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LCD TV SERVICE MANUAL

CHASSIS : ML-041D

MODEL : 23LX1RV-MC

CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

CONTENTS.... 2 PRODUCT SAFETY....3 SPECIFICATION...6 ADJUSTMENT INSTRUCTION...10 TROUBLE SHOOTING...13 BLOCK DIAGRAM...19 WIRING DIAGRAM....21 EXPLODED VIEW.... 22 EXPLODED VIEW PARTS LIST..23 REPLACEMENT PARTS LIST... 24 SVC. SHEET....

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet. Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit

AC Volt-meter

Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Good Earth Ground such as WATER PIPE, CONDUIT etc.
To Instrument's exposed METALLIC PARTS

0.15uF

Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

1.5 Kohm/10W

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 F to 600 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

This specification is applied to ML-041D chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below condition. (1) Temperature: 25C 2C (2) Humidity: 65% 10% (3) Power: Standard input voltage (AC 100-240V, 50/60Hz) (4) Measurement must be performed after heat-run more than 30min. (5) Adjusting standard for this chassis is followed a special standard.
3.General Specification(TV)
No. 1 Item Video input applicable system Specification 1)PAL-D/K,B/G,I 2)NTSC-M 3)SECAM NTSC 4.Receivable broadcasting system 1)PAL/SECAM BG 2)PAL/SECAM DK 3)PAL I/I 4)SECAM L/L 5)NTSC M 6)PAL-N/M 7)NTSC M 3 RF input channel VHF : E2 ~ E12 UHF : E21 ~ E69 CATV : S1 ~ S20 HYPER : S21 ~ S41 L/L : B,C,D VHF : 2 ~ 13 UHF : 14 ~ 69 CATV : 1 ~ 125 VHF Low : 1~M10 VHF High : 4~S22 UHF : S23~9 Input voltage Picture size Tuning system Operting environment Storage environment Display AC 100 - 240V/ 50Hz,60HZ 583mm FVS 100 program FS 1)Temp : 0 ~ 40 deg 2)Humidity : 85% 3)Temp : -20 ~ 60 deg 4)Humidity : 85% LCD Module 23 PAL, 200PR.(Option) NTSC JAPAN NTSC FRANCE PAL South America Market Except South America NTSC Market (RM) Remark
5.General Specification(Monitor)
No. 3 Panel Frequency range Control function Item Specification 23 TFT WXGA LCD H:31 ~ 61KHz, V: 56 ~ 75Hz 1) Contrast/ Brightness 2) H- Position/ V-Position 3) Tracking : Clock/Phase 4) Auto Configure 5) Reset 4 Component Jack 1: Y 3: Pb 5: Pr 7: Line1 Ready 9: LINE2 11: LINE3 13: Line3 Ready D4 Jack (525i,525p,750p,1125i) 2: Y GND 4: Pb GND 6: Pr GND 8: LINE1 10: Line2 Ready 12: SWITCH GND 5 Power ON Stand by DPMS Mode Power off Type 6 LCD Module Size Pixel Pitch LPL 0.372 x 0.124 x RGB mm Pixel Format Coating Back Light 1366 horiz. By 768 vert. pixels RGB strip arrangement Hard coating(3H), Anti-glare treatment of the front polarizer LPL EEFL 14: SWITCH H/V-Sync ON/ON OFF/ON ON/OFF Video Active OFF OFF LPL Power consumption Max 170 3.0 typ.3.5 559.8 x 333.8x45.7 mm (H) x (V) x (D) W W W W LED Green Red Green *. Japan only Middle east /NTSC Only DVI-I input Unit Remark
6.Optical Feature(LCD Module)
No. Item Specification LPL Viewing Angle <CR 10> Luminance Contrast Ratio CIE Color Coordinates WHITE RED Green Blue WX WY Wr Yr Xg Yg Xb Yb Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Luminance(cd/ ) Variation 450 1.0.284 0.295 0.285 0.293 0.289 0.303 Typical MAX/MIN ALL white/All back LPL R/L, U/D 176,176 Remark

7.Feature and Function

2. Designation

2.1 The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing. 2.2 Power Adjustment : Free Voltage 2.3 Magnetic Field Condition: Nil. 2.4 Input signal Unit : Product specification standard 2.5 Reserve after operation : Above 2 hours 2.6 Adjustment equipments : Pattern Generator(801GF, MSPG925F), DDC Adjustment Jig equipment HDCP Adjustment Jig equipment.

3. Adjustments

3.1 Adjustment Details : The machine can be adjusted by itself automatically with factory automatic equipment, in case error occurs, set manual adjustment to standard. 3.2 Adjustment signal Composition of The Auto Adjustment equipment 3.2.1 RS-232C Interchange 9600bps, Pin#2 : Rx, Pin#3 : Tx, 8bit, STOP bit=1, No Parity 3.2.2 Adjust data save * Save the adjusted data to the EEPROM with default value

ai - 0 - 00

3.2.3 Adjust OK

ak - 0 - 00

3.2.4 Screen Adjustment Instruction Forms CMD1 CMD2 SetID(0) Value a. CMD1,CMD2 : Instructions operated by Monitor b. SetID L 0h Set always 0 in Adjustment c. VALUE : Adjustment Value 3.3 PC signal Gain/Offset Adjustment 3.3.1 Adjustment Preparation - Execution of RF no signal during Heat Run over 30min - Pattern generator signal is connected to the DVI-I Jack of LCD TV. 3.3.1 Auto Gain/Offset Adjustment. - To use Pattern Generator(MSPG-925FS), Apply Model 37, Patten 19 ( XGA(1024 X 768)60Hz, Half balck and Half white signal (Don't apply 16 gray signal) - Press IN-START Key by using the Remote Controller(SVC) , after converting to Adjustment-Mode, press VOL+ Key consecutively in Auto-Gain Menu. - After adjustment is complete, pressing enter key, stores and completes the process. * Note) : PC Adjustment must be completed before auto adjustment.

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3.3 EDID (The Extended Display Identification Data) - Connect D-Sub to DVI-I Cable to DVI-I Jack. - Confirm the pc display by inputting the Analog signal. - After displayed, input the Analog EDID data. - Connect DVI D Cable to DVI Jack. - Confirm the pc display by inputting the Digital signal. - After displayed, input the Digital EDID data. 3.3.1 EDID DATA <DDC DATA Analog Set>
FF 0F FF 01 4B 81 AFF FF A0B A00 4C 1B 0A 09 0A 0B 20 B1 DA A20 0C 0D 45 1B 0E 0F FF FF FF 1E 6D 17

3.4 HDCP (High-Bandwidth Digital Contents Protection) Setting 3.4.1 When transmitting HD video source of HD STB through DVI(Digital Visual Interface), HDCP function is to execute Display & copy protection for securing contents security. 3.4.2 Confirm whether HDCP function is operated properly by connecting DVI Cable, after storing HDCP Key value on EEPROM(AT24C16)[address 0x1EF] (Refer to Working Order for Detailed work content ). * Reference : HDCP adjustment is not use. We are planning HDCP adjustment from NTSC. Note. : HDCP will temporarily exclude in spec. HDCP will apply from USA Product later.

01 4E 1F 0B 32 0A 52

1E 3B 00 FC 00 46

60 3D 1F

< DDC DATA Digital Set>
01 FF 0F 2C 02 FF 01 4B 81 A21 CFF FF A0B A00 4C 00 8E C1B 0A 09 0A 0B B1 DA D0C 0D 45 1B 0E 0F FF FF 00 1E 6D 18

01 4E 1F 0B 32 0A 06

50 A20
1E 3B 00 FC 01 C4 0E 0F 10 3E
09 0A 0B D0 1E 20 1D 80 9E 00

0C 0D 6E 2D 1C 00

10 C4 8E
1E 8C 0A D0 8A 20 E0 8E 21

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SVC REMOCON
To turn the TV on or off To turn the TV on automatically if the power is supplied to the TV. (Use the POWER ON POWER key to deactivate): It should be deactivated when delivered. To activate the mute function. MUTE To check TV screen image easily. P-CHECK To check TV screen sound easily S-CHECK To select size of the main screen (Normal, Spectacle, Wide or Zoom) ARC Switch to closed caption broadcasting CAPTION To toggle on/off the teletext mode TXT To select an external input for the TV screen TV/AV To start turbo sound TURBO SOUND TURBO PICTURE To start turbo picture To enter adjustment mode when manufacturing the TV sets. To adjust the screen voltage (automatic): In-start mute Adjust AV(Enter into W/B adjustment mode) IN-START W/B adjustment (automatic): After adjusting the screen W/B adjustment Exit two times (Adjustment completed) To enter into the adjustment mode. To adjust horizontal line and sub-brightness. ADJ To select the multiple sound mode (Mono, Stereo or Foreign language) MPX To release the adjustment mode EXIT To easily adjust the screen according to surrounding brightness APC(PSM) To easily adjust sound according to the program type ASC(SSM) To check component input MULTIMIDIA To check the front AV FRONT-AV To move channel up/down or to select a function displayed on the screen. CH To adjust the volume or accurately control a specific function. VOL To set a specific function or complete setting. ENTER To move the channel down in the PIP screen. PIP CH-(OP1) To use as a red key in the teletext mode To move the channel in the PIP screen PIP CH+(OP2) To use as a green key in the teletext mode To switch between the main and sub screens PIP SWAP(OP3) To use as a yellow key in the teletext mode To select the input status in the PIP screen PIP INPUT(OP4) To use as a blue key in the teletext mode To set a function that will automatically adjust screen status to match EYE the surrounding brightness so natural color can be displayed. To select the functions such as video, voice, function or channel. MENU To set the delivery condition status after manufacturing the TV set. IN-STOP To halt the main screen in the normal mode, or the sub screen at the PIP screen. STILL Used as a hold key in the teletext mode (Page updating is stopped.) Displays the teletext time in the normal mode TIME Enables to select the sub code in the teletext mode Used as the size key in the PIP screen in the normal mode SIZE Used as the size key in the teletext mode Used as the index key in the teletext mode (Top index will be MULTI PIP displayed if it is the top text.) To select the position of the PIP screen in the normal mode Used as the update key in the teletext mode (Text will be POSITION displayed if the current page is updated.) Used as Mode in the teletext mode MODE To select the simultaneous screen PIP To adjust screen tilt TILT To manually select the channel. 0~9

Shortcut keys Shortcut keys Shortcut keys
Use the AV key to enter the screen W/B adjustment mode.
Shortcut keys Shortcut keys

Shortcut keys

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TROUBLESHOOTING

No power (LED indicator off)

:[A]Process

Check 24V or 12V of Power B/D
No Power (LED indicator off)
Pass Check Output of L3, L1300 Change L3, L1300 Faill
Check Output of IC1300, IC4 or IC6
Change IC1300, IC4 or IC6 Faill

Check LED Assy Faill

Change LED Assy

Check P101 Connector

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No Raster

:[B]Process
Check LED Status on display unit

Repeat A PROCESS Faill

Check L900,L901 L902,L903
Change L900,L901, L902,L903
Check the input/ Output of IC901

Change IC901 Faill

Check inverter Connector or inverter
Change inverter connector or inverter
Check panel link Cable or module
Change panel link cable or module
Pass Check input source cable and jack Change module

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No Raster on Component signal

Repeat [A] Process Pass

Check the signal of Q310,Q315,Q316

Change Q310,Q315,Q316

:[C]Process
Re-soldering or Change the defect part Check IC800
Check the input/ output of IC800 Pass
Check the input/ output of IC600
Re-soldering or Change the defect part Check IC600
Pass Re-soldering or Change the defect part Check IC500,X500,IC501
Check the input/ output of IC500
Check the input/ output of IC901
Re-soldering or Change the defect part Check X900
Check input source cable and jack

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No Raster on AV Signa (Scart1.Scart2,S-Video)
No Raster on TV(RF) signal

Repeat [A] Process

Check the output of TU1000
Check 5V,33V of TU1000, Re-soldering of Change the defect part
Check the signal of Q317,Q318,Q308,Q313
Change Q317,Q318,Q308, Q313

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No Raster on DVD Signal
Check the signal of R1211,R1212,R1213
Check P1200,P1202 or DVD Cable

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No Sound(RF,SIDE AV)
No Sound(Scart1/2,DVD,PC)

Check the input source

Change source input
Check the input/output of IC1 Pass
Re-soldering or Change the defect part Check X11
Check the input/ output of IC401
Re-soldering or Change the defect part Check IC403,X601
Check the input/ output of IC400
Re-soldering or Change the defect part Check IC400

Check the speaker Faill

Change the speaker

Check the speaker wire

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POWER RAM RAM IC501 IC501 TPA3008 TPA3008 AMP AMP ADC_H/V_sync R/8
MSP4410K MSP4410K IC401 IC401
FLI2300 FLI2300 IC500 IC500 DVD_Y,Pb,Pr VCTI sound_ LR VCTI VCTI IC1 IC1 R,G,B AN15865A AN15865A IC800 IC800 IF+,-
MST9883 G/8 MST9883 IC600 IC600 B/8

DVD_ LR

SIDE_Comp. S-VHS PC_L,R AV_L,R Comp 1_L,R DVD_POWER & Y,Pb,Pr SIDE_L,R
GM5221 GM5221 IC901 IC901 R,G,B H/V_sync

FLI_H/V_sync

BLOCK DIAGRAM

ROM ROM IC900 IC900

LVDS 30 pin

SIDE_Y,Pb,Pr(Comp2)

AUDIO PC

DVI DVI

Comp1_Y,Pb,Pr

- 19 R,G,B

PC_R,G,B & H/V sync
Tuner Tuner TU1000 TU1000
BLOCK DIAGRAM DESCRIPTION
1. Video Controller Unit & Display Data Conversion Unit The video controller unit receives the video signals inputted through the tuner, AV port (VIDEO1, VIDEO2), and converts them into an ITU656 signal through the microcomputer (VCTI) combined with the video decoder that integrates various functions in one chip. Either the analog RGB(FLI2300) signal or PC RGB signal is selected by the switching IC and inputted to a scaler (GM2221), which is sent to the LCD module after being modified to an LVDS signal through the integrated LVDS IC. VCTi is the main microprocessor that handles video signal processing and sound signal processing. It also manages the RF signals received from the tuner. The scaler can control timing to fit into the LCD panel, and can also control the size and position of the inputsignal. 2. Power Supply Unit The power supply unit provides 24V, 12V and 5V DC power to the mainboard. The PWM Step-Up DC/DC Converter circuit is used to generate the 33V used for the tuner. Supplied 24V power is descended by the 13.3V step-down DDC. 13.3V provides source to sound amplifier IC. 24V power is also used to generate 5V and 3.3V power through the Step-Down DC/DC Converter and supplied 12V. 5V power is converted to 3.3V and 1.8V power through the regulator, which in turn supplies electrical power for ICs such as VCTI and scaler.

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WIRING DIAGRAM

5P-6631T25023Y

4P-6631T25023X
12P-6631T25019K 12P-6631T20034Y 12P-6631T20034Z
9P-6631T20037K 10P-6631T20033F
14P-6631T20033E 30P-6631T11020N

5P-6631T20033T

30P-6631T20040A

3P-6631T20033D

30P-6631T20040B

3P-6631T20031G

110 030

EXPLODED VIEW

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130 140

EXPLODED VIEW PARTS LIST
No. 010 PART NO. 3091TKE035A 3091TKE035B 6304FLP283A 3809TKE024D 3809TKE024E 040 3043TKK239D 3043TKK239B 080 3550TKK838A 3550TKK822A 6401TZZ063A 6401TZZ063B 4951TKS236A 4951TKS236B 090 6871TPT287J or 6871TPT287E 3313TN2038A 4951TKK174D 4951TKK174E 160 6871TSTA01A 6871TST630B 6871TVT370C 6871TST763C 3551TKK530F DESCRIPTION CABINET ASSEMBLY, 23LX1R BRAND 3090TKE025A USA V0 AUTOBAHN CABINET ASSEMBLY, 23LX1R BRAND 3090TKE025A USA V0 AUTOBAHN C/SKD LCD(LIQUID CRYSTAL DISPLAY), RESET CIRCUIT ADDITION BACK COVER ASSEMBLY, 23LX1R-MA 3808TKE017 FOR USA, V0, NTSC, PHONE JACK BACK COVER ASSEMBLY, 23LX1R 3808TKE017 FOR USA, V0, NTSC, C/SKD TILT SWIVEL ASSEMBLY, 23LX1RV 3043TKK239 DVDP STAND,KUMI TILT SWIVEL ASSEMBLY, 23LX1RV 3043TKK239 DVDP STAND COVER, RZ-23LG10 REAR CAP COVER, KZ-23LG10 REAR DVDP SPEAKER ASSEMBLY, KZ-26LZ51 R 4P SPEAKER ASSEMBLY, KZ-26LZ51 L 5P METAL ASSEMBLY, FRAME 23INCH MAIN METAL ASSEMBLY, FRAME 23INCH MAIN, CKD PWB(PCB) ASSEMBLY,POWER, RZ-23LZ50 POWER TOTAL BRAND DVD(23LX1RV) PWB(PCB) ASSEMBLY,POWER, RZ-23LZ50 POWER TOTAL BRAND AUTOBAHN 23" (PB-FREE) MAIN TOTAL ASSEMBLY, 23LX1RV-MC BRAND ML-041D MAIN CHASSIS ASSY METAL ASSEMBLY, REAR ML-041A RZ-23LZ50S METAL ASSEMBLY, REAR C/SKD ML-041A RZ-23LZ50S PWB(PCB) ASSEMBLY,SUB, 23LX1R LOGO ASSY LED & P/SW TOTAL BRAND LF PWB(PCB) ASSEMBLY,SUB, RZ-23LZ50 KEY CONTROL TOTAL BRAND LF PWB(PCB) ASSEMBLY,VIDEO, RM-32/26/23LZ50 SIDE A/V SUB TOTAL BRAND LF PWB(PCB) ASSEMBLY,SUB, 23LX1R LED & P/SW TOTAL BRAND LF COVER ASSEMBLY, 23KX1R REAR A/V BRACKET ASSY FOR USA DARK SILVER(7227S00112A)

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REPLACEMENT PARTS LIST
For Capacitor & Resistors, the charactors at 2nd and 3rd digit in the P/No. means as follows; CC, CX, CK, CN, CH : Ceramic CQ : Polyestor CE : Electrolytic CF : Fixed Film RD : Carbon Film RS : Metal Oxide Film RN : Metal Film RH : CHIP, Metal Glazed(Chip) RR : Drawing

CAPACITOR

C1102 C407 C410 C1001 C1002 C1003 C1004 C1007 C1010 C11 C12 C1209 C1210 C1211 C1212 C1213 C1300 C1302 C1305 C1307 C15 C16 C18 C19 C23 C3 C4 C411 C412 C417 C42 C421 C426 C428 C431 C432 C434 C436 C44 C440 C441 C444 C447 C45 C459 C460 C461 C462 C469 C471 C472 C473 C474 C477 0CE107EK638 0CH6152K406 0CH6152K406 0CH3103K516 0CH3103K516 0CH3103K516 0CH3103K516 0CH3103K516 0CK273DK51A 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CK105DK94A 0CH3103K516 0CK105DK94A 0CH3103K516 0CH3104K566 0CH3104K566 0CK106EF56A 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3103K516 0CH3103K516 0CH3104K566 0CH3104K566 0CH3104K566 0CH3222K516 0CH3222K516 0CH3222K516 0CH3222K516 0CH3222K516 0CH3222K516 0CH3104K566 0CK105DK94A 0CH3103K516 0CK105DK94A 0CH3103K516 0CH3104K566 0CH3104K566 0CK225DH94A 0CH3104K566 0CK225DH94A 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 100UF KMG 50V M FM5 TP 5 1500PF 50V J SL 2012 R/TP 1500PF 50V J SL 2012 R/TP 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 27000PF 2012 50V 10% B(Y5P) 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP "1UF 2012 50V 80%,-20% R/TP" 10000PF 50V 10% B(Y5P) 2012 "1UF 2012 50V 80%,-20% R/TP" 10000PF 50V 10% B(Y5P) 2012 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 10UF 3216 16V 10% X7R R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 2200PF 2012 50V 10% B(Y5P) 2200PF 2012 50V 10% B(Y5P) 2200PF 2012 50V 10% B(Y5P) 2200PF 2012 50V 10% B(Y5P) 2200PF 2012 50V 10% B(Y5P) 2200PF 2012 50V 10% B(Y5P) 0.1UF 50V 10% X7R 2012 R/TP "1UF 2012 50V 80%,-20% R/TP" 10000PF 50V 10% B(Y5P) 2012 "1UF 2012 50V 80%,-20% R/TP" 10000PF 50V 10% B(Y5P) 2012 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP "2.2UF 2012 25V 80%,-20% F(Y" 0.1UF 50V 10% X7R 2012 R/TP "2.2UF 2012 25V 80%,-20% F(Y" 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP

PART NO. 0CH8476F691 0CE476WK6DC 0CE226WJ6DC 0CE227WJ6DC 0CE476WK6DC 0CE475WJ6DC 0CE107WF6DC 0CH8476F691 0CH8476F691 0CH8476F691 0CH8106F691 0CH8106F691 0CH8476F691 0CH8476F691 0CH8476F691 0CH8476F691 0CH8476F691 0CH8476F691 0CH8476F691 0CH8476F691 0CH8476F691 0CE107WF6DC 0CE475WK6DC 0CE477WF6DC 0CE477WF6DC 0CE477WF6DC 0CE227WF6DC 0CE227WF6DC 0CH8476F691 0CH8476H691 0CE227WJ6DC 0CE227VH6DC 0CH8476F691 0CH8476F691 0CH8476H691 0CH8476F691 0CH8476F691 0CH8476H691 0CH8476H691 0CE227WJ6DC 0CE476WK6DC
DATE: 2005. 6. 28. DESCRIPTION / SPECIFICATION 47UF 16V 20% 105STD (CYL) R 47UF MVK 50V 20% R/TP(SMD) 22UF MVK 35V 20% R/TP(SMD) 220UF MVK/RC 35V 20% SMD TA 47UF MVK 50V 20% R/TP(SMD) 4.7UF MVK 35V 20% R/TP(SMD) 100UF MVK 16V 20% R/TP(SMD) 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 10UF 16V 20% 105STD (CYL) R 10UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 100UF MVK 16V 20% R/TP(SMD) "4.7UF MVK,RC 50V 20% SMD TA" 470UF MVK 16V 20% SMD R/TP( 470UF MVK 16V 20% SMD R/TP( 470UF MVK 16V 20% SMD R/TP( 220UF MVK 16V 20% R/TP(SMD) 220UF MVK 16V 20% R/TP(SMD) 47UF 16V 20% 105STD (CYL) R 47UF 25V 20% 105STD (CYL) R 220UF MVK/RC 35V 20% SMD TA 220UF MV 25V 20% R/TP(SMD) 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 25V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 16V 20% 105STD (CYL) R 47UF 25V 20% 105STD (CYL) R 47UF 25V 20% 105STD (CYL) R 220UF MVK/RC 35V 20% SMD TA 47UF MVK 50V 20% R/TP(SMD)

DIODEs

ZD1300 ZD1301 ZD1302 IC751 IC754 D107 D400 D711 D703 D704 ZD220 ZD222 D700 D701 D702 D705 D706 ZD209 0DR340009AA 0DR340009AA 0DR340009AA 0DRSE00018B 0DRSE00018B 0DS226009AA 0DS181009AA 0DD184009AA 0DZ510009EE 0DZ510009EE 0DZ510009EE 0DZ510009EE 0DZ510009EE 0DZ510009EE 0DZ510009EE 0DZ510009EE 0DZ510009EE 0DZ510009EE MBRS340 TP FAIRCHILD NON 40 MBRS340 TP FAIRCHILD NON 40 MBRS340 TP FAIRCHILD NON 40 "SRV05-4.TCT, SEMTECH R/TP S" "SRV05-4.TCT, SEMTECH R/TP S" KDS226 TP KEC - 80V - - 4NS KDS181 TP KEC SOT-23 80V KDS184 TP KEC - 85V - - - 3 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323 UDZ S 5.1B TP ROHM-K SOD323

IC501 IC749 IC753 IC907 IC918 IC1201 IC401 IC500 IC750 IC808 IC1 IC2001 IC400 IC600 IC800 IC901 IC1300 IC1301 IC2 IC3 IC4 IC4007 IC402 IC403 IC6 IC8 IC888 IC9 IC905 IC906 IC950 IC2000 IC702 IC752 0IMMREB010A 0IMMRSG036A 0IMMRSG036A 0IMCRAL006A 0IMCRAL006A 0IMCRNS007E 0IMCRMN028B 0IMCRGN002D 0IMCRSG010A 0IMCRNS007C 0IPRPMN003C 0IPRPJR017A 0IPRP00522A 0IPRPM3002D 0IPRPMA013A 0IPRPGN014C 0IPMG00063A 0IPMG00063A 0IPMGK2001B 0IKE702700D 0IPMGK2001B 0IPMGK2001C 0IPMGK2001B 0IKE704200J 0IPMGSG018D 0IMCRFA015A 0IMCRNS007A 0IMCRFA010A 0IPMGFA061A 0IPMGSG018D 0IPMGNS004B 0ISTL00026A 0ISTL00024A 0IMCRTI001A "M12L64322A-6T ESMT 86P,TSOP" "M24C02-WMN6T(P),LF SGS-THOM" "M24C02-WMN6T(P),LF SGS-THOM" "AT24C16AN-10SU-2.7,LF ATMEL" "AT24C16AN-10SU-2.7,LF ATMEL" LMS1587CS-3.3 NATIONAL SEMI MSP4410K MICRONAS 80P/PQFP "FLI2300BD-LF,PB FREE GENESI" ST3232CDR SGS-THOMSON SOP16 LMS1587CS-ADJ NATIONAL SEMI VCT49XYF C7(NTSC+PAL) MICRO "NJU26901E2 JRC 8P,EMP R/TP" "TPA3008D2PHPRG4,LF TEXAS IN" "MST9883C-LF-110 MSTAR 80P,L" "AN15865AAVT,PB FREE MATSUSH" "GM5221H-BC-LF,PB FREE GENES" MP1593DN-LF-Z MONOLITHIC PO MP1593DN-LF-Z MONOLITHIC PO AIC1117A-33CYTR(BS33) AIC S "KIA7027AF 3, SOT-89 TP RESE" AIC1117A-33CYTR(BS33) AIC S AIC1117A-25CYTR(BS25) AIC 3 AIC1117A-33CYTR(BS33) AIC S KIA7042AF SOT-89 TP 4.2V VO LD1086DT18TR-LF SGS-THOMSON KA7805R FAIRCHILD 2P D-PAK LM2940S 8V NATIONAL SEMICON "KA7809R, FAIRCHILD 2P D-PAK" "FAN1587AD33X FAIRCHILD 3P,D" LD1086DT18TR-LF SGS-THOMSON LM2676S-ADJ NATIONAL SEMICO "MC14066BDR2G,LF ON SEMI 14P" "MC14053BDR2G,LF ON SEMI 16P" "SN74HCT157DR,LF TEXAS INST"
COIL & CORE & INDUCTOR
L910 L1300 L1301 L414 L415 L416 L417 L100 L1002 L101 L1205 L1206 L1207 L1208 L1209 L1210 6200TEZ012L 6140VR0008B 6140VR0008B 6140VR0008A 6140VR0008A 6140VR0008A 6140VR0008A 6210TCE001G 6210TCE001G 6210TCE001G 6210TCE001G 6210TCE001G 6210TCE001G 6210TCE001G 6210TCE001G 6210TCE001G SLF12575T-680M2R0 TDK R/TP SLF12575T-150M3R2 15UH SMD SLF12575T-150M3R2 15UH SMD SLF12575T-330M4R7 33UH SMD SLF12575T-330M4R7 33UH SMD SLF12575T-330M4R7 33UH SMD SLF12575T-330M4R7 33UH SMD HH-1M3216-501 CERATEC 3216M HH-1M3216-501 CERATEC 3216M HH-1M3216-501 CERATEC 3216M HH-1M3216-501 CERATEC 3216M HH-1M3216-501 CERATEC 3216M HH-1M3216-501 CERATEC 3216M HH-1M3216-501 CERATEC 3216M HH-1M3216-501 CERATEC 3216M HH-1M3216-501 CERATEC 3216M

- 32 -

DATE: 2005. 6. 28. DESCRIPTION / SPECIFICATION TACT 2LEAD 100G(TA) LG C&D TACT 2LEAD 100G(TA) LG C&D TACT 2LEAD 100G(TA) LG C&D
*S *AL LOC. NO. R3125 R3126 R3127 R3137 R3138 SW1600 LED1600 PA2101 LED801 LED802 LED803 LED804 LED805 LED806 LED807
PART NO. 0RH1000D622 0RH1000D622 0RH1000D622 0RH1000D622 0RH1001D622 140-313A 0DL200000CA 6726TV0001A 0DLBE0158AA 0DLBE0158AA 0DLBE0158AA 0DLBE0158AA 0DLBE0158AA 0DLBE0158AA 0DLBE0158AA
DATE: 2005. 6. 28. DESCRIPTION / SPECIFICATION 100 OHM 1 / 10 W 2012 5.00% 100 OHM 1 / 10 W 2012 5.00% 100 OHM 1 / 10 W 2012 5.00% 100 OHM 1 / 10 W 2012 5.00% 1K OHM 1 / 10 W 2012 5.00% TACT 2LEAD 100G(TA) LG C&D SAM5670(DL-2LRG) BK Y-GREEN TSOP4838SO1 VISHAY 38.0KHZ BRIGHT LED ELECTRONICS BL-H BRIGHT LED ELECTRONICS BL-H BRIGHT LED ELECTRONICS BL-H BRIGHT LED ELECTRONICS BL-H BRIGHT LED ELECTRONICS BL-H BRIGHT LED ELECTRONICS BL-H BRIGHT LED ELECTRONICS BL-H
SW1704 140-313A SW1705 140-313A SW1706 140-313A

DVD BOARD

R3201 R3202 R3203 R3204 R3205 R3206 R3207 SW3201 SW3202 SW3203 SW3204 SW3205 0RD7501F609 0RD2401F609 0RD9100F609 0RD6200F609 0RD2400F609 0RD3301F609 0RD6201F609 140-313A 140-313A 140-313A 140-313A 140-313A 7.5K OHM 1/6 W 5.00% TA52 2.4K OHM 1/6 W 5.00% TAOHM 1/6 W 5.00% TAOHM 1/6 W 5.00% TAOHM 1/6 W 5.00% TA52 3.3K OHM 1/6 W 5.00% TA52 6.2K OHM 1/6 W 5.00% TA52 TACT 2LEAD 100G(TA) LG C&D TACT 2LEAD 100G(TA) LG C&D TACT 2LEAD 100G(TA) LG C&D TACT 2LEAD 100G(TA) LG C&D TACT 2LEAD 100G(TA) LG C&D

VIDEO BOARD

C2006 C2007 R2001 R2002 R2003 R2004 R2005 R2006 R2007 0CN4710K519 0CN4710K519 0RD0752Q609 0RD0752Q609 0RD0752Q609 0RD0752Q609 0RD0752Q609 0RD4703Q609 0RD4703Q609 470PF D 50V 10% B(Y5P) TA52 470PF D 50V 10% B(Y5P) TA1/4W(3 5% TA1/4W(3 5% TA1/4W(3 5% TA1/4W(3 5% TA1/4W(3 5% TA52 470K 1/4W(3 5% TA52 470K 1/4W(3 5% TA52

LED & P/SW BOARD

C1600 L1600 R1600 C2100 C3111 C3112 C3113 C3114 C3115 C3116 C3117 L2100 L2101 Q1601 Q1602 Q1603 Q3101 Q3102 Q3103 Q3104 Q3105 Q3106 Q3107 Q3108 R1601 R1602 R1603 R1604 R1605 R1606 R3101 R3102 R3103 R3104 R3105 R3106 R3107 R3121 R3122 R3123 R3124 0CH3104K566 0LC1032101A 0RH3301D622 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 6210TCE001G 0LC1032101A 0TR387500AA 0TR387500AA 0TR387500AA 0TR387500AA 0TR387500AA 0TR387500AA 0TR387500AA 0TR387500AA 0TR387500AA 0TR387500AA 0TR387500AA 0RH2701D622 0RH2700D622 0RH1001D622 0RH1001D622 0RH1001D622 0RH1500D622 0RH2200D622 0RH2200D622 0RH2200D622 0RH2200D622 0RH2200D622 0RH2200D622 0RH2200D622 0RH1000D622 0RH1000D622 0RH1000D622 0RH1000D622 0.1UF 50V 10% X7R 2012 R/TP 10UH 10% 3216 R/TC FI-C3216 3.3K OHM 1 / 10 W 2012 5.00 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP HH-1M3216-501 CERATEC 3216M 10UH 10% 3216 R/TC FI-C3216 CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC CHIP 2SC3875S(ALY) BK KEC 2.7K OHM 1 / 10 W 2012 5.OHM 1 / 10 W 2012 5.00% 1K OHM 1 / 10 W 2012 5.00% 1K OHM 1 / 10 W 2012 5.00% 1K OHM 1 / 10 W 2012 5.00% 150 OHM 1 / 10 W 2012 5.00% 220 OHM 1 / 10 W 2012 5.00% 220 OHM 1 / 10 W 2012 5.00% 220 OHM 1 / 10 W 2012 5.00% 220 OHM 1 / 10 W 2012 5.00% 220 OHM 1 / 10 W 2012 5.00% 220 OHM 1 / 10 W 2012 5.00% 220 OHM 1 / 10 W 2012 5.00% 100 OHM 1 / 10 W 2012 5.00% 100 OHM 1 / 10 W 2012 5.00% 100 OHM 1 / 10 W 2012 5.00% 100 OHM 1 / 10 W 2012 5.00%