Service Guide Specification

1. Model Description

MODEL SUFFIX L1550S-SNN L1550S-BNN ANAUER BRAND Product Name LG FLATRON L1550S-SN FLATRON L1550S-BN Part No. 3828TSL094N
Printing Specification 1. Trim Size (Format) : 215mm x 280 mm 2. Printing Colors Cover : LG COLORS Inside : Black 3. Stock (Paper) Cover : Snow White 150 g/ Inside : Snow White 100 g/ 4. Printing Method : 5. Bindery : Saddle stitch 6. Language : English 7. Number of pages : 28 (Including blank 1page)

Special Instructions

(1) Origin Notification
* LGEDI : Printed in Indonesia * LGESP : Printed in Brazil * LGENT : Printed in China * LGEWA : Printed in U.K. * LGEMX : Printed in Mexico * LGEIL : Printed in India

REV. NO.

Changes

MM/DD/YY

CHANGE NO.

CHANGE

CONTENTS

Pagination sheet

Front cover Inside blank English English English English English

English

Rear cover Inside 26

Rear Cover

Website:http://biz.LGservice.com E-mail:http://www.LGEservice.com/techsup.html
COLOR MONITOR SERVICE MANUAL

CHASSIS NO. : CL-82

MODEL:
L1550S-SN (L1550S-SNN.AB**EP,AN**EP) L1550S-BN (L1550S-BNN.AB**EP,AN**EP)
) **Same model for Service

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
*To apply the MSTAR Chip.
SPECIFICATIONS... 2 PRECAUTIONS.. 3 TIMING CHART.. 7 DISASSEMBLY.. 8 BLOCK DIAGRAM... 9 DESCRIPTION OF BLOCK DIAGRAM..10 ADJUSTMENT.. 12 SERVICE OSD.. 13 TROUBLESHOOTING GUIDE.. 14 WIRING DIAGRAM.. 18 EXPLODED VIEW...19 REPLACEMENT PARTS LIST.21 SCHEMATIC DIAGRAM... 23

SPECIFICATIONS

1. LCD CHARACTERISTICS Type : TFT Color LCD Module Active Display Area : 15 inch Size : 326.5(W) x 253.5(H) x 11.2(D) Pixel Pitch : 0.297 (H) x 0.297 (V) Color Depth : 6bit with FRC, 16M clolors Electrical Interface : LVDS Surface Treatment : Hard-coating(3H), Anti-Glare Operating Mode : Normally White, Transmissive mode Backlight Unit : 2-CCFL 2. OPTICAL CHARACTERISTICS 2-1. Viewing Angle by Contrast Ratio 10 CPT TN Left : 60min. Right : 70(Typ) Top : 50min., 60(Typ) Bottom : 55min., 65(Typ) LPL TN Left : 55min., 65(Typ) Right : 55min., 65(Typ) Top : 40min., 45(Typ) Bottom : 50min., 55(Typ) 2-2. Luminance 2-3. Contrast Ratio : 200(min), 250(Typ) : 300(min), 400(Typ) 4. Max. Resolution D-sub Analog 5. POWER SUPPLY 5-1. Power : AC 100~240V, 50/60Hz , 1.0A 5-2. Power Consumption
MODE POWER ON (NORMAL) STAND-BY SUSPEND DPMS OFF H/V SYNC VIDEO POWER CONSUMPTION LED COLOR ON/ON ACTIVE OFF/ON OFF ON/OFF OFF OFF/OFF OFF less than 25 W less than 1 W less than 1 W less than 1 W GREEN AMBER AMBER AMBER

: 1024 x 768@75Hz

6. ENVIRONMENT 6-1. Operating Temperature : 10C~35C 6-2. Relative Humidity : 10%~80% 6-3. MTBF : 50,000 HRS with 90% Confidence level Lamp Life : 40,000 Hours(Min) 7. DIMENSIONS (with TILT/SWIVEL) Width Depth Height : 356.8 mm (14.05'') : 151.7 mm (5.97'') : 359.8 mm (14.17'')
3. SIGNAL (Refer to the Timing Chart) 3-1. Sync Signal Type : Separate Sync. 3-2. Video Input Signal 1) Type 2) Voltage Level a) Color 0, 0 b) Color 7, 0 c) Color 15, 0 3) Input Impedance
: R, G, B Analog : 0~0.71 V : 0 Vp-p : 0.467 Vp-p : 0.714 Vp-p : 75
8. WEIGHT (with TILT/SWIVEL) Net. Weight Gross Weight : 4.1 kg (9.04 lbs) : 5.0 kg (11.02 lbs)
3-3. Operating Frequency Horizontal : 30 ~ 63kHz Vertical : 56 ~ 75Hz

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT. There are some special components used in LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturers specified parts to prevent electric shock, fire or other hazard. Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

WARNING

BE CAREFUL ELECTRIC SHOCK ! If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

AC Volt-meter

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT. Must mount the module using mounting holes arranged in four corners. Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel. Protect the module from the ESD as it may damage the electronic circuit (C-MOS). Make certain that treatment persons body are grounded through wrist band. Do not leave the module in high temperature and in areas of high humidity for a long time. The module not be exposed to the direct sunlight. Avoid contact with water as it may a short circuit within the module. If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.

1.5 Kohm/10W

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 to 600 F F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 to 600 F F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal F F) temperature (500 to 600 b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

TIMING CHART

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc. (s), Vertical etc. (ms) >>
H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines)

Sync Polarity

+ + + + + + + + + + + +

Dot Clock

25.175 28.322 25.175 30.24 31.5 31.5 36.0 40.0 50.0 49.5 57.75 78.75

Frequency

31.468 KHz 70.0 Hz 31.468 KHz 70.0 Hz 31.469 KHz 60.0 Hz 35.00 KHz 66.67 Hz 37.861 KHz 72.8 Hz 37.50KHz 75.0 Hz 35.156 KHz 56.25 Hz 37.879 KHz 60.3 Hz 48.077 KHz 72.188 Hz 46.875 KHz 75.0 Hz 49.725 KHz 74.55 Hz 48.363 KHz 60.0 Hz 56.476 KHz 70.0 Hz 60.023 KHz 75.0 Hz

Total Period (E)

1312 800
Sync Video Active Duration (D) Time ( A )

Front Porch (C)

Blanking Time (B)

176 28

Resolution
640 x x 400 (TEXT) 640 x x x x x x x x x 624 (MAC) 1024 x x x 768

DISASSEMBLY

Remove the screws.
1. Pull the front cover upward. 2. Then, let the all latches are separated. 3. Put the front face down.

Disassemble back cover.

Remove the 6 screws from each up of metal frame.
Pell off Al-tape from panel.
Remove Al-tape from control pcb fix.
Remove the 4 screws from each side of metal frame.

LCD Module

R,G,B differential

3.3V Reg. 78D33 TSU16AL & TR(KTA 1273)

1.8V 1.8V 3.3V1

3.3V Reg. 78D33
LVDS (Low Voltage Differential Signaling)

TSU16AL including

(ADC/LVDS/SCALER /INPUT SWITCHING /TMDS )

BLOCK DIAGRAM

-93.3V1 5V

MTV312 MICOM

AC Input

R,G,B, H/V Sync

DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part. This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 78.75MHz. This part consists of the Scaler, ADC and TMDS receiver. The Scaler gets the video signal converted analog to digital, interpolates input to 1024 x 768 resolution signal and outputs 8-bit R, G, B signal to transmitter. 2. Power Part. This part consists of the two 3.3V regulator to convert power which is provided 12V, 5V in Power board and Micom. 3.3V is provided for LCD panel. Also, 5V is converted 3.3V by regulator and 3.3V and 1.8V are provided for scaler. Converted power is provided for IC in the main board. 3. MICOM Part. This part consists of EEPROM IC which stores control data and the Micom. The Micom distinguishes polarity and frequency of the H/V sync supplied from signal cable. The controlled data of each modes is stored in EEPROM.

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LIPS Board Block Diagram

50 ~ 60Hz 100KHz

EMI COMPONENTS
INPUT RECTIFIER AND FILTER

ENERGY TRANSFER

OUTPUT RECTIFIER AND FILTER

5V GND

LINE 100 ~ 240V

PWM COMTROL CIRCUIT

PHOTOCOUPLER ISOLATI ON

SIGNAL COLLENTION

PRIMARY

SECONDARY

Operation description_LIPS
1. EMI components. This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse. 2. Input rectifier and filter. This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor. 3. Energy Transfer. This part function is transfer the primary energy to secondary through a power transformer. 4. Output rectifier and filter. This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the over power protection is also monitor by this part. 5. Photo-Coupler isolation. This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage. 6. Signal collection. This part function is to collect the any change from the dc output and feed back to the primary through photo transistor.

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ADJUSTMENT
Windows EDID V1.0 User Manual Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Dont need setup Windows 2000, XP => Need to Port Setup. This program is available to LCD Monitor only. 1. Port Setup a) Copy UserPort.sys file to c:\WINNT\system32\drivers folder b) Run Userport.exe 2. EDID Read & Write 1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click Update button c) Click Write button
c) Remove all default number d) Add 300-3FF
e) Click Start button. f) Click Exit button.

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SERVICE OSD
1) Turn off the power switch at the front side of the display. 2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval. 3) The SVC OSD menu contains additional menus that the User OSD menu as described below. a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only) i) MODULE : To select applied module.

Video Signal Generator

IBM Compatible PC

PARALLEL PORT

2C 23 RS

Control Line

Power inlet (required)

S MO NI

Power Select Switch (110V/220V) Power LED

4.7K 4.7K 4.7K 74LS06

OFF 74LS06

E ST Switch

F V-Sync On/Off Switch (Switch must be ON.)
Figure 1. Cable Connection

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TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER (POWER INDICATOR OFF)
CHECK J707 VOLTAGE PIN5, PIN6 (5V)? YES CHECK U501 PIN VOLTAGE (5V) ? YES CHECK KEY CONTROL CONNECTOR ROUTINE
CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE
CHECK 5VS LINE (OPEN CHECK) NO PROBLEM
IS U201 PIN90 (3.3V) VOLTAGE ? YES

CHECK 3.3V LINE

CHECK U201 PIN 96 PULSE YES

CHECK X-TAL

CHECK U201

Waveforms

1 U201-#96

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2. NO RASTER (OSD IS NOT DISPLAYED) LIPS
NO RASTER (OSD IS NOT DISPLAYED)
J707 PIN5, PIN6 5V? YES J707 PIN2 2.5V? YES J707 PIN1 5V? YES
CHECK MICOM INV ON/OFF PORT.
1. CONFIRM BRIGHTNESS OSD CONTRL STATE. 2. CHECK MICOM DIM-ADJ PORT
CHECK PULSE AS CONTACTING SCOPE PROBE TO CAUTION LABEL. (CONTACT PROBE TO CAUTION LABEL. CAN YOU SEE PULSE AT YOUR SCOPE?
YES REPLACE CCFL LAMP IN THE LCD MODULE

- 15 -

3. NO RASTER (OSD IS NOT DISPLAYED) Mstar
U201 PIN 18, 90 3.3V? YES U201 PIN96, 97 OSCILLATE AS 12MHZ? YES
CHECK U801 (17", 19") CHECK U803 (15")
1. CHECK PIN122, 123 SOLDERING CONDITION 2. CHECK X501 3. TROUBLE IN U201
U501 PIN43 IS 48KHz H-SYNC? PIN44 IS 60Hz V-SYNC? IS PULSE APPEARED AT SIGNAL PINS? AT MODE 12?
CHECK CONNECTION LINE FROM D-SUB TO U501
TROUBLE IN CABLE OR LCD MODULE
1 U201-#96, U501-#43 H-SYNC 2 U501-#44 V-SYNC

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4. TROUBLE IN DPM

TROUBLE IN DPM

CHECK R216, R217 R778, R781 YES
CHECK PC PC IS NOT GOING INTO DPM OFF MODE
CHECK U501 PIN 43.44 SYNC PULSE ?

CHECK H/V SYNC LINE

TROUBLE IN U501
3 R216, R778 H-Sync 3 R217, R781 V-Sync

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WIRING DIAGRAM

Connector Assy P/N:

6631T11012R

6631T11022C

- 18 -

080 030

EXPLODED VIEW

- 19 -

EXPLODED VIEW PARTS LIST

Ref. No.

Part No.
3091TKL157C 3091TKL157E 3091TKL157D 3091TKL157G

Description

CABINET ASSEMBLY, L1550 BRAND 3090TKL140 SILVER-EUROPE,SGI,UK CABINET ASSEMBLY, L1550 BRAND 3090TKL140 SILVER, AUSTRALIA, LIFE IS GOOD CABINET ASSEMBLY, L1550 BRAND 3090TKL140 SILVER, C-C/SKD CABINET ASSEMBLY, L1550 BRAND 3090TKL140 BK LCD(LIQUID CRYSTAL DISPLAY), CLAA150XP01 CHUNGHWA PICTURE TUBES LTD. TFT COLOR 0/3/3 DOT,250NT/16MS/PSWG LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4NA LG PHILPS TFT COLOR PSWG,LVDS,16MS,SS S D-IC LPL NJ,250NITS BACK COVER ASSEMBLY, L1550 3808TKL112. BACK COVER ASSEMBLY, L1550 3808TKL112 A-C/SKD-EUROPE,UK,RUSSIA BACK COVER ASSEMBLY, L1550 3808TKL112 SVC LABEL FOR LATIN AMERICA, E-C/SKD-PANAMA,MEXICO BACK COVER ASSEMBLY, L1550 3808TKL112 ABS350 9930(BK)-SGI BACK COVER ASSEMBLY, L1550 3808TKL112 ABS350 9930(BK) SVC LABEL FOR LATIN AMERICA-PANAMA TILT SWIVEL ASSEMBLY, L1550. TILT STAND BODY TILT SWIVEL ASSEMBLY, L1550. TILT STAND BODY, A-C/SKD TILT SWIVEL ASSEMBLY, L1550. TILT STAND BASE TILT SWIVEL ASSEMBLY, L1550. TILT STAND BASE, A-C/SKD PWB(PCB) ASSEMBLY,SUB, L1550SN CONTROL TOTAL BRAND GUMI LF PWB(PCB) ASSEMBLY,SUB, L1550SN CONTROL TOTAL BRAND LGEDI LF-C/SKD-EUROPE,UK PWB(PCB) ASSEMBLY,SUB, L1550SN CONTROL TOTAL BRAND LGENT LF-C/SKD-RUSSIA PWB(PCB) ASSEMBLY,SUB, L1550SN CONTROL TOTAL BRAND LGEMX LF-C/SKD-PANAMA,MEXICO METAL ASSEMBLY, FRAME L1550S AU, CPT METAL ASSEMBLY, FRAME L1550S METAL ASSEMBLY, FRAME L1550S LPL A-C/SKD PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH C306 68PF 450V POWER TOTAL LIEN CHANG PB FREE MAIN TOTAL ASSEMBLY, L1550SN BRAND MST LPL CL-82 LF MAIN TOTAL ASSEMBLY, L1550SN.KNEUEPD BRAND CL-82 LF-C/SKD-EUROPE,UK MAIN TOTAL ASSEMBLY, L1550SN.KNRUEPT BRAND CL-82 LF-C/SKD-RUSSIA MAIN TOTAL ASSEMBLY, L1550SN.KNMXEPM BRAND CL-82 LF-C/SKD-PANAMA,MEXICO METAL ASSEMBLY, FRAME L1550 REAR FRAME ASSY METAL ASSEMBLY, FRAME L1550 REAR FRAME ASSY, A-C/SKD

6304FCP005A 6304FLP156A

3809TKL110A 3809TKL110B 3809TKL110F 3809TKL110G 3809TKL110J

3043TKK241A 3043TKK241B

3043TKK242A 3043TKK242B
6871TSTA51A 6871TSTA51C 6871TSTA51B 6871TSTA51D
4951TKS219B 4951TKS219A 4951TKS219C

080 090

6871TPT282E 3313TL5128A 3313TL5128F 3313TL5128C 3313TL5128G

4951TKS218A 4951TKS218B

- 20 -

REPLACEMENT PARTS LIST

CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS, READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL. * NOTE : S SAFETY Mark AL ALTERNATIVE PARTS

*S *AL LOC. NO.

PART NO.
DATE: 2005. 03. 16. DESCRIPTION / SPECIFICATION

MAIN BOARD CAPACITORS

C204 C205 C206 C207 C211 C213 C214 C215 C216 C217 C218 C219 C220 C221 C222 C223 C224 C225 C226 C230 C231 C232 C233 C240 C251 C503 C504 C506 C507 C508 C701 C707 C708 C709 C717 C718 C727 C732 C733 C734 C735 C744 C803 C803 C809 C812 C812 C814 C814 C817 C818 C819 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK103CK51A 0CK103CK51A 0CH8106F611 0CC030CK01A 0CC180CK41A 0CK103CK51A 0CK105CD56A 0CC680CK41A 0CK103CK51A 0CK103CK51A 0CC101CK41A 0CC101CK41A 0CK105CD56A 0CK103CK51A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CC680CK41A 0CE107EF610 0CE107EF628 0CK103CK51A 0CE107EF610 0CE107EF628 0CE107EF610 0CE107EF628 0CK105CD56A 0CC102CK41A 0CK105CD56A 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 10UF 16V M 85STD(CYL) R/TP 3PF 1608 50V 0.25 PF R/TP NP 18PF 1608 50V 5% R/TP NP0 0.01UF 1608 50V 10% R/TP B(Y 1UF 1608 10V 10% R/TP X7R 68PF 1608 50V 5% R/TP NP0 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 100PF 1608 50V 5% R/TP NP0 100PF 1608 50V 5% R/TP NP0 1UF 1608 10V 10% R/TP X7R 0.01UF 1608 50V 10% R/TP B(Y 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 68PF 1608 50V 5% R/TP NP0 "100UF KMG,RD 16V 20% FL BULK"-C/SKD-EUROPE "100UF KMG,RD 16V 20% FM2.5 T"-C/SKD-PANAMA 0.01UF 1608 50V 10% R/TP B(Y "100UF KMG,RD 16V 20% FL BULK"-C/SKD-EUROPE "100UF KMG,RD 16V 20% FM2.5 T"-C/SKD-PANAMA "100UF KMG,RD 16V 20% FL BULK"-C/SKD-EUROPE "100UF KMG,RD 16V 20% FM2.5 T"-C/SKD-PANAMA 1UF 1608 10V 10% R/TP X7R 1000PF 1608 50V 5% R/TP NP0 1UF 1608 10V 10% R/TP X7R

DIODEs

D701 D702 D706 ZD701 ZD702 ZD703 ZD704 ZD711 ZD712 0DSIH00018A 0DSIH00018A 0DSIH00018A 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB "ENKMC2837-T112,LF ISAHAYA R/" "ENKMC2837-T112,LF ISAHAYA R/" "ENKMC2837-T112,LF ISAHAYA R/" "BZT52C5V6S-(F),LF DIODES R/T" "BZT52C5V6S-(F),LF DIODES R/T" "BZT52C5V6S-(F),LF DIODES R/T" "BZT52C5V6S-(F),LF DIODES R/T" "BZT52C5V6S-(F),LF DIODES R/T" "BZT52C5V6S-(F),LF DIODES R/T"
U201 U501 U502 U801 U803 Q502 0IPRPM3017A 0IZZTSZ710A 0ICS240813B 0IPMGKE011A 0IPMGKE011A 0IKE704200H "TSU16AL-LF MSTAR 100P,QFP TR" L1550SN MST MICOM ASSY MTV31 "CAT24WC08J-TE13 8P,SOIC R/TP" KIA78D33F KEC DPAK R/TP 3.3V KIA78D33F KEC DPAK R/TP 3.3V KIA7042AP TO-92 TP 4.2 VOLT

TRANSISTOR

Q503 Q503 Q504 Q504 Q505 Q505 Q703 Q704 Q803 U802 0TRIH80001A 0TR390409AE 0TRIH80001A 0TR390409AE 0TRIH80001A 0TR390409AE 0TR390609FA 0TR390609FA 0TR127309AA 0TFVI80067A "RT1C3904-T112,LF ISAHAYA R/T"-C/SKD-EUROPE FAIRCHILD KST3904(LGEMTF) TP-C/SKD-RUSSIA "RT1C3904-T112,LF ISAHAYA R/T"-C/SKD-EUROPE FAIRCHILD KST3904(LGEMTF) TP-C/SKD-RUSSIA "RT1C3904-T112,LF ISAHAYA R/T"-C/SKD-EUROPE FAIRCHILD KST3904(LGEMTF) TP-C/SKD-RUSSIA KST3906-MTF TP SAMSUNG SOT2 KST3906-MTF TP SAMSUNG SOT2 KTA1273-Y(KTA966A) TP KEC TO SI3865BDV(E3) VISHAY R/TP TS

RESISTORs

R201 R202 R203 R207 R208 R209 R210 R216 R217 R220 R240 R501 R503 R506 R508 R520 R521 R522 R523 0RJ0682D677 0RJ0682D677 0RJ0682D677 0RJ3900D677 0RJ0682D677 0RJ0682D677 0RJ0682D677 0RJ0000D677 0RJ0000D677 0RJ4701D677 0RJ1001D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701DOHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 390 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 1K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP

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*S *AL LOC. NO. R530 R534 R535 R537 R543 R544 R545 R547 R548 R549 R555 R557 R560 R701 R702 R703 R704 R706 R708 R709 R712 R716 R717 R722 R723 R724 R726 R727 R735 R737 R744 R747 R749 R751 R752 R753 R754 R755 R770 R771 R778 R779 R781 R802 R808 R814 R815 R816 R823 R824 R825
PART NO. 0RJ1002D677 0RJ0000D677 0RJ3301D677 0RJ3301D677 0RJ4701D677 0RJ4701D677 0RJ4700D677 0RJ4700D677 0RJ0332D677 0RJ0332D677 0RJ1000D677 0RJ1000D677 0RJ4702D677 0RJ0752D677 0RJ2001D677 0RJ0752D677 0RJ2001D677 0RJ0752D677 0RJ4700D677 0RJ4700D677 0RJ0102D677 0RJ4701D677 0RJ4701D677 0RJ1000D677 0RJ0332D677 0RJ0332D677 0RJ1002D677 0RJ1002D677 0RJ0000D677 0RJ0000D677 0RJ4701D677 0RJ4701D677 0RJ0000D677 0RJ4700D677 0RJ1000D677 0RJ1000D677 0RJ1000D677 0RJ1000D677 0RJ0000D677 0RJ0000D677 0RJ0682D677 0RJ1002D677 0RJ0682D677 0RJ0000D677 0RJ0000D677 0RJ2202D677 0RJ5600D677 0RJ1002D677 0RX0470J609 0RJ0272D677 0RJ2000D677

DATE: 2005. 03. 16. DESCRIPTION / SPECIFICATION 10K OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 3.3K OHM 1/10 W 5% 1608 R/TP 3.3K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 33 OHM 1/10 W 5% 1608 R/TP 33 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 47000 OHM 1/10 W 5% 1608 R/T 75 OHM 1/10 W 5% 1608 R/TP 2K OHM 1/10 W 5% 1608 R/TP 75 OHM 1/10 W 5% 1608 R/TP 2K OHM 1/10 W 5% 1608 R/TP 75 OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 10 OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 33 OHM 1/10 W 5% 1608 R/TP 33 OHM 1/10 W 5% 1608 R/TP 10K OHM 1/10 W 5% 1608 R/TP 10K OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 10K OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 22K OHM 1/10 W 5% 1608 R/TP 560 OHM 1/10 W 5% 1608 R/TP 10K OHM 1/10 W 5% 1608 R/TP 0.47 OHM 1 W 5% TAOHM 1/10 W 5% 1608 R/TP 200 OHM 1/10 W 5% 1608 R/TP
*S *AL LOC. NO. R2 R3 R4 R5 SW1 SW2 SW3 SW4 SW5 ZD1 ZD2
PART NO. 0RJ4701D677 0RJ2001D677 0RJ2001D677 0RJ4701D677 6600TR1002A 6600TR1002A 6600TR1002A 6600TR1002A 6600TR1002A 0DZ560009GB 0DZ560009GB
DATE: 2005. 03. 16. DESCRIPTION / SPECIFICATION 4.7K OHM 1/10 W 5% 1608 R/TP 2K OHM 1/10 W 5% 1608 R/TP 2K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP SKQGACE010 J-ALPS NON 12V 50 SKQGACE010 J-ALPS NON 12V 50 SKQGACE010 J-ALPS NON 12V 50 SKQGACE010 J-ALPS NON 12V 50 SKQGACE010 J-ALPS NON 12V 50 "BZT52C5V6S-(F),LF DIODES R/T" "BZT52C5V6S-(F),LF DIODES R/T"

OTHERs

X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP

CONTROL BOARD

C1 C2 LED1 R1 0CK104CK56A 0CK104CK56A 0DLLT0208AA 0RJ4701D677 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R LITEON LTST-C155KGJSKT R/TP 4.7K OHM 1/10 W 5% 1608 R/TP

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SCHEMATIC DIAGRAM

1. TSU56AL / TSU16AL

1 U201-#96, R216, R778 H-Sync 3 R217, R781 V-Sync

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2. MICOM
2 U501-#43 H-SYNC 2 U501-#44 V-SYNC

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3.POWER

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4. CONNECTOR & JACKS

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P/NO : 3828TSL094N
Mar. 2005 Printed in Korea