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IBM HS22 BladecenterIBM BladeCenter HS22 - 7870 - 6 GB RAM - 1.86 GHz - 0 GB HDD

Blade, Matrox MGA G200e, English, 4 MB cache - Monitor: .

The IBM BladeCenter HS22 offers flexible options to support a broad range of workloads, including virtualization and enterprise applications. Along with intuitive UEFI-based tools, the HS22 can be customized and deployed quickly while best-in-class reliability features help keep you up and running. Mix and match the HS22 with the industry's most diverse set of chassis and blades and that go beyond x86. The HS22 features an innovative mechanical design optimized for cooling capability to help... Read more

 

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Draft Document for Review May 6, 2011 1:46 pm

4538paper.fm

Redpaper
Randall Davis David Watts
IBM BladeCenter HS22 Technical Introduction
The IBM BladeCenter HS22 is a two-socket blade server running the latest Intel Xeon processors. It is ideal for infrastructure, virtualization and enterprise business applications and is compatible with the IBM BladeCenter H, E, S, and HT chassis. This paper covers the following topics: Model information on page 3 Chassis support on page 5 Processor on page 8 Memory on page 14 Standard onboard features on page 23 Local storage on page 25 Integrated virtualization on page 29 I/O expansion on page 29
Copyright IBM Corp. 2010. All rights reserved.

ibm.com/redbooks

Introduction
The HS22 supports up to two Intel Xeon 5500 or 5600 series multi-core processors, 12 DIMMs modules, two hot-swap drives, two PCI Express connectors, and one internal USB connector. Figure 1 shows the HS22.
Figure 1 The HS22 type 7870
Table 1 lists the features of the HS22.
Table 1 Features of the HS22 type 7870 Feature Processor options Intel Xeon 5600 Processor Series hex-core processors Intel Xeon 5600 Processor Series quad-core processors Intel Xeon 5500 Processor Series quad-core processors Intel Xeon 5500 Processor Series dual-core processors 1/MHz, 1033 MHz, or 1333 MHz (dependant on processor model) 4 MB, 8 MB, or 12 MB (shared between cores) 12 DIMM slots Models with Intel Xeon 5600 series processors: 192 GB using 16GB DIMMs Models with Intel Xeon 5500 series processors: 96 GB using 8GB DIMMs
Number of processors (std/max) Memory Speed Cache Memory slots Memory Maximums
Feature Memory Types Hot Swap Disk Drives (std/max) Maximum internal storage Network I/O upgrade DDR 3 ECC Very Low Profile (VLP) Registered DIMM DDR 3 ECC Very Low Profile (VLP) Low Power Registered DIMM 0 / 2 (SAS, SATA or SSD) Optional: Up to two 2.5 hot-swap SAS or SATA HDDs Optional: Up to two 2.5 hot-swap solid state drives Two ports, one Broadcom BCM5709S dual-port Gigabit Ethernet controller, TOE Two PCI Express connectors (CFFh and CIOv form factors)
Figure 2 shows the components on the system board of the HS22. Hot-swap drive bay 1 Memory for processor 2

Processor 2

USB connector

CIOv connector

Hot-swap drive bay 2

Processor 1

Memory for processor 1

CFFh connector

Figure 2 Layout of the HS22 system board

Model information

Table 2 shows the current models.
Table 2 Models of the HS22 type 7870 Server modelsa Processor model Clock speed Number of processors (std/max) Number of cores Shared cache size Maximum memory speed Memory (std/maxb)
Intel Xeon 5600 series 6-core processors 7870-N2xc Intel Xeon L5640 2.26 GHz 1/12 MB 1066 MHz 3x 2 GB / 192 GB
Server modelsa 7870-B6x 7870-HAxd 7870-H2x 7870-H4x 7870-C6x 7870-F2x 7870-C8x
Processor model Intel Xeon E5649 Intel Xeon X5650 Intel Xeon X5650 Intel Xeon X5670 Intel Xeon X5675 Intel Xeon X5680 Intel Xeon X5690
Clock speed 2.53 GHz 2.66 GHz 2.66 GHz 2.93 GHz 3.06 GHz 3.33 GHz 3.46 GHz
Number of processors (std/max) 1/2 1/2 1/2 1/2 1/2 1/2 1/2

Number of cores 6

Shared cache size 12 MB 12 MB 12 MB 12 MB 12 MB 12 MB 12 MB
Maximum memory speed 1333 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz
Memory (std/maxb) 3x 4 GB / 192 GB 3x 2 GB / 192 GB 3x 2 GB / 192 GB 3x 2 GB / 192 GB 3x 4 GB / 192 GB 3x 2 GB / 192 GB 3x 4 GB / 192 GB
Intel Xeon 5600 series 4-core processors 7870-A5x 7870-A7x 7870-G2x 7870-G4x 7870-GCxe 7870-B5x 7870-H5x 7870-C5x 7870-F3x 7870-C7x Intel Xeon E5603 Intel Xeon E5607 Intel Xeon E5620 Intel Xeon E5640 Intel Xeon E5640 Intel Xeon X5647 Intel Xeon X5667 Intel Xeon X5672 Intel Xeon X5677 Intel Xeon X5687 1.60 GHz 2.26 GHz 2.40 GHz 2.66 GHz 2.66 GHz 2.93 GHz 3.06 GHz 3.20 GHz 3.46 GHz 3.60 GHz 1/2 1/2 1/2 1/2 1/2 1/2 1/2 1/2 1/2 1/MB 8 MB 12 MB 12 MB 12 MB 12 MB 12 MB 12 MB 12 MB 12 MB 1066 MHz 1066 MHz 1066 MHz 1066 MHz 1066 MHz 1066 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz 1x 4GB / 192 GB 1x 4GB / 192 GB 3x 2 GB / 192 GB 3x 2 GB / 192 GB 3x 2 GB / 192 GB 3x 4 GB / 192 GB 3x 2 GB / 192 GB 3x 4 GB / 192 GB 3x 2 GB / 192 GB 3x 4 GB / 192 GB
Intel Xeon 5500 series 4-core processors 7870-A4x 7870-M2xc Intel Xeon E5507 Intel Xeon L5518 2.26 GHz 2.13 GHz 1/2 1/MB 8 MB 800 MHz 1066 MHz 3x 1 GB / 96 GB 2x 2 GB / 96 GB

In this Table 4: A green square ( ) in a bay means that it can hold any blade server supported in the BladeCenter E including the HS22 and HS22V. A blue square ( ) in a bay means that it can hold any supported blade server except an HS22 or HS22V. An E in a square means that the bay must remain empty.
Table 4 Placement of HS22 and other blades in a BladeCenter E with 2000 W power supplies Power rating of HS22 CPUa Total bays that must remain empty 0 E E E E E E E E E E Power domain 1 Total blades installable Max HS22s installable Power domain 2

Bay 10

Bay 11

Bay 12

Bay 13
130 W 95 W 95 W 95 W 80 W 80 W 60 W 60 W 40 W
a. See Table 8 on page 10 to determine to which HS22 server models these apply.
For example, consider the first row of Table 4 on page 6. If you want to install HS22 servers with 95 W CPUs, then you can install at most 11 of the servers into the chassis. Five of the servers must be installed in power domain 1 (bays 16), and six of the servers must be installed in power domain 2 (bays 7 - 12). HS22 servers with 130 W processors are not supported at all in the BladeCenter E with 2000 W power supplies. This is shows in the first row of Table 4 on page 6, where all cells are blue. Tip: Within a power domain, it does not matter which bay is left unoccupied as required. Bays 6, 13, and 14 are used in the table for illustrative purposes only.

Bay 14

Table 5 shows the number of HS22 blades that are supported in the BladeCenter E with 2320 W power supplies installed. As you can see, the BladeCenter E with 95W or lower processors are fully supported with the 2320 W power supplies in the chassis. However, the 130 W processors are not supported at all in this chassis. In Table 5: A green square ( ) in a bay means that it can hold any blade server supported in the BladeCenter E including the HS22 and HS22V. A blue square ( ) in a bay means that it can hold any supported blade server except an HS22 or HS22V. An E in a square means that the bay must remain empty.
Table 5 Placement of HS22 and other blades in a BladeCenter E with 2320 W power supplies Power rating of HS22 CPUa Total bays that must remain empty 0 Power domain 1 Total blades installable Max HS22s installable Power domain 2
130 W 95 W 80 W 60 W 40 W

BladeCenter H support

With the exception of servers with 130 W processors, the BladeCenter H fully supports installation of up to 14 HS22 servers. With HS22 servers with 130 W, the number of servers supported depends on the capacity of the power supplies and the cooling modules installed in the chassis: 2900 W power supplies 2980 W power supplies BladeCenter H standard blowers BladeCenter H Enhanced Cooling Modules (enhanced blowers) These power supplies and blowers are standard on particular models of the BladeCenter H. Table 6 lists the number of HS22 servers that are supported in models of the BladeCenter H chassis. In the Table 6: A green square in a cell means that the chassis can be filled with HS22 blade servers up to the maximum number of blade bays in the chassis (14 blades in the BladeCenter H). A yellow square in a cell means that the maximum number of HS22 blades that the chassis can hold is fewer than the total available blade bays. All other bays must remain

Feature code A16G A16H A16J A16L
Supported model H4x H5x CTO H2x, HAx B6x B5x CTO G4x, GCx CTO CTO G2x N2x CTO CTO A7x A5x
44T1887 44T1886 44T1885 44T1884 44T1883 59Y5575 44T1736 46M0697 49Y5052 59Y5695 43W5987 44T1712 59Y5692 43W5986

7763 5369

C4x C3x CTO B4x B3x L3x CTO L2x M2x A4x CTO A2x, CCx D3x D2x
For more information about the Intel Xeon 5500 and 5600 series processors see the following URL: http://www.intel.com/p/en_US/products/server/processor/xeon5000

Memory

The HS22 has six DIMM sockets per processor (12 DIMMs in total). The HS22 with the Xeon 5600 series processor can support up to 192 GB of memory in total when using 16 GB DIMMs and with both processors installed. The HS22 with the Xeon 5500 series processor can support up to 96 GB of memory in total when using 8 GB DIMMs and with both processors installed. The HS22 uses Double Data Rate-3 (DDR-3) very-low-profile (VLP) registered DIMMs. Figure 4 shows the location of the 12 memory DIMM sockets.
DIMM 7 DIMM 8 DIMM 9 DIMM 10 DIMM 11 DIMM 12
DIMM 6 DIMM 5 DIMM 4 DIMM 3 DIMM 2 DIMM 1
Figure 4 DIMM layout on the HS22 system board
Unlike previous generations of Intel Xeon processors, the Xeon 5500 and 5600 series processors have an integrated memory controller. The memory DIMMs connect directly to one of the processors. With one processor installed, only six DIMMs can be accessed. To access memory in the other six DIMM connectors, the second processor must be installed. Table 10 shows which memory DIMM connectors are connected to each processor.
Table 10 Memory channel configuration Processor 1 Memory channel Channel 0 Channel 1 Channel Channel 3 Channel 4 Channel 5 DIMM connector DIMM connector 1 and 2 DIMM connector 5 and 6 DIMM connector 3 and 4 DIMM connector 7 and 8 DIMM connector 11 and 12 DIMM connector 9 and 10
Topics in this section: Memory DIMM installation recommendations on page 15 Memory modes on page 16
Memory for HS22 servers with Xeon 5500 series processors on page 17 Memory for HS22 servers with Xeon 5600 series processors on page 20 Memory performance on page 23
Memory DIMM installation recommendations

Memory mirroring mode

Memory mirroring works much like disk mirroring and provides high server availability in the event of a memory DIMM failure. The total memory is divided into two channels. The third channel is unused. Data is written concurrently to both channels. With mirroring enabled, only one-third of total memory is available for use because two DIMM slots are the primary channel, two DIMM slots are the backup channel, and two DIMM slots are not used. Due to the double writes to memory, performance is affected. Figure 5 illustrates the HS22 memory mirroring layout.
HS22 Memory Mirroring Layout
Processor 1 QPI Processor 2

Memory Controller

Channel 0 Channel 2 Channel 1
Channel 3 Channel 5 Channel 4

DIMM 1

DIMM 3

DIMM 5

DIMM 7

DIMM 9

DIMM 11

DIMM 2

DIMM 4

DIMM 6

DIMM 8

DIMM 10

DIMM 12

primary channel 1

backup channel 1 channel not used

primary channel 2

backup channel 2 channel not used
Figure 5 The HS22 type 7870 memory mirroring layout
If a failed DIMM is one of the DIMMs in the primary channel, it is instantly disabled and the mirrored (backup) memory in the other channel becomes active (primary) until the failing DIMM is replaced. Mirroring is handled at the hardware level, and no operating system support is required. Note: If ServeRAID MR10ie is installed, the battery is installed in DIMM slot 7. Therefore, DIMM slot 7 cannot be used for mirroring. This limits the amount of memory available when using memory mirroring. The HS22 type 7870 supports different memory features and DIMM options depending on the series of Xeon processor installed, as detailed in the following sections: Memory for HS22 servers with Xeon 5500 series processors on page 17 Memory for HS22 servers with Xeon 5600 series processors on page 20
Memory for HS22 servers with Xeon 5500 series processors
All supported DIMMs installed in the HS22 with Xeon 5500 series processors operate at 1.5 volts. The HS22 supports the installation of certain 1.35-volt low-power memory options, but with the Xeon 5500 series processors installed these DIMMs also operate at 1.5 volts, and thus lose their energy-efficient capability. The largest memory DIMM that is supported in the HS22 with the Xeon 5500 series processor is 8 GB.
The maximum speed at which the memory channel runs on the HS22 is a combination of; The processor The X (Advanced) range of Xeon 5500 series processors has a maximum memory channel speed of 1333 MHz. This is the only range of Xeon processors capable of running memory DIMMs that are rated at 1333 MHz that are actually at 1333 MHz. The E and L ranges of Xeon 5500 series processor models have a maximum memory speed of 1066 MHz or 800 MHz and therefore cannot run the memory any faster than this. The memory DIMM module Not all DIMMs support running at 1333 MHz. Certain memory DIMMs only operate up to 1066 MHz. Even if these 1066 MHz DIMMs are used with a processor that supports 1333 MHz, the memory channel speed will still not exceed 1066 MHz. Dual-rank DIMMs offer better interleaving and thus better performance than single-rank DIMMs. See Table 14 on page 20 to determine the maximum memory channel speed that each DIMM supports and the number of ranks (note the Rank column in those tables). The number of DIMM modules installed With the Xeon 5500 series of processors, the more memory DIMMs per channel, the lower the speed at which the memory channels operate. If a processor that supports running the memory channels at 1333 MHz has one DIMM per channel, and the DIMM installed is also capable of running at 1333 MHz, then the memory channels run at 1333 MHz. If any or all of the memory channels have a second DIMM installed, then the memory channels run at 1066 MHz. DIMM modules should be installed in lots of three, which for the HS22 is either three or six DIMM modules per processor. This makes the best use of the bandwidth available to the processors three memory channels. See Table 8 on page 10 to determine the maximum memory channel speed for a given Xeon 5500 series processor. Key information: Note the following key information: If the 1.35-volt low-power DIMMs are installed in the HS22 with the Xeon 5500 series processor, then these low-power DIMMs will operate at 1.5 volts and thus lose their energy-efficient capability. The X (Advanced) range of Xeon 5500 series processors have a maximum memory channel speed of 1333 MHz and can therefore run 1DPC@ 1333 MHz. The HS22 with the Xeon 5500 series processor does not support 2DPC@ 1333 MHz.

Figure 6 shows a graphical representation of one and two DIMM modules per processor memory channel.
Intel Xeon 5500 series processors

DIMM DIMM DIMM

D IMM D IMM D IMM

One DIMM per channel

T wo D IMMs per channel
Figure 6 Intel Xeon 5500 series processor with one and two DIMMs per channel
Table 13 lists the supported memory speed for a given Xeon 5500 series processor type with one or two DIMM modules per channel installed.
Table 13 Xeon 5500 series processor memory speeds and DIMMs per channel Processor typea Advanced Standard Basic QPI link speedb 6.4 GT/s 5.86 GT/s 4.8 GT/s Max DDR3 speed 1333 MHz 1066 MHz 800 MHz 1DPCc 1333 MHz 1066 MHz 800 MHz 2DPCc 1066 MHz 1066 MHz 800 MHz
a. For more information about processor type, see Table 8 on page 10. b. GT/s = giga transfers per second. c. Maximum memory speed possible. Actual memory speed also depends on other factors, such as those described on page 18.
Table 14 lists the memory options for the HS22 using the Xeon 5500 series processors (ordered by DIMM capacity).
Table 14 Memory modules supported in the HS22 type 7870 using the Xeon 5500 series processors Part number 49Y1427 44T1485 49Y1428 49Y1429 44T1487 44T1486 44T1594 46C0560a 49Y1430 44T1488 44T1596 46C0563a 46C0564a 49Y1431 44T1579bc 46C7451 Feature code A0YV A0WX 1908 A0WY A0WZ 1910 Description 1 GB (1x 1 GB, 1Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP RDIMM 1 GB (1x 1 GB) Single Rank PC3-10600 CL9 ECC DDR3-1333 VLP LP RDIMM 2 GB (1x 2 GB, 2Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP RDIMM 2 GB (1x 2 GB, 1Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP RDIMM 2 GB (1x 2 GB) Single Rank PC3-10600 CL9 ECC DDR3-1333 VLP RDIMM 2 GB (1x 2 GB) Dual Rank PC3-10600 CL9 ECC DDR3-1333 VLP LP RDIMM 2 GB (1x 2 GB, 1Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP 2 GB (1x 2 GB, 1Rx8, 1.35 V) PC3L-10600 CL9 ECC DDRMHz VLP 4 GB (1x 4 GB, 2Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP RDIMM 4 GB (1x 4 GB) Dual Rank PC3-10600 CL9 ECC DDR3-1333 VLP RDIMM 4 GB (1x 4 GB, 2Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP RDIMM 4 GB (1x 4 GB, 1Rx4, 1.35 V) PC3L-10600 CL9 ECC DDRMHz VLP 4 GB (1x 4 GB, 2Rx8, 1.35 V) PC3L-10600 CL9 ECC DDRMHz VLP 8 GB (1x 8 GB, 2Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP RDIMM 8 GB (1x 8 GB) Dual Rank PC3-8500 CL7 ECC DDR3-1066 VLP RDIMM 8 GB (1x 8 GB, Dual Rankx4) PC3-10600 CL9 ECC DDR3-1333 VLP Rank Single Single Dual Single Single Dual Single Single Dual Dual Dual Single Dual Dual Dual Dual
a. Will run at 1.5 V only when used in blade server with the Xeon 5500 series processor. b. The 8 GB Dual Rank DIMM (44T1579) has a maximum memory speed of 1066 MHz. c. 44T1579 was withdrawn from marketing in September 2010.
Memory for HS22 servers with Xeon 5600 series processors
Standard DIMMs supported in the HS22 operate at 1.5 volts. The HS22 server with the Xeon 5600 series processors installed also supports low-power DIMMs that can operate at 1.35 volts. The 1.35-volt low-power memory DIMMs can be up to 10% more energy efficient than existing 1.5-volt memory DIMMs. The HS22 models with one of the Advanced (X) ranges of the Xeon 5600 series processor installed have the ability to run specific DIMMs at 1333 MHz even when two DIMMs per channel are populated. Table 7 on page 10 shows which processors support two DIMMs per channel. Table 16 on page 22 shows which DIMMs support two DIMMs per channel at 1333 MHz. The maximum speed at which the memory channel will run on the HS22 is a combination of: The processor The X (Advanced) range of Xeon 5600 series processors has a maximum memory channel speed of 1333 MHz. This is the only range of Xeon processors capable of running memory DIMMs that are rated at 1333 MHz that are actually at 1333 MHz. The E and L ranges of Xeon 5600 series processor models have a maximum memory speed of 1066 MHz or 800 MHz and therefore cannot run the memory any faster than this. 20

The memory DIMM module Not all DIMMs support running at 1333 MHz. Certain memory DIMMs only operate up to 1066 MHz. Even if these 1066 MHz DIMMs are used with a processor that supports 1333 MHz, the memory channel speed will still not exceed 1066 MHz. Dual-rank DIMMs offer better interleaving and thus better performance than single-rank DIMMs. See Table 16 on page 22 to determine the maximum memory channel speed that each DIMM supports and the number of ranks (note the Rank column in those tables). The number of DIMM modules installed The X (Advanced) range of Xeon 5600 series processors has the ability to run two DIMMs per memory channel and still operate the memory bus speed at 1333 MHz. With the E and L ranges of the Xeon 5600 series range of processors, the more memory DIMMs per channel, the lower the speed at which the memory channels operate. DIMM modules should be installed in lots of three, which for the HS22 is either three or six DIMM modules per processor. This makes the best use of the bandwidth available to the processors three memory channels. See Table 7 on page 10 to determine the maximum memory channel speed for a given Xeon 5600 series processor. Key information: Note the following key information: The HS22 with Intel Xeon 5600 series processors supports 1.35 V or 1.5 V DIMMs. Low-power 1.35-volt memory DIMMs is a feature supported for the HS22 using the Intel Xeon 5600 series processor only. The ability to run two DIMMs per channel (2DPC) at 1333 MHz is a feature supported for the HS22 using the Intel Xeon 5600 series processor only. If the low-power 1.35-volt DIMMs are installed with standard 1.5-volt DIMMs, then these low-power DIMMs also operate at 1.5 volts and thus lose their energy-efficient capability. For models with the Xeon 5600 processor: 1.35-volt DIMMs operate at 1.5 volts if you enable 2DPC at 1333 MHz in UEFI. Low-power 1.35-volt DIMMs support 1DPC at 1333 MHz or 2DPC at 1066 MHz, whereas 1.5-volt DIMMs support 2DPC at 1333 MHz (provided that the processor also supports these memory speeds). Figure 7 shows a graphical representation of one and two DIMM modules per processor memory channel.
Intel Xeon 5600 series processors
Figure 7 Intel Xeon 5600 series processor with one and two DIMMs per channel IBM BladeCenter HS22 Technical Introduction
Table 15 lists the supported memory speed for a given Xeon 5600 series processor type with one or two DIMM modules per channel installed.
Table 15 Xeon 5600 series processor memory speeds and DIMMs per channel Processor typea Advanced QPI link speedb 6.4 GT/s Max DDR3 speed 1333MHz 1.35V 1.5V Standard 5.86 GT/s 1066MHz 1.35V 1.5V Basic 4.8 GT/s 800MHz 1.35V 800 MHz 800 MHz 1066 MHz 800 MHz 1066 MHz 800 MHz 1333 MHz 1066 MHz 1066 MHz 1066 MHz Memory voltage 1.5V 1DPCc 1333 MHz 2DPCc 1333 MHz

a. For more information about processor type, see Table 7 on page 10. b. GT/s = giga transfers per second. c. Maximum memory speed possible. Actual memory speed also depends on other factors.
Table 16 lists the memory options for the HS22 using the Xeon 5600 series processors (ordered by voltage and then DIMM capacity).
Table 16 List of memory modules for the HS22 type 7870 using the Xeon 5600 series processors Part number Feature code Description 2DPC @1333a Rank
Standard DIMMs (1.5 V) 49Y1427 49Y1428 49Y1429 44T1594 49Y1430 44T1596 49YA0YV GB (1x 1 GB, 1Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP 2 GB (1x 2 GB, 2Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP 2 GB (1x 2 GB, 1Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP 2 GB (1x 2 GB, 1Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP 4 GB (1x 4 GB, 2Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP 4 GB (1x 4 GB, 2Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP 8 GB (1x 8 GB, 2Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz VLP Yes Yes Yes Yes Yes Yes Yes Single Dual Single Single Dual Dual Dual
Low Power DIMMs (1.35 V)b 46C0560 46C0561 46C0563 46C0564 46C0567 46C0568 46C0569d 46C0599 A0WX 1907 A0WY A0WZ 2 GB (1x 2 GB, 1Rx8, 1.35 V) PC3L-10600 CL9 ECC DDRMHz VLP 2 GB (1x 2 GB, 1Rx4, 1.35 V) PC3-10600 CL9 ECC DDRMHz VLP 4 GB (1x 4 GB, 1Rx4, 1.35 V) PC3L-10600 CL9 ECC DDRMHz VLP 4 GB (1x 4 GB, 2Rx8, 1.35 V) PC3L-10600 CL9 ECC DDRMHz VLP 4 GB (1x 4 GB, 2Rx4, 1.35 V) PC3-10600 CL9 ECC DDRMHz VLP 8 GB (1x 8 GB, 2Rx4, 1.35 V) PC3-10600 CL9 ECC DDRMHz VLP 8 GB (1x 8 GB, 2Rx4, 1.35 V) PC3-8500 CL7 ECC DDRMHz VLP 16 GB (1x 16 GB, 2Rx4, 1.35 V) PC3L-10600 CL9 ECC DDRMHz VLP Yesc Yesc Yesc Yesc Yesc Yesc No Yesc Single Single Single Dual Dual Dual Dual Dual
a. These DIMMs are supported to run two DIMMs per channel at a memory bus speed of 1333 MHz (2DPC@1333MHz) with the X (Advanced) range of Intel Xeon 5600 series processors. See Table 7 to determine the processors in the X range. b. Low-power 1.35v DIMMs operate at 1.5 volts if they are mixed with 1.5-volt DIMMs. c. Supports 2DPC@1333 MHz only when operating at 1.5 V. d. The 8 GB Dual Rank DIMM (46C0569) has a maximum memory speed of 1066 MHz.

Memory performance

Video controller

The Video subsystem in the HS22 is a component of the Integrated Management Module (IMM) and is based on the Matrox G200eV video core with 16 MB of video memory. Table 17 lists the supported video resolutions.
Table 17 Supported video resolutions Resolution 640 x x x 768 Maximum refresh 85 Hz 85 Hz 75 Hz
Trusted Platform Module (TPM)
Trusted computing is an industry initiative that provides a combination of secure software and secure hardware to create a trusted platform. It is a specification that increases network security by building unique hardware IDs into computing devices. The HS22 implements TPM Version 1.2 support. The trusted platform module (TPM) in the HS22 is one of the three layers of the trusted computing initiative (Table 18).
Table 18 Trusted computing layers Layer Level 1: Tamper-proof hardware, used to generate trustable keys Level 2: Trustable platform Level 3: Trustable execution Implementation Trusted Platform Module UEFI or BIOS Intel processor Operating system Drivers

Local storage

The HS22 blade server features an onboard LSI Logic 53C1064E SAS controller with two hot-swap drives bay accessible from the front of the blade server (Figure 8). The LSI Logic 53C1064E SAS controller provides RAID 0 or RAID 1 capability and supports up to two internal hot-swap SAS or SATA HDDs or two internal hot swap solid-state drives. The LSI 53C1064E SAS controller ports operate at a burst rate of 1.5 or 3.0 Gbps. An optional ServeRAID MR10ie is available that provides battery-backed write cache for internal and external disk drives.
Figure 8 The HS22 showing the front hot-swap disk drive bays

ServeRAID-MR10ie

The optional ServeRAID-MR10ie, part number 46C7167, is a SAS RAID controller for the HS22. It is installed in the CIOv expansion socket. It provides RAID support with
battery-backed cache for onboard and external disk drives. With the ServeRAID-MR10ie, you can connect to BladeCenter S storage or the external System Storage EXP3000 disk enclosure. Key features of the ServeRAID-MR10ie controller are: Provides 256 MB of ECC DDR-2 battery-backed cache Utilizes an LSI 1078 controller Supports data speeds of 1.5 or 3.0 Gbps Supports up to 26 disk drives Support for onboard and external disk drives Includes battery backup module Supports RAID levels 0, 1, 10, 5, 50, 6, and 60 Support for SAS disks Support for OS Boot over SAS Note: The ServeRAID-MR10ie does not support the use of SATA or SSD drives on the HS22 blade server. The ServeRAID-MR10ie option ships with a battery backup unit, in the form of a DIMM (which is installed in DIMM socket 7). IBM recommends that you replace the battery unit annually. The replacement battery unit is part number 46M0800. Tip: If the ribbon cable is not used to connect the card to the battery, the AMM event log will indicate that battery backup unit (BBU) is not present and write-back cache will not be a configurable option in the SAS configuration utility. For customers in countries with configure-to-order capability, the ServeRAID-MR10ie is available with and without the battery. Table 19 shows relevant part numbers and feature codes.

Table 19 Part numbers and feature codes Description ServeRAID-MR10ie (CIOv) Controller with battery ServeRAID-MR10ie (CIOv) Controller without battery Replacement battery Part number Feature code Not available

46C7167

Not available 46M0800
Note: If the ServeRAID MR10ie is installed, the battery is installed in DIMM slot 7. Therefore DIMM slot 7 cannot be used for memory. This will limit the total amount of memory that will be able to be installed.
Local SAS or SATA disk drives
The HS22 type 7870 has support for up to two hot-swap SFF SAS or SATA hard disk drives. These two hot-swap hard disk drives are accessible from the front of the blade server without removing the blade server from the BladeCenter chassis. See Table 20 for a list of supported SAS and SATA HDDs.
Table 20 Supported SAS and SATA HDDs Part Number Feature Code Description
SAS hard disk drives 43W7535 43W7536 43W7545 42D0632a 42D0637a 42D0672a 42D0677a 42D0707a 49Y2003 81Y9690a 5433 A1P3 IBM 73 GB 10 K SAS 2.5" SFF Slim-HS HDD IBM 146 GB 10 K SAS 2.5" SFF Slim-HS HDD IBM 73 GB 15 K SAS 2.5" SFF Slim-HS HDD IBM 146 GB 10 K 6 Gbps SAS 2.5" SFF Slim-HS HDD IBM 300 GB 10 K 6 Gbps SAS 2.5" SFF Slim-HS HDD IBM 73 GB 15 K 6 Gbps SAS 2.5" SFF Slim-HS HDD IBM 146 GB 15 K 6 Gbps SAS 2.5" SFF Slim-HS HDD IBM 500 GB Gbps NL SAS 2.5" SFF Slim-HS HDD IBM 600 GB 10 K 6 Gbps SAS 2.5" SFF Slim-HS HDD IBM 1TB 7.2K 6Gbps NL SAS 2.5" SFF HS HDD
SATA hard disk drives 43W7670 42D0747 81Y9722a 42D0752 81Y9726a 81Y9730a A1NX 5407 A1NZ A1AV 300 GB 10 K SATA 2.5" Slim-HS HDD IBM 160 GB 7200 NL SATA 2.5" SFF Slim-HS HDD IBM 250GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD IBM 500 GB 7200 NL SATA 2.5" SFF Slim-HS HDD IBM 500GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD IBM 1TB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD
a. Will only operate up to 3 Gbps when installed in the HS22

Solid state drives

Solid state drives (SSD) are a relatively new technology in the server world. SSDs are more reliable than spinning hard disk drives and they consume much less power than a standard SAS drive. Target Applications for SSDs include video surveillance, transaction-based DB and other applications that have high performance but moderate space requirements. Table 21 lists the supported SSDs.
Table 21 Supported Solid State Drives (SSDs) Part number 43W7648

Feature code 1051 5403

Description IBM 31.4 GB SATA 2.5" SFF Slim-HS SSD IBM 31.4 GB SATA 2.5" SFF Slim-HS SSD V2

41Y8264a

Part number 43W7714

Feature code 3745

Description IBM 50 SATA 2.5" SFF Slim-HS High IOPS SSD
a. IBM has withdrawn this option from marketing
The performance specifications for the 50 GB SATA High IOPS SSD drive are as follows: Formatted capacity: 50,000 MB Drive to host interface that supports SATA-1.0a, 1.5 Gbps burst rate SATA interface Combination 67% read/33% write transaction processing rate: Up to 2600 IOPS
IBM High IOPS SSD adapters
The HS22 type 7870 can support the installation of one or two IBM High IOPS SSD adapter in a PCI Express expansion unit attached to the blade server. The combination of the HS22 and the expansion unit will take up two blade slots in a BladeCenter chassis. This allows for self-contained high-performance servers and computing appliances in a BladeCenter environment. These adapters deliver throughput of up to 100,000 I/O operations per second (IOPS), while providing the added benefits of lower power, cooling, and management overhead, and a smaller storage footprint. One or two IBM High IOPS SSD adapters can be installed in the PCI Express I/O expansion unit. Table 22 lists the IBM High IOPS SSD adapters and the supported PCI Express expansion units.
Table 22 IBM High IOPS SSD PCIe Adapters and the supported PCI Express expansion units PCI Express I/O Expansion Unit 43W4391 Feature code 5985 Description IBM 160GB High IOPS SS Class SSD PCIe Adapter IBM 320GB High IOPS MS Class SSD PCIe Adapter 640GB High IOPS MLC Duo Adapter Y Y Y PCI Express Gen 2 Expansion Blade 46M6730 N N N
Part number 46M0877 46M0898 81Y4519
The IBM High IOPS SSD PCIe Adapters have the following specifications: 160 GB or 320 GB storage capacity Functions as a PCIe storage and controller device PCI Express low-profile MD2 form factor PCI Express 1.1 x4 host interface Power dissipation: 6 W (nominal), 9 W (maximum) For more information about the IBM High IOPS SSD PCIe Adapters see the IBM High IOPS SSD PCIe Adapters at-a-glance guide: http://www.redbooks.ibm.com/abstracts/tips0729.html
BladeCenter Storage and I/O Expansion Unit (SIO)
The HS22 type 7870 does not currently support the attachment of the Storage and I/O Expansion Unit.
Integrated virtualization
The HS22 offers an IBM standard USB Flash Drive option preloaded with VMware ESXi. This is an embedded version of VMware ESXi. It is fully contained on the flash drive, without requiring any disk space. The IBM USB Memory Key for VMware Hypervisor plugs into the USB port at the rear of the HS22 motherboard as shown in Figure 9. The CIOv expansion card is installed over the top of the USB memory key.

USB Socket

USB Memory Key for VMware Hypervisor
Figure 9 Rear view of HS22 motherboard showing position of USB port with embedded hypervisor memory key installed
Table 23 lists the part number, feature code, and description of the IBM USB Memory Key for VMware Hypervisor.
Table 23 IBM USB Memory Key for VMware Hypervisor Part Number 41Y8269a 41Y8283 41Y8278 41Y8287 Feature Code Description IBM USB Memory Key for VMware Hypervisor (ESXi 3.5 U4) IBM USB Memory Key for VMware Hypervisor (ESXi 3.5 U5) IBM USB Memory Key for VMware Hypervisor (ESXi 4.0) IBM USB Memory Key for VMware Hypervisor (ESXi 4.1)
a. Does not provide support for the HS22 using the Xeon 5600 series processor
For a complete description of the features and capabilities of VMware ESX Server see: http://www.vmware.com/products/vi/esx/

I/O expansion

The HS22 type 7870 is able to connect to a wide variety of networks and fabrics by installing the appropriate I/O expansion card. Supported networks and fabrics include 1 Gb and 10 Gb
Ethernet, 4 Gb and 8 Gb Fibre Channel, Serial Attached SCSI (SAS), and InfiniBand. An HS22 blade server with an I/O expansion card installed must be installed in a BladeCenter chassis with switch modules (or pass-thru) that are compatible with the I/O expansion card. The HS22 type 7870 blade server supports two formats of I/O expansion cards: the new CIOv format and the CFFh format, as discussed in the following sections.
The CIOv I/O expansion connector provides I/O connections to modules located in bays 3 and 4 of a supported BladeCenter chassis. The CIOv slot is a second-generation PCI Express 2.0 x8 slot. A maximum of one CIOv I/O expansion card is supported per single-wide blade server. A CIOv I/O expansion card can be installed on a blade server at the same time as a CFFh I/O expansion card is installed. Table 24 lists the CIOv expansion cards that are supported in the HS22 type 7870.
Table 24 Supported CIOv Expansion Cards for the HS22 server Part number 44W4475 46M6065 43W4068 46C7167 46M6140 44X1945 Feature code / 0071a Description Ethernet Expansion Card (CIOv) QLogic 4 Gb Fibre Channel Expansion Card (CIOv) SAS Connectivity Card (CIOv) ServeRAID-MR10ie (CIOv) Controller Emulex 8 Gb Fibre Channel Expansion Card (CIOv) QLogic 8 Gb Fibre Channel Expansion Card (CIOv)

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IBM BladeCenter HS22

IBM BladeCenter at-a-glance guide
The IBM BladeCenter HS22 is a two-socket blade server running Intel Xeon processors. It is ideal for mainstream business applications including as a virtualization engine, and is compatible with the IBM BladeCenter H, E, S, and HT chassis. The HS22 supports up to two Intel Xeon 5500 or 5600 series multi-core processors, 12 DIMMs modules, two hot-swap drives, two PCI Express connectors, and one internal USB connector for embedded virtualization. The HS22 is shown in Figure 1.
Figure 1. IBM BladeCenter HS22

Did you know?

IBM BladeCenter HS22 delivered leadership two-processor, single-node result for SPECjEnterprise2010 2,752.06 Enterprise jAppServer Operations Per Second (SPECjEnterprise2010 EjOPS). This score was achieved using the IBM BladeCenter HS22 as the application server running IBM WebSphere Application Server V7 as the middle tier and the IBM System x3850 X5 as the database server running IBM DB2 9.7 Enterprise Server. With this SPECjEnterprise2010 result, IBM demonstrates its ability to provide both software and hardware for an optimal solution in the middle tier and in the back-end database layer, and also to deliver a robust solution for clients complex workloads.
Locations of key components and connectors
Figure 2 shows the inside of the server indicating key components.
Figure 2. IBM BladeCenter HS22

Standard specifications

Table 1 lists the standard specifications. Table 1. Standard specifications
Components Form factor Processor (max) Number of processors Memory DIMM sockets Maximum memory Expansion slots Disk bays (total/hot-swap) Maximum internal storage Specification Single-wide (30 mm) Intel Xeon 5500 series processors Intel Xeon 5600 series processors 1 standard / 2 maximum 12x DDR-3 VLP DIMM slots Models with Intel Xeon 5600 series processors: 192 GB using 16GB DIMMs Models with Intel Xeon 5500 series processors: 96 GB using 8GB DIMMs One CIOv slot: 2 ports One CFFh slot: 4 ports Two hot-swap bays supporting SAS HDDs or solid-state drives Up to 1.2 TB total internal storage
Network interface 2x 1Gb Ethernet using a Broadcom 5709S onboard NIC Some models also include a 2-port 10Gb controller installed in the CFFh slot Hot-swap components RAID support Systems management Internal storage bays RAID-0, -1 and -1E (optional RAID-5 with battery-backed cache) Unified Extensible Firmware Interface (UEFI), IBM Integrated Management Module (IMM), Predictive Failure Analysis, optional embedded hypervisor for virtualization, IBM Systems Director Active Energy Manager, light path diagnostics, IBM Systems Director and IBM ServerGuide Trusted Platform Module (TPM), Power-on password, administrator password, unattended boot, selectable boot, unattended start mode Microsoft Windows, Red Hat Enterprise Linux, SUSE Linux Enterprise, VMware, Oracle Solaris Three-year customer replaceable unit and on-site and off-site limited warranty
Security Operating systems supported Limited warranty
The IBM BladeCenter HS22 includes the following items: Documentation CD Environmental Notices CD Statement of Limited Warranty Important Notices Technical Note Flyer

Standard models

Table 2 lists standard models. It uses std (standard), max (maximum), Eth (Ethernet). Table 2. Standard models
Model Intel Xeon Processor (model, cores, core speed, L3 cache, memory speed, power) (2 max) Memory (std / max) Std Eth SAS RAID Bays (used / max) Disk drives Slots (used / max)
Models with Intel Xeon 5500 Series Processors 4-core and 2-core 7870-A4x 7870-C4x 1x E5507 4C 2.26GHz 4MB 800MHz 1x X5570 4C 2.93GHz 8MB 1333MHz 3x 1GB / 96GB 2x 2GB / 96GB 2x 2GB / 96GB 3x 1GB / 96GB 2x 1Gb 2x 1Gb 2x 1Gb 2x 1Gb Yes Yes Yes Yes 0/2 0/2 0/2 0/2 Open Open Open Open 0/2 0/2 0/2 0/2
7870-M2x 1x L5518 4C 2.13GHz 8MB 1066MHz 7870-D3x 1x E5503 2C 2.00GHz 4MB 800MHz
Models with Intel Xeon 5600 Series Processors - 4-core 7870-A5x 7870-A7x 7870-G2x 7870-G4x 1x E5603 4C 1.60GHz 4MB 1066MHz 1x E5607 4C 2.26GHz 8MB 1066MHz 1x4GB / 192GB 2x 1Gb 1x4GB / 192GB 2x 1Gb Yes Yes Yes Yes 0/2 0/2 0/2 0/2 0/2 0/2 0/2 0/2 0/2 0/2 Open Open Open Open Open Open Open Open Open Open 0/2 0/2 0/2 0/2 1/2 0/2 0/2 0/2 0/2 0/2
1x E5620 4C 2.40GHz 12MB 1066MHz 3x2GB / 192GB 2x 1Gb 1x E5640 4C 2.66GHz 12MB 1066MHz 3x2GB / 192GB 2x 1Gb
7870-GCx 1x E5640 4C 2.66GHz 12MB 1066MHz 3x2GB / 192GB 2x 1Gb Yes 2x 10Gb 7870-B5x 7870-H5x 7870-C5x 7870-F3x 7870-C7x 1x X5647 4C 2.93GHz 12MB 1066MHz 3x4GB / 192GB 2x 1Gb 1x X5667 4C 3.06GHz 12MB 1333MHz 3x2GB / 192GB 2x 1Gb 1x X5672 4C 3.20GHz 12MB 1333MHz 3x4GB / 192GB 2x 1Gb 1x X5677 4C 3.46GHz 12MB 1333MHz 3x2GB / 192GB 2x 1Gb 1x X5687 4C 3.60GHz 12MB 1333MHz 3x4GB / 192GB 2x 1Gb Yes Yes Yes Yes Yes

Models with Intel Xeon 5600 Series Processors - 6-core 7870-N2x 7870-B6x 7870-H2x 1x L5640 6C 2.26GHz 12MB 1333MHz 3x2GB / 192GB 2x 1Gb Yes Yes Yes 0/2 0/2 0/2 0/2 0/2 0/2 0/2 0/2 Open Open Open Open Open Open Open Open 0/2 0/2 0/2 1/2 0/2 0/2 0/2 0/2
1x E5649 6C 2.53GHz 12MB 1333MHz 3x4GB / 192GB 2x 1Gb 1x X5650 6C 2.66GHz 12MB 1333MHz 3x2GB / 192GB 2x 1Gb
7870-HAx 1x X5650 6C 2.66GHz 12MB 1333MHz 3x2GB / 192GB 2x 1Gb Yes 2x 10Gb 7870-H4x 7870-C6x 7870-F2x 7870-C8x 1x X5670 6C 2.93GHz 12MB 1333MHz 3x2GB / 192GB 2x 1Gb 1x X5675 6C 3.06GHz 12MB 1333MHz 3x4GB / 192GB 2x 1Gb 1x X5680 6C 3.33GHz 12MB 1333MHz 3x2GB / 192GB 2x 1Gb 1x X5690 6C 3.46GHz 12MB 1333MHz 3x4GB / 192GB 2x 1Gb Yes Yes Yes Yes
All models contain an onboard 2-port Gigabit Ethernet controller. Model GCx also includes Broadcom 10Gb Gen2 2-port Ethernet Expansion Card (CFFh) installed in the CFFh expansion slot. Model HAx also includes the Emulex 10Gb Virtual Fabric Adapter (CFFh) installed in the CFFh expansion slot.
See the Standard specifications section for information about standard features of the server.

Chassis support

The HS22 is supported in the various BladeCenter chassis as listed in Table 3. Table 3. Chassis support
Description HS22 with 130W processors HS22 with up to 95W processors BC-E (8677) No BC-T No BC-S (8886) BC-H (8852) BC-HT AC (8750) BC-HT DC (8740)
Some limits* Some limits* Some limits* Some limits* Full Full Full Full

Some limits* No

* See Table 4 for details The number of HS22 servers supported in each chassis depends on the thermal design power of the processors used in the servers, as shown in Table 4. The table uses the following conventions: A green cell means the chassis can be filled with HS22 blade servers up to the maximum number of blade bays in the chassis (for example, 14 blades in the BladeCenter H). A yellow cell means that the maximum number of HS22 blades that the chassis can hold is fewer than the total available blade bays (for example, 12 in a BladeCenter H). Other bays in the chassis may or may not be occupied by servers other than HS22 and HS22V depending on the combination and some bays must remain empty. Consult the BladeCenter Interoperability Guide for specifics: http://ibm.com/support/entry/portal/docdisplay?lndocid=MIGR-5073016 Note: The HS22 is not supported in the BladeCenter E with power supplies smaller than 2000 W. Table 4. Chassis support (detailed)
Maximum number of HS 22 servers supported in each chassis BC-E with AMM (8677) (14 bays) 2000 W 2320 W power power supplies supplies None None 6 BC-S (8886)

(6 bays)

BC-H (models other than 4Tx) (14 bays) 2900W supplies
Standard blowers Enhanced blowers

BC-H (-4Tx) (14 bays) 2980W

Enhanced blowers

2980W supplies**
BC-HT AC (8750) (12 bays)
BC-HT DC (8740) (12 bays)
CPU TDP* 130W 95W 80W 60W 40W

None 14 14

* Thermal Design Power ** IBM BladeCenter H 2980W AC Power Modules, 68Y6601 (standard in 4Tx, optional with all other BC-H chassis models) IBM BladeCenter H Enhanced Cooling Modules, 68Y6650 (standard in 4Tx, optional with all other BC-H chassis models) Not supported

Processor options

The HS22 supports the processor options listed in Table 5. The server supports one or two processors. The table also shows which server models have each processor standard. If no corresponding where used model for a particular processor is listed, then this processor is available only through Configure to Order (CTO). Table 5. Processor options (Part 1)
Part number Intel Xeon processor description Models where used
Intel Xeon 5600 Series Processors: 4-core 81Y9323 81Y9324 81Y9325 59Y5705 59Y5707 59Y5708 49Y5184 59Y5704 81Y9326 59Y5712 81Y9328 59Y5714 81Y9330 Xeon E5603 4C 1.60GHz 4MB 1066MHz 80w Xeon E5606 4C 2.13GHz 8MB 1066MHz 80w Xeon E5607 4C 2.26GHz 8MB 1066MHz 80w Xeon E5620 4C 2.40GHz 12MB 1066MHz 80w Xeon E5630 4C 2.53GHz 12MB 1066MHz 80w Xeon E5640 4C 2.66GHz 12MB 1066MHz 80w Xeon L5609 4C 1.86GHz 12MB 1066MHz 40w Xeon L5630 4C 2.13GHz 12MB 1066MHz 40w Xeon X5647 4C 2.93GHz 12MB 1066MHz 130w Xeon X5667 4C 3.06GHz 12MB 1333MHz 95w Xeon X5672 4C 3.20GHz 12MB 1333MHz 95w Xeon X5677 4C 3.46GHz 12MB 1333MHz 130w Xeon X5687 4C 3.60GHz 12MB 1333MHz 130w A5x A7x G2x G4x, GCx B5x H5x C5x F3x C7x
Intel Xeon 5600 Series Processors: 6-core 68Y8125 81Y9327 68Y8124 59Y5706 59Y5709 59Y5710 59Y5711 81Y9329 59Y5713 81Y9331 Xeon E5645 6C 2.40GHz 12MB 1333MHz 80w Xeon E5649 6C 2.53GHz 12MB 1333MHz 80w Xeon L5638 6C 2.0GHz 12MB 1333MHz 60w Xeon L5640 6C 2.26GHz 12M 1333MHz 60w Xeon X5650 6C 2.66GHz 12M 1333MHz 95w Xeon X5660 6C 2.80GHz 12MB 1333MHz 95w Xeon X5670 6C 2.93GHz 12MB 1333MHz 95w Xeon X5675 6C 3.06GHz 12MB 1333MHz 95w Xeon X5680 6C 3.33GHz 12MB 1333MHz 130w Xeon X5690 6C 3.46GHz 12MB 1333MHz 130w B6x N2x H2x, HAx H4x C6x F2x C8x

Table 5. Processor options (Part 2)
Intel Xeon 5500 Series Processors: 2-core 59Y5692 Xeon E5503 2C 2.00GHz 4M 800MHz 80w D3x
Intel Xeon 5500 Series Processors: 4-core 44T1712 43W5987 59Y5695 44T1736 44T1883 44T1884 49Y5052 44T1887 Xeon E5504 4C 2.00GHz 4MB 800MHz Xeon E5506 4C 2.13GHz 4MB 800MHz Xeon E5507 4C 2.26GHz 4M 800MHz 80w Xeon E5520 4C 2.26GHz 8MB 1066MHz Xeon E5530 4C 2.40GHz 8MB 1066MHz Xeon E5540 4C 2.53GHz 8MB 1066MHz Xeon L5518 4C 2.13GHz 8MB 1066MHz 60W Xeon X5570 4C 2.93GHz 8MB 1333MHz A4x M2x C4x

Memory options

The HS22 has six DIMM sockets per processor (12 DIMMs in total) and uses Double Data Rate-3 (DDR-3) very-low-profile (VLP) registered DIMMs. Servers with Intel Xeon 5600 series processors support 16GB DIMMs meaning a total of up to 192 GB of RAM is supported. Servers with Intel Xeon 5500 series processors support 8GB DIMMs meaning a total of up to 96 GB of RAM is supported. The memory DIMMs connects directly to one of the processors. With one processor installed, only six DIMMs can be accessed. To access memory in the other six DIMM connectors, the second processor must be installed. Tables 6 and 7 list memory options available for HS22 server: one of 5500 series processors and one for 5600 series processors. DIMMs can be installed one at a time, but for performance reasons, install them in sets of three (one for each of the three memory channels). Table 6. Memory options for servers with Xeon 5500 series processors
Part number 49Y1427 44T1485 49Y1428 49Y1429 44T1487 44T1486 44T1594 46C0560 49Y1430 44T1488 44T1596 46C0563 46C0564 49Y1431 44T1579 46C7451 Description 1 GB (1x 1 GB, 1Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz 1 GB (1x 1 GB) Single Rank PC3-10600 CL9 ECC DDR3-1333 VLP 2 GB (1x 2 GB, 2Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz 2 GB (1x 2 GB, 1Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz 2 GB (1x 2 GB) Single Rank PC3-10600 CL9 ECC DDR3-1333 MHz 2 GB (1x 2 GB) Dual Rank PC3-10600 CL9 ECC DDR3-1333 MHz 2 GB (1x 2 GB, 1Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz 2 GB (1x 2 GB, 1Rx8, 1.35 V) PC3L-10600 CL9 ECC DDRMHz 4 GB (1x 4 GB, 2Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz 4 GB (1x 4 GB) Dual Rank PC3-10600 CL9 ECC DDR3-1333 MHz 4 GB (1x 4 GB, 2Rx8, 1.5 V) PC3-10600 CL9 ECC DDRMHz 4 GB (1x 4 GB, 1Rx4, 1.35 V) PC3L-10600 CL9 ECC DDRMHz 4 GB (1x 4 GB, 2Rx8, 1.35 V) PC3L-10600 CL9 ECC DDRMHz 8 GB (1x 8 GB, 2Rx4, 1.5 V) PC3-10600 CL9 ECC DDRMHz 8 GB (1x 8 GB) Dual Rank PC3-8500 CL7 ECC DDR3-1066 MHz 8 GB (1x 8 GB, Dual Rankx4) PC3-10600 CL9 ECC DDR3-1333 MHz Max support Models where used A4x, D3x C4x M2x -
Table 7. Memory options for servers with Xeon 5600 series processors
Part number Description Supports 2DPC @1333* Max suppt Models where used
Standard DIMMs (1.5 V) 49Y1427 1GB (1x 1GB, 1Rx8, 1.5V) PC3-10600 CL9 ECC DDR49Y1428 2GB (1x 2GB, 2Rx8, 1.5V) PC3-10600 CL9 ECC DDRYes Yes F2x, F3x, G2x, G4x, GCx, H2x, H4x, H5x, HAx, N2x -

49Y1429 2GB (1x 2GB, 1Rx4, 1.5V) PC3-10600 CL9 ECC DDR44T1594 2GB (1x 2GB, 1Rx8, 1.5V) PC3-10600 CL9 ECC DDR3 1333

Yes Yes Yes Yes

49Y1430 4GB (1x 4GB, 2Rx4, 1.5V) PC3-10600 CL9 ECC DDR49Y1431 8GB (1x 8GB, 2Rx4, 1.5V) PC3-10600 CL9 ECC DDRLow Power DIMMs (1.35 V) 46C0560 2GB (1x 2GB, 1Rx8, 1.35V) PC3L-10600 CL9 ECC DDR46C0561 2GB (1x 2GB, 1Rx4, 1.35V) PC3-10600 CL9 ECC DDR46C0563 4GB (1x 4GB, 1Rx4, 1.35V) PC3L-10600 CL9 ECC DDR3 1333

Yes Yes Yes

A5x, A7x, B5x, B6x, C5x, C6x, C7x, C8x -
46C0564 4GB (1x 4GB, 2Rx8, 1.35V) PC3L-10600 CL9 ECC DDR46C0567 4GB (1x 4GB, 2Rx4, 1.35V) PC3-10600 CL9 ECC DDR46C0568 8GB (1x 8GB, 2Rx4, 1.35V) PC3-10600 CL9 ECC DDR46C0569 8GB (1x 8GB, 2Rx4, 1.35V) PC3-8500 CL7 ECC DDR46C0599 16GB (1x16 GB, 2Rx4, 1.35V) PC3L-10600 CL9 ECC DDR3 1333

Yes Yes Yes No Yes

* Supports two DIMMs per channel at a memory speed of 1333 MHz Note that although the maximum speed at which the memory channel runs on the HS22 is 1333 MHz, this depends on a combination of three items: Processor memory speed: The processor has a maximum memory speed of 1333, 1066, or 800 MHz depending on the processor model. Only the X (Advanced) range of Xeon 5500 and 5600 series processors supports a maximum memory channel speed of 1333 MHz. See the processor options (Table 5) for the maximum memory speed. Memory DIMM: Most but not all DIMMs listed in Tables 6 and 7 support running at 1333 MHz. Some only run at 1066 MHz. This is noted in the description of the DIMM. Number of DIMMs installed: The HS22 implements memory so that 2 DIMMs are on each of the three memory channels of the processor. if only 1 DIMM is installed to each channel (that is, 3 DIMMs per processor) then the DIMMs can operate at the lower of the DIMM rated speed and processor memory channel rated speed, up to 1333 MHz. However at 2 DIMMs per channel (6 DIMMs per processor), memory can only operate at 1333 MHz if Xeon 5600 X (Advanced) range of processors (models X56nn) are installed. All other processors (all 5500, L56nn, and E56nn) cannot drive the memory channel at 1333 MHz if there are 2 DIMMs per channel.

In summary, to ensure DIMMs operate at 1333 MHz, select a Xeon X56nn processor and use DIMMs that are rated at 1333 MHz, and support running at 2 DIMMs per channel at 1333 MHz, The following memory protection technologies are supported: ECC ChipKill Memory Mirroring Memory Sparing
Internal disk storage options
The HS22 blade server features an onboard LSI Logic 53C1064E 3 Gbps SAS controller with two hot-swap drives bay accessible from the front of the blade server. The LSI Logic 53C1064E SAS controller provides RAID 0 or RAID 1 capability and supports up to two internal hot-swap SAS or SATA HDDs or two internal hot swap solid-state drives. Table 8 lists the hard drive options that are available for internal storage. Table 8. Disk drive options for internal disk storage
Part number SAS disk drives 42D0672 42D0632 42D0677 42D0637 42D0707 49Y2003 SATA disk drives 42D0747 42D0752 IBM 160GB 7200 NL SATA 2.5" SFF Slim-HS HDD IBM 500GB 7200 NL SATA 2.5" SFF Slim-HS HDD IBM 73GB 15K 6Gbps SAS 2.5" SFF Slim-HS HDD IBM 146GB 10K 6Gbps SAS 2.5" SFF Slim-HS HDD IBM 146GB 15K 6Gbps SAS 2.5" SFF Slim-HS HDD IBM 300GB 10K 6Gbps SAS 2.5" SFF Slim-HS HDD IBM 500GB 7200 6Gbps NL SAS 2.5" SFF Slim-HS HDD IBM 600GB 10K 6Gbps SAS 2.5" SFF Slim-HS HDD Description Maximum quantity supported
Solid state drives (SSD) 43W7714 IBM 50GB SATA 2.5" SFF Slim-HS High IOPS SSD 2

Internal tape drives

The server does not support an internal tape drive option.

Optical drives

The server does not support an optical drive option, however it does interface to the optical drive installed in the BladeCenter chassis media tray if one is installed there.
External disk storage expansion
SAS Connectivity Modules (one or two) must be installed into chassis to support external disk storage expansion. SAS Connectivity Module is listed in Table 9. Table 9. SAS Connectivity Modules
Part number 39Y9195 Description SAS Connectivity Module Maximum quantity supported per one chassis 2
The external disk storage expansion enclosure listed in Table 10 is supported with HS22. Table 10. External storage expansion enclosures
Part number 172701X Description IBM System Storage EXP3000 Maximum quantity supported per one blade server 1

The hard disk drives listed in Table 11 are supported with external expansion enclosures. Table 11. Hard drive options for external expansion enclosures
Part number Description Maximum quantity supported per one enclosure
EXP3000 Hot-Swap SATA 3.5" Hard Drives 43W7630 49YGB Dual Port Hot Swap SATA IBM 2 TB 7200 Dual Port SATA 3.5'' HS HDD 12 12
EXP3000 Hot-Swap SAS 3.5" Hard Drives 44W2234 44W2239 44W2244 IBM 300 GB 15K 6 Gbps SAS 3.5" Hot-Swap HDD IBM 450 GB 15K 6 Gbps SAS 3.5" Hot-Swap HDD IBM 600 GB 15K 6 Gbps SAS 3.5" Hot-Swap HDD 12
The RAID controller listed in Table 12 is supported with external expansion enclosures. Table 12. RAID controllers for external storage expansion enclosures
Part number 46C7167 Description ServeRAID-MR10ie (CIOv) Controller with battery Maximum quantity supported 1
Note: If the ServeRAID MR10ie is installed, the battery is installed in DIMM slot 7. Therefore DIMM slot 7 cannot be used for memory. This will limit the total amount of memory that will be able to be installed.
The ServeRAID MR10ie Controller has the following specifications: Two SAS ports routed internally to the chassis I/O bays 3 and 4 Supports RAID levels 0, 1, 5, 6, 10, 50, and 60 Provides 256 MB of ECC DDR-2 battery-backed cache 3 Gbps throughput per port PCI Express 1.0 x4 host interface Based on the LSI 1078 controller Supports up to 26 disk drives. Support for on-board and external disk drives Supports connectivity to the EXP3000 storage expansion enclosures The external SAS cables listed in the following table are supported with external expansion enclosures and MR10ie RAID controllers connected to SAS Connectivity Modules. Table 13. External SAS cables for external storage expansion enclosures
Part number 39R6531 39R6529 Description IBM 3 m SAS Cable IBM 1 m SAS Cable Maximum quantity supported per enclosure 1 1

External tape backup

The server supports the external tape attachment options listed in Table 14. Table 14. External tape options
Part number Tape libraries 3572-Sxx 3573-xxx 3576-xxx 3580-S3x 3580-S4x 3584-xxx IBM System Storage TS2900 Tape Autoloader IBM System Storage TS3100/TS3200 Tape Library (all models) IBM System Storage TS3310 Modular Tape Library (all models) IBM System Storage TS2230 Tape Drive Express Model IBM System Storage TS2240 Tape Drive Model S4E IBM System Storage TS3500 Tape Library (all models) Description

I/O expansion options

The HS22 server offers the following PCI Express 2.0 slots, neither of which is hot-swap. CIOv expansion slot CFFh expansion slot The CIOv I/O expansion connector provides I/O connections through the midplane of the chassis to modules located in bays 3 and 4 of a supported BladeCenter chassis. It is a PCIe 2.0 x8 slot. The CFFh I/O expansion connector provides I/O connections to high-speed switch modules that are located in bays 7, 8, 9, and 10 of a BladeCenter H or BladeCenter HT chassis, or to switch bay 2 in a BladeCenter S chassis. The CFFh slot is a PCIe x16 slot. The HS22 optionally supports the IBM BladeCenter PCIe Gen 2 Expansion Blade. The expansion blade provides the capability to attach selected PCI Express cards to the HS22. This capability is ideal for many applications that require special telecommunications network interfaces or hardware acceleration using a PCI Express card. See Table 15. The expansion blade provides one full height and full length PCI Express slot and one full height and half length PCI Express slot with a maximum power usage of 75 watts for each slot. It integrates PCI Express card support capability into the BladeCenter architecture. Up to four expansion blades can be attached to an HS22. Each expansion blade occupies a bay in the BladeCenter chassis. The server also supports IBM BladeCenter PCI Express I/O Expansion Unit (PCI Express Gen 1). A maximum of one unit can be attached to a single blade. Table 15. Expansion blades

For information about this adapter, see the IBM High IOPS SSD PCIe Adapters at-a-glance guide: http://www.redbooks.ibm.com/abstracts/tips0729.html?Open

Power supplies

Server power is derived from the power supplies installed in the BladeCenter chassis. There are no server options regarding power supplies.
Integrated virtualization
The server supports VMware ESXi installed on a USB memory key. The key is installed in a USB socket inside the server. Table 19 lists the virtualization options. Table 19. Virtualization options
Part number 41Y8269 41Y8283 41Y8278 41Y8287 Description IBM USB Memory Key for VMware Hypervisor (ESXi 3.5 U4) IBM USB Memory Key for VMware Hypervisor (ESXi 3.5 U5) IBM USB Memory Key for VMware Hypervisor (ESXi 4.0) IBM USB Memory Key for VMware Hypervisor (ESXi 4.1) Maximum quantity supported 1 1

Remote management

The server contains an IBM Integrated Management Module (IMM), which interfaces with the advanced management module in the BladeCenter chassis. The combination of these two provides advanced service-processor control, monitoring, and an alerting function. If an environmental condition exceeds a threshold or if a system component fails, LEDs on the system board are lit to help you diagnose the problem, records the error in the event log, and alerts you to the problem. A virtual presence capability is also available for remote server management capabilities. Remote server management is provided through industry-standard interfaces: Intelligent Platform Management Interface (IPMI) Version 2.0 Simple Network Management Protocol (SNMP) Version 3 Common Information Model (CIM) Web browser The server also supports virtual media and remote control features, which provide the following functions: Remotely viewing video with graphics resolutions up to 1600x1200 at 75 Hz, regardless of the system state Remotely accessing the server using the keyboard and mouse from a remote client Mapping the CD or DVD drive, diskette drive, and USB flash drive on a remote client, and mapping ISO and diskette image files as virtual drives that are available for use by the server Uploading a diskette image to the IMM memory and mapping it to the server as a virtual drive Capture blue-screen errors

Physical specifications

Dimensions: Height: 245 mm (9.7 in) Depth: 446 mm (17.6 in) Width: 58 mm (2.28 in) Maximum weight: 5.4 kg (12 lb) (depending on the configuration when options are added)

Regulatory compliance

The server conforms to the following international standards: Australia and New Zealand C-Tick Mark, Class A CE Mark (EN55022:1998 Class A, EN60950, EN55024:1998, EN61000-3-2 and EN61000-3-3) CISPR 22, Class A CSA C22.2 No.60950 Safety of Information Technology Equipment 60950 Canada ICES-003, issue 3, Class A China GB 9254-1998, GB17625.1-1998, GB17625.2-1999 FCC - Verified to comply with Part 15 of the FCC Rules, Class A IEC-60950 (CB Certificate and CB Test Report) Japan VCCI, Class A Korea MIC NOM-019 Seguridad de Equipto de Procesamiento de Datos within 30 days of planned availability TUV-GS (EN60950/ISO 9241-3/ISO 9241-8) Taiwan BSMI CNS13438, Class A UL 60950 Safety of Information Technology Equipment

Warranty options

The BladeCenter HS22 has a three-year on-site warranty with 9x5 next business day terms. IBM offers the warranty service upgrades through IBM ServicePac, discussed in this section. The IBM ServicePac is a series of prepackaged warranty maintenance upgrades and post-warranty maintenance agreements with a well-defined scope of services, including service hours, response time, term of service, and service agreement terms and conditions. IBM ServicePac offerings are country-specific, that is, each country might have its own service types, service levels, response times, and terms and conditions. Not all covered types of ServicePac might be available in a particular country. For more information about IBM ServicePac offerings available in your country visit the IBM ServicePac Product Selector at https://www-304.ibm.com/sales/gss/download/spst/servicepac. Table 20 explains warranty service definitions in more detail. Table 20. Warranty service definitions
Term IBM on-site repair (IOR) 24x7x2 hour 24x7x4 hour 9x5x4 hour Description A service technician will come to the server's location for equipment repair. A service technician is scheduled to arrive at your customers location within two hours after remote problem determination is completed. We provide 24-hour service, every day, including IBM holidays. A service technician is scheduled to arrive at your customers location within four hours after remote problem determination is completed. We provide 24-hour service, every day, including IBM holidays. A service technician is scheduled to arrive at your customers location within four business hours after remote problem determination is completed. We provide service from 8:00 a.m. to 5:00 p.m. in the customer's local time zone, Monday through Friday, excluding IBM holidays. If after 1:00 p.m. it is determined that on-site service is required, the customer can expect the service technician to arrive the morning of the following business day. For noncritical service requests, a service technician will arrive by the end of the following business day. A service technician is scheduled to arrive at your customers location on the business day after we receive your call, following remote problem determination. We provide service from 8:00 a.m. to 5:00 p.m. in the customer's local time zone, Monday through Friday, excluding IBM holidays.

9x5 next business day

In general, the types of IBM ServicePac are as follows: Warranty and maintenance service upgrades One, two, three, four, or five years of 9x5 or 24x7 service coverage On-site repair from next business day to four or two hours One or two years of warranty extension Remote technical support services One or three years with 24x7 coverage (severity 1) or 9x5 next business day for all severities Installation and startup support for System x servers Remote technical support for System x servers Software support - Support Line Microsoft or Linux software VMWare IBM Director
Supported operating systems
The server supports the following operating systems: Microsoft Windows Compute Cluster Server 2003 Microsoft Windows Essential Business Server 2008 Premium Edition Microsoft Windows Essential Business Server 2008 Standard Edition Microsoft Windows HPC Server 2008 Microsoft Windows Server 2003 Compute Cluster Edition Microsoft Windows Server 2003, Enterprise Edition with Microsoft Cluster Service (MSCS) Microsoft Windows Server 2003, Enterprise Edition (64 bit) with Microsoft Cluster Service (MSCS) Microsoft Windows Server 2003, Web Edition Microsoft Windows Server 2003/2003 R2, Datacenter Edition Microsoft Windows Server 2003/2003 R2, Datacenter x64 Edition Microsoft Windows Server 2003/2003 R2, Enterprise Edition Microsoft Windows Server 2003/2003 R2, Enterprise x64 Edition Microsoft Windows Server 2003/2003 R2, Standard Edition Microsoft Windows Server 2003/2003 R2, Standard x64 Edition Microsoft Windows Server 2008 HPC Edition Microsoft Windows Server 2008 R2 Microsoft Windows Server 2008, Datacenter x64 Edition Microsoft Windows Server 2008, Datacenter x86 Edition Microsoft Windows Server 2008, Enterprise x64 Edition Microsoft Windows Server 2008, Enterprise x86 Edition Microsoft Windows Server 2008, Standard x64 Edition Microsoft Windows Server 2008, Standard x86 Edition Microsoft Windows Server 2008, Web x64 Edition Microsoft Windows Server 2008, Web x86 Edition Microsoft Windows Small Business Server 2003/2003 R2 Premium Edition Microsoft Windows Small Business Server 2003/2003 R2 Standard Edition Microsoft Windows Small Business Server 2008 Premium Edition Microsoft Windows Small Business Server 2008 Standard Edition Red Hat Enterprise Linux 4 AS for AMD64/EM64T Red Hat Enterprise Linux 4 AS for x86 Red Hat Enterprise Linux 4 ES for AMD64/EM64T Red Hat Enterprise Linux 4 ES for x86 Red Hat Enterprise Linux 4 WS/HPC for AMD64/EM64T Red Hat Enterprise Linux 4 WS/HPC for x86 Red Hat Enterprise Linux 5 Server Edition Red Hat Enterprise Linux 5 Server Edition with Xen Red Hat Enterprise Linux 5 Server with Xen x64 Edition Red Hat Enterprise Linux 5 Server x64 Edition Red Hat Enterprise Linux 6 Server Edition Red Hat Enterprise Linux 6 Server x64 Edition Red Hat Enterprise MRG 1.0 Realtime (x64) Solaris 10 Operating System SUSE LINUX Enterprise Real Time 10 AMD64/EM64T SUSE LINUX Enterprise Real Time 11 AMD64/EM64T SUSE LINUX Enterprise Server 10 for AMD64/EM64T SUSE LINUX Enterprise Server 10 for x86 SUSE LINUX Enterprise Server 10 with Xen for AMD64/EM64T SUSE LINUX Enterprise Server 10 with Xen for x86 SUSE LINUX Enterprise Server 11 for AMD64/EM64T SUSE LINUX Enterprise Server 11 for x86 SUSE LINUX Enterprise Server 11 with Xen for AMD64/EM64T VMware ESX 3.5

VMware ESX 4.0 VMware ESX 4.1 VMware ESXi 3.5 VMware ESXi 4.0 VMware ESXi 4.1 See the IBM ServerProven website for the latest information about the specific versions and service levels supported and any other prerequisites: http://www.ibm.com/systems/info/x86servers/serverproven/compat/us/nos/matrix.shtml
Related publications and links
For more information, see the following resources: IBM BladeCenter HS22 product page http://ibm.com/systems/bladecenter/hardware/servers/hs22 IBM BladeCenter Information Center http://publib.boulder.ibm.com/infocenter/bladectr/documentation IBM BladeCenter HS22 Installation and User's Guide http://ibm.com/support/entry/portal/docdisplay?lndocid=MIGR-5079689 IBM BladeCenter HS22 Problem Determination and Service Guide http://ibm.com/support/entry/portal/docdisplay?lndocid=MIGR-5079687 ServerProven hardware compatibility page for the HS22 http://ibm.com/systems/info/x86servers/serverproven/compat/us/blade/7870.html ServerProven compatibility page for operating system support http://ibm.com/systems/info/x86servers/serverproven/compat/us/nos/ematrix.shtml BladeCenter Interoperability Guide http://www.ibm.com/support/docview.wss?uid=psg1MIGR-5073016 At-a-glance guides for IBM BladeCenter servers and options http://www.redbooks.ibm.com/portals/bladecenter?Open&page=ataglance Configuration and Option Guide http://www.ibm.com/systems/xbc/cog/ xRef - IBM System x Reference Sheets http://www.redbooks.ibm.com/xref IBM System x Support Portal http://ibm.com/support/entry/portal/ http://ibm.com/support/entry/portal/Downloads/Hardware/Systems/BladeCenter/BladeCenter_HS22

Notices

This information was developed for products and services offered in the U.S.A. IBM may not offer the products, services, or features discussed in this document in other countries. Consult your local IBM representative for information on the products and services currently available in your area. Any reference to an IBM product, program, or service is not intended to state or imply that only that IBM product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any IBM intellectual property right may be used instead. However, it is the user's responsibility to evaluate and verify the operation of any non-IBM product, program, or service. IBM may have patents or pending patent applications covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries, in writing, to: IBM Director of Licensing, IBM Corporation, North Castle Drive, Armonk, NY 10504-1785 U.S.A. The following paragraph does not apply to the United Kingdom or any other country where such provisions are inconsistent with local law: INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you. This information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice. Any references in this information to non-IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this IBM product and use of those Web sites is at your own risk.IBM may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you. Information concerning non-IBM products was obtained from the suppliers of those products, their published announcements or other publicly available sources. IBM has not tested those products and cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. This information contains examples of data and reports used in daily business operations. To illustrate them as completely as possible, the examples include the names of individuals, companies, brands, and products. All of these names are fictitious and any similarity to the names and addresses used by an actual business enterprise is entirely coincidental. Any performance data contained herein was determined in a controlled environment. Therefore, the results obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurement may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment. COPYRIGHT LICENSE: This information contains sample application programs in source language, which illustrate programming techniques on various operating platforms. You may copy, modify, and distribute these sample programs in any form without payment to IBM, for the purposes of developing, using, marketing or distributing application programs conforming to the application programming interface for the operating platform for which the sample programs are written. These examples have not been thoroughly tested under all conditions. IBM, therefore, cannot guarantee or imply reliability, serviceability, or function of these programs. Copyright International Business Machines Corporation 2011. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.

This document was created or updated on April 12, 2011. Send us your comments in one of the following ways: Use the online Contact us review form found at: ibm.com/redbooks Send your comments in an e-mail to: redbook@us.ibm.com Mail your comments to: IBM Corporation, International Technical Support Organization Dept. HYTD Mail Station PSouth Road Poughkeepsie, NY 12601-5400 U.S.A. This document is available online at http://www.ibm.com/redbooks/abstracts/tips0822.html.

Trademarks

IBM, the IBM logo, and ibm.com are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. These and other IBM trademarked terms are US registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at http://www.ibm.com/legal/copytrade.shtml The following terms are trademarks of the International Business Machines Corporation in the United States, other countries, or both: BladeCenter DB2 IBM Systems Director Active Energy Manager IBM Redbooks (logo) ServerProven ServicePac System Storage System x WebSphere The following terms are trademarks of other companies: Microsoft, Windows, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both. Intel Xeon, Intel, Intel logo, Intel Inside logo, and Intel Centrino logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Linux is a trademark of Linus Torvalds in the United States, other countries, or both. Other company, product, or service names may be trademarks or service marks of others.

 

Technical specifications

Full description

The IBM BladeCenter HS22 offers flexible options to support a broad range of workloads, including virtualization and enterprise applications. Along with intuitive UEFI-based tools, the HS22 can be customized and deployed quickly while best-in-class reliability features help keep you up and running. Mix and match the HS22 with the industry's most diverse set of chassis and blades and that go beyond x86. The HS22 features an innovative mechanical design optimized for cooling capability to help keep the blade running smoothly even under demanding conditions. Combined with low-voltage components, the industry's most energy-efficient chassis, and robust power management tools, the HS22 helps control power consumption and maximize efficiency.

General
TypeServer
Product Form FactorBlade
Built-in DevicesLED panel
Embedded SecurityTrusted Platform Module (TPM 1.2) Security Chip
Server Scalability2-way
Hot-Swap Bays Qty2
Width1.1 in
Depth17.6 in
Height9.6 in
Weight11.9 lbs
ColorStealth black
LocalizationEnglish
Processor
TypeIntel Xeon E5502 / 1.86 GHz
Multi-Core TechnologyDual-Core
64-bit ComputingYes
Installed Qty1
Max Supported Qty2
UpgradabilityUpgradable
Processor Main FeaturesHyper-Threading Technology, Intel QuickPath Interconnect
Cache Memory
TypeL2 cache
Installed Size4 MB
Cache Per Processor4 MB
Mainboard
Chipset TypeIntel 5520
Data Bus Speed800 MHz
RAM
Installed Size6 GB / 96 GB (max)
TechnologyDDR3 SDRAM - ECC Chipkill
Memory Speed1333 MHz
Memory Specification CompliancePC3-10600
Form FactorDIMM 240-pin
FeaturesMemory Mirroring, very low profile
Configuration Features3 x 2 GB
Storage Controller
Type1 x Serial Attached SCSI - integrated - PCI Express
Controller Interface TypeSerial Attached SCSI
Storage Controller NameLSISAS1064e
Channel Qty2
RAID LevelRAID 0, RAID 1
Storage
Hard DriveNone.
Monitor
Monitor TypeNone.
Graphics Controller
TypePCI - integrated
Graphics Processor / VendorMatrox MGA G200e
Video Memory128 MB DDR2 SDRAM
Networking
NetworkingNetwork adapter - PCI Express - integrated
Ethernet Ports2 x Gigabit Ethernet
Ethernet Controller(s)2 x Broadcom BCM5709S
Data Link ProtocolEthernet, Fast Ethernet, Gigabit Ethernet
Remote Management ProtocolIPMI 2.0
Remote Management ControllerMaxim VSC452 Super Baseboard Management Controller with Integrated VGA Controller
FeaturesWake on LAN (WoL), PXE support, Teaming support
Expansion / Connectivity
Expansion Bays Total (Free)2 ( 2 ) x hot-swap - 2.5" SFF
Expansion Slots Total (Free)2 ( 1 ) x processor - LGA1366 Socket 12 ( 9 ) x memory - DIMM 240-pin
Interfaces1 x management - RS-485 2 x network - Ethernet 10Base-T/100Base-TX/1000Base-T - RJ-45
Miscellaneous
FeaturesAdministrator password, power-on password, selectable boot, unattended boot, unattended start mode, automatic server restart (ASR)
Compliant StandardsUL 60950, ICES-003 Class A, FCC, CSA C22.2
Manufacturer Selling ProgramIBM Express
Operating System / Software
SoftwareIBM ServerGuide
Manufacturer Warranty
Service & Support3 years warranty
Service & Support DetailsLimited warranty - parts and labor - 3 years - on-site - response time: next business day
Environmental Parameters
Min Operating Temperature50 °F
Max Operating Temperature95 °F
Humidity Range Operating8 - 80%
Universal Product Identifiers
BrandIBM
Part Number7870EDU
GTIN00883436054287

 

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