6) The resumption from the idle or standby mode to the active mode is initiated when a command which requires disc access is executed. (7) The resumption after the sleep mode is possible only after the RESET signal, the SRST (bit 2 of the DEVICE Control Register) or the ATAPI SOFT RESET command is detected. If resumption after the sleep mode is initiated using the RESET signal, an operation similar to when the power is switched ON occurs. (8) If resumption after the sleep mode is initiated using the SRST or the ATAPI SOFT RESET command, the drive enters the standby mode. (9) Tray ejection in each of the active, idle, standby and sleep modes is possible. (10) If the tray is ejected in the active, idle or standby mode, the drive enters the standby mode when the tray is out or the sleep mode when the tray is ejected in the sleep mode. (11) If the tray is inserted when the tray is out, the disc detection operation is performed. (12) If no disc is loaded, the drive will resume a mode when the tray is out. (13) If the disc is loaded, the drive will resume the active mode. However, the drive resumes the sleep mode following the TOC read only when the tray is ejected in the sleep mode.

15.2 Active Mode A state in which the drive is capable of responding in the shortest possible time to an access using a command, and all the electrical circuitry of the drive, the pickup, spindle motor and sled motor are operating. In the following cases, the drive will enter the active mode: (1) While it is being booted after the power is switched ON and self diagnosis is under way. (2) While the booting operation or Reading of the TOC is under way when the tray is inserted and the disc is loaded. (3) While the booting operation or Reading of the TOC is in progress with the power ON and the disc loaded. (4) While an command that requires disc access is being executed. (5) Until the drive switches over to other power management mode using the timer in the drive or the command after either (2), (3) or (4) above is performed. 15.3 Idle Mode The idle mode has the same operational functions as the active mode. However, the current consumption is reduced by lowering the rotational speed of the spindle motor in the idle mode. The transition to the idle mode comes in the following two ways: (1) When using the timer in the drive: After executing (2), (3) and (4) in 14.2, if the specified time elapses by the timer in the drive, the mode will switch from the active mode to the idle mode. The specified time of the timer is set to 8 seconds. (2) When using the power management command (IDLE, IDLE IMMEDIATE):
The transition from the active or standby mode is possible using the power management command (IDLE, IDLE IMMEDIATE). For details, refer to the Software Specification.
15.4 Standby Mode Except for the functions required for the reception of a command, all other functions are in the power save condition. And although the command can be received, a time is required to restore the functions that are in the power save condition for the command that requires disc access. The transition to the standby mode comes in the following three ways: (1) When using the timer in the drive: After executing (2), (3) and (4) in 15.2, if the specified time elapses by the timer in the drive, the mode will switch from the active to the standby mode via the idle mode. Although the specified time of the timer can be preset using the STANDBY command or MODE SELECT command, it is set to 32 seconds by default. The transition time to the idle mode is included in the preset value of the timer. For details, refer to the Software Specification. The timer will be initialized to the specified value after executing (2), (3) and (4) in 15.2. The timer will not be initialized when a command which does not require disc access is executed in the active mode. (2) When using the power management command (STANDBY, STANDBY IMMEDIATE) or START/ STOP UNIT command: The transition from the active or idle mode is possible using the power management command (STANDBY, STANDBY IMMEDIATE) or START/STOP UNIT command. For details, refer to the Software Specification. (3) When the power is switched ON or a disc is not detected by the disc detection operation while the tray is being retracted, the drive will enter the standby mode. 15.5 Sleep Mode The drive enters a state in which all functions are stopped and no command can be received. The transition to the sleep mode is possible using the SLEEP command. For details, refer to the Software Specification. The resumption from the sleep mode is possible using the RESET signal, the SRST (bit 2 of the Device Control Register) or the ATAPI SOFT RESET command.

15.5.1 Tray ejection/insertion in the sleep mode If the eject button is pressed in sleep mode, the tray will be ejected before sleep mode is entered. If the tray is inserted while in this state, disc detection is performed; If the disc is loaded on the tray, the start-up operation is performed before sleep mode is entered. If the disc is not loaded on the tray, sleep mode is entered.

16. OTHERS

16.1 Using the Lens Cleaner Some commercially available wet-type lens cleaners may sometimes actually make the lens dirtier rather than cleaning it. In general, we recommend that you avoid using a wet-type lens cleaner. Use a dry-type lens cleaner. 16.2 RoHS Compliance The drive complies with European directive "2002/95/EC".
16.3 Safety of Laser Products When selling this unit or a system with this unit to an end user, print the following text in the instruction manual or enclose the separate sheet on which the following text is printed with the instruction manual.
This product has been designed and manufactured according to FDA regulations "title 21. CFR. chapter1, subchapter J. based on the radiation Control for Health and Safety Act of 1968", and is classified as a class 1 laser product. There is no hazardous invisible laser radiation during operation because invisible laser radiation emitted inside of this product is completely confined in the protective housings. The label required in this regulation is shown bellow. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
Optical pickup Type Manufacturer Laser output Wavelength Standard : HOP-6202T : Hitachi Media Electronics Co., Ltd. : Less than 1.4mW (Play) and 75mW (Record) on the objective lens : 777-787nm (CD) 645-664nm (DVD) : IEC60825-1 : 2001

(Fig. 16.3-1)