HP BladeSystem servers draw cool air in through the front and expel warm air through the rear of the enclosure. Therefore, the front of the rack enclosure must be adequately ventilated to enable ambient room air to enter the enclosure, and the rear of the enclosure must be adequately ventilated to enable the warm air to escape from the enclosure. IMPORTANT: Do not block the ventilation openings.
If the front of the rack is not completely filled with components, the remaining gaps between the components can cause changes in the airflow, which can adversely affect cooling within the rack. Cover these gaps with blanking panels. CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement ensures proper airflow. Using a rack without blanking panels results in improper cooling that can lead to thermal damage. In high density configurations, the HP 10000 Series Rack Airflow Optimization Kit (AF090A) should be installed to prevent airflow from the rear of the rack to the front the rack via gaps in the rack frame. HP 10000 Series and 10000 G2 Series racks provide proper server cooling from flow-through perforations in the front and rear doors that provide 65 percent open area for ventilation. CAUTION: Always use blanks to fill empty spaces in enclosures. This arrangement ensures proper airflow. Using an enclosure without the proper blanks results in improper cooling that can lead to thermal damage.

Temperature requirements

To ensure continued safe and reliable equipment operation, install or position the rack in a well ventilated, climate-controlled environment. The operating temperature inside the rack is always higher than the room temperature and is dependent on the configuration of equipment in the rack. Check the TMRA for each piece of equipment before installation. CAUTION: To reduce the risk of damage to the equipment when installing third-party options: Do not permit optional equipment to impede airflow around the enclosure or to increase the internal rack temperature beyond the maximum allowable limits. Do not exceed the manufacturers TMRA.

Power requirements

Installation of this equipment must comply with local and regional electrical regulations governing the installation of IT equipment by licensed electricians. This equipment is designed to operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992 (code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on options, refer to the product rating label or the user documentation supplied with that option.

WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not overload the AC supply branch circuit that provides power to the rack. Consult the electrical authority having jurisdiction over wiring and installation requirements of your facility. CAUTION: Protect the enclosure from power fluctuations and temporary interruptions with a regulating UPS. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the enclosure in operation during a power failure.

Grounding requirements

This equipment must be grounded properly for proper operation and safety. In the United States, you must install the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as any local and regional building codes. In Canada, you must install the equipment in accordance with Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must install the equipment in accordance with any regional or national electrical wiring codes, such as the International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed or certified grounding-type devices. Because of the high ground-leakage currents associated with this equipment, HP recommends the use of a PDU that is either permanently wired to the buildings branch circuit or includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips to supply power to this equipment is not recommended.
Component and LED identification
Enclosure front components
Device bays* Air intake slot (Do not block.) Power supply bay 1 Power supply bay 2 Power supply bay 3 Power supply bay 4 Insight Display Power supply bay 5 Power supply bay 6 Air intake slot (Do not block.)
*For more information, see "Device bay numbering."
Power supply bay numbering

Power supply LEDs

Power LED 1 (green)

Off On Off

Fault LED 2 (amber)

Off Off On

UID LED Active Onboard Administrator LED Health LED
USB 2.0 Type A connector used for connecting supported USB devices such as DVD drives, USB key drives, or a keyboard or mouse for enclosure KVM use. To connect multiple devices, a USB hub (not included) is required. Serial RS232 DB-9 connector with PC standard pinout. Connect a computer with a null-modem serial cable to the Onboard Administrator command line interface (CLI). VGA DB-15 connector with PC standard pinout. To access the KVM menu or Onboard Administrator CLI, connect a VGA monitor or rack KVM monitor for enclosure KVM.

Serial connector

Interconnect bay numbering
To support network connections for specific signals, install the interconnect module into the appropriate bay.

Server blade signal

NICs 1, 2, 3, and 4 (embedded) Mezzanine 1 Mezzanine 2 Mezzanine 3

Interconnect bay number

1, 2 3, 4 5, 6 and then 7, 8 7, 8 and then 5, 6

Interconnect bay label

NOTE: For information on the location of LEDs and ports on individual interconnect modules, see the documentation that ships with the interconnect module. For more information, see "Mapping to interconnect ports (on page 48)."

Installation

Installation overview
To set up and install the enclosure:

1. 2. 3. 4. 5. 6. 7.

Disassemble the enclosure ("Disassembling the enclosure" on page 22). For rack-free installations ("Rack-free installation" on page 25), set up the enclosure on an appropriate surface, then install the rear cage and enclosure components. For rack installations, install the enclosure into the rack ("Installing the enclosure into the rack" on page 27) then reassemble the enclosure. Install the enclosure components ("Component installation" on page 30) into the enclosure. Connect the enclosure components ("Cabling and powering up the enclosure" on page 56) in the enclosure. Connect the AC power cables and power up the enclosure ("Powering up the enclosure" on page 59). Configure the enclosure ("Running the Insight Display installation steps" on page 64) using the Insight Display.
Disassembling the enclosure
Before installing the enclosure into the rack, you must disassemble the enclosure. Because a fullypopulated enclosure can weigh up to 217.7 kg (480 lb), remove the components and the rear cage from the enclosure to make moving and installing the enclosure easier. Two people should work together to remove the rear cage from the enclosure. The empty enclosure with the rear cage installed weighs 58.6 kg (129 lb). When the enclosure is disassembled, the empty enclosure without the rear cage installed weighs 35.5 kg (78 lb). The empty rear cage weighs 23.2 kg (51 lb).
With the enclosure still on the pallet, remove all components from the front and rear of the enclosure.

Measuring with the rack template
The rack template ships with the rack rail kit and provides detailed instructions on where to position the enclosure rack rails and where to install the four cage or clip nuts. Each enclosure kit includes the rack rails recommended for that enclosure. NOTE: Four cage nuts and four clip nuts are included with the enclosure. Cage nuts should be used in racks with square holes. Clip nuts should be used in racks with round holes. When installing multiple enclosures, install the rack rails and cage or clip nuts for one enclosure, and then install the enclosure. Repeat for each additional enclosure.
Installing the rack rails
The rack rails are marked for easy identification. The left rack rail is marked "L" and the right rack rail is marked "R." To install the rack rails:
Begin with the left rack rail. Align the end of the rail with the rear rack column. Slide the rack rail closed until the end of the rail is locked in place, wrapping behind the rear rack column.
Slide the front end of the rail to the rack front column. When fully seated, the rack rail will lock into place.
Repeat the procedure for the right rack rail.
Installing the enclosure into the rack
The empty enclosure with the rear cage installed weighs 58.6 kg (129 lb). When the enclosure is disassembled, the empty enclosure without the rear cage installed weighs 35.5 kg (78 lb). The empty rear cage weighs 23.2 kg (51 lb). WARNING: Always use at least two people to lift an enclosure into the rack. If the enclosure is being loaded into the rack above chest level, a third person must assist with aligning the enclosure with the rails while the other two people support the weight of the enclosure. To install the enclosure into the rack:
At the front of the rack, lift and align the enclosure guiding fins with the guiding groove in the rack rails. IMPORTANT: Be sure that the guiding fins on the enclosure seat properly in the guiding groove on the rack rail.
Push the handles down on each side of the enclosure, and slide the enclosure fully into the rack.
Tighten the thumbscrews to secure the enclosure to the rack.
Install the rear cage into the enclosure. ("Installing the rear cage into the enclosure" on page 29) Repeat the procedure for the remaining enclosures. NOTE: Up to four 10U enclosures can be installed in a 42U rack. If you are installing more than one enclosure, install the first enclosure in the bottom of the rack, and then install additional enclosures by moving up the rack with each subsequent enclosure. Plan rack installation carefully because it is difficult to change the location of components after they are installed.
Installing the rear cage into the enclosure
Open all hinges completely.
Position the rear cage at the rear of the enclosure, and align the rear cage guiding fins with the guiding groove in the rack rails. Slide the rear cage fully into the enclosure. CAUTION: Do not touch or bump rear cage connector pins when installing the rear cage into the enclosure.

Close the hinges, and tighten the thumbscrews to secure the rear cage.

Component installation

The following sections contain installation instructions for the individual enclosure components. All components must be installed and cabled before you power up the enclosure. There is no specific installation order requirement for the enclosure components.
Installing a power supply
See "Running the Insight Display installation steps (on page 64)" for information on the types of power configurations available and how to set them up. If your HP BladeSystem c7000 Enclosure is equipped with a three-phase power configuration, six power supplies are required. Single-phase configurations can have fewer than six power supplies. Install the power supplies based on the total number of supplies needed:
Two power supplies: Bays 1 and 4 Three power supplies: Bays 1, 2, and 4 Four power supplies: Bays 1, 2, 4, and 5 Five power supplies: Bays 1, 2, 3, 4, and 5 Six power supplies: All bays
Install power supply blanks in any unused power supply bays. Power supplies are installed in this manner to provide maximum flexibility for redundancy in three-phase configuration options. CAUTION: Do not mix HP 2250W, HP 2400W High Efficiency, HP BL7000 2400W Platinum, or -48vDC power supplies in one enclosure. Install only one type of power supply in a single enclosure.
NOTE: This document discusses installation of AC power supplies only. For information on configuring DC power supplies or HP Carrier Grade Solutions, see the documentation that came with your power supply. To install a power supply:
Slide the HP BladeSystem Insight Display to the right or left to gain access to all power supply bays. Open the power supply bracket.
Insert the power supply into the enclosure, and then close the bracket.
Check the power supply LEDs (on page 14) to determine the status of the power supply. To calculate how many power supplies are needed, see the HP BladeSystem Power Sizer (http://www.hp.com/go/bladesystem/powercalculator).

Installing blades

The c7000 enclosure is divided into four quadrants by the vertical support metal work. Within each quadrant, a removable divider supports half-height blades. To install a full-height blade in any quadrant, this divider must be removed. Therefore, a quadrant can only contain either full-height blades or halfheight blades. CAUTION: Failure to install the divider in a quadrant when installing half-height blades can result in damage to the connectors on the server blades.
Blade Zone 1 Blade Zone 2 Blade Zone 3 Blade Zone 4
Storage blades and tape blades can be installed in the same quadrant as both full-height and half-height blades. A bracket ships with each SB40c Storage Blade that allows a half-height blade to be mounted on top of the storage blade. The lower tape or storage blade cannot be removed without first removing the upper half-height blade.

The following table lists the available configurations for full-height devices installed in device bay N (18). Connection

NIC 1 NIC 2 NIC 3 NIC 4

1/Port N+8 2/Port N+8 1/Port N 2/Port N 3/Port N 4/Port N 3/Port N+8 4/Port N+8

Comments

One double-wide interconnect module Only port 1 of a two-port card can be connected
5/Port N 6/Port N 7/Port N 8/Port N 5/Port N 7/Port N 7/Port N+8 8/Port N+8 5/Port N+8 6/Port N+8 5/Port N+8 7/Port N+8
Up to four single-wide interconnect modules
Mezzanine slot 24x cards Mezzanine slot 31x or 2x cards
4x port 1 4x port 2 1x/2x port 1 1x/2x port 2 1x/2x port 3 1x/2x port 4
One or two double-wide interconnect modules Up to four single-wide interconnect modules

Mezzanine slot 34x cards

Mapping BL2x220c Blades
To support network connections for specific signals, install an interconnect module in the bay corresponding to the embedded NIC or mezzanine signals.
Interconnect device mapping for double dense server blades
The following table lists the available configurations for double dense server blades installed in device bay N (1-16).
Server A Embedded NIC Server A Mezzanine Server B Embedded NIC Server B Mezzanine
NIC 1 (ENET:1) NIC 2 (ENET:2) Port 1 Port 2 NIC 1 (ENET:1) NIC 2 (ENET:2) Port 1 Port 2
1/Port N 3/Port N 5/Port N 6/Port N 2/Port N 4/Port N 7/Port N 8/Port N
Interconnect device mapping for AMC Telco I/O expansion blades
The following table lists the available configurations for AMC Telco I/O expansion blades installed in device bay N (1-16). Connection

AMC Embedded (1)

Port 1 Port 2 Port 3 Port 4
1/Port N 2/Port N 3/Port N 4/Port N 5/Port N 6/Port N 7/Port N 8/Port N

AMC Embedded (2)

Port 5 Port 6 Port 7 Port 8
Interconnect bay identification

Bay-to-bay crosslinks

Four trace SerDes signals between adjacent bays are provided in the enclosure midplane to permit bay-tobay communications. Interconnect modules can only connect horizontally.

Device bay crosslinks

Device bay crosslinks are wired between adjacent horizontal device bay pairs.
For half-height blades, these signals connect a four-lane PCIe module to a partner blade such as a tape blade or a PCI expansion blade. For full-height blades, these signals are used to connect a PCIe module to a partner blade in the lower adjacent bay and require a PCIe pass-thru mezzanine card installed in mezzanine connector 3. The Onboard Administrator disables the device bay crosslinks when they cannot be used, such as when two server blades reside in adjacent device bays.

Serial connector VGA connector
Enclosure linkdown port Enclosure linkup port and service port

Enclosure link cabling

Two enclosure link ports are provided on the rear of the enclosure. Link multiple enclosures installed in one rack to:
Allow any active Onboard Administrator module to access the linked enclosures. Use the enclosure link-up port on the top enclosure for temporary connection to a PC using the enclosure service port ("Cabling a PC to the enclosure service port" on page 58) to provide quick access to any Onboard Administrator module, iLO 2, or interconnect module with Ethernet management ability. Allow enclosure settings to be shared between enclosures, which simplifies deployment of multiple enclosures. NOTE: The enclosure link ports are designed only to support c-Class enclosures in the same rack. The enclosure link-up port on the top enclosure is the service port, and the enclosure linkdown port on the bottom linked enclosure is unused. NOTE: If more c-Class enclosures are added to the rack at a later time, the open enclosure link-up port on the top enclosure can be used to link the new enclosure. NOTE: The HP BladeSystem c-Class enclosure link ports are not compatible with the HP BladeSystem p-Class enclosure link ports.
To link the enclosures, use a standard Category 5 (CAT5) patch cable to connect the enclosure link-down port on the first enclosure to the enclosure link-up port on the second enclosure.
Cabling a PC to the enclosure service port
A PC can be temporarily connected to the enclosure to access the Onboard Administrator modules, iLO 2, and interconnect modules with Ethernet management ability. When enclosures in the same rack are linked, connecting a PC to the service port enables you to access the Onboard Administrator modules, iLO 2, and interconnect modules for all linked c-Class enclosures in that rack. NOTE: The service port is the enclosure link-up port on the top enclosure in a group of linked enclosures. If the enclosures are not linked together, each enclosure has a service port. Only one PC at a time can be connected to a group of linked enclosures using the service port.
Use the Insight Display on the enclosure you are logging into to obtain the Service IP address of that active Onboard Administrator module on the Enclosure Info screen. The Service IP address can be found in the Enclosure Settings screen. Connect the laptop or PC 10/100Mb Ethernet port configured for DHCP addressing to the available link-up port on the top enclosure in the rack using a standard CAT5 patch cable. A Windows PC automatically obtains an IP address. If no IP address is obtained, configure the PC Ethernet port for static addressing using the IP address 169.254.1.254 with a netmask of 255.255.0.0. Open a web browser on the PC and enter the active Onboard Administrator module Service IP address found in the Enclosure Info screen in step 2. Log into the Remote Onboard Administrator. See the HP BladeSystem Onboard Administrator User Guide for information on using the Remote Onboard Administrator feature.

Dark (no power)The Insight Display has a 2-minute inactivity period. If no action is taken and no alert condition exists, the enclosure UID is off, or the chat mode has not been activated, the screen light turns off after 2 minutes. Pressing any button on the Insight Display reactivates the screen.
The Enclosure Health icon is located on the bottom left corner of every screen, indicating the enclosure health. To access the Health Summary screen from any Insight Display screen, navigate the cursor to the Enclosure Health icon and press OK. For information on driver and firmware updates, see the HP website (http://www.hp.com/go/blades/).
Running the Insight Display installation steps
To identify the enclosure, the rear enclosure UID light and the background of the Insight Display are illuminated blue when the enclosure is powered on initially. When the enclosure is powered up for the first time, the Insight Display launches an installation wizard to guide you through the configuration process. At the beginning of the installation, the wizard automatically powers on the enclosure UID. After the installation is complete, the wizard powers off the enclosure. After configuring the enclosure, the Insight Display verifies that there are no installation or configuration errors. If errors are present, the Insight Display guides you through the process of correcting the errors. The Installation Wizard
HP BladeSystem Insight Display 64
automatically turns on the enclosure UID at the beginning of the installation and turns it off after the installation is complete. The Enclosure Settings screen is the first screen to appear. The background color is blue because the enclosure UID is active when this screen appears.
Review each setting on the Enclosure Settings screen for accuracy. To change any value, move the cursor to the menu option to be edited, and press the OK button. Change the setting to the appropriate value, navigate the cursor to Accept, and press the OK button to return to the Enclosure Settings menu. Repeat this step until all options on the Enclosure Settings menu are accurate. TIP: Select the ? icon to access detailed help information about each setting or topic.
TIP: Within any menu option, navigate the cursor to What is This, and press the OK button to view additional information about each setting, option, or alert.
When all settings on the Enclosure Settings menu are accurate, move the cursor to Accept All, and press the OK button to accept the current settings. You can change the following options in the Enclosure Settings screen: Redundant Power ModeThe default setting is AC Redundant. The following selections are valid:
AC Redundant Power Supply Redundant
HP BladeSystem Insight Display 65

Limit AC Input VAThe default setting is Not Set. You can change the Max AC Watts in increments of 50 Watts. Power SavingsThe default setting is Enabled. The following selections are valid:
EnabledYou can place some of the power supplies on standby automatically to increase overall enclosure power subsystem efficiency. DisabledAll power supplies share the load; the power subsystem efficiency varies based on load.
OA1 IP AddrThe default setting is DHCP. If no IP address is received, the IP address is 0.0.0.0. The IP address, mask, and gateway are set within this option. OA2 IP AddrIf this module is present, the default setting is DHCP. If no IP address is received, the IP address is 0.0.0.0. If only one Onboard Administrator module is installed, the screen will display Not Present. Enclosure NameThe default setting is a unique factory-assigned name. The accepted character values are 09, AZ, az, -, _ and. is used to signal the end of the name. NOTE: Do not use the symbol in the middle of a text field. Entries in text fields will be truncated to the last character before the symbol. TIP: Select Clear from the navigation bar to quickly clear entries in text fields up to the symbol. Rack NameThe default setting is UnnamedRack The accepted character values are 09, AZ, az, -, _ and. is used to signal the end of the name. Insight Display PIN#The default setting is Not Set. HP recommends that you set a PIN to protect the enclosure configuration from unauthorized changes. You must enter the PIN after each inactivity period to change options in the Enclosure Settings menu. The accepted character values are 09, A Z, az, -, _ and. is used to signal the end of the name.
Navigate to the Accept All button at the bottom of the Enclosure Settings screen, and press the OK button to accept all the settings and continue. In the Check: Linked Enclosures screen, the message Linked enclosures detected appears if the Onboard Administrator module detects other enclosures. Use the up and down arrow buttons to change Push Settings = to one of the following values:
HP BladeSystem Insight Display 66
YesCopy the configured power settings, rack name, and LCD Lockout PIN (if set) from the Enclosure Settings screen to the detected enclosures. NoContinue configuring the current enclosure only. The Insight Display installation wizard must be run on each of the other detected enclosures. Select this option if each enclosure requires different power settings. IMPORTANT: If your facility uses Static IP addressing for the Onboard Administrator modules, you must manually enter those IP addresses into the Insight Display for each Insight Display separately. You can enter those Onboard Administrator module IP addresses before you send the settings to adjacent enclosures. You can return to the Enclosure Settings menu after the Installation Wizard completes to change the Onboard Administrator module IP addresses, if necessary.

When the enclosure UID LED is off, the Insight Display is illuminated amber when any error condition exists. The navigation bar displays the following selections when an error condition exists:
Health summary iconDisplays the Health Summary screen. Fix THISSuggests corrective action to clear the current error. Next AlertDisplays the next alert, or if none exist, displays the Health Summary screen. Previous AlertDisplays the previous alert.

Power errors

Power errors can occur because of insufficient power to bring up an enclosure. Power errors can occur on blades, storage blades, or interconnect modules. To correct a power error:
Use the arrow buttons to navigate to Fix This, and press OK. Review and complete the corrective action suggested by the Insight Display. In most cases, you must either add power supplies to the enclosure or remove the indicated components.

Cooling errors

Cooling errors occur when too few fans are installed in the enclosure or when the existing fans are not installed in an effective configuration. Cooling errors can occur on blades, storage blades, or interconnect modules. To correct a cooling error:
Use the arrow buttons to navigate to Fix This, and press OK. Review and complete the corrective action suggested by the Insight Display. In most cases, you must either add fans to the enclosure, correct the fan configuration, or remove the indicated components.

Location errors

Location (installation) errors occur when the component is not installed in the appropriate bay. Location errors can occur on blades, storage blades, power supplies, and fans. To correct a location error:
Use the arrow buttons to navigate to Fix This, and press OK. Review and complete the corrective action suggested by the Insight Display. Remove the indicated component, and install it into the correct bay. The Insight Display will indicate the correct bay number.

Configuration errors

Configuration errors can occur if the interconnect modules are installed in the wrong bays or if mezzanine cards are installed in the wrong connectors in the blade. Configuration errors can occur on blades and interconnect modules. To correct a configuration error:
Use the arrow buttons to navigate to Fix This, and press OK. Review and complete the corrective action suggested by the Insight Display. Depending on the error received, do one of the following:
Remove the indicated interconnect module and install it into the correct bay (the Insight Display indicates the correct bay). Remove the blade to correct the mezzanine card installation (the Insight Display will indicate the correct bay). For information on installing the mezzanine card, see the server-specific user guide on the Documentation CD.

Device failure errors

Regulatory compliance notices
Regulatory compliance identification numbers
For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number. The regulatory model number is not the marketing name or model number of the product.
Federal Communications Commission notice
Part 15 of the Federal Communications Commission (FCC) Rules and Regulations has established Radio Frequency (RF) emission limits to provide an interference-free radio frequency spectrum. Many electronic devices, including computers, generate RF energy incidental to their intended function and are, therefore, covered by these rules. These rules place computers and related peripheral devices into two classes, A and B, depending upon their intended installation. Class A devices are those that may reasonably be expected to be installed in a business or commercial environment. Class B devices are those that may reasonably be expected to be installed in a residential environment (for example, personal computers). The FCC requires devices in both classes to bear a label indicating the interference potential of the device as well as additional operating instructions for the user.

FCC rating label

The FCC rating label on the device shows the classification (A or B) of the equipment. Class B devices have an FCC logo or ID on the label. Class A devices do not have an FCC logo or ID on the label. After you determine the class of the device, refer to the corresponding statement.

Class A equipment

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at personal expense.

Cables

Connections to this device must be made with shielded cables with metallic RFI/EMI connector hoods in order to maintain compliance with FCC Rules and Regulations.
Regulatory compliance notices 91
Canadian notice (Avis Canadien)
Class A equipment This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numrique de la classe A respecte toutes les exigences du Rglement sur le matriel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numrique de la classe B respecte toutes les exigences du Rglement sur le matriel brouilleur du Canada.
European Union regulatory notice
Products bearing the CE marking comply with the following EU Directives:
Low Voltage Directive 2006/95/EC EMC Directive 2004/108/EC Ecodesign Directive 2009/125/EC, where applicable
CE compliance of this product is valid if powered with the correct CE-marked AC adapter provided by HP. Compliance with these directives implies conformity to applicable harmonized European standards (European Norms) that are listed in the EU Declaration of Conformity issued by HP for this product or product family and available (in English only) either within the product documentation or at the following HP website (http://www.hp.eu/certificates) (type the product number in the search field). The compliance is indicated by one of the following conformity markings placed on the product: For non-telecommunications products and for EU harmonized telecommunications products, such as Bluetooth within power class below 10mW.
For EU non-harmonized telecommunications products (If applicable, a 4-digit notified body number is inserted between CE and !).
Please refer to the regulatory label provided on the product. The point of contact for regulatory matters is Hewlett-Packard GmbH, Dept./MS: HQ-TRE, Herrenberger Strasse 140, 71034 Boeblingen, GERMANY.
Regulatory compliance notices 92
Disposal of waste equipment by users in private households in the European Union
This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or the shop where you purchased the product.

recommended ambient operating temperature

unit identification

uninterruptible power system

universal serial bus

AC power configuration, single-phase 59 AC power configuration, three-phase 63 AC power configurations 59, 63 accessing a server blade with local KVM 41 accessing local media devices 42 airflow requirements 8, 10 alerts 64, 69, 79, 80, 81 AMC Telco port mapping 53 authorized reseller 82 configurations, power 59 configuring the enclosure with HP BladeSystem Insight Display 64 cooling errors 80 creating a full-height device bay blank 36 critical alerts 68, 69, 79 crosslinks, bay to bay 54 CSR (customer self repair) 82 customer self repair (CSR) 82
Declaration of Conformity 91 device bay crosslinks 54 device bay numbering 15 device bay shelf, installing 38 device bay shelf, removing 35 device failure errors 81 diagnosing problems 77 disassembling the enclosure 22 double dense server blade port mapping 52
batteries, replacing 94 battery replacement notice 94 bay numbering, full-height device 15 bay numbering, half-height device 15 bay numbering, interconnect 20, 53 bay numbering, power supply 14 bay to bay crosslinks 54 BL2x220c blades, mapping 52 Blade and Port Info screen 68, 73 BSMI notice 93
electrical grounding requirements 12 electrostatic discharge 96 Enclosure Info screen 72 enclosure LEDs 13, 74 enclosure link cabling 57 enclosure link-down port 56, 57, 58 enclosure link-up port 56, 57, 58 Enclosure Settings screen 72 enclosure, configuring 64 enclosure, disassembling 22 enclosure, installing into rack 25 errors, configuration 80 errors, cooling 80 errors, device failure 81 errors, fan 80 errors, installation 80 errors, location 80 errors, power 80 Ethernet switches 47 European Union notice 92
cable configuration 56, 57, 58 cables 56, 91 cables, FCC compliance 91 cables, overview 56 cabling network to enclosure 58 cabling, enclosure link 57 cabling, Onboard Administrator module 56 cabling, service port 56, 57, 58 Canadian notice 91 Chat Mode screen 76 class A equipment 90 class B equipment 90 components, front panel 13, 15 components, identification 13, 15 components, installation 30, 46 components, Onboard Administrator 18, 19, 46 configuration errors 80 configuration, fan 43

Technologies in the HP BladeSystem c7000 Enclosure
Technology brief, 5th edition
Introduction..... 2 Overview of HP BladeSystem c7000 Enclosure.... 2 Enclosure management.... 4 BladeSystem Onboard Administrator... 4 ProLiant Onboard Administrator for ProLiant server blades... 9 Insight Display.... 9 Insight Control.... 10 Interconnect options and infrastructure... 11 Interconnect modules..... 12 Server blades..... 13 Storage options inside the BladeSystem enclosure... 13 Mezzanine cards..... 15 Virtual Connect.... 15 Fabric connectivity and port mapping.... 17 c7000 bay-to-bay crosslinks... 18 HP Thermal Logic technologies... 19 Active Cool 200 fans.... 20 HP PARSEC architecture.... 21 Thermal Logic for the server blade.... 23 Sea of Sensors.... 24 Power supplies and enclosure power subsystem... 25 Conclusion..... 30 Appendix: Fan and server population guidelines... 32 Fan bay numbering.... 32 Server blade bay numbering.... 32 Enclosure blade zones.... 33 For more information.... 35

Introduction

The HP BladeSystem c7000 Enclosure is an evolution of the entire rack-mounted infrastructure. It consolidates and repackages all the supporting infrastructure elementscompute, storage, network, and powerinto a single infrastructure-in-a-box that accelerates the integration and optimization of the data center. This technology brief provides an overview of the HP BladeSystem c7000 Enclosure, including Thermal Logic power and cooling technologies and interconnect options. More information about the infrastructure components and BladeSystem technologies is available on the HP website: www.hp.com/go/bladesystem.
Overview of HP BladeSystem c7000 Enclosure
The HP BladeSystem c7000 Enclosure was the first enclosure implemented using the BladeSystem c-Class architecture. 1 It is optimized for enterprise data center applications. It fits into standard size HP and third-party racks; accommodates BladeSystem c-Class server blades, storage blades, and interconnect modules; and provides all the power, cooling, and I/O infrastructure needed to support them throughout the next several years. The c7000 enclosure can be populated with the following components: Up to 8 full-height (FH) or 16 half-height (HH) server, storage, or other option blades per enclosure Up to eight interconnect modules simultaneously supporting a variety of network interconnect fabrics such as Ethernet, Fibre Channel (FC), InfiniBand (IB), Internet Small Computer System Interface (iSCSI), or Serial-attached SCSI (SAS) Up to 10 Active Cool 200 fan kits Up to six power supplies Redundant BladeSystem Onboard Administrator (OA) management modules (optional activestandby design) Figures 1 and 2 show front and rear views of the c7000 enclosure. The c7000 enclosure and the c3000 enclosure support many of the same critical components such as servers, interconnects, mezzanine cards, storage blades, power supplies, and fans.
HP also offers the HP BladeSystem c3000 Enclosure, which is optimized for remote sites or small businesses. More information about the c3000 enclosure is in the technology brief titled HP BladeSystem c3000 Enclosure technologies: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01508406/c01508406.pdf.
Figure 1. HP BladeSystem c7000 Enclosure front view
Figure 2. HP BladeSystem c7000 Enclosure rear view
The c7000 enclosure is10U high and includes a shared, 5-terabit-per-second, high-speed NonStop midplane for wire-once connection of server blades to network and shared storage. A pooled-power backplane delivers power and ensures that the full capacity of the power supplies is available to all server blades and interconnects. The enclosure is available with either a single-phase AC, three-phase AC, or -48V DC power subsystem to meet the needs of the data center power infrastructure. The c7000 Enclosure has redundant signal paths between servers and interconnect modules (Figure 3). The NonStop signal midplane and separate power backplane in the c7000 enclosure have no active components. Separating the power delivery in the backplane from the high-speed interconnect signals in the midplane results in minimal thermal stress to the signal midplane.

Role-based user accounts The BladeSystem Onboard Administrator provides configurable user accounts that can provide complete isolation of multiple administrative roles such as server, LAN, and SAN. User accounts are configured with specific device bay or interconnect bay permissions and one of three privilege levels: administrator, operator, or user. An account with administrator privileges including BladeSystem Onboard Administrator bay permission can create or edit all user accounts on an enclosure. Operator privileges allow full information access and control of permitted bays. User privileges allow information access but no control capability. The BladeSystem Onboard Administrator requires user login to the web GUI or CLI with an account ID and password. For a local account, the password is stored on the BladeSystem Onboard Administrator. For an LDAP account, the BladeSystem Onboard Administrator contacts the defined LDAP server to check the user credentials. Two-factor authentication allows even tighter security for the user management session to the BladeSystem Onboard Administrator. Enclosure linking Rather than requiring separate logins to access multiple management processors within each enclosure, the BladeSystem Onboard Administrator allows single point access. Thus, an administrator can use single sign-on to log in to a single BladeSystem Onboard Administrator and use the web GUI to graphically view and manage the HP BladeSystem c-Class components in up to seven linked enclosures. For example, an IT administrator could automatically propagate management commandssuch as changing the enclosure power modethroughout the linked enclosures. The c7000 enclosure contains two enclosure link ports to allow any active BladeSystem Onboard Administrator module to access linked enclosures. On a standalone enclosure or upper enclosure in a series of linked enclosures, the upper enclosure link-up port functions as a service port for temporary connection to a PC with a CAT5 patch cable. It provides quick access to any BladeSystem Onboard Administrator module, ProLiant Onboard Administrator (iLO 2 or iLO 3), or interconnect module with Ethernet management ability. The enclosure link-down port connects to the enclosure link-up port on the enclosure below it. Linking the enclosures enables the rack technician to access all the enclosures through the open link-up/service port. If more c-Class enclosures are added to the rack, they can be linked through the open enclosure link-up port on the upper enclosure or the link-down port on the bottom enclosure. NOTE
The linked enclosures will enforce a common rack name on all the linked enclosures unless different rack names are established prior to linking the enclosures and not changed after linking the enclosures.

IMPORTANT

The HP BladeSystem c-Class Enclosure link ports are not compatible with the HP BladeSystem p-Class Enclosure link ports.
ProLiant Onboard Administrator for ProLiant server blades
HP BladeSystem c-Class employs ProLiant Onboard Administrator (iLO2 or iLO 3) to configure, update, and operate individual server blades remotely. The c7000 enclosure includes an Ethernet management network to aggregate all ProLiant Onboard Administrator (iLO 2 or iLO 3) management communications across the entire enclosure. This management network connects ProLiant Onboard Administrator (iLO 2 or iLO 3) processors to the BladeSystem Onboard Administrator through the BladeSystem Onboard Administrator tray, as illustrated in Figure 4. The BladeSystem Onboard Administrator provides direct access to each ProLiant Onboard Administrator (iLO 2 or iLO 3) through the enclosure management network. The BladeSystem Onboard Administrator uses this network to manage pooled enclosure power and cooling, which results in substantial energy savings over the same number of individual rack-mounted servers.

Insight Display

The Insight Display, Figure 5, is an ever-ready, enclosure-mounted information exchange device with access to all BladeSystem Onboard Administrator setup, management, and troubleshooting features. It is a quick and easy-to-use device that allows technicians to initially configure the enclosure. It also provides information about the health and operation of the enclosure. The Insight Display is effective mechanically because it is large enough to see ample information, and it can slide back and forth to allow access to the power supplies.
Figure 5. Insight Display on the c7000 enclosure
When the c7000 enclosure is initially powered on, the enclosure UID LED and the Insight Display are illuminated blue to identify the enclosure being configured. The Insight Display automatically launches an installation wizard to guide the user through the configuration process. After the enclosure is configured, the Insight Display verifies that there are no installation or configuration errors. The Installation Wizard turns off the enclosure UID when the installation is complete. When an error or alert condition is detected, the Insight Display Health Summary screen displays the total number of error conditions and their locations in the order of error severity (Figure 6). Failure alerts (if any exist) display first and then caution alerts. Providing this level of diagnostic information for each enclosure dramatically shortens setup, repair, and troubleshooting time. For example, in Figure 6 the Insight Display diagnostic screen reports an error in power supply bay 5. The Health Summary screen shows the power supply in bay 5 as red. When the technician selects View Alert, the Device Error Summary screen indicates the same condition. The Device Error detail in the third screen shows that the power supply in bay 5 has failed. When the technician selects fix on the Device Error screen, suggestions for corrective action appear (in this case an animation indicating the proper positions when replacing power supplies in the c7000 enclosure).

Figure 6. BladeSystem c-Class Insight Display diagnostic screens indicating an error and suggested corrective action
More information about the Insight Display is available in the technology brief titled Managing the HP BladeSystem c-Class: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00814176/c00814176.pdf.

Insight Control

Insight Control delivers essential management for HP BladeSystem lifecycles, including proactive health management, lights out remote control, optimization of power usage, rapid server deployment, performance analysis, vulnerability scanning and patch management, and virtual machine management. The software is delivered on DVD media. It includes an integrated installer to rapidly and consistently deploy and configure HP Systems Insight Manager (HP SIM) and essential infrastructure management software. The integrated installer includes a wizard-based interface that presents a series of configuration questions. When the user has answered the configuration questions, each of the selected components will be deployed in a single process. The HP Insight Software Advisor checks to ensure that the host central management server meets all installation pre-requites before installation. When installation is complete, the Insight Software Update Utility will check for available software updates. HP Insight Control installs and licenses the following components for use: HP Systems Insight Manager HP iLO 2 or iLO 3 Advanced for BladeSystem Insight Control performance management Insight Control power management Insight Control server deployment Insight Control server migration Insight Control virtual machine management Insight Control integrates with leading enterprise management platforms through industry standards. It includes one year of 24 x 7 HP Software Technical Support and Update Service.
Interconnect options and infrastructure
A key component of the c7000 enclosure is the I/O infrastructureessentially, a NonStop signal midplane that provides the internal wiring between the server or storage blades and the interconnect modules. The NonStop signal midplane is an entirely passive board that takes advantage of serializer/deserializer (SerDes) technology to support multiple protocols and provide point-to-point connectivity between device bays and interconnect bays. The term passive means there are no active electrical components on the board. On one side of the board are the sixteen connectors for the server/storage blades. Internal traces link them to the eight connectors on the other side of the board for the interconnect modules (Figure 7). The signal midplane also includes the management signals from each bay to the BladeSystem Onboard Administrator modules. These management signals are completely isolated from the highspeed server-to-interconnect signals. The BladeSystem Onboard Administrator is the terminating point for all interconnect bays. An interconnect module cannot use the connection to the BladeSystem Onboard Administrator to communicate with another interconnect module.

Interconnect modules in the c7000 are available in two widths: single- and double-wide. Single-wide modules provide sixteen internal ports, each connected to a separate device bay in the front of the enclosure. Double-wide modules provide sixteen double-wide internal ports providing connectivity to DDR InfiniBand and other 4-lane, high speed interconnects. Each interconnect module also provides external connectors that vary based on its particular design. In the c7000 enclosure, pairs of single-wide interconnect modules installed in adjacent horizontal bays provide redundant connectivity for dual-port interfaces in each device bay. Adjacent interconnect modules also have high-speed cross-connect capability through the enclosures NonStop signal midplane. For double-wide interconnects such as DDR InfiniBand, two modules are installed in c7000 interconnect bays 5 and 7 to provide redundant high bandwidth connectivity. NOTE
The c-Class Ethernet Pass-Thru Module only supports fixed-speed gigabit Ethernet. Because the server, storage, or other option blades are connected through SerDes to the interconnect bays, and SerDes Ethernet does not have an auto-negotiation protocol, a switch is required to connect to 10/100 networks outside of the enclosure. The 10 Gb Ethernet Pass-Thru Module supports 1 Gb or 10 Gb connections to the server. Note that this is a limitation of the 1 GB Ethernet Pass-Thru Module only. The Fibre Channel Pass-Thru Module ports do auto-negotiate.

Server blades

Server blades for the BladeSystem c7000 enclosure are built according to c-Class standard formfactors referred to as half-height and full-height. The enclosure can hold either full-height or half-height server blades or a combination of the two. The enclosure is preconfigured with device bay dividers to house half-height server or storage blades. Dividers must be removed to accommodate full-height server blades. For connectivity, every server blade ships with at least two built-in Ethernet connections. To maintain flexibility, the server blades use optional mezzanine cards to provide additional interconnect fabric connections such as 10GbEthernet, InfiniBand, and Fibre Channel. Half-height server blades typically have two embedded Gigabit NICs and two c-Class PCIe mezzanine option connectors. A half-height server configured with one dual-port Gigabit NIC mezzanine card and one quad-port NIC mezzanine card provides eight independent NICs. Fullheight server blades typically have four embedded Gigabit NICs and three c-Class PCIe mezzanine option connectors. A full-height server configured with three quad-port Gigabit NIC mezzanine cards provides sixteen independent Gigabit NICs. The inherent flexibility of c-Class design allows customers to configure up to four different interconnect fabrics without sacrificing redundancy or performance. The most up-to-date information about c-Class server blades is available at this website:

www.hp.com/go/bladesystem/.
Storage options inside the BladeSystem enclosure
Storage options inside the enclosure provide an alternative to local disk drives or SAN connectivity. The c7000 enclosure supports several types of storage solutions. Tape and PCI option blades are also available for c-Class. Each of these blades increases configuration flexibility by adding options that would not fit inside the server blade.
Direct attach storage blades The StorageWorks SB40c Storage Blade delivers direct attach storage for c-Class server blades, with support for up to six hot plug small form factor (SFF) SAS or SATA hard disk drives. The enclosure backplane provides a PCIe connection to the adjacent c-Class server blade and enables high performance storage access without any additional cables. The SB40c Storage Blade features an onboard Smart Array P400 controller with 256 MB battery-backed write cache, for increased performance and data protection. For mechanical compatibility, storage blades use the same halfheight form factor as server blades. The SB40c direct attach storage blade must be paired with an adjacent server blade in the same cooling zone. This is because the physical connection between the direct attach storage blade and its adjacent server blade is a dedicated x4 PCIe connection across the NonStop midplane that connects the adjacent bays. The half-height server blade and direct attach storage blade must be paired in specific bays. Refer to the appendix for bay number details. A mezzanine card is not required to connect a half-height server blade to a direct attach storage blade. A mezzanine card is required to connect a full-height server blade to a direct attach storage blade. The card must be in the Mezzanine 3 connector to allow full use of the interconnect bays with Type I or Type II mezzanine cards, to be consistent with the half-height blades, and to enable mixing half-height and full-height server blades in the same enclosure. NOTE
When used with a full-height server blade, the direct attach storage blade must be in the bottom bay. To maintain essential airflow, a blank must be attached above the storage blade to block the empty upper bay, or a half-height server blade must be inserted into the upper bay. For this configuration, the storage blade should be installed before the half-height server blade is installed, and the half-height server blade should be removed before the storage blade is removed.

Table 1. Compatibility of mezzanine cards and mezzanine connectors in ProLiant c-Class server blades
c-Class server blades Mezz connector 1 Full height Half height Mezz connector 2 Full height Half height Mezz connector 3 Full height Half height
Type I mezz card yes yes yes yes yes yes
Type II mezz card no no yes yes yes no
For the most up-to-date information about the c-Class mezzanine card options, go to the HP website: http://h18004.www1.hp.com/products/blades/components/c-class-interconnects.html.

Virtual Connect

Virtual Connect technology is a set of interconnect modules and embedded software for c-Class enclosures that simplifies the setup and administration of server connections. HP Virtual Connect includes the following components: HP 1/10 Gb-F Virtual Connect Ethernet Module HP Virtual Connect Flex-Gb Ethernet Module HP Virtual Connect FlexFabric 10 Gb/24-port Module HP Virtual Connect 4 Gb Fibre Channel Module HP Virtual Connect 8 Gb 20-Port Fibre Channel Module HP Virtual Connect 8 Gb 24-Port Fibre Channel Module HP Virtual Connect Manager Virtual Connect implements server-edge virtualization so that server administrators can add, replace, or move server blades within their enclosures without changes being visible to the external LAN and
SAN environments. HP recommends using Virtual Connect or managed switches to reduce cabling and management overhead. Like Ethernet and Fibre Channel switches, Virtual Connect modules slide into the interconnect bays of c-Class enclosures. To support Fibre Channel, the enclosure must have at least one Virtual Connect Ethernet module, because the Virtual Connect Manager software runs on a processor that resides on the Ethernet module. HP Virtual Connect Enterprise Manager software is also available for centralized management of multiple c-Class enclosures and Virtual Connect domains. When the LAN and SAN connections are made to the pool of servers, the server administrator uses Virtual Connect Manager to define a server connection profile for each server. Instead of using the default media access control (MAC) addresses for all network interface controllers (NICs) and default World Wide Names (WWNs) for all host bus adapters (HBAs), the Virtual Connect Manager creates bay-specific profiles, assigns unique MAC addresses and WWNs to these profiles, and administers them locally. Network and storage administrators can establish all LAN and SAN connections once during deployment. If servers are later deployed, added, or changed, no connection changes are needed because Virtual Connect keeps the profile for that LAN and SAN connection constant. To help administrators fully utilize 10 GbE connection bandwidth, HP introduced Flex-10 technology in the BladeSystem c-Class architecture. Using Flex-10, administrators can partition the bandwidth of a single 10 Gb pipeline into multiple FlexNICs. With Virtual Connect FlexFabric and FlexFabric Adapters, each 10 Gb pipeline includes FlexNICs and a FlexHBA for Fibre Channel over Ethernet and iSCSI traffic. In addition, administrators can dynamically regulate the bandwidth for each FlexNIC and FlexHBA connection by setting it to a user-defined portion of the total 10 Gb connection. Speed can be set from 100 Mb per second to 10 Gb per second in 100 Mb increments. There are advantages to partitioning a 10 GbE pipeline: More NIC connections per server, which is especially important in a virtual machine environment Ability to match bandwidths to the network function, such as management console or production data Flex-10 technology uses two hardware components: Virtual Connect modules HP Virtual Connect Flex-Gb Ethernet Module or HP Virtual Connect FlexFabric 10 Gb/24-port Module Server adapters the 10 Gb Flex-10 LAN-on-motherboard (LOM), the HP NC532m Flex-GbE Network Adapter mezzanine card, the HP NC551i FlexFabric adapter (LOM), the HP NC551m FlexFabric adapter mezzanine card, or the HP NC551m FlexFabric adapter (LOM) The HP Virtual Connect Flex-Gb Ethernet Module or HP Virtual Connect FlexFabric 10 Gb/24port Module is required to manage the 10 GbE (Flex-10) server connections to the data center network. The 10 Gb Flex-10 and FlexFabric adapter LOMs and mezzanine cards are NICs, each with two 10 Gb ports. Each 10 Gb port can be configured from one to a maximum of four individual FlexNICs (for Flex-10 NICs and FlexFabric adapters) or three FlexNICs and one FlexHBA (FlexFabric adapters only). The server ROM and the operating system or hypervisor recognize each FlexNIC and FlexHBA as an individual NIC or HBA, respectively. Full details about Virtual Connect Flex-10 technology and Virtual Connect FlexFabric are available in several technology briefs on the HP BladeSystem Technical Resources website:

http://h18004.www1.hp.com/products/blades/components/c-class-tech-function.html
Fabric connectivity and port mapping
Because the connections between the device bays and the interconnect bays are hard-wired through the NonStop signal midplane, the mezzanine cards must be matched to the appropriate type of interconnect module. For example, a Fibre Channel mezzanine card must be placed in the mezzanine connector that connects to an interconnect bay holding a Fibre Channel switch. Interconnect bays 1 and 2 are reserved for Ethernet switches or pass-thru modules supporting server LAN on Motherboard (LOM) NIC connections to ports on the Ethernet switch or pass-thru module. Supported bays for additional Ethernet switch modules include unpopulated interconnect bays 3/4, 5/6, or 7/8. Redundant switches must be adjacent to one another in interconnect bays 3/4, 5/6, or 7/8. Connecting the ports of embedded devices to the interconnect bays in the c7000 enclosure is relatively simple. For port mapping purposes, it does not matter in which bay a server blade is installed. The mezzanine connectors always connect to the same interconnect bays. Figure 9 shows BladeSystem c7000 port mapping of half-height server blades to interconnect bays. Figure 10 shows BladeSystem c7000 port mapping of full-height server blades to interconnect bays.
Figure 9. HP BladeSystem c7000 port mapping of half-height server blades to interconnect bays
Figure 10. HP BladeSystem c7000 port mapping of full-height server blades to interconnect bays
Port mapping differs slightly between full-height and half-height server blades due to the support for additional mezzanine cards on the full-height version. HP simplified the process of mapping mezzanine ports to switch ports by providing management tools through the BladeSystem Onboard Administrator and HP Systems Insight Manager software. Specific port mapping details can be found in the HP BladeSystem Onboard Administrator User Guide available at this website: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00705292/c00705292.pdf.
c7000 bay-to-bay crosslinks
Four-trace SerDes signals between adjacent bays in the c7000 midplane permit horizontal bay-to-bay communications. Device bay crosslinks Device bay crosslinks are wired between adjacent device bay pairs as indicated by the arrows in the c7000 enclosure front view (Figure 11). For half-height server blades, these signals are used for fourlane PCIe connection to a partner blade such as a tape blade or PCI expansion blade. The two blades always occupy a pair of slots. If the server blade is installed in an odd-numbered bay, the partner blade is installed in the adjacent even-numbered bay to the right. If the server blade is installed in an even-numbered bay, the partner blade is installed in the adjacent odd-numbered bay to the left. For full-height server blades, these signals are used for PCIe connection to a partner blade in the lower adjacent bay and require a PCIe pass-thru mezzanine card installed in mezzanine connector 3. The server blade is installed in an odd-numbered bay. The partner blade is installed in the adjacent even-numbered bay to the right and is always located on the lower row of the enclosure in slot 10, 12, 14, or 16. The BladeSystem Onboard Administrator disables the device bay crosslinks in instances where they cannot be used, such as two server blades residing in adjacent device bays.

Figure 13. Ducted fan cross-section and ducted fan blade compared to traditional server fan
Active Cool 200 fans are controlled by the BladeSystem Onboard Administrator, which can ramp cooling capacity up or down based on system needs. Along with optimizing the airflow, the control algorithm optimizes the acoustic levels and power consumption. As a result, the c7000 enclosure can accommodate full-featured servers that are 60% more dense than traditional rack-mount servers, while
the Active Cool 200 fans consume only 50% of the power typically required and use 30% less airflow. As new Active Cool fans are introduced, they may not interoperate with Active Cool 200 fans. If mixed fans that are not interoperable are detected in an enclosure, the BladeSystem Onboard Administrator will indicate a fan compatibility problem.

HP PARSEC architecture

The c7000 enclosure uses PARSEC architectureparallel, redundant, scalable, enclosure-based cooling. Parallel In this context, parallel means that fresh, cool air flows over all the blades (in the front of the enclosure) and all the interconnect modules (in the back of the enclosure). The enclosure is divided into four cooling zones with fans in each. The Active Cool 200 fans provide cooling for their own zone and redundant cooling for the rest of the enclosure. To ensure scalability, HP designed both the fans and the power supplies with enough capacity to meet the needs of compute, storage, and I/O components well into the future. To optimize thermal design, HP developed a relatively airtight center air plenum, or air chamber. In the c7000 enclosure, all device bays include a shutoff door that is normally closed to prevent air leakage through that device bay. When a server blade is inserted, it seals into the center air plenum docking collar, and the server shut-off door opens to allow airflow across that server blade. Similarly, the fan seals into the center air plenum docking collar. Each fan bay includes louvers that automatically open when a fan is installed. If a fan is not installed or is not functional, the pressure distribution around the fan changes. This pressure change causes the louvers to close, ensuring that cooling air is not diverted through the inoperative fan (Figure 14).
Figure 14. HP BladeSystem c7000 self-sealing enclosure
The enclosure and the components within it optimize the cooling capacity through unique mechanical designs. Managed airflow through the enclosure ensures that every device gets cool air, that no device is in the path of hot exhaust air from another device, and that air goes only where it is needed for cooling. Fresh air is pulled into the interconnect bays through a slot in the front of the enclosure. Ducts allow the air to move from the front to the rear of the enclosure, where it is then pulled into the interconnects and the central plenum. The air is then exhausted out the rear of the system (Figure 15).

For more information about power supply efficiency, see the 80 PLUS website: http://www.80plus.org/manu/psu/psu_detail.aspx?id=41&type=1.
US/Japan three-phase enclosures use a different type of threephase power than International enclosures. For more information, see the Power basics for IT professionals technology brief available on the HP website: http://h20000.www2.hp.com/bc/docs/support/SupportManual/ c01234421/c01234421.pdf.
Pooled power All the power in the c7000 enclosure is part of a single power pool that any server blade within the enclosure can access. This provides maximum flexibility when configuring the power in the system so that customers can choose the required level of redundancy. Because this power design has no zones, it facilitates both N+N and N+1 power modes, which future-proofs the enclosure for higher power requirements, if needed. Therefore, looking forward at least five years, HP believes there is sufficient power capacity to handle future power-hungry devices. The c7000 enclosure has three redundancy modes: AC or DC redundant, power supply redundant, and no redundancy mode. The BladeSystem Onboard Administrator or the Insight Display can be used to select the power redundancy mode. For more information, the HP BladeSystem Onboard Administrator User Guide is available at this website:
http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00705292/c00705292.pdf.
Since all the power supplies share in delivering pooled power to the entire enclosure, the BladeSystem Onboard Administrator report will show that all power supply outputs track each other fairly closely. This distributes the load evenly, which is particularly important when using three-phase AC power. If the user changes the power mode of the enclosure to AC redundant, the BladeSystem Onboard Administrator ensures that equal numbers of power supplies are available on the A and B sides as indicated in Figure 20. This logical grouping ensures that when the enclosure is configured with the three-phase AC input module, all the power supplies on one side will maintain enclosure power if AC input power is lost on the other side. If the user configures the enclosure power mode to N+1 or not redundant, the power supplies can be installed in any bay.
Figure 20. HP BladeSystem c7000 power supplies
Connecting to PDUs with AC redundancy to each rack In an N+N AC redundancy configuration, the total power available equals the amount from the A or B side, whichever contains fewer power supplies. In this configuration, N power supplies are used to provide power and the same number are used to provide redundancy, where N can equal 1, 2, or 3.

Any number of power supplies from 1 to N can fail without causing the enclosure to lose power. When correctly wired with redundant AC line feeds, this configuration will also ensure that a single AC line feed failure will not cause the enclosure to power off. Typical power configuration connecting to an uninterruptible power supply (UPS) In a configuration with N+1 power supply redundancy connecting to a UPS, the total power available equals the total power available less one power supply. Up to six power supplies can be installed and one of them is always available to provide redundancy. In the event of a single power supply failure, the redundant power supply will take over the load of the failed power supply. Connecting with no power redundancy configured In a configuration with no power redundancy, the total power available equals the power available from all installed power supplies. Any power supply or AC line failure will cause the system to power off if the remaining power supplies are unable to handle the full load. The BladeSystem Onboard Administrator manages power allocation rules of various components and can limit overall power capacity for the enclosure. More information on power management is available in the technology brief entitled Managing the HP BladeSystem c-Class: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00814176/c00814176.pdf. Dynamic Power Saver mode Most power supplies operate more efficiently when heavily loaded and less efficiently when lightly loaded. Dynamic Power Saver mode provides power load shifting for maximum efficiency and reliability. Dynamic Power Saver technology maximizes power supply efficiency to reduce operating costs. Power supply efficiency is simply a measure of DC watts output divided by AC or DC watts input. At 50% efficiency, 2000W input would yield 1000W output. The difference is costly wasted energy that generates unnecessary heat. Dynamic Power Saver mode is active by default since it saves power in the majority of situations. When enabled, Dynamic Power Saver runs the required power supplies at a higher use rate and puts unneeded power supplies in standby mode. A typical power supply running at 20% load could have an efficiency rating as low as 60%. However, at 50% load, the efficiency rating could be up to 94%, providing a significant savings in power consumption. In the first example in Figure 21, without Dynamic Power Saver, power demand is low and spread inefficiently across six power supplies. In the second example, with Dynamic Power Saver active, the power load is shifted to two power supplies for more efficient operation. The remaining power supplies are placed in a standby condition. When power demand increases, the standby power supplies instantaneously deliver the required extra power. This enables the power supplies to operate at optimum efficiency, with no effect on redundancy.

Conclusion

The HP BladeSystem c7000 Enclosure is the foundation of a modular computing architecture that consolidates and simplifies infrastructure, reduces operational cost, and delivers IT services more effectively. Thermal Logic technologies provide the mechanical design features, built-in monitoring, and control capabilities that enable IT administrators to optimize their power and thermal environments. The shared, high-speed, NonStop midplane and pooled-power backplane in the enclosure accommodate new bandwidths and new technologies. The BladeSystem Onboard
Administrator supplies the infrastructure to provide essential power and cooling information and help to automate infrastructure management. The HP BladeSystem c7000 Enclosure provides all the power, cooling, and I/O infrastructure to support c-Class modular servers, interconnects, and storage components, today and for the next several years.
Appendix: Fan and server population guidelines
For correct operation, fans and server blades must be installed in the correct bays of the HP BladeSystem c7000 Enclosure. The BladeSystem Onboard Administrator ensures that fans and blades are correctly placed before allowing systems to power on.

Fan bay numbering

Figure A-1 indicates the location of the ten fan bays in the back of the enclosure. Table A-1 identifies the correct bays in which up to ten fans must be located.
Figure A-1. Required order for populating fans in the HP BladeSystem c7000 Enclosure
Table A-1. Fan bay population locations Number of fans Fan bays populated (cooling zones) 4, 5 (Zone 1) and 9, 10 (Zone 3) 3, 4, 5 (Zone 1) and 8, 9, 10 (Zone 3) 1, 2, 4, 5, 6, 7, 9, 10 (all four zones) 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 (all four zones) Device bays supported Two devices located in bays 1, 2, 9 or 10 14, 912 14, 912, 58, 1316 14, 912, 58, 1316
Server blade bay numbering
Half-height server blades should be populated in the front of the enclosure from top to bottom and from left to right. The first two half-height server blades should be placed in bays 1 and 9; the second two half-height server blades should be placed in bays 2 and 10 and so on, until the enclosure is full. Full-height server blades should be populated from left to right.
Figure A-2. Numbering of half-height server bays in the HP BladeSystem c7000 Enclosure

Enclosure blade zones

The c7000 enclosure is divided into four zones by vertical support metalwork. These are not the same as the cooling zones referred to above. Within each zone a removable divider is used to support half-height devices. To install a full-height server blade in any zone, this divider must be removed. Storage blades and tape blades can be installed in the same zone as either full-height or half-height server blades. Each SB40c or tape blade comes with a bracket that allows a half-height blade to be mounted on top of the storage blade.