SuperDVR & WS 401 Series Cards
SUPERDVR & WS 401 USB/SERIES CARDS

CONTENTS

INTRODUCTION.... 7 SUMMARIZATION... 7 SYSTEM REQUIREMENTS... 10 WS 401 SERIES CARDS SYSTEM REQUIREMENTS.. 10 TD 3316 SYSTEM REQUIREMENTS... 11 WS 401 USB CARDS SYSTEM REQUIREMENTS. 12 WS 401 CARD SYSTEM REQUIREMENTS.. 12 SYSTEM SPECIFICATIONS... 13 HARDWARE INSTALLATION... 14 VIDEO CAPTURE CARD HARDWARE... 14 WS 401 Card Hardware.. 14 TD WS 401 Card Hardware... 15 WS 401 Card Hardware.. 16 WS 401 Card Hardware.. 18 TD 3216 Card Hardware... 19 TD 3316 Card Hardware... 20 TD 3101 USB Card Hardware.. 23 WS 401USB Card Hardware... 24 WS 401 Card Hardware.. 25 Alarm Board Hardware... 27 INSTALL VIDEO CAPTURE CARD DRIVER.. 28 MAIN DISPLAY INTERFACE... 33
DISPLAY CONTROL PANEL... 33 LOGIN.... 35 RECORD.... 36 Record Modes.... 36 Record Setup.... 37 Record Status Panel... 38 Manual Record Mode... 39 Sensor Alarm Record Mode... 39 Motion Detection Record Mode.. 39 Schedule Record... 40 Recycling Record.... 40 SYSTEM SETUP.... 41 BASIC CONFIGURATION... 43 VIDEO CONFIGURATION.... 45 MOTION DETECTION CONFIGURATION.. 46 Set Motion Detection Area... 48 Set Motion Detection Sensitivity... 48 SCHEDULE CONFIGURATION... 49 MOTION DETECTION ALARM CONFIGURATION.. 50 Alarm Record... 53 Alarm Output... 54 AUTO MAIL FUNCTION... 55 E-MAP CONFIGURATION.... 58 Edit a map... 58 View the map.... 60 PTZ CONTROL CONFIGURATION... 61 Protocol Setup.... 62 Serial ports setup.... 63
USERS CONFIGURATION... 64 CHANGE USER RIGHTS... 65 Add User.... 66 Delete User... 66 PTZ CONTROL.... 66 RECORD SEARCH AND PLAYING BACK.. 71 RECORD SEARCH.... 73 RECORD PLAYING BACK AND CONTROL... 74 OTHER FUNCTIONS... 80 Record File Backup... 80 Delete Record Files... 81 REMOTE SURVEILLANCE AND PLAYING BACK.. 88 REMOTE LIVE SURVEILLANCE.. 88 Remote Surveillance Client-side Setup.. 89 REMOTE PLAYING BACK... 97 Remote Playing back server Configuration.. 97 Remote playing back Client-side Setup.. 98 Play Control... 107 Remote Record... 108 MOBILE SURVEILLANCE... 108 INTRODUCTION TO MOBILE SURVEILLANCE.. 108 Client Configuration of Symbian 60... 112 APPENDIX 2: FREQUENTLY ASKED QUESTIONS.. 118 APPENDIX 2.1: ABOUT INSTALLATION.. 118 Appendix 2.1.1 Cannot Install the SuperDVR Driver.. 118
Appendix 2.1.2 Why cannot run SuperDVR at the windows 2003 operate system?... 118 Appendix 2.1.3 Unspecified error in the End of Installation. 118 Appendix 2.1.4 Cant find TD series Devices in Device Manager. 119 APPENDIX 2.2 HOW TO USE SUPERDVR.. 119 Appendix 2.2.1 Meanings of the indicator lights.. 119 Appendix 2.2.2 How does the different record mode work?. 119 Appendix 2.2.3 How to set recycling record mode on the system?. 120 Appendix 2.2.4 How to set auto reboot function?. 120 Appendix 2.2.5 How to quickly use the schedule record function?.. 121 Appendix 2.2.6 What are the byte rates for different image qualities from highest to normal?... 121 Appendix 2.2.7 The frame rate seems to be lower than what I set?. 121 Appendix 2.2.8 Why I cant select more channels to backup?. 121 Appendix 2.2.9 When should I select manual Gain Control?. 122 APPENDIX 2.3 HOW TO USE NETWORK FUNCTION.. 122 Appendix 2.3.1 How to monitor on the client-side?.. 122 Appendix 2.3.2 Why I cant download the client-side software?. 122 Appendix 2.3.3 Why cant the server be configure d at the client-side?... 122 Appendix 2.3.5 What should I do if the Internet speed is quite slow?. 123 APPENDIX 2.4 OTHER QUESTIONS.. 124 Appendix 2.4.2 Why I cant find the recorded files?.. 124 Appendix 2.4.3 Why the screens display is uns Table with dithering and water-wave images?... 124 Appendix 2.4.4 Why does it delay to play back, and its slow to close and open the driver?.... 125 Appendix 2.4.5 Why I cant play back?.. 125 Appendix 2.4.6 Why do I see some gray blocks on time progress bar
area when play back?... 125 Appendix 2.4.7 Why do I see some old record sections that cant be covered when play back?... 126 APPENDIX 3 QUICK START FOR USING.. 126 APPENDIX 4 FUNCTION TREE... 130

Introduction

Summarization
Thank you for choosing our digital video capture cards. 1 Channel, 4 Channel, 8 Channel and 16 Channel cards adopt MPEG4 compression format, and enable maximum 16 channels real-time or none real-time surveillance. Our cards are mature and cost-effective products that should be your ideal choices. They enable synchronous audio and video compression and transmission, with their powerful compression rate and network transmission function. They are widely used in banks, intelligent communities, traffic management units, medical systems, educational systems, armed forces and so on. This manual is suitable for SuperDVR 4.3, which supports WS 401 cards. In this manual, you will learn how to install the hardware and driver (software), and how to setup the systems of this range of products. Please make sure your operations with the products are strictly in accordance with the manual, so as to keep the stability of the digital surveillance systems. The following are standard functions of the products: (1) Schedule record mode Users can choose any term in a day to record and set up record modes, i.e. sensor alarm record, motion detection record, manual record, Schedule Record.

technology (19) Remote Surveillance and PTZ control through LAN, Intranet, and Internet. (20) Support alarm pre-record. (21) Support buzzer, email alarm out. (22) Can greatly decrease fragmented files while using NTFS partition. (23) User-friendly graphical user interface.

System Requirements

WS 401 series cards system requirements
Card PC Module CPU Motherboard HDD RAM VGA OS DirectX Intel PIII processorminimum 800MHz Intel 815/845/865/915 series 80G minimum 256M minimum GeForce2GeForce4FX5200ATI Rage128 Windows2000 / XP 9.0 WS 401
Table 1.1 WS 401series cards system requirements Notice, motherboards listed below which has passed the test can work well with WS 401: GIGA: GA-8IRXI (Intel 845D)
GA-8IE2004 (Intel 845E) GA-6OXT (Intel 815EP) GA-8PE800 (Intel 845PE)
GA-8IPE1000-G (Intel 865PE) ASUS: P4S8X (Sis 648) TUSL2-C (Intel 815EP) P4P800 (Intel 865PE) MSI: MS-6566E (Intel 845E) Intel845DDA+ (Intel 845E)
TD 3316 system requirements
Card PC Module CPU Motherboard HDD RAM VGA Intel P4 2.8G minimum Intel 865/915 160G minimum 512M minimum NVIDIA GeForce MX440/FX5200 ATI RADEON 7500/ X300/ X250/ X5518 OS DirectX Windows 2000(SP4 above)/ Windows XP(SP1above) 9.0 WS 401
Table 1.2 WS 401 system requirements Notice, motherboards listed below which has passed the test can work well with WS 401:
Foxconn 865A01Intel 865 Ga-81pe1000-G 865Intel 865 Asus P4p800 865Intel 865 ASUS P5GD1-VM 915Intel 915 MSI 6728 865Intel 865 Abit IS7-E 865Intel 865
ASUS-P4GPL-X 915Intel 915 ASROCK 775I915PL-SATA2 915Intel 915
WS 401 USB cards system requirements
Card PC Module CPU Motherboard HDD RAM VGA OS DirectX USB Intel P4 Celeron processorminimum 1700MHz Intel 845/865/915 series 80G minimum 256M minimum GeForce2GeForce4FX5200ATI Rage128 Windows 2000(SP4 above)/2003(SP1 above)/XP(SP2 above) 9.0 2.0 WS 401
Table 1.3 WS 401 system requirements
WS 401 card system requirements
Card PC Module CPU Motherboard HDD RAM VGA OS DirectX Intel P4 Celeron processor 2.0G minimum Intel 845/865/915 series 80G minimum 256M minimum GeForce MX400ATI 920032M above Windows 2000/2003/XP 9.0 WS 401
Table 1.4 WS 401system requirements
Notice, motherboards listed below which has passed the test can work well with TD 4104:
ASROCK 775I915PL-SATA2 Asus P4p800SE ASUS P5VDC-X GA G8i845GVW-RZ GA-k8vT890 MSI 865PE IWILL i845G Foxconn 865GV

Special Notice: If recorded disk partitions format is FAT32 and the system has run for a long time, the system will create a lot of data fragments that may results in system runs slowly. Its recommended to make disk defragmenter every 10 to 30 days. We strongly suggest that use NTFS format for record disk partition.

System Specifications

Format: PAL/NTSC Resolution: WS 401support 320x240 / 640x480 (NTSC), 352x288 / 704x576 (PAL), TD3316 supports 352240 / 704480 (NTSC), 352x288 / 704x576 (PAL)and TD 4104 supports 320240 (NTSC) , 352288 (PAL). Maximum Frame rate per channel: 25 fps (PAL), 30 ftp (NTSC) Screen set: resolution 1024768, color quality 16 bits or 32 bits Compression code rate: 50 kbps 1.2 Mbps

Data format: MPEG4

Hardware installation
Video Capture Card Hardware

WS 401 Card Hardware

Figure 2.1 WS 401 Video Capture Card
Pin Port 1PIN 2PIN 3PIN 4PIN 5PIN 6PIN 7PIN 8PIN 9PIN Define 5V ALARM_COM ALARM_NC ALARM_IN1 ALARM_NO ALARM_IN2 GND ALARM_IN3 GND Interpret Power Source (5V) Alarm COM Alarm Normal Close Alarm Input 1 Alarm Normal Open Alarm Input 2 Ground Alarm Input 3 Ground

Pin Port 10PIN

Define ALARM_IN4

Interpret Alarm Input 4

Table 2.1 WS 401 card pins

TD WS 401 Card Hardware

Figure 2.2 TD 3008 Video Capture Card
Figure 2.3 pin definitions of TD 3008 Video Capture Card
Figure 2.4 WS 401Video Capture Card circuit link for Watchdog function
Figure 2.5 WS 401Video Capture Card Alarm Port The Alarm Port pin definitions of TD 3016 Card are as below:
Pin Port Pin1 Pin2 Define Alarm_in1 Alarm_in2 Interpret Alarm Input 1 Alarm Input 2 Pin Port Pin21 Pin22 Define Alarm_out5 Alarm_out6 Interpret Alarm Output 5 Alarm Output 6
Pin Port Pin3 Pin4 Pin5 Pin6 Pin7 Pin8 Pin9 Pin10 Pin11 Pin12 Pin13 Pin14 Pin15 Pin16 Pin17 Pin18 Pin19 Pin20
Define Alarm_in3 Alarm_in4 Alarm_in5 Alarm_in6 Alarm_in7 Alarm_in8 Alarm_in9 Alarm_in10 Alarm_in11 Alarm_in12 Alarm_in13 Alarm_in14 Alarm_in15 Alarm_in16 Alarm_out1 Alarm_out2 Alarm_out3 Alarm_out4

Set Motion Detection Sensitivity
Draw the bar and select a certain value for motion detection

sensitivity.

Click and enter Schedule Configuration page as below:
Figure 4.8 Schedule Configuration Our TD series system offers the users with powerful schedule configuration options. Every channel has three kinds of record modes, i.e. schedule record, motion detection record and sensor alarm record. We provide users to set schedules from Sunday to Monday separately for all of the three record modes. Sensor alarm record mode has the highest priority among all record modes. Here users can set schedules for it. When users need to edit schedule for a channel, first select the camera name in the three record modes group, and select the color
bars on the right side, then select Edit to edit schedules. Click Add to add schedule for a certain channel. Note: the added schedule should not be reduplicate to the former settings. Click Delete to delete schedule. Click Clear All to delete all the schedules of a certain channel. See the Figure 4.8 and learn how to edit schedules for a channel:

Figure 4.9 Edit Schedule

Motion Detection Alarm Configuration
Alarm Triggering Conditions Configuration The system can receive alarm both from local place and network (1) Local place alarm record triggering conditions configuration
Figure 4.10 Local place alarm triggering conditions configuration Relative Explanations:
[Buzzer]: Users can select whether to open the computer buzzer if the alarms have been triggered and also select how long the buzzer rings [PreRecord]: Users can select whether to enable alarm pre-record and also pre-record time. [Motion Holding Time]: Motion sensor may detect some movement, only if the movement lasts for a period exceeding the default time, then the alarm record will begin and buzzer beeps. [Disk Shortage Alarm]: If the HDD available space is less then the set value, the buzzer will beep if Buzzer has been selected.
Alarm output terminal in LAN
Figure 4.11 Alarm output terminals in LAN Select Remote Alarm, and enter the area as Figure 4.10 shows. Click Add to add alarm output terminals in LAN. Look the Figure below:
Figure 4.12 Add alarm output terminal in LAN Find the terminal computer and click OK, and users can see the name of the selected terminal will appear in the box as below:

Figure 4.13 List of alarm output LAN terminals Note: this function is only valid in LAN, not in Internet.

Alarm Record

Figure 4.14 Alarm trigger method configuration Every sensor can trigger multiple channels to record. For example, if users select CAM1, CAM4 and CAM5 for Sensor2, then once the sensor is activated, CAM1, CAM4 and CAM5 will begin to record. Users can also select the voltage, high and low, for alarm signals.

Alarm Output

Figure 4.15 Alarm output Configuration
[Video Loss]: Users can select alarm output for this option. For example, users select alarm_out1 and alarm_out3 and remote alarm for video loss. Then video loss of any channel will trigger alarm_out1, alarm_out3 to show red light in the Alarm output status panel (refer to Figure 3.6 for reference), and the system will give out related warning message to the terminals in List of alarm output LAN terminals (refer to Figure 4.12) [Disk Alarm]: when HDD available space is less than the set value (refer to Figure 4.9), it will trigger selected alarms. [Sensor 1]: If users have mounted sensors, when the sensors have been activated, then it will trigger the selected output alarms. [Sensor 2] [sensor 16] TD3004 card has maximum 4 sensors, and TD3016 and TD3116 card have maximum 16 sensors. [Motion 1]: Users can set motion detection alarm output by
different alarms and remote alarm. [Motion 2] - [Motion 16] 4 ch card has maximum 4 motion alarms, 8CH card has maximum 8 motion alarms, and 16 ch card has maximum 16 motion alarms.
Notes should choose our additional alarm device board while You using TD3008, TD3216, TD3316, TD4104 cards for alarm I/O.

Auto Mail Function

in the main interface and access to the following
Alarm Configuration area where users can make motion detection alarm setup, sensor alarm setup and short of HDD space alarm setup. Now users can select the above-mentioned alarms to be output by Auto Mail.
Figure 4.16 Alarm output configuration
Click Auto mail icon on the top left side and enter the following area to make Auto Mail setup:

Focus Zoom In/Out Iris
Figure 5.2 PTZ Control function buttons panel In the upper circle, there are five function buttons, i.e. upward button, downward button, leftward button, rightward button and stop button. The other buttons are Focus buttons (+ and -), Zoom buttons (+ and -), Iris buttons (+ and -). Click increase and decrease the corresponding values. When users need to utilize PTZ control, first enter PTZ Control Interface (refer to Figure 5.1), and click the corresponding channel (users can see a red fringe around the channel), then users can begin to control the enabled PTZ control enabled camera. Notice: After pressing left mouse button on any function button in PTZ Control Function Buttons Panel (refer to Figure 5.2), PTZ device starts moving, when user releases it, PTZ device stops moving. and to
Figure 5.3 Speed adjustment Users can select different Pan speed, Tilt speed, Focus speed and Zoom speed for PTZ devices.
[Pan Speed]: set horizontal rotating speed [Tilt Speed]: set vertical rotating speed
[Focus Speed]: set camera focus speed [Zoom Speed]: set zoom in/ zoom out speed
and a pop-up window will appear; users can choose
different preset or group set.
Figure 5.4 Preset and group select Click to set Preset point and change Preset point name.
Every Group includes multiple Preset points. In case users select preset1, preset2 and preset3 for group1, preset1, preset2 and preset3 will be automatically accessed in sequence after users select group1 for auto scout.
Figure 5.5 Preset Click appear:
[Dwell]: users can set the dwell time of a page here.
, a pop-pup window as following will
Figure 5.6 Group configuration
Record Search and playing back
Click in the SuperDVR Main Display Interface (refer to Figure 3.1) and access to the following areas:
Figure 6.1 Search and playing back Interface This interface is divided into 4 parts, i.e. record search area, record playing back area, record play area and other functions area. Press and return to the live surveillance status.

Record Search

Search By Date Record Time Display Search Original Files Search Backup Files Search Manual Record Events Search Schedule Record Events Search Motion Detection Events Search Sensor Alarm Events
Figure 6.2 Record search areas A, B and C marks the areas of three search methods. A: Search by date (range from Jan 1st, 1971 till now) B: Search in backup file and original file C: Search by record mode. This is useful when user wants to look through some important events. Users can select one or above of the three searching methods to search for needed record file.
Record playing back and Control
Figure 6.3 Record playing back and control Explain of the button function:

Select Live Surveillance and click OK to install Remote Surveillance client-side program as below. In the next chapter, we will learn more about Remote Playing back. When connecting to the server for the first time, then the following window will pop-up:
Figure 7.3 Inquiry for installing WebCam downloading component Notice: If users have already installed client-side program before and SuperDVR version has not been changed on the server, after inputting server address in IE browser, Figure 7.9 will come out without downloading or installing WebCam.
Figure 7.4 WebCam client-side drivers initializing After initialization has been completed, WebCam will be installed automatically.
Figure 7.5 WebCam installation
Figure 7.6 Default install path Users can choose path by clicking Browse. Click Next to continue:
Figure 7.7 Register program folder name Click Next after input the folder name or select the default name, and then Finish installation as below:
Figure 7.8 Installation success Then the WebCam main interface will appear as below:
Figure 7.9 WebCam main interfaces
and input user name and password, as below:
Figure 7.10 Login webcam Click Options and enter the advanced setting area. Users can modify default Server IPData Port and Command Port. Note: The default User name is SYSTEM without password. Users can set user name and password at the server end (refer to Figure 4.23). After logging into server, you will get the first channel video from server, and you can adjust screen mode just like SuperDVR, the bellow is the WebCam surveillance mode interface.
Figure 7.11 WebCam surveillance state Alarm state monitor and PTZ control are all same as SuperDVR, we would not need to give detail explanation here.

Remote Playing back

Remote Playing back server Configuration
For using our powerful remote playing back function, users should first enable Web Cam service and Remote Playing back Service in Basic Configuration (refer to Figure 4.1 and Figure 7.12).
Figure 7.12 Remote playing back service configurations
[RPB Port]: the default value is 13551
Note: Uses can enable remote playing back service without running the SuperDVR. Just enter the installation folder of SuperDVR, and activate MediaServer, users can also enable the RPB service. Once the remote playing back service has been enabled, there will be an icon on the taskbar to remind users the service has been activated.
Figure 7.13 Remote playing back service activated
Remote playing back Client-side Setup
Users should also first download and install playing back program. This chapter will guide users how to make it. Input server address in IE browser, and the following interface appears:

Figure 7.25 Time control Lever The following area is for users to control the play speed.
Figure 7.26 Play speed control module

Remote Record

Click to
and begin to record remotely. And the icon changes. Click it again and stop recording. Users can select save
path and compression format before logging in the system.

Mobile Surveillance

Introduction to Mobile Surveillance
In SuperDVR system, the mobile surveillance can be realized by connecting the mobile phone to the system. For time being, the function is supported by Windows Mobile system and Symbian Series 60 Developer Platform 2.0 intelligent mobile phone system. So far, the types of phones on which the function has been tested include mini 02, Xda II, Xda Atom, pocket PC phone edition, dopod 696, dopod 900, dopod 838, which are based on Windows Mobile system, and Nokia 6260, Nokia N70, Nokia 3230,
Nokia6680 based on Smybian Series 60 system. Client Configuration of Windows Mobile Server configuration on SuperDVR needs to be set before the function on phone is activated. Please refer to Section 7.1 Remote Live Surveillance. Firstly activate the network access on mobile phone and then run Internet Explorer after the server configuration has been done. Input the servers address and the connection is built up shown as below:
Figure 7.27 connected to the server Click PCam v1.0.6.5291. A dialog box pops up:
Figure 7.28 Downloading dialog box Please click Yea to start installing:
Figure 7.29 Downloading status information PCam will be opened after the download is finished:
Figure 7.30 Main layout of PCam Input the servers address, username and password respectively in the columns of Server, User and Password and click Go to log on the server. Successful log on information appears if the server address, username and password are all correct.
Figure 7.31 Log on system successfully Channel one is the default displaying channel after log on successfully. Changing channel can be approached by selecting the channel in rolling-down menu of Channel:
Figure 7.32 selecting channel Click Stop to disconnect the communication with the server.

Appendix 2.3.3 Why cant the server be configure d at the
client-side? The possible causes:
It can not be configure d at the client-side, when the server is being configured d at the server-end. Only the last configuration is valid if server different configuration is deployed simultaneously.
Appendix 2.3.4 Why I cant see the images? The possible causes:
The VGA card is too outdated. Have not installed newer DirectDraw. SuperDVR cannot run in Window 98 system. Data port or command port is conflicts with other network services. The user is connected to Internet through LAN, and the network administrator hasnt enabled corresponding data port or command port. The client-side has installed firewall software that may stop video transmission. MPEG4 codec has not been installed properly, please download new version WebCam. Bad network speed.
Appendix 2.3.5 What should I do if the Internet speed is quite slow? The more channels opened, and the slower the video transmission speed, therefore try to use one channel display mode when the network speed is slow. Tips:
There may be some surplus channels that have no video input. Switching off the channels is of help to improve transmission speed. (Refer to Basic Configuration about switching on/off channels.) Appendix 2.3.6 Why I cant start WebCam server or RPB server? Possible causes:
Other software is using these ports. If so, please change WebCam ports configuration or stop other software.
Appendix 2.4 Other questions
Appendix 2.4.1 Why computer display doesnt work, and why I cant access window system?
The capture card may not be well installed. Unplug the card and try it again.
Note: Please unplug the power plug of the computer, so as to avoid damaging the motherboard chip set. Appendix 2.4.2 Why I cant find the recorded files? HDD space is not enough. Appendix 2.4.3 Why the screens display is uns Table with dithering and water-wave images? Possible causes:
Camera electrical power is not enough. There is external electromagnetic disturbance, or electrostatic disturbance of camera BNC connector (Its suggested to connect
ground wire to the connector). User hasnt installed necessary VGA driver. VGA card problem. Try reinstalling the VGA card, or changing another VGA card.
Appendix 2.4.4 Why does it delay to play back, and its slow to close and open the driver? Possible causes:
Windows system problem. Try to reboot the computer. There are too many recorded files or too many fragments on the HDD, therefore it takes time to search for the files, you need delete the files that you dont need, or need to make disk defragmenter now. Capture card problem. Computer hardware system is too outdated.

Appendix 2.4.5 Why I cant play back? Windows media player has been damaged, or decoder hasnt been installed properly. Its suggested to reinstall the relative software system. Computer problem, recorded files have been damaged. Its suggested to fix these files using SuperAVIFix program. Appendix 2.4.6 Why do I see some gray blocks on time progress bar area when play back? Possible causes:
User has deleted these recorded files. SuperDVR has deleted recorded file when recycle option being is
chosen. Recorded files cant be opened because the recording is on.
Appendix 2.4.7 Why do I see some old record sections that cant be covered when play back? Possible causes:
You have ever selected disk partitions different from the current. These recorded files are being played back when covering it. Database of recorded log was damaged. You have ever installed SuperDVR on different directories.
Appendix 3 Quick Start for Using
Before installing the PCI card, check PC requirements:
P III 800 MHZ 256 MB RAM Windows 2000 (SP4 min) or Win XP (SP1 min) NVIDIA Video Card with 32 MB min or similar DirectX 9.0 minimum 80 GB HDD
Installation Instruction:
Insert the PCI card. (But do not connect the Camera yet.) Launch windows Windows will come up with Hardware wizard. Just click CANCEL Put the installation CD in and open up SuperDVR folder run the setup file Follow the steps and in Windows XP, it will come up with a
message say this program has not passed windows logo testing, just Continued anyway Reboot computer once it is completed.
FOR COMPLETE INSTRUCTIONS, REFER TO THE MANUAL. Once Boot up, On Desktop there will be SuperDVR icon opened well. If this program recognizes the PCI card, program will open just fine. Please log in first to the program. Once your program is opened, now connect the Camera. Done. Troubleshooting: When opening the SuperDVR program, it says Cant find card
Reboot one more time. If still same problem, click Start program SuperDVR Install and then Uninstall. Reboot computer. After reboot, go back to start program SuperDVR install. Now click on INSTALL to reinstall driver. Then Reboot. If for some reason still cant find card, uninstall driver again. Shut down computer. Move PCI Card to another slot. Reboot. And CANCEL when windows detect it. Then reinstall driver by going to start program SuperDVR install.

FOR OTHER SETTINGS IN THE PROGRAM PLEASE READ THE MANUAL. Q: How to setup the web client to monitor from Internet?
On Main Computer where the DVR card installed: Make sure the computer connected to Internet. DSL or Cable Modem preferably. Find out your IP address. You can go to this link to find the IP address http://lawrencegoetz.com/programs/ipinfo/ Open up the SuperDVR program and go to basic configuration. Check and ENABLE Web Camera Service and Remote Play Back Service. Make Note on Data Port, Command Port and RPB port.
NOTE: IF YOU ARE CONNECTING TO INTERNET USING ROUTER, YOU NEED TO configure THE SETUP OF THE ROUTER AND DO THE PORT FORWARDING. PORTS THAT NEED TO BE FORWARDED: 80, 1159, 1259 AND 13551. CHECK YOUR ROUTER MANUAL ON HOW TO SETUP THAT. On Remote Client Computer: Minimum Requirement for the client computer:
Open up Internet Explorer.
If you are running XP with SP2 do the following: on Internet explorer, click on TOOLS and Internet Option. Security Tab, Custom Level, and ENABLE DOWNLOAD UNSIGNED ACTIVEX CONTROLS
In the column of the Internet explorer, type in the IP address of Main Computer Click OK on Live Surveillance. This will download the webcam program. And then you can download Remote Playing back as well. On Desktop now you should see WEBCAM and REMOTE PLAYING BACK icon. Open up webcam, click on KEY symbol icon, user name: system. Password blank unless you setup a password within the main computer. Server: this the IP address of the main computer. Data port: 1159 and Command port: 1259. Click OK. Now you should be able to view the live video from main computer. To Play Back the VIDEO that has been recorded in Main Computer, Open up REMOTE PLAYING BACK. Click on CONFIGURE. Remote server: the IP address of main computer. IP port: 13551. OK Click LOGIN. OK. Now you should be able to play back the recorded video from main computer.
FOR MORE DETAILS INFO: READ THE MANUAL.

Appendix 4 Function Tree

SuperDVR

Account Live Config Search&Play PTZ Control

Login Logout

Screen

See Next Page

Search
Select Camera Move Control
Single Screen 4 Screen 6 Screen 8 Screen 9 Screen 13 Screen 16 Screen Full Screen Next Page AutoDwell Disk Space Record Status Alarm State Minimize
Date Time Events Play Control
Play/Pause Reverse/Pause Stop Previous Frame Next Frame Previous Section Next Section Audio Mute Audio Soudness Screen
Left Right Up Down Stop Zoom Control
Zoom Out Zoom In Focus Control

Far Near Iris Control

Single Screen 4 Screen 9 Screen 16 Screen Zoom Capture Print Setup Print Backup

Open Close Speed Adjust

Pan Speed Adjust Tilt Speed Adjust Focus Speed Zoom Speed Preset Points Config
Select Cameras Time Range Target Device Target Path Attach PlayFile Delete

Preset Points Set

Select Cameras Time Range
Select Point Name Save Preset Group Set
Select Group Group Name Edit Choose Group Points Dwell Interval Save Goto Preset Point
Select Preset Point Select Group

C ig onf

Basic Config

Video ProcAmp

Alarm Config

PTZ Config

System Config
Caption Mode Interval of AutoDwell CallMonitor Mode Resolution DeInterlace Storage Disk
Select Camera Brightness Contrast Hue Saturation Gain Mode

Serial Port

Auto Gain Enabled Gain Value Schedule Config
Buzzer Disk Shortage Motion Hold Time Sensor Hold Time Prerecord Enable Prerecord Time Remote Alarm
Port Index Baud rate Data bits Parity bits Stop bits Protocol
Select Disk Recycle Windows Auto Login

Select Schedule Type

UserName Password Auto Reboot
Enable Interval Time Set Live Audio Audio Config
Schedule record Motion Detect Sensor Alarm Alarm Output Schedule Operate
Enable PC List Sensor Alarm Config Output Device Config AutoMail Config
Select Camera Enable Protocol Type Address Authorization
Select Schedule Add Edit Delete Motion Detect Config
SMTP Server User Name Email From Password Send To Subject Message Body Attach Picture Send Mail Test

Add User Edit Rights Delete User
Select Channel Gain Adjust Network Service

Http Port WebCam Service

Select Camera Motion Area Sensitivity
Enable Data Port Command Port RPB Service
Enable RPB Port Video Quality Camera Config
Switch Name Time Stamp Record Mode
Schedule Manual Motion Dectect Sensor Record Quality Record Frame Rate
Schedule Manual Motion Dectect Sensor Security

WebCam

Select Server Login

UserName Password Screen

Single Screen 4 Screen 6 Screen 8 Screen 9 Screen 13 Screen 16 Screen Next Page Minimize PTZ Control
Select Camera Pan Tilt Focus Zoom Iris Stop Exit

Remote Playback

Login Server

UserName Password Config

Select Server
Server IP or name IP Port Record
Save Path Frame Speed Advance
Compressor Quality Screen Mode Choice
Single Screen 4 Screen 9 Screen 16 Date & Time
Date Start Time Stop Time Play Control

Play Speed

Speed Up Speed Down Original Play Pause Drag Record Event Browse BandWidth Monitor Minimize Exit

As the complexity of computer systems increase, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or passive heatsinks. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel 865G/865GV chipset Graphics and Memory Controller Hub (82865G/82865GV GMCH) and Intel 865PE/865P chipset Memory Controller Hub (82865PE/82865P MCH), and discuss a reference thermal solution. The simplest and most cost-effective method is to improve the inherent system cooling characteristics of the (G)MCH through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise. This document presents the conditions and requirements to properly design a cooling solution for systems that implement the 865G/865GV/865PE/865P chipset. Properly designed solutions provide adequate cooling to maintain the chipset (G)MCH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the (G)MCH case temperature at or below those recommended in this document, a system designer can ensure the proper functionality, performance, and reliability of this chipset. Note: Unless otherwise specified, the information in this document applies to the 865G chipset, 865GV chipset, 865PE chipset, and 865P chipset. The term (G)MCH refers to both GMCH and MCH host bridges. For example, the term (G)MCH might be used in a discussion that pertains to all of the host bridges (82865G GMCH, 82865GV GMCH, 82865PE MCH, and 82865P MCH).

Terminology

Description
Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted, bonded, and encapsulated in molding compound. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound. Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note that the device arrives at the customer with solder balls attached. Intel I/O Controller Hub 5. The chipset component that contains the primary PCI interface, LPC interface, USB, ATA, and/or other legacy functions. Mini Ball Grid Array. A smaller version of the BGA with a ball pitch of 1.00 mm [0.039 in]. Graphic and Memory Controller Hub. The chipset component that contains the processor and memory interface and integrated graphics core. Memory Controller Hub. The chipset component that contains the processor and memory interface. The measured ambient temperature locally to the component of interest. The ambient temperature should be measured just upstream of airflow for a passive heatsink or at the fan inlet for an active heatsink. The measured case temperature of a component. For processors, it is measured at the geometric center of the integrated heat spreader (IHS). For other component types, it is generally measured at the geometric center of the die or case. The maximum case/die temperature with an attached heatsink. This temperature is measured at the geometric center of the top of the package case/die. The minimum case/die temperature with an attached heatsink. This temperature is measured at the geometric center of the top of the package case/die. Thermal Design Power is specified as the highest sustainable power level of most or all of the real applications expected to be run on the given product, based on extrapolations in both hardware and software technology over the life of the component. Thermal solutions should be designed to dissipate this target power level. Thermal Interface Material: thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance. Linear Feet per Minute. Unit of airflow speed. Case-to-ambient thermal characterization parameter (Psi). A measure of thermal solution performance using total package power. Defined as (TC TA) / Total Package Power. Heat source size should always be specified for measurements. Wave Solder Heatsink. A heatsink that is installed to a motherboard via wave solder process. Pins are fixed to the heatsink base and are held in place on the motherboard by solder. There are no associated retention clips or retention anchors.

FC-BGA

Intel ICH5

MBGA GMCH

TC-MAX TC-MIN

lfm CA

Reference Documents
Document Intel 865G/865GV Chipset: Intel 82865G/82865GV Graphics and Memory Controller Hub (GMCH) Datasheet Intel 865PE/P Chipset: Intel 82865PE/82865P Chipset Memory Controller Hub (MCH) Datasheet Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Datasheet Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines Design Guide Various System Thermal Design Suggestions Document Number / Location http://developer.intel.com/design/ chipsets/datashts/252514.htm http://developer.intel.com/design/ chipsets/datashts/252523.htm http://developer.intel.com/design/ chipsets/designex/252673.htm http://developer.intel.com/design/ pentium4/datashts/298643.htm http://developer.intel.com/design/ pentium4/guides/252161.htm http://www.formfactors.org

Product Specifications

Package Description
The (G)MCH is available in a 37.5 mm [1.48 in] x 37.5 mm [1.48 in] Flip Chip Ball Grid Array (FCBGA) package with 932 solder balls. The die size is currently 9.73 mm [0.383 in] x 9.73 mm [0.383 in] and is subject to change. A mechanical drawing of the package is shown in Figure 15, Appendix A.
Non-Grid Array Package Ball Placement
The (G)MCH package uses a balls anywhere concept. Minimum ball pitch is 1.0 mm [0.039 in], but ball ordering does not follow a 1 mm grid. Board designers should ensure correct ball placement when designing for the non-grid array pattern. For exact ball locations relative to the package, refer to the Intel 865G/865GV Chipset Datasheet or Intel 865PE/865P Chipset Datasheet.
Figure 1. (G)MCH Non-Grid Array
37.5mm x 37.5mm Substrate [1.48 in x 1.48 in]

Shifted Grid

Std Grid w/ Depop
Non standard grid ball pattern. Minimum pitch = 1.0 mm [0.039 in]

Thermal Specifications

To ensure proper operation and reliability of the (G)MCH, the temperature must be at or below the maximum value specified in Table 1. System and component level thermal enhancements are required to dissipate the heat generated and maintain the (G)MCH within specifications. Chapter 3 provides the thermal metrology guidelines for case temperature measurements. The (G)MCH should also operate above the minimum case temperature specification listed in Table 1.
Table 1. Intel 82865G/865GV/82865PE/82865P (G)MCH Case Temperature Specifications

Table 2. Intel 82865G/82865GV GMCH and 82865PE/82865P MCH Thermal Design Power Specifications
Configuration Intel 82865G GMCH (Integrated Graphics @ 266 MHz) Dual-channel / 4 DIMMs / 400 MHz DDR / 800 MHz FSB Dual-channel / 2 DIMMs / 400 MHz DDR / 800 MHz FSB Single-channel / 2 DIMMs / 400 MHz DDR / 800 MHz FSB Intel 82865PE MCH (Discrete Graphics) Dual-channel / 4 DIMMs / 400 MHz DDR / 800 MHz FSB Dual-channel / 2 DIMMs / 400 MHz DDR / 800 MHz FSB Single channel / 2 DIMMs / 400 MHz DDR / 800 MHz FSB Intel 82865P MCH (Discrete Graphics) Dual-channel / 4 DIMMs / 333 MHz DDR / 533 MHz FSB Dual-channel / 2 DIMMs / 333 MHz DDR / 533 MHz FSB Single-channel / 2 DIMMs / 333 MHz DDR / 533 MHz FSB Intel 82865GV (Integrated Graphics @ 266 MHz, no AGP support) Dual-channel / 4 DIMMs / 400 MHz DDR / 800 MHz FSB 12.6 W 10.3 W 9.5 W 7.6 W

TDP Value

12.9 W 11.8 W 10.0 W

11.3 W 10.2 W 8.3 W

Mechanical Specifications
Heatsinks that attach to the (G)MCH via a retention mechanism should exert a load within the maximum static load specification listed in Table 3. During heatsink installation, care should be taken to avoid rocking the heatsink on the package die or exceeding the maximum transient compressive load in Table 3.
Table 3. (G)MCH Mechanical Specifications
Parameter Maximum Static Compressive Load Maximum Transient Compressive Load Value 133.4 N [30 lbf] 178 N [40 lbf] Notes
NOTES: 1. A compressive load is defined as a uniform load applied normal to the die surface (downwards) 2. A transient compressive load is defined as a uniform load applied normal to the die surface (downwards) temporarily during heatsink installation.

Thermal Metrology

The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring chipset component case temperatures.
Case Temperature Measurements
To ensure functionality and reliability, the chipset (G)MCH is specified for proper operation when TC is maintained at or below the maximum temperature listed in Table 2. The surface temperature at the geometric center of the die corresponds to TC. Measuring TC requires special care to ensure an accurate temperature reading. Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce error in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, or contact between the thermocouple cement and the heatsink base (if a heatsink is used). To minimize these measurement errors a thermocouple attach with a zero-degree methodology is recommended. Although the basic metrology is the same for a clip-attached heatsink and a Wave Solder Heatsink (WSHS), the removal and replacement of the WSHS requires additional guidelines for accurate thermal measurements. Refer to the WSHS rework procedure in Section 4.3.3 for guidelines on installing a WSHS modified for a zero-degree attach. Physical modifications to a WSHS are identical to modifications for a clip-attached heatsink. Sections 3.1.1 details the modifications required to measure package case temperature using both clip-attached heatsinks and WSHS.

Thermocouple Attach Methodology
1. 2. 3. 4. 5. Mill a 3.3 mm [0.13 in] diameter hole centered on the bottom of the heatsink base. The milled hole should be approximately 1.5 mm [0.06 in] deep. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole to one edge of the heatsink. The slot should be in the direction parallel to the heatsink fins (see Figure 3). Attach thermal interface material (TIM) to the bottom of the heatsink base. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. During this step, make sure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 2). Attach heatsink assembly to the (G)MCH , and route thermocouple wires out through the milled slot. For the Wave Solder Heatsink, refer to Section 4.3.3 for guidelines on proper heatsink removal and installation. Following the guidelines is critical to ensure an accurate and repeatable metrology.
Figure 2. Zero-Degree Angle Attach Methodology

Top View, Not to Scale

Thermocouple Wire
Cement + Thermocouple Bead Substrate

angle_attach_1

Figure 3. Zero-Degree Angle Attach Heatsink Modifications
Generic Heatsink Shown Not to Scale
1.3 mm (0.05 in.) (0.5 mm (0.02 in.) Depth)
3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in.) Depth)
Angle_Attach_Heatsink_Mod

Thermal Testing Software

The Thermal Testing Software is a utility designed to generate the Thermal Design Power (TDP) on the (G)MCH. The combination of the processor and the bandwidth capability of the (G)MCH enable high levels of system performance. To assess the thermal performance of the (G)MCH thermal solution during worst-case realistic application conditions, Intel has developed a software utility that operates the (G)MCH at near worst-case power dissipation. The utility was developed solely for testing customer thermal solutions at or near the thermal design power. Figure 4 shows a decision flowchart for determining thermal solution needs. Note that applications may exceed the thermal design power value for transient time periods. For power supply current requirements under these transient conditions, refer to each components datasheet for the ICC (Max Power Supply Current) specification. Contact your Intel Field Sales representative to obtain a copy of this software. Caution: The thermal testing software has been found to dissipate only 66% of TDP for the 82865PE/82865P MCH due to bandwidth efficiencies at 533 MHz FSB. Due to this reduced power level, the maximum case temperature (TC) is de-rated when validating thermal solutions with the application for the 82865PE/82865P MCH @ 533 MHz FSB and 333 MHz DDR memory. Refer to Table 1 for the de-rated specification. Note that this does not apply to 82865G/82865GV GMCH.

Figure 4. Thermal Solution Decision Flowchart
Attach device to board using normal reflow process.
Attach thermocouples using recommended metrology. Setup the system in the desired configuration.
Run the Power program and monitor the device die temperature.

TC > Specification?

Select Heatsink

Heatsink required

Thermal Mechanical Test Vehicle
A Thermal Mechanical Test Vehicle (TMTV) is available for early thermal testing prior to the availability of actual silicon. The TMTV contains a heater die and can be powered up to a desired power level to simulate the heating of a (G)MCH package. The TMTV also contains daisy chain functionality and can be used for mechanical testing. The TMTV needs to be surface mounted to a custom board designed to provide connectivity to the die heater and/or daisy chain depending on the needs of the user. The package ball connections are provided so the user may design and build a board to interface with the TMTV. Note that although the TMTV is designed to closely match the (G)MCH package mechanical form and fit, it is recommended that final validation be performed with actual production material. The TMTV mechanical features, including die size, ball count, etc., may not reflect those of the final production package.
TMTV Daisy Chain Operation
The TMTV has alternating pins shorted together on the package to allow daisy chain functionality. When mounted to a complementary test board, entire rows or the entire package can be shorted together. Test points on the board can then facilitate the identification of any opens on the mounted package after any mechanical testing (shock, vibration, temperature cycling, etc.). Figure 5 shows a schematic of the internal package structures and Figure 6 shows an example of a complementary test board configuration.
Figure 5. TMTV Daisy Chain Structure
Figure 6. Example Complementary Test Board Connections
DC Row Isolation Test Points Board Trace Package Trace

Via to Board Backside

TMTV Thermal Operation
The heater located within the TMTV die should be accessed by connecting two sets of eight (8) solder balls to each side of a power supply in parallel. The heater consists of a resistor and the polarity of the power supply connections is arbitrary. The package balls to access the heater are identified in Table 4. Ball reference designations can be found in Figure 5 and Figure 6. A graphical representation of the die heater and its connections are shown in Figure 7.

Table 4. TMTV Heater Connections
Ball Designation AK10, AM9, AL9, AM10, AL10, AG11, AK9, AN10 AG28, AF28, AF29, AG27, AH27, AG29, AH26, AH29 Connection Heater End 1 Heater End 2
Figure 7. TMTV Die Heater Representation
HEATER END 1 HEATER END 2

3.3.2.1

Recommended Test Parameters
The following example describes how to determine the voltage required to operate at the recommended (G)MCH Thermal Design Power (TDP) listed in Table 2. The voltage to be applied to each heater can be easily calculated. The heater resistance must be measured on each TMTV unit to set the correct power dissipation. The typical resistance of the heater is 70. The maximum allowable power for the TMTV is 30 W so as not to exceed the temperature limit of the package. Example TDP = 11.7 W R = 70 (measured resistance across heater) V = SQRT (Power x Resistance) = SQRT (11.7 W * 70 ) = 28.6 V Solving for voltage, the calculated value of V = 28.6 V. Hence, if a nominal 28.6 V is applied to the die heater, the TMTV will operate at the 11.7 W thermal design power.

3.3.2.2

TMTV Correction Factors
Due to changes in die size between the TMTV and the planned production die size, a correction factor is required for any heatsink thermal performance measurements made with the TMTV. Thermal performance of a (G)MCH heatsink is determined using the case-to-ambient thermal characterization parameter, CA (Psi). Refer to Section 3.1 for instructions on measuring TC (package case temperature). Figure 8 shows recommended ambient temperature measurement locations for a board in a JEDEC test configuration. CA is analogous to thermal resistance but is defined using total package power instead of the actual power dissipated between the package case and local ambient. The TMTV die size is 8.153 mm x 8.153 mm [0.321 in x 0.321 in]. The correction factors listed in Table 5 are for a currently assumed die size of 9.73 mm x 9.73 mm [0.383 in x 0.383 in] for the (G)MCH.
Table 5. TMTV Correction Factor

Parameter CA Correction Factor 0.935
NOTE: The TMTV correction factor was calculated assuming an airflow velocity of 0.76 m/s [150 lfm] and a TIM comprised of phase change material. The correction factor may not apply to configurations that deviate from these assumptions.
Any case-to-ambient thermal characterization parameters based on data collected from a TMTV should be multiplied by the correction factor in Table 5 to account for changes in die size. The correction factor calculation is as follows: {GMCH CA} = {TMTV CA} x Correction factor

Example Calculation

TC = 90 C TA = 50 C Total Package Power = 11.7 W CA, MEASURED = (TC TA) / Total Package Power = (90 50) / 11.7 = 3.4 C/W Applying the correction factor, we get: CA, CORRECTED = Correction Factor x CA, MEASURED = 0.968 x 3.4 = 3.3 C/W

Airflow Characterization

Figure 8 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for both a single thermocouple and a pair of thermocouples are presented.
Figure 8. Airflow Temperature Measurement Locations
Airflow velocity should be measured using industry standard air velocity sensors. Typical airflow sensor technology may include hot wire anemometers. Figure 8 provides guidance for airflow velocity measurement locations. These locations are for a typical JEDEC test setup and may not be compatible with chassis layouts due to the proximity of the processor to the (G)MCH. The user may have to adjust the locations for a specific chassis. Be aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an inaccurate measurement may result. Measurements should be taken with the chassis fully sealed in its operational configuration to achieve a representative airflow profile within the chassis.
Reference Thermal Solution
The Wave Solder Heatsink (WSHS) is the reference component thermal solution for the (G)MCH. This chapter provides detailed information on operating environment assumptions, heatsink manufacturing, heatsink rework, and mechanical reliability requirements.

Operating Environment

An airflow speed of 0.76 m/s [150 lfm] is assumed to be present 25 mm [1 in] in front of the heatsink air inlet side of the attached reference thermal solution. The potential for increased airflow speeds may be realized by ensuring that airflow from the processor heatsink fan exhausts in the direction of the (G)MCH heatsink. This can be achieved by orienting the processor heatsink fins perpendicular to the (G)MCH heatsink face or by using a heatsink with omni directional airflow, such as a radial fin or X pattern heatsink. Figure 9 illustrates a straight fin heatsink fin orientation that provides airflow to the (G)MCH heatsink. In addition, (G)MCH board placement should ensure that the (G)MCH heatsink is within the air exhaust area of the processor heatsink. Note that heatsink orientation alone does not guarantee that 0.76 m/s [150 lfm] airflow speed will be achieved. The system integrator should use analytical or experimental means to determine whether a system design provides adequate airflow speed for a particular (G)MCH heatsink.

Figure 9. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink

Airflow Direction

(G)MCH Heatsink Top View
Processor Heatsink (Fan not shown)

proc_airflow

Other methods exist for providing airflow to the (G)MCH heatsink, including the use of system fans and/or ducting, or the use of an attached fan (active heatsink). The local ambient air temperature (TA) at the (G)MCH heatsink is assumed to be 50 C. The thermal designer must carefully select the location to measure airflow to get a representative sampling. These environmental assumptions are based on a 35 C system external temperature measured at 1524 m [5000 ft].
Mechanical Design Envelope
The motherboard component keep-out restrictions for the WSHS are included in Appendix B. The WSHS extends 38.2 mm [1.5 in] nominally above the board when mounted. System integrators should ensure no board or chassis components would intrude into the volume occupied by the WSHS.
Thermal Solution Assembly
The reference thermal solution consists of a passively cooled Wave Solder Heatsink. The heatsink is comprised of an extruded aluminum heatsink with four mounting pins pressed into each corner of the heatsink base. A thermal interface material (Chomerics T-710) is pre-applied to the heatsink bottom over an area in contact with the package die. A 45-degree dado cut is performed on the heatsink base to create rails to reduce the possibility of tilt when assembling the WSHS. Since the rails are oriented at 45 degrees relative to the heatsink edges, the WSHS is only compatible with a (G)MCH rotated 45 degrees relative to the motherboard. Section 4.3.1 describes an alternate WSHS design that is compatible with a (G)MCH that is not rotated relative to the motherboard. Note that the rails do not touch the package substrate in the nominal position. The WSHS is shown in the installed configuration in Figure 10 (the (G)MCH cannot be seen in this view, as it is hidden by the WSHS base). Drawings of the WSHS extrusion and with the entire WSHS assembly are shown in Appendix B.
Figure 10. Wave Solder Heatsink Installed on Board
Alternate WSHS for Non-Rotated (G)MCH
The WSHS can be modified into an alternate configuration for a non-rotated (G)MCH. Customers that want to develop an alternate design should work with their suppliers and implement the following recommendations: Create an extrusion die that will create two parallel rails matching the rails shown in the heatsink drawing (Appendix B, Figure 17), but at a zero-degree rotation relative to the heatsink. The extruded rails should use the same width, height, and spacing as shown in the drawing. The tolerances shown should be replicated in the extrusion. Omit the dado cut from the manufacturing process.

4.3.2.1

Manufacturing with the WSHS
This section describes manufacturing related considerations for WSHS use in an HVM setting.
Assembly Process Settings
Table 6 provides recommended wave solder process settings for installation of the WSHS.
Table 6. Wave Solder Recommended Settings for WSHS
Setting Board Temperature on Pre-heat Region Exit Dwell Time Solder Bath Temperature Minimum 90 C [194 F] Maximum 120 C [248 F] Notes Recommend not exceeding 120 C [248 F] due to flux dry out Not to exceed 160 C [320 F] board topside temperature Not to exceed 160 C [320 F] board topside temperature using the minimum dwell time

As Required

240 C [464 F]
In addition, the recommended solder type is standard eutectic 63/37 Sn/Pb. No top hat plungers should be used to hold down the WSHS during the wave solder process since it may increase the risk of heatsink tilt. For best results, the WSHS should be left in a floating condition as it passes through the wave solder.

4.3.2.2

Inspection Criteria
After the WSHS is installed and exits the wave solder process, it should be visually inspected to ensure there are no gross tilt issues. Any gross tilt in the WSHS will impact the thermal performance of the heatsink. The recommended allowable observed tilt is approximately 0.36 mm [0.014 in] variation between pin gaps on opposite sides of the heatsink (~16% difference in gap, nominal gap is ~2.2 mm [0.086 in]). The pin gap is defined as the distance between the bottom of the heatsink base and the top of the motherboard. This amount of gap is easily detectable by trained inspectors. Gross tilt inspection results can allow for closer inspection and measurement of tilt. To establish the initial wave solder process, a more detailed inspection may be used to confirm the process is robust and does not induce heatsink tilt. A detailed inspection may include the use of feeler gauges to measure the pin gap more precisely and assess the presence of heatsink tilt. The recommended allowable tilt can be used as criteria for determining the success of the wave solder process. Once a successful wave solder process is in place, the manufacturer may choose to use visual gross tilt inspection in an HVM setting.
WSHS Removal and Installation Procedure
Two methods exist for WSHS removal, lead clipping or de-soldering. Re-installation of the heatsink for rework or metrology purposes includes a single method.

4.3.3.1

Removal via Lead Clipping Methodology
Recommended Equipment List
55-degree angle clippers (Figure 11) Solder wicking kit

Figure 11. 55-Degree Angle Clippers

Removal Procedure

1. 2. 3. 4. 5. Remove processor heatsink retention mechanism. Cut the WSHS leads using the 55-degree angle clippers. To reduce potential of damaging board and components, cut the leads in the order shown in Figure 12. Flip the board over and remove the leads, using tweezers and a soldering iron with a STTC 137 tip. Apply flux and remove any residual solder from each hole. Inspect the board and ensure all holes are clean and completely free of solder. Make sure none of the adjacent components were damaged during the removal process.
Figure 12. WSHS Lead Clipping Order (Heatsink Shown Is Not (G)MCH WSHS)

WSHS_lead_clip_order

4.3.3.2
Removal via De-Soldering Methodology
Recommended equipment list
1. 2. 3. De-soldering gun Solder wicking kit Vertical rework jig (Figure 13)
Figure 13. Example Vertical Rework Jig (Heatsink Shown Is Not (G)MCH WSHS)
1. 2. 3. 4. 5. 6. Remove processor heatsink retention mechanism. De-solder the WSHS leads using a SMTC 104 tip. Use a small amount of solder to prime the tip if necessary. Stand the board vertically using jig (Figure 13). Use a soldering iron with an STTC 137 tip to loosen WSHS pins and remove the heatsink. Gently wiggle each lead loose while applying heat to lead. Apply flux and remove any residual solder from each hole. Inspect the board and ensure all holes are clean and completely free of solder. Make sure none of the adjacent components were damaged during the removal process.

4.3.3.3

Re-Installation Methodology

Recommended Equipment

WSHS rework target SMT rework tool such as an SRT 1000 or 1100

Installation Procedure

1. 2. 3. 4. 5. 6. 7. Insert WSHS into board. Avoid scratching the board as the pins are placed into the mounting holes. Ensure the WSHS floats on top of the (G)MCH. The WSHS should move freely. If it does not float, remove any residual solder that may be in the mounting holes. Place the WSHS target on top of the WSHS fins. Use the SMT rework tool to melt the TIM. Use 145 grams placement force and set the bottom temperature to 220 C (428 F) for 90 seconds duration. Cool the board to room temperature. Stand the board vertically using jig. Solder the WSHS leads using a soldering iron with a STTC 137 tip.
Figure 14. WSHS Target (Heatsink Shown Is Not (G)MCH WSHS)
Environmental Reliability Requirements
The environmental reliability requirements for the reference thermal solution are shown in Table 7. These should be considered as general guidelines. Validation test plans should be defined by the user, based on anticipated use conditions and resulting reliability requirements.

Table 7. Reference Thermal Solution Environmental Reliability Requirements
Test1 Mechanical Shock Requirement Quantity: 3 drops for + and - directions in each of 3, perpendicular axis (i.e., total 18 drops). Profile: 50 G trapezoidal waveform, 11 ms duration, 4.3 m/s [170 in/s] minimum velocity change. Setup: Mount sample board on test fixture. Include 450 g processor heatsink. Duration: 10 min/axis, 3 axis Frequency Range: 5 Hz to 500 Hz Power Spectral Density (PSD) Profile: 3.13 g RMS Thermal Cycling Temperature Life Unbiased Humidity -40 C to +85 C, 1000 cycles 85 C, 1000 hours total 85% relative humidity / 130 C, 100 hours Visual Check Visual/Electrical Check Visual Check Pass/Fail Criteria2 Visual\Electrical Check

Random Vibration

Visual/Electrical Check
NOTES: 1. The above tests should be performed on a sample size of at least 12 assemblies from three, different lots of material. 2. Additional Pass/Fail Criteria may be added at the discretion of the user.
Appendix A: Enabled Suppliers
Enabled suppliers for the (G)MCH WSHS reference thermal solution are listed in Table 8. Table 8. (G)MCH Wave Solder Heatsink Enabled Suppliers
Supplier Intel Part Number Vendor Part Number Contact Information Taiwan: Monica Chih, Project Manager, 886-2-29952666, Ext 131 USA: Harry Lin, 714-739-5797

C19335

00C852301A

Foxconn

2ZA41-001
Malaysia: Cheow-Kooi Lee, 604-6122122 USA: Kevin Tao, 714-626-1278
Note: These vendors and devices are listed by Intel as a convenience to Intels general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.
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Appendix B: Mechanical Drawings
The following table lists the mechanical drawings available in this document:
Drawing Name (G)MCH Package Drawing (G)MCH Component Keep-Out Restrictions WSHS Heatsink Extrusion Drawing WSHS Heatsink Assembly Drawing

Page Number 36 37

Figure 15. (G)MCH Package Drawing
Figure 16. (G)MCH Component Keep-Out Restrictions
Figure 17. WSHS Heatsink Extrusion Drawing
Figure 18. WSHS Heatsink Assembly Drawing