Product End-of-Life Disassembly Instructions
Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP Compaq dc5850 Microtower Business PC Name / Model #2 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances EL-MF877-00 Template Revision A
Notes With a surface greater than 10 sq cm
Quantity of items included in product 2 to 3 (1 sys board, 1 or 2 P/S PCAs 1
All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps

2. 4, 6, or 7 in P/S

Include the cartridges, print heads, tubes, vent chambers, and service stations.

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1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name MAIN BEZEL Fan duct FAN DUCT
Plastic Part Description P_MAINBEZEL P_FAN_DUCT_01 P_FAN_DUCT_02
Weight (grams) 165 g 99.3 g 51
ISO 11469:2000 Plastic Part Mark >ABS< >PC+ABS FR(40)< >PC+ABS FR(40)<

Optional: Photo

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Phillips screwdriver Description #2 Dikes Description #3 Torx screwdriver T-15 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. To remove the access panel, loosen the captive thumbscrew (1) that secures the access panel to the computer chassis, slide the access panel back (2) about 1.3 cm (1/2 inch), and then lift it off the unit. (see Figure 1). To remove the front bezel, press outward on the two latches on the right side of the bezel and the single latch on the left side of the bezel (1) to release the bottom of the bezel, then swing the bottom of the bezel away from the chassis (2) to release the top of the bezel. (see Figure 2). Remove or cut all expansion cards, cables, and any other devices from the system board. To remove the battery: Locate the battery and battery holder on the system board. Depending on the type of battery holder on the system board, complete the following instructions to remove the battery. TYPE 1 BATTERY HOLDER (see Figure 3): Lift the battery out of the holder. TYPE 2 BATTERY HOLDER (see Figure 4): To release the battery from its holder, squeeze the metal clamp that extends above one edge of the battery. When the battery pops up, lift it out. TYPE 3 BATTERY HOLDER (see Figure 5): Pull back on the clip that holds the battery in place, and then remove the battery. To remove the system board (see Figure 6): a. Remove all expansion boards. b. Disconnect all cables connected to the system board. c. Remove the heatsink from the system board by loosening the four captive screws that secure the heatsink to the system board, and then lifting the heatsink from the system board. b. Remove the seven screws that secure the system board to the chassis. c. Slide the system board toward the front of the computer, and then lift the board up to remove it. To remove the power supply. a. Remove the four screws that secure the power supply to the chassis (see Figure 7). b. Press the tab in front of the power supply that holds it in place (1). c. Slide the power supply toward the front of the computer (2), rotate toward the fan so the power supply clears the lip on the top of the chassis (3), and then lift the power supply out of the chassis (4) (see Figure 8).

HP uses five different power supply vendors. See the instructions below to disassemble and remove required power supply components: POWER SUPPLY 1: a. Using dikes, cut the two plastic clamps that secure the wires to the power supply cover (see Figure 9). b. Using a phillips screwdriver, remove the six screws that secure the cover to the power supply chassis - two screws on top, two screws on the bottom, two screws on the left side (see Figures 10 & 11). NOTE: You do not need to remove the screws from the fan guard or the power connector. EL-MF877-00 Page 2 Template Revision A
c. Slide the cover off the power supply. d. Using dikes, cut all cables connecting the PCA to the power supply. e. From the bottom of the power supply, remove the three screws that secure the power supply PCA to the chassis (see Figure 12). f. Remove the power supply PCA from the power supply chassis. g. Cut the small PCA from the large power supply PCA (see Figure 13). h. Cut two capacitors from the PCA, as shown in Figure 13.
POWER SUPPLY 2: a. Using dikes, cut the plastic clamp that secures the wires to the power supply cover (see Figure 14). b. Using a phillips screwdriver, remove the six screws that secure the cover to the power supply chassis - all six screws are on top (see Figure 15). NOTE: You do not need to remove the screws from the fan guard or the power connector. c. Lift the cover off the power supply. d. Using dikes, cut all cables connecting the PCA to the power supply. e. From the inside, remove the four screws that secure the power supply PCA to the chassis (see Figure 16). f. Remove the PCA from the power supply chassis. g. Cut the small PCA from the large power supply PCA (see Figure 16) h. Cut four capacitors from the PCA, as shown in Figure 16. POWER SUPPLY 3: a. Using dikes, cut the plastic clamp that secures the wires to the power supply cover (see Figure 17). b. Using a phillips screwdriver, remove the four screws that secure the cover to the power supply chassis - two screws on top, two screws on the bottom (see Figure 17 & 18). NOTE: You do not need to remove the screws from the fan guard or the power connector. c. Slide the cover off the power supply. d. Using dikes, cut all cables connecting the PCA to the power supply. e. From the outside, remove the four screws that secure the power supply PCA to the chassis (see Figure 19). f. Remove the two screws that secure the PCA to the top of the power supply chassis (see Figure 20). g. Remove the power supply PCA from the power supply chassis. h. Cut seven capacitors from the PCA, as shown in Figure 21. POWER SUPPLY 4: a. Using dikes, cut the plastic clamp that secures the wires to the power supply cover (see Figure 22). b. Using a phillips screwdriver, remove the six screws that secure the cover to the power supply chassis - all six screws are on top (see Figure 23). NOTE: You do not need to remove the screws from the fan guard or the power connector. c. Slide the cover off the power supply. d. Remove the two screws that secure the top PCA to the power supply (see Figure 24). e. Using dikes, cut all cables connecting the PCA to the power supply. f. From the outside, remove the four screws that secure the power supply PCA to the chassis (see Figure 25). h. Remove the large PCA from the power supply chassis. i. Cut six capacitors from the PCA, as shown in Figure 26. POWER SUPPLY 5: a. Using dikes, cut the plastic clamp that secures the wires to the power supply cover (see Figure 27). b. Using a phillips screwdriver, remove the five screws that secure the cover to the power supply chassis - three screws are on top, two are on the bottom (see Figure 28 & 29). NOTE: You do not need to remove the screws from the fan guard or the power connector. c. Slide the cover off the power supply. d. Using dikes, cut all cables connecting the PCA to the power supply. e. From the outside, remove the four screws that secure the power supply PCA to the chassis (see Figure 30). f. Remove the large PCA from the power supply chassis. g. Cut the small PCA from the large power supply PCA (see Figure 31) h. Cut six capacitors from the PCA, as shown in Figure 31. EL-MF877-00 Template Revision A Page 3

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Template Revision A

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FIGURE 1: Removing the access panel.
FIGURE 2: Removing the front bezel
FIGURE 3: Type 1 battery holder

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FIGURE 4: Type 2 battery holder
FIGURE 5: Type 3 battery holder
FIGURE 6: Removing the system board screw locations

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FIGURE 7: Power supply screw locations
FIGURE 8: Removing the power supply tab location

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FIGURE 9: POWER SUPPLY 1: Plastic tie locations
FIGURE 10: POWER SUPPLY 1: Screw locations
FIGURE 11: POWER SUPPLY 1: Screw locations (screws on bottom not visible)

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FIGURE 12: POWER SUPPLY 1: Large PCA screw locations
FIGURE 13: POWER SUPPLY 1: Capacitors and small PCA to cut

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FIGURE 14: POWER SUPPLY 2: Plastic tie location
FIGURE 15: POWER SUPPLY 2: Screw locations
FIGURE 16: POWER SUPPLY 2: Large PCA screw locations; Capacitors and small PCA to cut

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FIGURE 17: POWER SUPPLY 3: Screw and plastic tie locations
FIGURE 18: POWER SUPPLY 3: Screw locations
FIGURE 19: POWER SUPPLY 3: Large PCA screw locations

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FIGURE 20: POWER SUPPLY 3: Small PCA screw locations
FIGURE 21: POWER SUPPLY 3: Capacitors to cut

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FIGURE 22: POWER SUPPLY 4: Plastic tie location
FIGURE 23: POWER SUPPLY 4: Screw locations
FIGURE 24: POWER SUPPLY 4: Top PCA screw locations

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FIGURE 25: POWER SUPPLY 4: Large PCA screw locations
FIGURE 26: POWER SUPPLY 4: Capacitors to cut

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FIGURE 27: POWER SUPPLY 5: Plastic tie location
FIGURE 28: POWER SUPPLY 5: Screw locations
FIGURE 29: POWER SUPPLY 5: Screw locations

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FIGURE 30: POWER SUPPLY 5: PCA screw locations
FIGURE 31: POWER SUPPLY 5: Small PCA and capacitor locations

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HP-Compaqdc5850_FA.fh11 5/6/08 2:21 PM Page 2

C M Y CM MY CY CMY K

HP Compaq dc5850 Business Desktop PC
HP recommends Windows Vista Business.
HP-Compaqdc5850_FA.fh11 5/6/08 2:21 PM Page 3
Dependable, versatile and built with latest technology, the HP Compaq dc5850 Business Desktop PC is packed with customisable features for uncompromising security, hassle-free manageability and improved performance to tackle the everyday needs of any organisation. With its highly stable platform and legendary HP support and services, our PCs deliver worry-free computing to help boost productivity. HP Compaq dc5850 Business Desktop PC, the very foundation of your business.
Proven technology as a strong foundation
Built with cutting-edge technology to deliver the features critical to enterprise clients. Outstanding abilitiesAMD chipset with latest processor offerings including AMD Phenom X3 and X41, 2, Athlon X2 and single core3 and Sempron processor Increased performanceHyperTransport Technology 3.0 Immersive experienceATI Radeon 3100 with powerful DirectX 104 for increased visual detail per frame Receive warnings to backup data prior to drive failurenew generation SATA hard drives with SMART IV NCQ support Increased audio flexibility, performance and noise reductionhigh-definition Multi-streaming 4-channel audio and Unified Audio Architecture
Built for powerful enterprise productivity
Engineered with useful tools and enhanced features to boost overall productivity and efficiency. Extend the life of PCoptimised thermal design Meet space restraints and comfort level choice of two flexible chassis designs Expandability and enhanced graphics includes a PCIe x16 graphics card slot and standard dual independent display capability Increase IT efficiency, streamline processes, and lower overall cost of ownership standard ASF 2.0 and Altiris Out-of-Band Management Solution Improve user and administrator productivitybetter desktop migration tools, management for hot patching, and graphics driver model
SmartMedia/xd CompactFlash l/ll SD/MMC+/miniSD MS PRO/MS PRO Duo
SHIELDED with uncompromising security
Experience essential security features that protect both your physical assets and critical data.
Enhanced data protection and system access Embedded TPM 1.2-compliant security chip provides hardware-based encryption capabilities. Stay productive with local recovery tools HP Backup and Recovery Manager features include securing end-user data with backup on optional 2nd hard drive. Safeguards physical assets against theft or temperingHP Business PC security locks and devices. Optional HP ProtectTools offer the flexibility to adopt only the modules that meet your security needs, such as: BIOS Configuration Credential Manager for establishing various levels of access

USB 2.0

TPM 1.2 Embedded Security Chip
Cost savings with a stable, manageable platform
Streamline enterprise business processes, no matter the size, while lowering IT costs and operating expenses. Reduce testing time and support costs a single, common and stable software image across the series helps Cost-saving support solutions needed throughout the PC lifecycleHP Desktop Lifecycle Services Deploy the tools requiredHP Client Management Solutions portfolio addresses specific business productivity goals, minimising waste of resource
Impressive reliability and quality
Multiple generations of technologies boasts improved quality and lower industry standard hardware failure rates, delivering peace of mind to business computing. Desktop platform design ensures a high level of quality and reliabilitymore than 1 10,000 hours of testing to withstand demanding user environment Increased viewing planestandard dual independent display capability Minimise disruptionstandard RAID feature allows you to mitigate disruptions and help protect critical business documents World-wide service and supportavailable for the life of your PC including global limited warranties, quick and easy access to expert advice 24 hours a day, 7 days a week, online or by phone Personalised service for every stage of the PC lifecycle with HP Total Care Customisable and integrated hardware and softwareHP Factory Express Services builds PCs to your specifications even before they are deployed

Designed with the environment in mind
HP Compaq dc5850 Business Desktop PC is designed to reduce environmental impact, while saving cost through its energy efficient features and functionality. Easy to recycleHP designed products and packaging are built with materials that help reduce waste and environmental impact Saving cost through efficient use of energy S3 sleep settings enabled by default conserves power after periods of inactivity Industry CertificationsENERGY STAR, Taiwan Green Mark, EPEAT Korea Eco-label, Japan PC Green Label, TCO (Sweden) and CECP energy (China) Efficient performanceAMD chipset technology that switches power modes based on system usage
This system requires a separately purchased 64-bit operating system and 64-bit software products to take advantage of the 64-bit processing capabilities of AMD technology. Dual/quad/triple-core processing available with AMD technology is a recent technology innovation designed to improve performance of this system. Given the wide range of software applications available, performance of a system including a 64-bit operating system and a dual/quad/triple-core processors will vary. This system requires a separately purchased 64-bit operating system and 64-bit software products to take advantage of the 64-bit processing capabilities of the AMD 64 processor. Given the wide range of software applications available, performance of a system including a 64-bit operating system will vary. DirectX 10 requires Windows Vista.
HP-Compaqdc5850_FA.fh11 5/6/08 2:21 PM Page 4
designed to meet your EVERYDAY business needs
Equip your business with flexible, customisable and expandable performance

Front view

External drive bays Power button DVD-ROM drive 2 5.25" and 1 3.5" External bays
Audio-in /Audio-out jacks
Power button Audio-in /Audio-out jacks USB 2.0 ports Media card reader (optional) DVD drive USB 2.0 ports

Microtower

Small form factor

Rear view

Power connection Audio-in /Audio jacks Audio-in /Audio jacks PS/2 ports DVI-D 6 USB 2.0 ports Serial port (optional)
Power connection Serial port VGA port RJ-45 (network) jack PS/2 ports DVI-D 6 USB 2.0 ports 4 Expansion slots Serial port VGA port RJ-45 (network) jack 4 Expansion slots
Parallel/serial port (Optional) Microtower Small form factor

Parallel port (Optional)

Internal view
300-watt active power supply or optional 80% high efficiency power supply

3.5" Internal bay for NCQ Smart IV Hard Drive
3.5" External bay for media card reader or floppy drive
240-watt active power supply or optional 80% high efficiency power supply 4 DDR2 DIMM slots supports 800Mhz up to 8 GB Internal USB header for optional flash memory 2 Low profile PCIe x1 Slots
2 5.25" External bays 1 3.5 External bay for Media card reader or floppy 2 3.5" Internal bays for NCQ Smart IV HDD 4 DDR2 DIMM Slots supports 800 MHz and up to 8 GB Full height PCIe x16 slot
Internal USB header for optional flash memory Heat sink supports processors up to 95W 2 Full height PCIe x1 slots Microtower Full height PCI slot
5.25" External bay Heat sink supports up to 95- watt processors Low profile PCI Slot Low profile PCIe x16 Slot Small form factor
HP-Compaqdc5850_FA.fh11 5/6/08 2:21 PM Page 1

Microtower Processor

AMD Phenom X4 Processors with HyperTransport Technology up to 2.3 GHz1, AMD Phenom X3 Processors with HyperTransport Technology up to 2.3 GHz1, AMD Athlon 64 X2 Processors with HypterTransport Technology up to 2.8 GHz2, AMD Athlon 64 Processors with HyperTransport Technology up to 2.7 GHz3, AMD Sempron Processors with HyperTransport Technology up to 2.3 GHz Genuine Windows Vista Business 32* Genuine Windows Vista Business 64* Genuine Windows Vista Home Basic 32* Genuine Vista Business Edition with downgrade to Genuine XP Professional pre-installed4 FreeDOS AMD 780V PC2-6400 (DDR2-800 MHz) Non-ECC DIMM Memory
NOTE: Dual channel memory configurations supported for enhanced performance (requires both slots populated with same type and size memory).

Operating system

Chipset Memory5 Hard drive(s)6 Expansion bays Expansion slots Memory slots Graphics Removable media7 Audio Communications I/O ports and connectors
80, 160, 250, 500-GB SATA NCQ Smart IV 3.0-GB/s hard drive (7200 rpm); 80, 160-GB SATA NCQ Smart III 3.0-GB/s hard drive (10,000 rpm); optional dual drive RAID Internal: 23.5 inches External: 13.5 inches and 25.25 inches Full-height: 1 PCI, 2 PCIe x1, and 1 PCIe xDIMMs ATI Radeon 3100 Graphics with DirectX 10 technology SATA DVD-ROM Drive or SATA SuperMulti LightScribe8 DVD Writer Drive, HP 16-in-1 Media Card Reader (USB connection on the motherboard) Integrated High Definition multi-streaming audio Integrated Broadcom 5755 Gigabit Ethernet 10 USB 2.0 ports (2 front, 6 rear, 2 internal USB header) 1 VGA port, one DVI-D port, DVI output (available via optional ADD2 card), 1 serial with second optional, 2 PS/2 ports (mouse and keyboard), front headphone and microphone jacks, RJ-45 port, parallel port (optional) Standard keyboard and 2-button optical scroll mouse available as USB or PS/2, or USB 2-button laser mouse Integrated TPM 1.2 (standard), HP Desktop Security lock kit (lock and cable); Security cable with Kensington lock 377.2 x 176.5 x 428 mm (14.85 x 6.95 x 16.85 inches) 10.63 kg (23.44 lb) 300-watt passive PFC Power Supply (user selectable 1 15V/230V); Optional 80% High Efficiency 300W Active PFC 100.3 x 337.8 x 374.86 mm (3.95 x 13.3 x 14.9 inches) 8.10 kg (17.86 lb) 240-watt active PFC Power Supply (user selectable 1 15V/230V); Optional 80% High Efficiency 240W Active PFC Internal: 13.5 inches External: 13.5 inches and 15.25 inches Low-profile: 1 PCI, 2 PCIe x1, and 1 PCIe x16

Input Device Security Dimensions (h x w x d) Weight Power Warranty
3 years Parts, Labour, Onsite; other HP Care Pack Services available see http://www.hp.com/go/lookuptool
* Certain Windows Vista product features require advanced or additional hardware. See http://www.microsoft.com/windowsvista/getready/hardwarereqs.mspx and http://www.microsoft.com/windowsvista/getready/capable.mspx for details. Windows Vista Upgrade Advisor can help you determine which features of Windows Vista will run on your computer. To download the tool, visit http://www.windowsvista.com/upgradeadvisor 1 This system requires a separately purchased 64-bit operating system and 64-bit software products to take advantage of the 64-bit processing capabilities of the AMD 64 processor. Given the wide range of software applications available, performance of a system including a 64-bit operating system will vary. 2 This system requires a separately purchased 64-bit operating system and 64-bit software products to take advantage of the 64-bit processing capabilities of AMD X technology. Dual-core processing available with AMD X technology is a recent technology innovation designed to improve performance of this system. Given the wide range of software applications available, performance of a system including a 64-bit operating system and a dual-core processor will vary. 3 Dual/quad/triple-core processing available with AMD technology is a is a recent technology innovation designed to improve performance of this system. Given the wide range of software applications available, performance of a system including a 64-bit operating system and a dual/quad/triple-core processors will vary. 4 An end user that is a business (including governmental or educational institutions) is expected to annually order at least 25 customer systems with the same custom image. 5 Above 3 GB, all memory may not be available due to system resource requirements. 6 GB = 1 billion bytes. Actual formatted capacity is less. Up to 8 GB is reserved for system recovery software. 7 Double Layer discs can store more data than single layer discs. However, double-layer discs burned with this drive may not be compatible with many existing single-layer DVD drives and players. 8 LightScribe creates a grayscale image similar to a black and white photograph. LightScribe media required and is not included.
To learn more, visit www.hp.com/apac/bpc
2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are registered trademarks of Microsoft Corporation. Windows Vista is either a registered trademark or trademark of Microsoft Corporation in the United States and/or other countries. Intel, the Intel logo, Intel Core, Intel Celeron, and Intel Centrino are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the U.S. and other countries. Printed in Singapore, May 2008