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Comments to date: 2. Page 1 of 1. Average Rating:
Ron Gold 7:38am on Thursday, September 16th, 2010 
LG Electronics RZ 32LZ 50-55 Actually size W 930mm H 530mm D 120mm Features High Def W-XGA Native Resolution 1366x788 Very Bright 600CD/m2 Contrast ra...
Andy_DKW 4:57pm on Tuesday, April 20th, 2010 
This review is for the LG RZ 32 LZ50 LCD television. It has some good features and cheap price The pixels seem to disappear with a brush of a jumper Quality and Value Annoying back cover

Comments posted on www.ps2netdrivers.net are solely the views and opinions of the people posting them and do not necessarily reflect the views or opinions of us.

 

Documents

doc1

website:http://biz.LGservice.com e-mail:http://www.LGEservice.com/techsup.html

CHASSIS : ML-041A

CAUTION

htt p: //

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
MODEL : RM-23LZ50, RM-23LZ50C

LCD TV SERVICE MANUAL

CONTENTS
CONTENTS.... 2 PRODUCT SAFETY....3 SPECIFICATION...6

TIMING CHART....10

TROUBLE SHOOTING...16 BLOCK DIAGRAM...21
EXPLODED VIEW.... 24 EXPLODED VIEW PARTS LIST..25 REPLACEMENT PARTS LIST... 26

SVC. SHEET....

WIRING DIAGRAM....23
ADJUSTMENT INSTRUCTION...11

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Warning:

To determine the presence of high voltage, use an accurate high impedance HV meter. Adjust brightness, color, contrast controls to minimum. Measure the high voltage. The meter reading should indicate 23.5 1.5KV: 14-19 inch, 26 1.5KV: 19-21 inch, 29.0 1.5KV: 25-29 inch, 30.0 1.5KV: 32 inch If the meter indication is out of tolerance, immediate service and correction is required to prevent the possibility of premature component failure.
The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the LCD PANEL. For continued X-RAY RADIATION protection, the replacement panel must be the same type panel as specified in the Replacement Parts List.

X-RAY Radiation

To Instrument's exposed METALLIC PARTS
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet. Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

AC Volt-meter

0.15uF

1.5 Kohm/10W

Good Earth Ground such as WATER PIPE, CONDUIT etc.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 to 600 F F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 to 600 F F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 to 600 F F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink.

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

This specification is applied to ML-041A chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below condition. (1) Temperature: 25C 2C (2) Humidity: 65% 10% (3) Power: Standard input voltage (AC 100-240V, 50/60Hz) (4) Measurement must be performed after heat-run more than 30min. (5) Adjusting standard for this chassis is followed a special standard.
3.General Specification(TV)
No. 1 Item Video input applicable system Specification 1)PAL-D/K,B/G,I 2)NTSC-M 3)SECAM NTSC 4.Receivable broadcasting system 1)PAL/SECAM BG 2)PAL/SECAM DK 3)PAL I/I 4)SECAM L/L 5)NTSC M 7)NTSC M 6)PAL-N/M
VHF : E2 ~ E12 UHF : E21 ~ E69 CATV : S1 ~ S20 L/L : B,C,D VHF : 2 ~ 13 UHF : 14 ~ 69 CATV : 1 ~ 125 UHF : S23~62 584.4mm FS 2)Humidity : 85% 4)Humidity : 85% LCD Module
7)NTSC Area(RM) PAL FRANCE NTSC JAPAN 23 PAL, 200PR.(Option) NTSC LPL

RF input channel

HYPER : S21 ~ S41
Input voltage Picture size

Tuning system

Operting environment Storage environment Display
VHF Low : 1~M10 VHF High : 4~S22 AC 100 - 240V/ 50Hz,60HZ FVS 100 program 1)Temp : 0 ~ 40 deg 3)Temp : -20 ~ 60 deg

(PAL Market)

Remark EU/Non-EU(RZ/RT)
5.General Specification(Monitor)
No. 3 Panel Frequency range Control function Item Specification 23 TFT WXGA LCD H:31 ~ 61KHz, V: 56 ~ 75Hz 1) Contrast/ Brightness 2) H- Position/ V-Position 3) Tracking : Clock/Phase 4) Auto Configure 5) Reset 1: Y 5: Pr 7: Line1 Ready 9: LINE2 11: LINE3 13: Line3 Ready 2: Y GND D4 Jack (525i,525p,750p,1125i) 4: Pb GND 6: Pr GND 8: LINE1 10: Line2 Ready 12: SWITCH GND 14: SWITCH H/V-Sync 5 Power ON Stand by DPMS Mode Power off ON/ON OFF/ON ON/OFF DVI-I input Unit Remark
Video OFF OFF LPL Power consumption Max 170 3.x 332.6 x34.5 mm 0.1305 x 0.3915 x RGB mm 1280 horiz. By 768 vert. pixels RGB strip arrangement Hard coating(3H), Anti-glare treatment of the front polarizer LPL EEFL typ.30 W W W W Active LPL
Type Size Pixel Pitch Pixel Format Coating Back Light

LCD Module

Japan only LED Red dimmed Red Red dimmed *. (H) x (V) x (D)

/NTSC Only

Middle east

Component Jack

6.Optical Feature(LCD Module)
No. Item Specification LPL Viewing Angle <CR10> Luminance Contrast Ratio CIE Color Coordinates WHITE RED Green Blue WX WY Wr Yr Xg Yg Xb Yb Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Luminance(cd/) Variation 450 1.0.284 0.295 0.285 0.293 0.289 0.303 Typical MAX/MIN ALL white/All back LPL R/L, U/D 176,176 Remark

0C 37 3C 4D FF FF FF FF FF FF 00 1E 6D 0E 2B 78 EE E4B AB 8C 4F 61 4F 1F 00 BC AE 00 1C 0A 00 0A 4C 5A 0A 0A 0A 39 AA 0B 75 A1 CF 00 FD 20 0C 01 1B 0D 32 FC 0E 01 9C 4B 00 0F 1F 52 FC BB

2. Adjustment

2.1 Auto Gain/Offset adjustment
2.1.1 Adjustment preparation
1) Conduct Heat Run with the White Pattern for more than 30 minutes. 2) Connect the signals of Pattern Generator to DVI-I Jack of LCD TV.

[DDC DATA Digital]

0C 37 3C 4D 00
2.1.2 Auto Gain/Offset adjustment
1) Use the Pattern Generator (801GF, VG819) to authorize XGA (1024 X 768) for resolution and 16 gray scale signals for patterns. Or authorize 16 gray scale (11 gray scale) signals in accordance with VG819. 2) Press the IN-START Key to convert to the adjustment mode using the adjustment (SVC) remote controller, and press VOL+ Key at the AutoGain menu. 3) Once the adjustment is completed, press the Enter Key to save and finish the adjustment
2.2 EDID (The Extended Display Identification Data) setting
1) Connect D-Sub to DVI-I Cable with DVI-I Jack. 2) Select TV as an input source and press the [Instart] key on the remote control. 4) Select Analog for analog data, and Digital for digital data. 5) Connect the DDC automation equipment and write the DDC data.

- 11 -

2.3 HDCP (High-Bandwidth Digital Contents Protection) Set
2.3.1 HDCP DVI(Digital Visual Interface) is the link which transmits HD video of HD and STB when in sleep mode. This function prevents the hazard of hang display thus securing the security against the contents and copy protection. 2.3.2 To store in EEPROM(AT24C16) in HDCP function connect DVI cable.Detailed work content from work map reference.
Note. : HDCP will temporarily exclude in spec. HDCP will apply from USA Product later.
09 FF FF FF FF FF FF 00 1E 6D 0E 2B 96 EE E4B BF EE 40 3B CA CF 40 1F 00 BC AE 00 1C 0A 00 0A 4C 5A 0A 0A 20 20

0A 3A AA 20 20

0B 75 A00 FD 20 0C 61 1B 00 20

0D 32 FC 00 20

0E 01 9C 4B 00

0F C1F 52 FC 13

3. Shipping Conditions
10 Power Volume Level Main Pcture Input Main Last Channel Mute ARC Station Auto Program Manual Program

Off 30 TV Pr 01 Off 16:9

CONDITION

REMARK

Picture
PSM Dynamic Contrast Brightness Colour Sharpness Tint

Dynamic 0 Flat Off 0 TV

SSM AVL Balance

Special

Input Child Lock Auto sleep Language

H-Position V-Position Clock Phase

Auto Configure

- 12 -
Off English(Area Management) Variable by each mode

NTSC OPTION

Favorite Program

Program Edit

*Option(PAL)
Side AV SCART PC SideComp 16:9 200PR Text ACMS

CONDITION Option 1

0: Side AV Off 1: Side AV On 0: SCART Off 1: SCART On 0: PC Off 1: PC On 0: SideComp Off 1: SideComp On 0: Wide Off 1: Wide On 0: 100 Program 1: 200 Program 0: Text Off 1: Text On 0: ACMS On 1: ACMS Off

Language

CONDITION Option 3
0: Eng Only 1: EU5 2: 12 nations(Europe) 3: Eng + Chines 4: Eng + Arab + Urdu 5: Eng + FARSI

el. wj

Inch opt DDCi 0 Analog

Option 2

HiDev Hotel Top I II SAVE Turbo Vol Ch/Aus 0: HiDev Off 1: HiDev On 0: Hotel Off 1: Hotel On 0: Top Off 1: Top On

- 13 -

1: Ch. Sound Memory 0: except below area(Off) 0: except below area(Off) 1: China, Australia On 1: Middle-east Area Vol On

0: Ch. Sound Non Memory

reserved
2: TURKY EU 16: FARI ALL Digital: Digital

Txt Lang

0: WEST EU
1: EAST EU 1 3: EAST EU 2 4: CYRILLIC 1 5: CYRILLIC 2 6: CYRILLIC 3 7: TURKY GRE 1
8: TURKY GRE 2 9: TURKY GRE 3 10: ARAB FRAN 11: ARAB ENG 12: ARAB HEB 1 13: ARAB HEB 2 14: FARSI ENG 15: FARSI FRA

Analog: Analog

EDID ADJUSTMENT
Windows EDID V1.0 User Manual Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Dont need setup Windows 2000, XP => Need to Port Setup. This program is available to LCD Monitor only. 1. Port Setup a) Copy UserPort.sys file to c:\WINNT\system32\drivers folder b) Run Userport.exe 2. EDID Read & Write 1) Run WinEDID.exe
e) Click Start button. f) Click Exit button.

Video Signal Generator

IBM Compatible PC
c) Remove all default number d) Add 300-3FF
2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click Update button c) Click Write button

PARALLEL PORT

5V OFF ON
5V ON 5V 4.7K 4.7K 4.7K 74LS06 74LS06

Control Line

Power inlet (required)
Power Select Switch (110V/220V) Power LED

PO WE R

E ST Switch
F V-Sync On/Off Switch (Switch must be ON.)
Figure 1. Cable Connection

- 14 -

SVC REMOCON

FUNTION

REAMARK

Shortcut keys

To turn the TV on or off To turn the TV on automatically if the power is supplied to the TV. (Use the POWER ON POWER key to deactivate): It should be deactivated when delivered. To activate the mute function. MUTE To check TV screen image easily. P-CHECK To check TV screen sound easily S-CHECK To select size of the main screen (Normal, Spectacle, Wide or Zoom) ARC Switch to closed caption broadcasting CAPTION To toggle on/off the teletext mode TXT To select an external input for the TV screen TV/AV To start turbo sound TURBO SOUND TURBO PICTURE To start turbo picture To enter adjustment mode when manufacturing the TV sets. To adjust the screen voltage (automatic): In-start mute Adjust AV(Enter into W/B adjustment mode) IN-START W/B adjustment (automatic): After adjusting the screen W/B adjustment Exit two times (Adjustment completed) To enter into the adjustment mode. To adjust horizontal line and sub-brightness. ADJ To select the multiple sound mode (Mono, Stereo or Foreign language) MPX To release the adjustment mode EXIT To easily adjust the screen according to surrounding brightness APC(PSM) To easily adjust sound according to the program type ASC(SSM) To check component input MULTIMIDIA To check the front AV FRONT-AV To move channel up/down or to select a function displayed on the screen. CH To adjust the volume or accurately control a specific function. VOL To set a specific function or complete setting. ENTER To move the channel down in the PIP screen. PIP CH-(OP1) To use as a red key in the teletext mode To move the channel in the PIP screen PIP CH+(OP2) To use as a green key in the teletext mode To switch between the main and sub screens PIP SWAP(OP3) To use as a yellow key in the teletext mode To select the input status in the PIP screen PIP INPUT(OP4) To use as a blue key in the teletext mode To set a function that will automatically adjust screen status to match EYE the surrounding brightness so natural color can be displayed. To select the functions such as video, voice, function or channel. MENU To set the delivery condition status after manufacturing the TV set. IN-STOP To halt the main screen in the normal mode, or the sub screen at the PIP screen. STILL Used as a hold key in the teletext mode (Page updating is stopped.) Displays the teletext time in the normal mode TIME Enables to select the sub code in the teletext mode Used as the size key in the PIP screen in the normal mode SIZE Used as the size key in the teletext mode Used as the index key in the teletext mode (Top index will be MULTI PIP displayed if it is the top text.) To select the position of the PIP screen in the normal mode Used as the update key in the teletext mode (Text will be POSITION displayed if the current page is updated.) Used as Mode in the teletext mode MODE To select the simultaneous screen PIP To adjust screen tilt TILT To manually select the channel. 0~9

Shortcut keys Shortcut keys Shortcut keys

- 15 -

Shortcut keys Shortcut keys
Use the AV key to enter the screen W/B adjustment mode.

TROUBLESHOOTING

No power (LED indicator off)

:[A]Process

Fail Fail
Check Output of IC1300, IC4 or IC8

Change LED Assy

Pass Change IC1300,IC4 or IC8 Pass Check P101 Connector
Check Output of L3, L1300

Check LED Assy

- 16 -
Change L3, L1300 Change L808,L809 (F801,F802)
Check 24V or 12V of Power B/D
Check short of main B/D or Change Power B/D

No Raster

:[B]Process
Check LED Status on display unit

Repeat A PROCESS Fail

Check L900,L901 L902,L903
Change L900,L901, L902,L903
Check the input/ Output of IC901

Fail Faill Fail

Change inverter connector or inverter Change panel link cable or module Change module\
Check inverter Connector or inverter
Check input source cable and jack
Check panel link Cable or module Pass

- 17 -

Change IC901
No Raster on Component signal
Check the signal of Q310,Q315,Q316

Fail Fail Faill

Check the input/ output of IC1

- 18 -

Check the input/output of IC500, IC600
Pass Check the input/ output of IC901 Pass Check input source cable and jack
Re-soldering or Change the defect part Re-soldering or Change the defect part Re-soldering or Change the defect part

Change Q310,Q315,Q316

Repeat [A] Process
No Raster on AV Signa (Video1,Video2, S-Video)
No Raster on TV(RF) signal
Check the signal of C316,C317,Q308,Q313
Change C316,C317, Q308,Q313
Check the input/output of IC1
Check the input/output of IC500, IC600 Fail Pass Check the input/output of IC901 Fail Pass Check input source cable and jack

- 19 -

Check the output of TU1000
Check 5V, 33V of TU1000 Re-soldering or Change the defect part

No Sound

Check the input source

Change source input

Check the input/output of IC1 Pass
Check the input/output of IC100,IC101

Check the speaker wire

Check the speaker

- 20 -

Re-soldering or Change the defect part Change speaker
Re-soldering or Change the defect part
DVI DVI 8 M52758 S/W R,G,B 3 PC_R,G,B 3

PC_R,G,B

HD_Y,Pb,Pr (NT) HD_Y,Pb,Pr 3 R,G,B 3 R R,G,B G B 8 3

NTSC _ IF R,G,B SM5301

SIDE_COMP 3
MST9883 ADC FLI2300 GM5221 SCALER

LVDS or TTL OUT

BLOCK DIAGRAM

- 21 -

SIDE_Y,C

CVBS_IN

VCT49xyI VCTI

HD_COMP _ L,R

SIDE_ LR

MPS7720 AMP

w. wj el.

CVBS_L,R

LA7222C

PC_ LR

BLOCK DIAGRAM DESCRIPTION
1. Video controller unit and display data conversion unit The video controller unit receives the video signal inputted to the tuner, AV port (AV1, AV2, S-Video and component) and converts it to the analog RGB signal through the microcomputer (VCTI) combined with the video decoder that integrates various functions in one chip. Then, it is inputted to the AD converter (AD9883) and generates the 4:4:4 format digital signal. This digital signal is inputted to the picture enhancer (FLI2300), which processes the video signal and converts the image quality enhanced data to an analog RGB signal again before displaying it. The image quality enhanced de-interlace signal is inputted to the scaler (GM5221) and converted to the LVDS signal by the integrated LVDS IC before being sent to the LCD module. VCTI is the main microcomputer that processes both video signals and sound signals. It also processes the RF signal received from the tuner. The scaler enables to adjust timing on the LCD panel, as well as an adjustment of the size and position of the input signal. The graphic controller unit receives the PC (analog RGB) input and the DVI-D (digital signal), and sends the PC input to the scaler analog port and DVI-D input to the digital port. The scaler receives two inputs and converts them to the LVDS signal before sending to the module. 2. Power unit The power unit supplies 33V, 24V and 12V DC power to the main board. 33V DC power is used for the tuner, whereas 24V DC power is directly used by the inverter and the sound amplifier IC. 24V DC power is also used to generate 5V through the regulator. 12V DC power is used for the LCD panel. 5V DC is converted to 3.3V and 1.8V through the regulator, which supplies the necessary power to various ICs, such as VCTI, scaler, FLI2300 and AD9883.

- 22 -

WIRING DIAGRAM

Wiring Part List

P105 P202 SPK 10

3 P750

Part No. 6631T11020G 6631T20033F 6631T20032J 6631T25019K 6631T20023A 6631T20033T 6631T20033V 6631T20029Z 6631T20029Y 6631T20033E

REPLACEMENT PARTS LIST

For Capacitor & Resistors, the charactors at 2nd and 3rd digit in the P/No. means as follows; CC, CX, CK, CN, CH : Ceramic CQ : Polyestor CE : Electrolytic CF : Fixed Film RD : Carbon Film RS : Metal Oxide Film RN : Metal Film RH : CHIP, Metal Glazed(Chip) RR : Drawing

*S *AL LOC. NO.

PART NO.
DATE: 2004. 06.18. DESCRIPTION / SPECIFICATION#
*S *AL LOC. NO. C130 C1001 C1002 C1003 C1004 C1007 C1010 C107 C109 C11 C110 C113 C114 C12 C127 C128 C1300 C1302 C1305 C1307 C135 C136 C15 C16 C18 C19 C23 C3 C306 C318 C4 C42 C44 C45 C49 C500 C505 C506 C507 C508 C509 C51 C510 C511 C512 C513 C514 C517 C518 C519 C521 C522 C523 C526
PART NO. 181-007F 0CH3103K516 0CH3103K516 0CH3103K516 0CH3103K516 0CH3103K516 0CK273DK51A 0CK225DFK4A 0CH3103K516 0CH3104K566 0CH3103K516 0CK225DFK4A 0CK225DFK4A 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3103K516 0CH3104K566 0CH3103K516 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CK106EF56A 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566 0CH3104K566
DATE: 2004. 06.18. DESCRIPTION / SPECIFICATION "MPE ECQ-V1H224JL3(TR), 50V 0" 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 10000PF 50V 10% B(Y5P) 2012 27000PF 2012 50V 10% B(Y5P) "2.2UF 2012 16V 20%,-20% F(Y5" 10000PF 50V 10% B(Y5P) 2012 0.1UF 50V 10% X7R 2012 R/TP 10000PF 50V 10% B(Y5P) 2012 "2.2UF 2012 16V 20%,-20% F(Y5" "2.2UF 2012 16V 20%,-20% F(Y5" 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 10000PF 50V 10% B(Y5P) 2012 0.1UF 50V 10% X7R 2012 R/TP 10000PF 50V 10% B(Y5P) 2012 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 10UF 3216 16V 10% X7R R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP 0.1UF 50V 10% X7R 2012 R/TP

- 33 -

*S *AL LOC. NO. R965 R966 R967 R968 R970 R972 R975 R98 R99
PART NO. 0RJ0222D677 0RJ0222D677 0RJ0222D677 0RJ0222D677 0RJ1001D677 0RJ1000D677 0RJ1000D677 0RJ1000D677 0RJ1000D677
DATE: 2004. 06.18. DESCRIPTION / SPECIFICATION 22 OHM 1/10 W 5% 1608 R/TP 22 OHM 1/10 W 5% 1608 R/TP 22 OHM 1/10 W 5% 1608 R/TP 22 OHM 1/10 W 5% 1608 R/TP 1K OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP
*S *AL LOC. NO. R2001 R2002 R2003 R2004 R2005 R2006 R2007 JA2000 JA2001 JA2002
PART NO. 0RD0752Q609 0RD0752Q609 0RD0752Q609 0RD0752Q609 0RD0752Q609 0RD4703Q609 0RD4703Q609 6612J00060A 380-336E 380-336F
DATE: 2004. 06.18. DESCRIPTION / SPECIFICATION 75 1/4W(3 5% TA1/4W(3 5% TA1/4W(3 5% TA1/4W(3 5% TA1/4W(3 5% TA52 470K 1/4W(3 5% TA52 470K 1/4W(3 5% TA52 PMJ016-07 PARK ELEC. RCA/DIN WA6013E PARKELEC RCA 1P WH G WA6013E PARKELEC RCA RED 1P

OTHERs

P700 JA100 JA205A JA205B SC1 SC2 Z1000 X11 X500 X900 IC900 TU1000 6612BBBHN6A 6612F00059C 380-336E 380-336F 6612VJH008D 6612J00066A 6200QL3002F 6202VDT002E 6202VDT002J 6202VDT002B 6620F00017A 6700VS0003C 440062-1 AMP DVI INTERACED R KJA-SHS360LB KSD SHIELD 3.6P WA6013E PARKELEC RCA 1P WH G WA6013E PARKELEC RCA RED 1P PJ6063D PARKELEC DVD IN 3P G PPJ6063-09 PARK ELEC. RCA 3P "X6966M EPCOS ST SIP5K, 6200Q" SX-1SMD SUNNY RADIAL 2025000 SX-1 SUNNY 13.500000MHZ +/SX-1 SUNNY SC14.3MHZ +/- 30 CCSD-32T-SM WOOYOUNG 32P PLC TAEW-G051P LG INOTEK MULTI V

KEY BOARD

L1700 R1700 R1701 R1702 R1703 R1704 R1705 R1706 SW1700 SW1701 SW1702 SW1703 SW1704 SW1705 SW1706 0LA0102K119 0RN8200F409 0RN6200F409 0RN5100F409 0RN4300F409 0RN3300F409 0RN2700F409 0RN2701F409 140-313A 140-313A 140-313A 140-313A 140-313A 140-313A 140-313A 10UH K 2.3*3.4 TP 820 1/6W 1% TA1/6W 1% TA1/6W 1 TAOHM 1/6 W 1.00% TA1/6W 1% TA1/6W 1% TA52 2.7K OHM 1/6 W 1.00% TA52 TACT 2LEAD 100G(TA) LG C&D N TACT 2LEAD 100G(TA) LG C&D N TACT 2LEAD 100G(TA) LG C&D N TACT 2LEAD 100G(TA) LG C&D N TACT 2LEAD 100G(TA) LG C&D N TACT 2LEAD 100G(TA) LG C&D N TACT 2LEAD 100G(TA) LG C&D N

LED & IR BOARD

C1500 L1500 C1600 L1600 R1600 R1601 R1602 R1603 TR1600 LD1600 SW1600 IR1500

VIDEO BOARD

C2006 C2007 0CN4710K519 0CN4710K519 470P 50V K B TA52 470P 50V K B TA52
0CN1040K949 0LA0102K119 0CH3104K566 0LC1032101A 0RH3301D622 0RH2200D622 0RH1000D622 0RH1201D622 0TR150400BA 0DLBE0118AA 140-313A 6726TV0001A
0.1M 50V Z F TA52 10UH K 2.3*3.4 TP 0.1UF 50V 10% X7R 2012 R/TP 10UH 10% 3216 R/TC FI-C32163.3K 1/10W 5 D.R/TP 220 1/10W 5 D.R/TP 100 1/10W 5 D.R/TP 1.2K 1/10W 5 D.R/TP CHIP 2SA1504S(ASY) BK KEC BRIGHT LED ELECTRONICS BL-BU TACT 2LEAD 100G(TA) LG C&D N TSOP4838SO1 VISHAY 38.0KHZ H

- 34 -

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Date: 2004. 05. 07 P/No.:3854TP3001A
P/NO : 3828TSL103U Sep., 2004 Printed in Korea

 

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