Product End-of-Life Disassembly Instructions
Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP Compaq dc5850 Small Form Factor Business PC Name / Model #2 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances EL-MF877-00 Template Revision A
Notes With a surface greater than 10 sq cm
Quantity of items included in product 2 or 3 (1 sys board, 1 or 2 P/S PCAs 1
All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps

2, 4, or 5

Include the cartridges, print heads, tubes, vent chambers, and service stations.

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1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name Main bezel Fan holder Fan duct Tower stand
Plastic Part Description Main bezel Fan holder Fan duct Tower stand
Weight (grams) 75g 54g 48g 126g
ISO 11469:2000 Plastic Part Mark >ABS< >PC FR(40)< >PC+ABS FR(40)< >ABS<

Optional: Photo

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Phillips screwdriver Description #2 Dikes Description #3 Torx screwdriver T-15 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. 3. 4. To remove the access panel, press the buttons on the left and right sides of the computer (1), slide the access panel back until it stops, and then lift it up and off the chassis (2) (see Figure 1). Lift up the green latch behind the upper right side of the bezel and push down on the latch behind the lower right side of the bezel (1), then pull the right side of the bezel off the chassis (2), followed by the left side. (see Figure 2). Remove or cut all expansion cards, cables, and any other devices from the system board. To remove the battery: Locate the battery and battery holder on the system board. Depending on the type of battery holder on the system board, complete the following instructions to remove the battery. TYPE 1 BATTERY HOLDER (see Figure 3): Lift the battery out of the holder. TYPE 2 BATTERY HOLDER (see Figure 4): To release the battery from its holder, squeeze the metal clamp that extends above one edge of the battery. When the battery pops up, lift it out. TYPE 3 BATTERY HOLDER (see Figure 5): Pull back on the clip that holds the battery in place, and then remove the battery. To remove the system board (see Figure 6): a. Remove the fan shroud from the chassis. b. Rotate the drive cage to its upright position. c. Rotate the power supply to its full upright position. d. Disconnect all data and power cables from the system board. e. Disconnect the serial port from the system board. f. Remove the heatsink from the system board by loosening the four captive screws that secure the heatsink to the system board, and then lifting the heatsink from the system board. g. Remove the seven screws that secure the system board to the chassis. h. Lift up the front of the system board, and then pull the system board forward, up, and out of the chassis. To remove the power supply (see Figure 7): a. Rotate the drive cage up and disconnect the power cables from all of the drives. b. Disconnect the power cables from the system board. c. Release the power supply cables from the cable retaining clips on the bottom of the chassis and under the drive cage. d. Rotate the power supply to its full upright position, pull the power supply forward (1), and then lift the power supply straight up and out of the chassis (2).

EL-MF877-00 Template Revision A

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HP uses seven different power supply vendors. The power supply cover is removed using the same procedure for each power supply; however, the internal components differ for all of the power supplies. To remove the power supply cover: a. Using dikes, cut the two plastic clamps that secure the wires to the power supply cover (see Figure 9). b. Using a phillips screwdriver, remove the four screws from the top, two screws from the back, and two screws from the front of the power supply, that secure the cover to the power supply (see Figures 8, 9, & 10). c. Lift the covers off the power supply. The cover you remove is in two pieces, and hinges connect the covers to the power supply chassis. After you remove the cover, refer to the procedures below for the remaining power supply disassembly instructions:
POWER SUPPLY 1: 1. Using dikes, cut all wires connected to the PCA in the power supply. 2. Remove the three screws that secure the power supply PCA to the chassis (see Figure 11). 3. Remove the power supply PCA from the power supply chassis. 4. Cut two capacitors from the PCA as shown in Figure 11. POWER SUPPLY 2: 1. Using dikes, cut all wires connected to the PCA in the power supply. 2. Remove the three screws that secure the power supply PCA to the chassis (see Figure 12). 3. Remove the power supply PCA from the power supply chassis. 4. Cut the small PCA from the large PCA as shown in Figure 12. 5. Cut four capacitors from the large PCA as shown in Figure 12. POWER SUPPLY 3: 1. Using dikes, cut all wires connected to the PCA in the power supply. 2. Remove the three screws that secure the power supply PCA to the chassis (see Figure 13). 3. Remove the power supply PCA from the power supply chassis. 4. Cut the small PCA from the large PCA as shown in Figure 13. 5. Cut five capacitors from the large PCA as shown in Figure 13. POWER SUPPLY 4: 1. Using dikes, cut all wires connected to the PCA in the power supply. 2. Remove the three screws that secure the power supply PCA to the chassis (see Figure 14). 3. Remove the power supply PCA from the power supply chassis. 4. Cut five capacitors from the PCA as shown in Figure 14. POWER SUPPLY 5: 1. Using dikes, cut all wires connected to the PCA in the power supply. 2. Remove the three screws that secure the power supply PCA to the chassis (see Figure 15). 3. Cut five capacitors from the PCA as shown in Figure 15. POWER SUPPLY 6: 1. Using dikes, cut all wires connected to the PCA in the power supply. 2. Remove the three screws that secure the power supply PCA to the chassis (see Figure 16). 3. Remove the power supply PCA from the power supply chassis. 4. Cut four capacitors from the PCA as shown in Figure 16. POWER SUPPLY 7: 1. Using dikes, cut all wires connected to the PCA in the power supply. 2. Remove the three screws that secure the power supply PCA to the chassis (see Figure 17). 3. Remove the power supply PCA from the power supply chassis. 4. Cut the small PCA from the large PCA as shown in Figure. 5. Cut four capacitors from the large PCA as shown in Figure 17.

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3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
FIGURE 1: Removing the access panel.
FIGURE 2: Removing the front bezel
FIGURE 3: Type 1 battery holder

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FIGURE 4: Type 2 battery holder
FIGURE 5: Type 3 battery holder
FIGURE 6: Removing the system board screw locations

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FIGURE 7: Removing the power supply
FIGURE 8: Power supply cover screw locations (top)
FIGURE 9: Power supply cover screw locations and plastic tie locations

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FIGURE 10: Power supply cover screw locations
FIGURE 11: POWER SUPPLY 1: PCA screw locations and capacitors (2) to cut
FIGURE 12: POWER SUPPLY 2: PCA screw locations; Capacitors (4) to cut

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FIGURE 13: POWER SUPPLY 3: Large PCA screw locations; Capacitors (5) and small PCA to cut
FIGURE 14: POWER SUPPLY 4: PCA screw locations; Capacitors (5) to cut

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FIGURE 15: POWER SUPPLY 5: PCA screw locations; Capacitors (5) to cut
FIGURE 16: POWER SUPPLY 6: PCA screw locations; Capacitors (4) to cut

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FIGURE 17: POWER SUPPLY 7: Large PCA screw locations; Capacitors (4) and small PCA to cut

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Service and Support
On-site Warranty and Service Note 1: This three-year (3-3-3), limited warranty and service offering delivers three years of parts, labor and on-site repair. Response time is next business-day Note 2 and includes free telephone support Note x 7. Global coverage Note 2 ensures that any product purchased in one country and transferred to another non-restricted country will remain fully covered under the original warranty and service offering. Some countries/regions do not offer one year onsite and labor. For HP Care Pack services see http://www.hp.com/go/lookuptool. NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply. NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country. 3: NOTE 3 Technical telephone support applies only to HP-configured, HP and HP-qualified, third-party hardware and software. Toll-free calling and 24 x 7 support may not be available in some countries. Microtower Small Form Factor
14.85 x 6.95 x 16.85 in 3.95 x 13.3 x 14.9 in Chassis Dimensions (H x W x D) (37.72 x 17.65 x 42.80 cm) (10.03 x 33.78 x 37.85 cm) N/A 1.05 x 6.95 x 7.83 in Optional Tower Stand (26.75 x 176.46 x 198.87 mm) Dimensions (H x W x D) 20.42 lb (9.28 kg) 16.76 lb (7.62 kg) System weight* 1739 cu in 782.77 cu in System volume 29.44 lb (13.38 kg) 25.08 lb (11.40 kg) Shipping weight* 77.1 lb (35 kg) 77.1 lb (35 kg) Maximum supported weight (desktop orientation) 12.0 x 19.76 x 23.62 in 9.72 x 19.68 x 22.67 in Shipping box dimensions (H x W x D) * Configured with 1 hard drive, 1 optical drive, no diskette drive, and no PCI card. 300W power supply passive PFC 240W power supply - active PFC Power Supply Energy Efficient Power 300W 85% efficient power supply active PFC 240W 85% efficient power supply active PFC Supply Ports USB 2.(2 front, 6 rear) Serial 1 standard with 2nd optional Parallel 1 optional PS/keyboard, 1 mouse Video VGA and DVID for integrated graphics Support for Multi-Monitor standard Audio Integrated High Definition audio with internal speaker Front mic and headphone Rear input (supports microphone or line input), line out NIC (RJ-45) Integrated Broadcom Gigabit Ethernet

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Chipset AMD 780V chipset
Processor One of the following
AMD Sempron Dual-Core Processors with HyperTransport Technology: AMD Sempron XProcessor (2.0-GHz, 512K L2 cache, HT bus 2.0) AMD Sempron Processors with HyperTransport Technology: AMD Sempron LE-1300 Processor (2.3-GHz, 512K L2 cache, HT bus 1.0) AMD Sempron LE-1250 Processor (2.2-GHz, 512K L2 cache, HT bus 1.0) AMD Athlon Single-Core Processors with HyperTransport Technology: AMD Athlon LE-1640B Processor (2.7-GHz, 512K L2 cache, HT bus 2.0) AMD Athlon Dual-Core Processors with HyperTransport Technology: AMD Athlon XProcessor (2.7-GHz, 1MB L2 cache, 2 MB Shared L3 cache, HT bus 3.0) AMD Athlon X2 6000+ Processor (3.1-GHz, 1MB L2 cache, HT bus 3.0) AMD Athlon X2 5800+ Processor (3.0-GHz, 1MB L2 cache, HT bus 2.0) AMD Athlon X2 5600B Processor (2.9-GHz, 1MB L2 cache, HT bus 2.0) AMD Athlon X2 5400B Processor (2.8-GHz, 1MB L2 cache, HT bus 2.0) AMD Athlon X2 5200B Processor (2.7-GHz, 1MB L2 cache, HT bus 2.0) AMD Athlon X2 5000B Processor (2.6-GHz, 1MB L2 cache, HT bus 2.0) AMD Athlon X2 4850B Processor (2.5-GHz, 1MB L2 cache, HT bus 2.0) AMD Athlon X2 4450B Processor (2.3-GHz, 1MB L2 cache, HT bus 2.0) AMD Phenom Triple-Core Processors with HyperTransport Technology: AMD Phenom II XProcessor, (2.6-GHz, 1.5 MB Dedicated L2 cache, 6 MB Shared L3 cache, HT bus 3.0) AMD Phenom X3 8600B Processor (2.3-GHz, 1.5 MB Dedicated L2 cache, 2 MB Shared L3 cache, HT bus 3.0) AMD Phenom X3 8750B Processor (2.4-GHz, 1.5 MB Dedicated L2 cache, 2 MB Shared L3 cache, HT bus 3.0) AMD Phenom Quad-Core Processors with HyperTransport Technology: AMD Phenom II XProcessor, (2.5-GHz, 2 MB Dedicated L2 cache, 4 MB Shared L3 cache, HT bus 3.0) AMD Phenom X4 9600B Processor (2.3-GHz, 2 MB Dedicated L2 cache, 2 MB Shared L3 cache, HT bus 3.0) AMD Phenom X4 9750B Processor (2.4-GHz, 2 MB Dedicated L2 cache, 2 MB Shared L3 cache, HT bus 3.0) AMD Phenom X4 9850B processor (2.5 GHz, 2 MB Dedicated L2 cache, 2 MB Shared L3 cache, HT bus 3.0)

MT X X X X X X X X X X X X X X X X X X X X
SFF X X X X X X X X X X X X X X X X X

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Removable Storage One or more of the following depending on form factor (see Storage Drive Support section above)
Diskette Drives 1.44-MB Diskette Drive Media Reader HP 16-in-1 Media Reader (USB connection on the system board) Optical Drives SATA DVD-ROM Drive1 SATA CD-RW/DVD-ROM Combo Drive1,2 SATA SuperMulti LightScribe DVD Writer Drive1,2,3 HP SATA Blu-ray Writer NOTES: NOTES 1 For playing DVDs, InterVideo WinDVD For writing CDs, choice of Sonic/Roxio DigitalMedia Plus 7.2 (Windows XP only) or Easy Media Creator For writing CDs and DVDs, video editing and authoring DVDs, choice of Sonic/Roxio DigitalMedia Plus 7.2 (Windows XP only) or Easy Media Creator 9

X X X X X X

Media Card Reader One of the following
HP 16-in-1 3.5 Media Card Reader HP 22-in-1 3.5 Media Card Reader HP 22-in-1 3.5 Media Card Reader with 1394

Security

Integrated 1.2 TPM Embedded Security Chip* HP Desktop Security lock kit (lock and cable) Security cable with Kensington lock Optional HP ProtectTools security software suite Optional USB Port Disable at factory (user configurable via BIOS) * TPM module disabled where use is restricted by law; for example, Russia.
Integrated Broadcom Gigabit Ethernet (integrated on system board) Broadcom NetXtreme Gigabit Ethernet PCIe NIC Card Broadcom NetXtreme Plus Gigabit Ethernet PCIe NIC Card

Wireless

Wireless A+G PCI Card (full height bracket) Wireless A+G PCI Card (low profile bracket) HP 802.11 b/g/n Wireless PCIe x1 card (full height bracket) HP 802.11 b/g/n Wireless PCIe x1 card (low profile bracket)
2006 Agere PCI 56K International SoftModem (full height) 2006 Agere PCI 56K International SoftModem (low profile) LSI PCIe x1 Hi-Speed 56K International SoftModem

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Graphics
Integrated ATI Radeon 3100 Graphics (with DirectX 10 technology) NVIDIA GeForce 8400 GS 256MB SH PCIe x16 Graphics Card ATI Radeon HD 2400 XT 256MB DH PCIe x16 Graphics Card ATI Radeon HD SH PCIe x16 Graphics Card ATI Radeon HD 3650 (512MB DH) PCIe x16 Graphics Card ATI Radeon HD 4550 Dual Head PCIe x16 Graphics Card HP DisplayPort to VGA Adapter
Integrated High Definition audio with ADI1884 codec (all ports are stereo) Microphone and Headphone front ports
Line-out and Line-In rear ports* X X Multistreaming capable* X X Internal Speaker X X * Rear audio input port is re-taskable as Line-in or Microphone-in. External speakers must be powered externally. Multistreaming can be enabled in the ADI control panel to allow independent audio streams to be sent to/from the front and rear jacks. This allows for different audio applications to use separate audio ports on the system. For example, the front jacks could be used with a headset for a communications application while the rear jacks are being used with external speakers and a multimedia application.

Input Devices

Keyboard One of the following HP PS/2 Standard Keyboard HP USB Standard Keyboard Mouse One of the following USB 2-Button Laser Mouse PS/2 2-Button Optical Scroll Mouse USB 2-Button Optical Scroll Mouse

Miscellaneous

HP FireWire / IEEE 1394 PCI Card (full height) HP FireWire / IEEE 1394 PCI Card (low profile) 2nd serial port adapter 2nd serial port adapter (low profile) Tower stand 1-GB Flash Module for Vista ReadyBoost

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After-Market Options (availability may vary by region)
Office 2007 Media-less License Kits (MLK's)
MS Office Basic Edition 2007 Media-less License Kit MS Office Small Business Edition 2007 Media-less License Kit MS Office Professional Edition 2007 Media-less License Kit
After-Market Options Part Number RZ361A#ABA RZ365A#ABA RZ363A#ABA

Communications

Wireless LAN HP 802.11 b/g/n Wireless PCIe x1 card NICs Broadcom NetXtreme Gigabit Ethernet Plus PCIe NIC Card Intel Gigabit CT Desktop NIC Modem LSI PCIe x1 Hi-Speed 56K International SoftModem Connectivity Bundle Connectivity Starter Kit - Surge Protector/LAN cable/Printer cable
FH971AA FS215AA FH969AA FH970AA RT174AA
Single head solutions ATI Radeon 3470 256MB SH PCIe x16 X X FH972AA Multi head solutions NVIDIA Quadro NVS 290 Dual Head PCIe x16, low profile KG748AA X X Graphics Card ATI HD 2400 XT 256MB Dual Head PCIe x16, low profile KD060AA X X Graphics Card ATI Radeon HD 3650, 512MB Dual Head PCIe x16, full height KS505AA X Graphics Card ATI HD 4550 PCIe x16 (256GB/DDR3) Dual Head Graphics Card X X AT042AA NVIDIA GeForce 8400 GS 256MB DH PCIe x1 Graphics Card* X X GJ120AA * 1GB of system memory required. Graphics cards use part of the total system memory to enhance graphics performance.

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Hard Drives Serial ATA Hard Drives HP 80-GB SATA (NCQ/Smart IV) 3.0-Gb/s Hard Drive HP 160-GB SATA (NCQ/Smart IV) 3.0-Gb/s Hard Drive HP 250-GB SATA (NCQ/Smart IV) 3.0-Gb/s Hard Drive HP 320-GB SATA (NCQ/Smart IV) 3.0-Gb/s Hard Drive HP 500-GB SATA 3.0-Gb/s SMART IV Hard Drive HP Removable SATA Hard Drive Enclosure (Frame & Carrier) HP Removable SATA Hard Drive Enclosure (Carrier Only)

Multimedia

Thin USB Powered Speakers Wired Premium Headset (VoIP and Overture Conf)

KK912AA AQ704AA

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Optical Drives DVD-ROM Drive HP SATA DVD-ROM Drive DVD Writer HP SATA SuperMulti LightScribe DVD Writer Drive

AH047AA GF343AA

Removable Storage
Diskette and Digital Drives HP 1.44-MB External USB Diskette Drive HP 1.44-MB Internal Diskette Drive Multimedia HP 22-in-1Media Card Reader with 1394 with PCI Card Removable Hard Drive HP Removable SATA Hard Drive Enclosure (Frame & Carrier) HP Removable SATA Hard Drive Enclosure (Carrier Only)
DC141B AH053AA KN518AA RY102AA RY103AA
Kensington lock HP Business PC Security Lock HP ProtectTools Version 4.0 HP Chassis Security Kit HP 2007 Wall Mount/Security Sleeve HP USB Smartcard Keyboard
PC766A PV606AA FH974AA AR639AA GF344AA ED707AA

Manageability

HP Client Configuration Manager, Premium Edition
HP ProtectTools Client Security Software including: HP ProtectTools Security Manager BIOS Configuration for HP ProtectTools Credential Manager for HP ProtectTools Device Access Manager for HP ProtectTools Drive Encryption for HP ProtectTools Embedded Security for HP ProtectTools Java Card Security for HP ProtectTools Altiris Client Management Suite Level 1 Includes: Altiris Deployment Solution Altiris Inventory Solution Altiris Application Metering Solution Altiris Carbon Copy Solution Altiris Software Delivery Solution Altiris Application Management Solution Altiris Patch Management Solution
T3488AA (use T3489AA for 1000 licenses) KN740AA
DR605A (use DR606A for 1000+ licenses)

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Brackets/Stands HP 2007 SFF Tower Stand

GJ118AA

Miscellaneous Accessories
HP USB Graphics Adapter DisplayPort TO VGA Adapter DisplayPort TO DVI-D Dual Link Adapter (WKS offering)
HP DMS59 DVI Dual-head Connector Cable HP DVI to DVI Cable HP DisplayPort To DVI-D Adapter HP 2nd Serial Port Adapter HP Parallel Port Adapter Belken USB to Serial Adapter HP FireWire / IEEE 1394 PCI Card 5.25" Blank Bezel Kit (Carbonite 50/Bulk Pack) Local Area Network (LAN) cable, Ethernet cable Firewire (1394) Cable 7-outlet Surge Protector HP 1TB Media Vault Pro MV5140 HP 1.5TB Media Vault Pro MV5150
X X X X X X X X X X X X X

X X X X X X X X X X X X

NL571AA AS615AA NR078AA (launching July 6th) DL139A DC198A FH973AA PA716A KD061AA EM449AA PA997A DC177B AH122AA AH123AA AG290AA GX667AA#ABA GX668AA#ABA

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Technical Specifications
Unit Environment and Operating Conditions General Unit Operating Guidelines Microtower
Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range. Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow. Never restrict airflow into the computer by blocking any vents or air intakes. Do not stack computers on top of each other or place computers so near each other that they are subject to each other's recirculated or preheated air. Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow. If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply. Operating: 50 to 95 F (10 to 35 C)* Temperature Range Non-operating: -22 to 140 F(-30 to 60 C) Operating: 10% to 90% (non-condensing at ambient) Relative Humidity Non-operating: 5% to 95% (non-condensing at ambient) Operating: 10,000 ft (3048 m) Maximum Altitude (unpressurized) Non-operating: 30,000 ft (9144 m) *NOTE: Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct NOTE: sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed. Microtower Small Form Factor 300-watt BTX power 300-watt 85% 240-watt BTX power 240-watt 85% supply Passive PFC efficient* BTX power supply Active PFC efficient* BTX power 115v/230v line supply Active PFC 115v/230v line supply Active PFC switch switch 90 to 132VAC, or 90 to 264VAC 90 to 132VAC, or 90 to 264VAC 180 to 264VAC 180 to 264VAC 100 to 127VAC, or 100 to 240VAC 100 to 127VAC, or 100 to 240VAC 200 to 240VAC 200 to 240VAC 50/60 Hz 50/60 Hz 50/60 Hz 50/60 Hz 4763 Hz 4763 Hz 4763 Hz 4763 Hz 8A/4A 5A/2.5A 6A/3A 3.5A/1.75 Typical 315 btu/hr Typical 270 btu/hr Typical 315 btu/hr Typical 270 btu/hr (79 kg-cal/hr) (68 kg-cal/hr) (79 kg-cal/hr) (68 kg-cal/hr) Maximum 1575 Maximum 1280 Maximum Maximum 1025 btu/hr btu/hr 1260 btu/hr btu/hr (397 kg-cal/hr) (322 kg-cal/hr) (317 kg-cal/hr) (258 kg-cal/hr) Variable speed fan Variable speed fan Variable speed fan Variable speed fan X X X X X X

Power Supply

Operating Voltage Range Rated Voltage Range Rated Line Frequency Operating Line Frequency Range Rated Input Current Heat Dissipation
Power Supply Fan ENERGY STAR Compliant FEMP Standby Power Compliant (<2W in S5 Power Off)**

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Power Consumption in ES Mode Suspend <4W <3W <4W <3W to RAM (S3) (Instantly Available PC) NOTES: NOTES * Energy efficient power supply is a requirement for ENERGY STAR qualification in conjunction with a select range of processors and modules ** Power consumption in the Off/Apparent Off mode is measured and reported with the network interface controller "Wake on LAN" feature disabled in F10 Setup (default is "enabled"). ROM BIOS Information Key features of the HP BIOS in the dc5850 include: Deployment and manageability HP BIOS provides several technologies that help integrate the HP Business desktop computer into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 12 languages. Stability HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification. Security HP BIOS offers a robust and flexible set of security features to help the system administrator secure their systems from removal of sensitive data, and help prevent access by unauthorized users. Tracking and tracing capabilities in case of theft available in select countries (subscription sold separately). Thermal and power management The HP BIOS provides and enables thermal and power management technologies to assist in operating the HP Business Desktop computer in any enterprise environment. Serviceability HP BIOS provides diagnostic and detailed service information. Upgrades and recovery HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS updates from within DOS (Flashlite), BIOS updates from within Windows (HPQFlash, SSM), HP Client Manager, and fail-safe recovery. In addition, the HP Business Desktop BIOS Utilities tool enables replicated BIOS setup throughout the Enterprise; it is available from within the BIOS software and from the support website. Additional HP BIOS Features Administrator password Also known as the setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS. Advanced Configuration and Power Interface (ACPI) Represents a significant innovation in power and configuration management, allowing operating systems and applications to manage power based on activity and usage. Provides power conservation features under Windows XP. Ability to mute the internal speaker Other Features ACPI-Ready Hardware Description Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode. Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system. System Management BIOS, previously known as DMI BIOS, for system management information Power button acts as both an on/off button and suspend-to-sleep button

4.99 x 2.54 x 0.71 in (126.8 x 64.4 x 18.0 mm) 0.268 lb (65 g) Atheros AR5414X chipset PCI Spec 2.2 IEEE 802.11a/b/g 5.1500 to 5.8500 GHz 2.4000 to 2.4835 GHz 2.4465 to 2.4835 GHz (Europe, Middle East, Asia and Asia Pacific excluding Japan) 2.4000 to 2.4697 GHz (Japan) 32 to 140 F (0 to 60 C), operating -4 to 176 F (-20 to 80 C), non-operating 10% to 85% non-condensing 5V 5% Tx/Rx peak 560/250mA @ 3.3V (max.)

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Output power (approximately) Receive sensitivity Data transfer rate Spreading Security Antenna Throughput 15 dBM 2dB
Certifications Certifications for use by country
-90dBm at 11 Mbps (typical) Standard rates of 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 48, 54 and Super AG Mode108-Mbps DSSS (Direct Sequence Spread Spectrum) 64(40h) bit, 128(104h) bit, WPA, IEEE802.1X, AES-OCB, AES-CCM, Microsoft PEAP,TKIP, WEP. External 5dBi antenna 108 Mbps (only with Belkin 54G or 200 ft (60.96 m) Indoor above router that supports 108 Mbps speed) 54 Mbps 200 ft (60.96 m) Indoor 11 Mbps 200 ft (60.96 m) Indoor Wi-Fi certified North America: United States, Canada Europe: Austria, Belgium, Cyprus, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Liechtenstein, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, United Kingdom Australia New Zealand
Technology speeds: 56,000 Kbps maximum downstream data, controllerless 2006 Agere PCI 56K Data Transmission International SoftModem NOTE: 56 Kbps technology refers to download speeds only and requires compatible modems at server sites. Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download transmissions. (Upload only) Data Speeds 33,600/31,200/28,800/26,400/21,600/19,200/16,800/14,400/12,000/ 9,600/7,200/4,800/2,400/1,200/300 ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A, Data Standards and Bell 103 14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s Fax Speeds ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2 Fax Mode Capabilities V.44, 42bis, V.42 and MNP2-5 Error Correction and Data Compression ACPI; PPMI 1.1 and wake support with PME and Vaux; meets PCI 2.3 Power Management requirements and PC 2001 requirements Driver upgradeable for future enhancements Upgradeability ITU-T V.80 video ready interface Video TIA/EIA 602 standard AT command set Other Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a UART-compatible interface Optional ring wakeup signal Operating Temperature 32 to 158 F (0 to 70 C)

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Operating Humidity Power
Chipset Dimensions (L X H) Connection Other Features Safety
20% to 90%, non-condensing Requires a 3.3-V auxiliary power rail on PCI bus Uses only one PCI load (i.e., one grant/request pair), one shared IRQ, one electrical load Agere Systems SV92PL Integrated PCI interface with 5-V tolerant buffers and CardBus support Complies with PCI low profile specifications-6.7 x 2.3 in (17.0 x 5.8 cm) and supports high- and low-profile brackets Single RJ-11 connector Digital line protection, call progress monitoring via on-board piezo device, support for high profile and low profile brackets, PnP ID support UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV, NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO, SEMKO, CE mark FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN 61000-4-6, EN 61000-4-8 FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals Not available in Korea or the Republic of South Africa. Bare PCB material compliant to 94V-0 or better (marked as such) PC 2001 compliant, PCI version 2.3, WHQL approved; ACPI compliant

EMC Telecom Health Other

LSI PCIe x1 56K Data Transmission International SoftModem
Data Speeds Data Standards Fax Speeds Fax Mode Capabilities Error Correction and Data Compression Power Management
Technology speeds: 56,000 Kbps maximum downstream data, controllerless NOTE: 56 Kbps technology refers to download speeds only and requires compatible modems at server sites. Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download transmissions. (Upload only) 33,600/31,200/28,800/26,400/21,600/19,200/ 16,800/14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A, and Bell 103 14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2 V.44, 42bis, V.42 and MNP2-5 PCI Bus Power Management Interface Specification (PCI-PM) Revision 1.2, Appendix A. D0, D3hot, and D3cold. Wake on Ring state when in D3cold. If the power management event (PME) feature is enabled in D3cold, a modem can wake the system via WAKE# (WAKEN) or beacon. Meets PCI Express 1.1 standard. Driver upgradeable for future enhancements ITU-T V.80 video ready interface TIA/EIA 602 standard AT command set Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a UART-compatible interface Optional ring wakeup signal Canada Version 21 August 21, 2009 Page 25

Upgradeability Video Other
Operating Temperature Operating Humidity Power

EMC Telecom Other

32 to 158 F (0 to 70 C) 20% to 90%, non-condensing Requires a 3.3-V auxiliary power rail on PCI express bus Uses only one PCI express load (i.e., one grant/request pair), one shared IRQ, one electrical load LSI SV92EX Integrated PCI interface with 3.3-V tolerant buffers and CardBus support Complies with PCI express low profile specifications-6.7 x 2.3 in (17.0 x 5.8 cm) and supports high- and low-profile brackets Single RJ-11 connector Digital line protection, call progress monitoring via on-board piezo device, support for high profile and low profile brackets, PnP ID support UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV, NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO, SEMKO, CE mark FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN 61000-4-6, EN 61000-4-8 FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals Not available in Korea or the Republic of South Africa. The SV92EX device is packaged in a 32-pin micro leadless chip carrier (MLCC). The SV92EX is fully compliant with the PCI Express revision 1.1 specification. WHQL approved; ASPM compliant.

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Technical Specifications - Graphics
Integrated AMD DX10 graphics Bus Type Memory Controller Clock Speed Overlay Planes Maximum Color Depth Maximum Vertical Refresh Rate Multi-display Support Graphics/Video API Support Integrated DVI-D connector Display Devices Supported
PCIe x16 Variable and User selectable in BIOS settings 400MHz bpp 85Hz Yes DX10, OpenGL 2.0
Compliant with DDWG (Digital Display Working Group) and VESA specifications for a single-link digital DVI (DVI-D) connector. HP L1530 HP L1740 HP L1755 HP L1940 HP L1955 HP L2035 HP L2335 Resolutions Resolution Maximum Refresh Rate (Hz) Supported Analog Connection Digital Connection 640x60 800x60 1024x60 1280x60 1280x60 1440x60 1600x60 1680x60 1920x60-R 1920x60-R 1920xN/A 2048xN/A NOTE: 60-R denotes reduced blanking timings are used on single-link DVI connections and may be used with other digital connections

488,397,to 131 F (5 to 55 C) 160,041,885,696 bytes 1 in (2.54 cm) Media diameter: 3.5 in (8.89 cm) Physical size: 4 in (10.2 cm) Serial ATA (3.0 Gb/s) Up to 3 Gb/s 8 MB Single Track Average Full-Stroke
7,200 rpm 312,581,to 131 F (5 to 55 C) 80,026,361,856 bytes 1 in (2.54 cm) Media diameter: 3.5 in (8.89 cm) Physical size: 4 in (10.2 cm) Serial ATA (3.0 Gb/s) Up to 3 Gb/s 8 MB Single Track Average Full-Stroke 7,200 rpm 156,301,to 131 F (5 to 55 C)

Page 32

10,000 RPM Serial ATA Hard Drives 160-GB Capacity Height Width Interface Synchronous Transfer Rate (Maximum) Cache Seek Time (typical reads, includes controller overhead, including settling) Rotational Speed Logical Blocks Operating Temperature Capacity Height Width Interface Synchronous Transfer Rate (Maximum) Cache Seek Time (typical reads, includes controller overhead, including settling) Rotational Speed Logical Blocks Operating Temperature
160,041,885,696 bytes 1 in (2.54 cm) Media diameter: 3.5 in (8.89 cm) Physical size: 4 in (10.2 cm) Serial ATA (1.5 Gb/s), Native Command Queuing enabled Up to 1.5 Gb/s 16 Mbytes Single Track Average Full-Stroke

0.3 ms 4.6 ms 10.2 ms

10,000 RPM 312,581,to 131 F (5 to 55 C) 80,026,361,856 bytes 1 in (2.54 cm) Media diameter: 3.5 in (8.89 cm) Physical size: 4 in (10.2 cm) Serial ATA (1.5 Gb/s), Native Command Queuing enabled Up to 1.5 Gb/s 16 Mbytes Single Track Average Full-Stroke 10,000 RPM 156,301,to 131 F (5 to 55 C)

Page 33

Technical Specifications - Input/Output Devices
PS/2 Standard Keyboard Physical characteristics Keys Dimensions (L x W x H) Weight Operating voltage Power consumption System interface ESD EMI RFI Microsoft PC Languages Keycaps Switch actuation Switch life

Electrical

104, 105, 106, 107, 109 layout (depending upon country) 18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm) 2 lb (0.9 kg) minimum + 5VDC 5% 50-mA maximum (with three LEDs ON) PS/2 6-pin mini din connector CE level 4, 15-kV air discharge Conforms to FCC rules for a Class B computing device

Mechanical

Environmental
Approvals Ergonomic compliance
Functionally compliant 38 available Low-profile design 55-g nominal peak force with tactile feedback 20 million keystrokes (using Hasco modified tester) Contamination-resistant switch membrane Switch type Key-leveling mechanisms For all double-wide and greater-length keys 6 ft (1.8 m) Cable length Microsoft PC Mechanically compliant 43-dBA maximum sound pressure level Acoustics 50 to 122 F (10 to 50 C) Operating temperature Non-operating -22 to 140 F (-30 to 60 C) temperature 10% to 90% (non-condensing at ambient) Operating humidity Non-operating humidity 20% to 80% (non-condensing at ambient) 40 g, six surfaces Operating shock 80 g, six surfaces Non-operating shock 2-g peak acceleration Operating vibration Non-operating vibration 4-g peak acceleration 26 in (66 cm) on carpet, six-drop sequence Drop (out of box) 42 in (107 cm) on concrete, 16-drop sequence Drop (in box) UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC ANSI HFS 100, ISO 9241-4, and TUVGS

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HP USB 2-Button Laser Mouse Scroll Wheel Maximum Rotation Speed Switch Type Switch Life
rats/sec wheel Button 3,000,000 Wheel 1,000,000 times Tilt switch 500,000 times Operating Temperature 32 to 104 F (0 to 40 C) -4 to 140 F (-20 to 60 C) Non-operating Temperature 10% to 90% (non-condensing at ambient) Operating Humidity Non-operating Humidity 20% to 80% (non-condensing at ambient) Operating Shock Non-operating Shock Operating Vibration Non-operating Vibration Operating Voltage Power Consumption MTBF ESD 40 g, six surfaces 80 g, six surfaces 2-g peak acceleration 4-g peak acceleration + 5VDC 5%

Regulatory Approvals

> 150,000 hrs IEC-61000-4-2 criteria B, Contact discharge: +/- 4kV, Air discharge: +/- 8kV FCC Class B EMI-RFI PC 99 Compliant PC98 800dpi Resolution 25 cm/sec Tracking Speed 0.5mm Acceleration 0.6N (60gf) Switch Actuation Button 3,000,000 Switch Life Wheel 1,000,000 times Tilt switch 500,000 times 1850mm Cable Length PC99 compliant PC98-99 UL60950-1, UL 94, UL 746 (A-E), UL 796 TUV/GS: EN 60950-1, EN 60825-1 FCC Class B, UL 1950, cUL, TUV GS, CE, C-tick, VCCI, BSMI, RRL

Page 35

HP PS/2 Optical Scroll Mouse Dimensions (H x L x W) Weight Environmental
3.95 x 6.21 x 11.7 cm (1.56 x 2.44 x 4.61 in) 4.44 oz (126 g) 32 to 104F (0 to 40 C) Operating temperature -4 to 140F ( -20 to 60 C) Non-operating temperature 10% to 90% (non condensing at ambient) Operating humidity Non-operating humidity 10% to 90% non condensing 40 g, 6 surfaces Operating shock 80 g, 6 surfaces Non-operating shock 2 g peak acceleration Operating vibration Non-operating vibration 4 g peak acceleration Drop (out of box) 80 cm height onto asphalt tile over concrete or equivalent, 5-drop in 5 direction except the cable face 5 VDC 10% Operating voltage 100mA Power consumption PS/2 mini-din connector System consumption CE level 4, 15 kV air discharge ESD Conforms to FCC rules for a Class B computing EMI-RFI device Microsoft PCFunctionally compliant 400 20% DPI Resolution 10 in/s (25.4 cm/s) maximum Tracking speed 100 in/s/s (2.54 m/s/s) Acceleration 61 g nominal peak force Switch actuation 3,000,000 operations (using Hasco modified Switch life tester) Low force micro-switches Switch type Tracking mechanism life 155 mi (250 km) at average speed of 10 in/s 6 ft (1.8 m) Cable length Microsoft PCMechanically compliant 8 mm Width 1.01 in (25.6 mm) Diameter Maximum rotation speed 48 rats/sec Light force micro-switch Switch type 1 million operations Switch life Minimum 200,000 revolutions Mechanical life UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, Compliant BSMI, C-Tick, MIC

Scroll wheel

Regulatory approvals

Page 36

HP USB Optical Scroll Mouse Dimensions (H x L x W) Weight Cable length

Environmental (all conditions non-condensing)
Temperature Relative Humidity Maximum Wet Bulb Temperature

SATA DVD-ROM Drive

Height Orientation Interface type Disc capacity Dimensions (W x H x D) Weight (max) Read speeds
5.25-inch, half-height, tray-load Either horizontal or vertical SATA/ATAPI Single layer: Up to 4.7 GB (6 times capacity of CD-ROM) Double layer: Up to 8.5 GB (12 times capacity of CD-ROM) 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm) 2.6 lb (1.2 kg) Up to 8X DVD+R/-R/+RW/ -RW/+R DL /-R DL Up to 16X DVD-ROM Up to 4X DVD-RAM Up to 48X CD-ROM, CD-R Up to 32X CD-RW Canada Version 21 August 21, 2009 Page 39
Removable Storage Media Compatibility DVD-ROM Media CD-ROM CD-R CD-RW DVD-ROM DVD-ROM DL DVD-RAM DVD+R DVD+R DL DVD+RW DVD-R DVD-RW DVD-R DL Random Full Stroke Cache Buffer Data Transfer Modes
Access times (typical reads, including setting)
Source DC Power Requirement DC Current
Read Write Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No DVD: < 140 ms (typical), CD: < 125 ms (typical) DVD: < 250 ms (seek), CD: < 210 ms (seek) 2 MB (minimum) ATA PIO mode 4 (16.7 MB/s); ATA Multi-word DMA mode 2 (16.7 MB/s); ATA UltraDMA Mode 3 (44.4 MB/s -default) SATA DC power receptacle 5 VDC 5%-100 mV ripple p-p 12 VDC 5%-200 mV ripple p-p 5 VDC <1000 mA typical, < 1600 mA maximum 12 VDC < 600 mA typical, < 1400 mA maximum 41 to 122 F (5 to 50 C) 10% to 90% 86 F (30 C)

Page 40

Technical Specifications - Removable Storage
HP 16-in-1 Media Card Reader
USB 2.0 High-speed device USB Interface Advance protocol support Supports hardware ECC (Error Correction Code) function Supports hardware CRC (Cyclic Redundancy Check) function Supports MS 4-bit parallel transfer mode Supports MS-PRO 4-bit parallel transfer mode Supports SD 4-bit parallel transfer mode Supports high-speed 50-MHz SD 4-bit card (version 1.1) Support high-speed 52-MHz MMC 8-bit card MicroSD (T-Flash) Memory Stick Micro Operational Environmental Extremes Test Parameters/Conditions Power applied, unit operating on system 5% nominal supply voltage. 10C 10% R.H. = 24 hours 10C 90% R.H. = 24 hours 20C 90% R.H. = 24 hours 30C 90% R.H. = 24 hours 40C 90% R.H. = 24 hours 50C 90% R.H. = 24 hours 50C 10% R.H. = 24 hours Test Parameters/Conditions Storage Environmental 60C @ 80% R.H. for 96 hours Extremes -30C @ 20% R.H. for 48 hours No power applied Delta C < 1.0C/min Delta % R.H. < 1.5% R.H./min USB-IF, WHQL, Compliant with USB Mass Storage Class Bulk only Transport Specification Rev. 1.0, Compliant Intel Front Panel I/O Connectivity Design Guide V. 1.2 FCC, CE, BSMI, C-Tick, VCCI, MIC, cUL, TUV-T

Page 44

Batteries This product complies with ISO standards: EU Directive 91/ 157/ EEC EU Directive 93/ 86/ EEC EU Directive 98/ 101/ EEC Batteries used in the product do not contain: Mercury greater the 5ppm by weight Cadmium greater than 10ppm by weight Lead greater than 2000ppm by weight.
Battery size: CR2032 (coin cell) Battery type: Lithium This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2002/95/EC. This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). This product is in compliance with the IEEE 1680 (EPEAT) standard at the GOLD level, see: www.epeat.net Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043. This product contains 0% recycled materials (by wt.) This product is 93% recyclable when properly disposed of at end of life. Corrugated Paper 1700 g Packaging Materials EPE Foam 138 g LDPE Bag 50 g The EPE foam packaging material is made from 30 to 60% industrial recycled content. The corrugated paper packaging materials contains at least 80% post consumer recycled content. Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. By July 1, 2006, RoHS substances were virtually eliminated (virtually = to levels below legal limits) for all HP electronic products subject to the RoHS Directive, except where it is widely recognized that there is no technically feasible alternative (as indicated by an exemption under the EU RoHS Directive). This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at: http://www.hp.com/hpinfo/globalcitizenship/environment/ supplychain/gen_specifications.html): Asbestos Certain Azo Colorants Certain Brominated Flame Retardants may not be used as flame retardants in plastics Cadmium Chlorinated Hydrocarbons Chlorinated Paraffins Formaldehyde DA - 12900 Canada Version 21 August 21, 2009 Page 45