HP-00007-01, Appendix 3

13-Oct-2004

Appendix 3 Product End-of-Life Disassembly instructions Product Identification: Marketing Name / Model iPAQ rz1710/1717 Description PDA
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Item Description Notes Quantity of items included in product. Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries With a surface greater than 10 square cm All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps 2 1
Mercury containing components
Liquid Crystal Displays (LCD) with a surface greater than 100 square cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB / PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials
0 Include the cartridges, print heads, tubes, vent chambers, and service stations. 0

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containing refractory ceramic fibers Components, parts and materials containing radioactive substances 0
Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Wiha Picofinish 267P Tool Size (if applicable) M1.4* L4.0 T1.4* L5.0 M1.7* L8.0
Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1 Remove the stylus, SD card, Mini-SD card, SIM card, battery cover 30 and battery. Remove the screws Separate housing and bezel Disconnect all the FPCs and cables from the connectors of M/B. Remove the M/B from the bezel Remove the sub board from the bezel. Remove the backup battery cover to take out the backup battery. 10 10
OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within the product which require selective treatment (with descriptions and arrows identifying locations) can be inserted below:
Insert Speaker Assy Screw (M1.4* L4.0)

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Screw (T1.5* L5.0)

Insert Speaker

Insert Battery cable

Insert Battery

Insert LCD Cable
Insert Micro Phone Connector

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