SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500F to 600F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500F to 600F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500F to 600F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

This specification is applied to the LCD TV used LB81D chassis.

3. Test method

1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CB specification - EMC: CISPR 13 specification

2. Requirement for Test

Each part is tested as below without special appointment. 1) Temperature : 255C (779F), CST : 405C 2) Relative Humidity : 6510% 3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 20 minutes prior to the adjustment.

4. General specification

Item Broadcasting system Available Channel 1) VHF : 00 ~ 12 2) UHF : 20 ~ 75 3) CATV : 02 ~ 44 4) DTV : 06 ~12, 27 ~ 69 Tuner IF 1) PAL : 38.90MHz(Picture), 34.40MHz(Sound) 2) DVB-T : 36.125MHz Input Voltage Screen Size Aspect Ratio Module Operating Environment Storage Environment 100 - 240V~, 50/60Hz 47 inch Wide (1920 x 1080) 52 inch Wide (1920 x 1080) 16:9 LC470WUD-SAA1 LK520D3LZ97 1) Temp : 0 ~ 40 deg 2) Humidity : ~ 80 % 1) Temp : -20 ~ 60 deg 2) Humidity : ~ 85 % 47LG70YD-AA 52LG70YD-AA LGE Spec Mark : 240V, 50Hz 47LG70YD-AA 47LG70YD-AA Specification PAL-BG, DTV : DVB-T Remark
5. Chrominance & Luminance Specification
No 1. 2. 3. 4. Item White peak brightness Contrast ratio Brightness uniformity Color coordinate RED GREEN BLUE WHITE RED GREEN BLUE WHITE 5. 6. 7. Color coordinate uniformity Contrast ratio Color Temperature Cool Medium Warm 8. 9. 10. 11. Color Distortion, DG Color Distortion, DP Color S/N, AM/FM Color Killer Sensitivity 43 -1800 11,000 9,300 6,500 10.0 10.0 % deg dB dBm X Y X Y X Y X Y X Y X Y X Y X Y 0.610 0.300 0.250 0.570 0.120 0.030 0.242 0.Typ. -0.03 0.638 0.335 0.289 0.609 0.145 0.063 0.279 0.292 0.640 0.330 0.280 0.600 0.150 0.060 0.272 0.277 0.670. 0.360 0.310 0.630 0.180 0.090 0.302 0.307 N/A 47LG70YD-AA 52LG70YD-AA <Test Condition> HDMI input, 85% Full white pattern 52LG70YD-AA Typ. +0.03 Min Typ Max Unit cd/m2 cd/m2 cd/m2 % Remark 47LG70YD-AA 52LG70YD-AA N/A Full white 47LG70YD-AA
6. Component Video Input (Y, PB, PR)
No Resolution 15 720x480 720x480 720x480 720X480 720x576 720x576 1280x720 1280x720 1280x720 1920x1080 1920x1080 1920x1080 1920x1080 1920x1080 1920x1080 Specification H-freq(kHz) 15.73 15.75 31.47 31.5 15.625 31.25 44.37.5 28.125 33.75 33.72 56.25 67.433 67.5 V-freq(Hz) 59.59.59.94 60.59.59.SDTV, DVD 480i SDTV, DVD 480i SDTV 480p SDTV 480p SDTV, DVD 576i SDTV 576p HDTV 720p HDTV 720p HDTV 720p HDTV 1080i HDTV 1080i HDTV 1080i HDTV 1080p HDTV 1080p HDTV 1080p Remark

7. RGB PC INPUT Mode

No Resolution 720*400 640*480 800*600 1024*768 H-freq(kHz) 31.468 31.469 37.684 37.879 46.875 48.363 56.470 60.1280*768 1360*768 1366*768 1280*1024 1920*1080 47.78 47.72 47.56 63.595 66.647 V-freq.(Hz) 70.08 59.94 75.00 60.31 75.00 60.00 70.00 75.029 59.87 59.8 59.6 60.0 59.988 Pixel clock(MHz) 28.321 25.17 31.50 40.00 49.50 65.00 75.00 78.75 79.5 84.75 84.75 108.875 138.625 WXGA WXGA WXGA SXGA WUXGA VESA(XGA) VESA VESA Input 848*480 60Hz, 852*480 60Hz --> 640*480 60Hz Display Proposed Remark

* Download

1) Execute ISP program Mstar ISP Utility and then click Config tab. 2) Set as below, and then click Auto Detect and check OK message. If display Error, Check connect computer, jig, and set. 3) Click Connect tab. If display Cant, Check connect computer, jig, and set.

(1) (3)

2) Automatically detecting update file in USB Stick - If your downloaded program version in USB Stick is Low, it didnt work. But your downloaded version is High, USB data is automatically detecting 3) Show the message Copying files from memory

4) Updating is staring.

Please Check Speed : To us speed between from 200 KHz to 400 KHz (2) OK
4) Click Read tab, and then load download file(XXXX.bin) by clicking Read. 5) Fishing the version uploading, you have to put USB stick and AC Power off.

(4) filexxx.bin

6) After putting AC Power on and check updated version on your TV.

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* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote controller 2) Select "MODEL SELECT" and Push OK button. 3) Go To INCH and choice proper inch. 4) TV power turn off and on. 5) Completed selecting Tool option
Impress Resolution 1080i Model : 223 in Pattern Generator(1080i Mode) Pattern: 65 in Pattern Generator (MSPG-925 Series, MPSG-1025D) - 7 color bar. - Adjust by commanding AUTO_COLOR_ADJUST. 2) Confirmation - We confirm whether 0xB3 (480i)/0xBC (1080i) address of EEPROM 0xA2 is 0xAA or not. - If 0xB3 (480i)/0xBC(1080i) address of EEPROM 0xA2 isnt 0xAA, we adjust once more. - We can confirm the ADC values from 0xAD~0XB2 (480i)/0XB6~BB (1080i) addresses in a page 0xA2. * Manual ADC process using Service Remocon. After enter Service Mode by pushing ADJ key, execute ADC Adjust by pushing G key at ADC CALIBRATION : COMPONENT. Impress Resolution 480i

3.1. ADC Process

(1) PC input ADC
1) Auto RGB Gain/Offset Adjustment - Convert to PC in Input-source - Signal equipment displays Output Voltage : 700 mVp-p Impress Resolution XGA (1024 x 768 @ 60Hz) Model : 60 in Pattern Generator Pattern : 65 in Pattern Generator (MSPG-925 Series, MPSG-1025D) - 7 color bar. [gray pattern that left & right is black and center is white signal(Refer below picture)]
<Fig. 1> Adjustment pattern(PC) - Adjust by commanding AUTO_COLOR_ADJUST. 2) Confirmation - We confirm whether 0xAA (RGB) address of EEPROM 0xA2 is 0xAA or not. - If 0xAA (RGB) address of EEPROM 0xA2 isnt 0xAA, we adjust once more - We can confirm the ADC values from 0xA4~0XA9 (RGB) addresses in a page 0xA2 * Manual ADC process using Service Remocon. After enter Service Mode by pushing ADJ key, execute ADC Adjust by pushing G key at ADC CALIBRATION: RGB-PC. Impress Resolution 1080i

3.2. Function Check

(1) Check display and sound
- Check Input and Signal items. (cf. work instructions) 1) TV 2) AV 3) COMPONENT (480i) 4) RGB (PC : 1024 x 768 @ 60hz) 5) HDMI 6) PC Audio In * Display and Sound check is executed by Remote controller.

(2) COMPONENT input ADC

1) Component Gain/Offset Adjustment - Convert to Component in Input-source - Signal equipment displays Impress Resolution 480i MODEL : 209 in Pattern Generator(480i Mode) Pattern : 65 in Pattern Generator (MSPG-925 Series, MPSG-1025D) - 7 color bar.

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4. Total Assembly line process
4.1. Adjustment Preparation
(1) W/B Equipment condition CA210: CH 9, Test signal: Inner pattern (85IRE) (2) Above 5 minutes H/run in the inner pattern. (power on key of adjust remote control) (3) 15 Pin D-Sub Jack is connected to the AUTO W/B EQUIPMENT. (4) Adjust Process will start by execute I2C Command (Inner pattern (0xF3, 0xFF).
Color Temperature Medium 9,300 Cool 11,000 K X=0.276(0.002) Y=0.283(0.002) K X=0.285(0.002) Y=0.293(0.002) Warm 6,500 K X=0.313(0.002) Y=0.329(0.002) <Test Signal> Inner patern (216gray,85IRE)
4.2. DPM operation confirmation
(Only Apply for MNT Model) Check if Power LED Color and Power Consumption operate as standard. - Set Input to RGB and connect D-sub cable to set - Measurement Condition: (100-240V@ 50/60Hz) - Confirm DPM operation at the state of screen without Signal

4.3. DDC EDID Write

In case of 2008 year new model for Australia and Taiwan which is developed with Mstar scaler, Manufacture have no use for dwnload of EDID for HDMI1/2/3/4 because HDMI EDID data is in the Application Program
4.3.1 Analog data 128Byte(2Bi)
EDID block 0, Bytes 0-127[00H-7FH] Block Type : EDID 1.3
0A 4B FF 88 1F 4C FF FF FF FF 4B A5 4E 00 D1 C01 EBC 0A 6 FF 1A 20 0A 00 1E 78 EA 1A 1B 9 A B C D E F 6D FB 9C D9 B0 A49 9C A38 1F 50 A00 1E 30 1C 00 FD FC E4
(5) Adjust Process will finish by execute I2C Command (Inner pattern (Inner pattern (0xF3,0x00)). (6) At the adjust W/B/, the spec of luminance set the Min 200 cd/m2 (7) In specially, the spec of luminanec set the Min 150 cd/m2 at the module of sharp(52) ** Caution ** Color Temperature: COOL, Medium, Warm One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0. (when R/G/B Gain are all C0, it is the FULL Dynamic Range of Module) * Manual W/B process using adjusts Remote control. - After enter Service Mode by pushing ADJ key, - Enter White Pattern off of service mode, and change off ---> on. - Enter W/B ADJUST by pushing G key at 3.W/B ADJUST. - The default value of RGB-GAIN is 192 at cool, Medium, Warm (There is a difference between picture image and set)

4.3.2 Digital data(HDMI-1) 256Byte
0A 45 BFF 28 1F 4C 4 FF FF FF 80 4C A1 0C 01 C4 8E 40 CFF 8E 0A FF 0A 3A 1E 1E 0A 9 A B C D 6D FC 9C CF 74 A4C 2D 40 1D 00 BC 52 D0 1E 00 FD E 01 B0 D1E 01 F C0 2C FC 6B
EDID block 1, Bytes 128-255[80H- FFH] Block Type : CEA EDID Timing Extension Version 3.
8E 07 BC23 f1 4E 07 2D 01 1D 00 9E 8C 8E C4 8E 21 2C CD0 0A 8E 1C D01 1D 00 1E 00 A 72 1D 9E 00 B C 2C 20 DD 1F 0C 25 0C 1E 00 E F 80 C6E 1C 10
* After done all adjustments, Press In-start button and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the models module from factory JIG model. * Dont push The IN STOP KEY after completing the function inspection.

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4.3.3 Digital data(HDMI-2) 256Byte
EDID Block 0, Byte 0-127[00H-7FH] Block Type : EDID 1.3
4.7. HDCP (High-Bandwidth Digital Contents Protection) SETTING (Scaler : Mstar)
Because HDCP key is built in HDCP exclusive EEPROM, Download progress is not needed.
8E 07 BC23 F1 4E 07 2D 01 1D 00 9E 8C 8E C4 8E 21 2C CD0 0A 8E 1C D01 1D 00 1E 00 A 72 1D 9E 00 B C 2C 20 DD 1F 0C 25 0C 1E 00 E F 80 C6E 1C 00
HDCP-KEY - Not USE 0:0x38 AE 0D ED 40 E6 BB FA 4E DE 51 FB 8E D9 AA 34 A8 C4 EA D8 6C DC 5C 91 5C B1 A2B 8B 8B FCC 1C A0E E39 A3 E86 CE 67 EB A0 F6B 86 F8A 77 AD3 7B EF 5C AA 9E CD 5E 66 EF C1 3C E1 8F 2A 82 DE 8F 52 CC A8 1F 37 D9 D4 C16 7E 42 FF 57 CD 6B E00 1A F5A AF 86 BA FE 41 A8 D5 A1:0x00 FC96 9E 35 0D 67 A8 8B DD 7A EF0 FF F5 8F F3 4E 5C FEB EC D5C 4F 43 2E E7 9F F6D 15 B20 F8 5E D4F F0 C1 8F 3D 31 B2 FB A1 6E CA A6 D3 A1D C78 8E 3E C47 AF 6A 6F 5B E1 4D 2B 2F CC 18 8E 42 DC 9A F8 3C D0 D04 FB 8C 54 9D AEB EEEF 7E FD F12 AC E4 BC A3 9B 65 A1 0E ED 1A 84 AD A3F 11 A7 1B D1 7F 6C 6F D3 DF 25 D0 FB
4.3.2 Digital data(HDMI-3) 256Byte
4.11 Outgoing condition Configuration
- fffff and make ship condition - When pressing IN-STOP key by Service remocontrol, Red LED are blinked alternatively. And then Automatically turn off. (Must not AC power OFF during blinking)

4.12 Internal pressure

8E 07 BC23 F1 4E 07 2D 01 1D 00 9E 8C 8E C4 8E 21 2C CD0 0A 8E 1C D01 1D 00 1E 00 A 72 1D 9E 00 B C 2C 20 DD 1F 0C 25 0C 1E 00 E F 80 C6E 1C F0

Confirm whether is normal or not when between power board's ac block and GND is impacked on 1.5kV(dc) or 2.2kV(dc) for one secon
1) All Data : HEXA Value 2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum Because RGB/HDMI EDID Data is downloaded from flash memory to EDID data storage EEPROM automatically when you push down power only key, Download progress is not needed.

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5. Adjustment Command
5.1. I2C(100K BPS) 5.2. COMMUNICATION START

START 6E A STOP 50Ms

5.4. Adjustment Commands(LENGTH=84)
Adjustment Contents CMD(hex) FACTORY ON FACTORY OFF EEPROM ALL INIT. EEPROM Read EEPROM Write E0 E2 E4 E7 E8 ADR 00 VAL[HEX] data Description Factory mode on Factory mode off EEPROM All clear EEPROM Read EEPROM Write by some values COLOR SAVE (R/G/B cutoff, Drive, Contrast, Bright) EB Color Save
# Until ACK BIT goes LOW, Repeat it.

5.3. Command form

Command form use DDC2AB standard communication protocol.
START 6E A 50 A LEN A 30 A CMD A 00 A VAL A CS A STOP
H POSITION V POSITION CLOCK PHASE R DRIVE
00:cool 01:medium 02:warm
They have different range each mode, FOS Adjustment
a. LEN : DATA BYTE number to send b. CMD : Command language theat monitor executes. c. VAL : FOS DATA d. CS : Dadas CHECKSUM that transmit e. DELAY : 50Ms f. A : Acknowledge

Drive adjustment

G DRIVE
00 :cool 01:medium 02:warm

B DRIVE

5.5. EEPROM DATA READ

(1) Signal TABLE

R CUTOFF G CUTOFF

Delay 100ms

00 7F 00 7F 00 7F 00 3F 00 - 64 02

Offset adjustment

B CUTOFF BRIGHT

128 Bytes

Bright adjustment Luminance adjustment Auto COLOR Adjustment
CONTRAST AUTO_COLOR_ ADJUST CHANGE_COLOR_ TEMP
(2) Command Set * Purpose : To read(84h) the appointment Address of E2PROM by 128(80h)-byte

Adjustment item EEPROM READ CMD(hex) ADH(hex) ADL(hex) E7 A80 A80 A80 A80 Details 0-Page 0~7F Read 0-Page 80~FF Read 1-Page 0~7F Read 1-Page 80~FF Read 2-Page 0~7F Read 2-Page 80~FF Read 3-Page 0~7F Read 3-Page 80~FF Read

0,1,2,3

0: Cool 1: Medium 2: Warm 3: User

White Pattern

00: White pattern off FF: White pattern on

AUTO_ INPUTCHANGE

0,10,20,30, 0 : TV 40,60,: DTV 20 : SCART: SCART: Component 60 : RGB 90 : HDMI

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5.6. E2PROM Data Write

Delay 20m

LEN : 84h+Bytes CMD : 8Eh ADH : E2PROM Slave Address(A0,A2,A4,A6,A8), Not 00h (Reserved by Buffer To EEPROM) ADL : E2PROM Sub Address(00~FF) Data : Write data (2) Command Set
Adjustment item EEPROM WRITE CMD(hex) E8 LEN 94 84+n Remark 16-Byte Write n-byte Write
* Purpose 1) EDID write : 16-byte by 16-byte, 8 order (128-byte) write(TO 00 7F of EEPROM Page A4). 2) FOS Default write : 16-mode data (HFh, HFl, VF, STD, HP, VP, Clk, ClkPh, PhFine) write 3) Random Data write : write the appointment Address of E2PROM.

5.7. NVRAM Read

- Send CMD(70h) to read Video RAM value from MICOM And save its value to 128-Bytes Buffer(Common Buffer for the use of EDID)
- Delay 500ms (Time to Wait and Read Video RAM from MICOM) - Be transmitted the contents of MICOMs 128-bytes Buffer to PC. (128th Data is the CheckSum of 127-bytes data : Thats OK if the value of adding 128-bytes Data is Zero)
START 6F A Data 1. Data 128 A CS NA STOP

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TROUBLESHOOTING
1. TV/CATV doesnt display
Check TU401 Pin15(Video output), Pin16(Sound output) Can you see the normal signal?
Could you measure voltage of TU800 & IIC lines? Are they all normal?
You should check power line & IIC lines.
You should replace TUNER. Check the output of TR(Q503). Can you see the normal waveform?
You should decide to replace TR(Q503) or not.
Check the output of Main IC(IC100). Especially you should check The H,V sync and clock. Can you see the normal waveform?

6. HDMI doesnt display
Check input connect J900 , J901, J902 Can you see the normal waveform?
J900 , J901, J902 may have problem. Replace this Jack.
Check DDC communication lines(IC900, IC901, IC903 Pin5,6)
After checking the Power of this chip, you should decide to replace this or not.
Check HDCP communication lines(IC902)
Check the input of HDMI Seitch(IC902) This signal is TMDS. Can you see the normal waveform?
After checking the trace of TMDS lines and power of HDMI Switch, you should decide to replace HDMI Switch or not.
Check the output of HDMI Switch(IC902). Can you see the normal waveform?
After checking the Power of HDMI Switch you should decide to replace MST3361 or not.

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ANT X-TAL 12Mhz 6212AA2004F

MP1593DN-LF 0IPMG00063A

1.8V 2.5V 3.3V 12V

2 $0.46 5V 2.5_DDR

TS1_CLK TS1_SYNC TS1_VLD TS1_D0 IN[A2] OUT[A1] SCL_D_TU SDA_D_TU TU_TS_CLK TU_TS_SYNC TU_TS_VAL TU_TS_DATA[0]
DVB/PAL Tuner (TDVS-H702P) LG Innotek
HY5DU561622 HY5DU561622 (DDR) (DDR) HY5DU561622 HY5DU561622 (DDR) (DDR)
TV_CVBS+(1.8Vp-p) SIF+(96dBuV)
CVBS0P SIF_IN1P SCL_A_TU SDA_A_TU

0IMMR00141A

Rear CVBS IN1 IN2
LVDS[177-190, 194-199] RXE/RXO CVBS1[30] AUL_IN0[68] AUR_IN[69] SV_C0[25] SV_Y0[26] (MST2379A/LGE7363C) ROMSCK[35] GPIO15[48] Air : DVB/PAL ROMSD[36]

Side CVBS IN3 IN3 OUT1

Side Y/C

L C D LVDS(8Bit)

EEPROM(32K) EEPROM(32K) 24C32 24C32

CVBS_Out

M-STAR

Comp_1 YPbPr

5V Changed 32K 0IMMRAL025A

Flash(8M*2) Flash(8M*2)

512K 3.3V

BLOCK DIAGRAM

- 21 Comp_Y Comp_Pb Comp_Pr

EEPROM AT24C028N

Comp_2 YPbPr
DDC_SCL/UART_Rx DDC_SDA/UART_Tx
Video SW (IC500, STMAV340)
RG B/YPbYr*2 CVBS*2 YC *1 SPI_CK[171] SPI_DI[172] L /R-IN*3 SPI_DO[173] S IF SPI_CZ[174] CVBS OUT*1

EAN32213401 Power

KEY_CTL[1,2,3]

PC(VGA)

(IC603)

MAX3232CDR R232C_TXD

R232C_RXD

RS232C(Debug)

Tx_Out
PB_IN[11] SOY[13] Y_IN[14] SAR3[204] PR_IN[16] SAR2[203] AUL_IN1[70] SAR1[202] AUR_IN1[71] SAR0[201] BIN[1]SOGIN[2]GIN[3]RIN[4] IR_RX[57] VS_RGB[7] HS_RGB[8] SCL/RX[33] SDA/TX[34] DM_DET[ AUOUTL0[79] AUOUTR0[80]GPIO12[45]

Only LG 7O

1.8V 3.3V 1.3V 2.3V 2.5V 12V 2.5_DDR 1.8_DDR
HY5DU561622 HY5DU561622 (DDR) (DDR) HY5DU561622 HY5DU561622 (DDR) (DDR) HYB18TC256160BF-3S HYB18TC256160BF-3S (DDR) (DDR) HYB18TC256160BF-3S HYB18TC256160BF-3S (DDR) (DDR)

6212AA2004F

IN[256] OUT[255]

$0.46 5V 6

LVDS[177-190, 194-199] RXE/RXO

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LVDS(8Bit)
MICRONAS MICRONAS ((FRC9459M-EL-A3)) FRC9459M-EL-A3
5V Changed 32K 512K 6 $0.67 SST25VF016B SST25VF016B EAN32213401

S M W 0 | 4 0

$0.145 - $0.76 0IMMRAL025A 3.3V
(MST2379A/LGE7363C) ROMSCK[35] ROMSD[36] Air : 8VSB Cable : 256/64QAM RG B/YPbYr*2 CVBS*3 SPI_CK[171] SPI_DI[172] YC *2 SPI_DO[173] L /R-IN*3 SPI_CZ[174] S IF SAR3[204] CVBS OUT*1 SAR2[203]
SAR1[202] SAR0[201] IR_RX[57]

S M W 0 | C

IF_N TS[0-7]
Add sy nc p attern of each input/output

MSD2379A

[MSTAR]

TS_DATA

IF_AGC TS_VALID I2C MSCL / MSDA MAIN I2C

TS_CLK TS_SYNC

I2C MSCL / MSDA
- 24 SIF CVBS_0 Add deta il bloc k di agram of VSB

Buffer

TUNER_CVBS

DDC_I2C E2PROM_I2C

EDID / ISP E2PR OM

IF_AGC TS_VALID

TUNER S / SDA CL I2C MSCL / MSDA MAIN I2C
- 25 SIF CVBS_0 Add deta il bloc k di agram of VSB

Signal Video

(From Tuner) AT_TU_V

[MSD2379A]

CVBS0 CVBS1 SVIDEO ( Y/C )
AV Y/C IN S-Video Y/Cb/Cr_IN Component RGB_IN RGB DTV_IN

- 26 RGB

Component ( Y/Cb/Cr )

LGDT3303 T3303 LGD

TS Data Add deta il bl oc k di agr am of each Vid eo input

AU_OUT0_ L/R

NT 000 P3

SPEAKER Output

- 27 SIF AV1_L/R Add deta il bl oc k di agr am of each Audio input

COMPONENT_L/R

DSUB RGB_L/R

57 IR IN[MSD2379

Local Key
KEY_CTL_0 KEY_CTL_SARSAR0

- 28 -

SAR is low speed 6-Bits ADC input and also for GPIO function use.
The I/O tolerance is 3.3V maximum for use.
The application of A/D key, the conversion voltage for full scale of MSD1226L is 1.8V.

12V 12V

0.6A 265mA Sound Mute 12V Option Pannel 23 EEPROM AT24C32AN

IC800 MP1583DN-Z

Sound Amp YDA138
Output Current : 3A Input : 4.75V to 23V Output : 1.22V to 21V

PWR_ON 8

EXPLODED VIEW

IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

802 120

Copyright C 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only