ORDER NO. KM40507819CE

Telephone Equipment
KX-TCD150FXB KX-TCD150FXC KX-TCD152FXB KX-TCA115EXB KX-TCA115EXC

Digital Cordless Phone

Black Version Dark Blue Version (for Central Europe)
2005 Panasonic Communications Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
KX-TCD150FXB / KX-TCD150FXC / KX-TCD152FXB / KX-TCA115EXB / KX-TCA115EXC
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can download and refer to the original Operating Instructions on TSN Server for further information.

CONTENTS

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 1.1. Suggested PbF Solder 1.2. How to recognize that Pb Free solder is used 2 FOR SERVICE TECHNICIANS 3 CAUTION 4 OPERATING INSTRUCTIONS 4.1. BATTERY 4.2. LOCATION OF CONTROLS 4.3. Connection 4.4. Guide to Settings 4.5. For Service Hint 5 DISASSEMBLY INSTRUCTIONS 5.1. Base Unit 5.2. Handset 5.3. Charger Unit 6 ASSEMBLY INSTRUCTIONS 6.1. Warning When Constructing the Base Unit 6.2. How to Replace the Handset LCD 7 TROUBLESHOOTING GUIDE 7.1. Check Power 7.2. Check Battery Charge 7.3. Check Link 7.4. Check Handset Transmission 7.5. Check Handset Reception 7.6. Check Caller ID 7.7. Bell Reception 8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND CHARGER UNIT) 8.1. Check Point (Base Unit) 8.2. The Setting Method of JIG (Base Unit) 8.3. Adjustment Standard (Base Unit) 8.4. Check Point (Charger Unit) 8.5. Adjustment Standard (Charger Unit) 9 TROUBLESHOOTING BY SYMPTOM (HANDSET) 9.1. Check Point (Handset) 9.2. The Setting Method of JIG (Handset) 22 9.3. Adjustment Standard (Handset) 10 THINGS TO DO AFTER REPLACING IC 10.1. Base Unit 10.2. Handset 11 RF SPECIFICATION 11.1. Base Unit 11.2. Handset 12 HOW TO CHECK THE HANDSET SPEAKER 13 FREQUENCY TABLE (MHz) 14 BLOCK DIAGRAM (BASE UNIT) 15 CIRCUIT OPERATION (BASE UNIT) 15.1. Outline 15.2. Power Supply Circuit 15.3. Telephone Line Interface 15.4. Transmitter/Receiver 15.5. Pulse Dialling 16 BLOCK DIAGRAM (HANDSET) 17 CIRCUIT OPERATION (HANDSET) 17.1. Outline 17.2. Power Supply Circuit/Reset Circuit 17.3. Charge Circuit 17.4. Battery Low/Power Down Detector 18 CIRCUIT OPERATION (CHARGER UNIT) 18.1. Power Supply Circuit 19 SIGNAL ROUTE 20 CPU DATA (BASE UNIT) 20.1. IC2 (BBIC) 21 CPU DATA (HANDSET) 21.1. IC1 (BBIC) 22 ENGINEERING MODE 22.1. Base Unit 22.2. Handset 23 HOW TO REPLACE THE FLAT PACKAGE IC 23.1. PREPARATION 23.2. FLAT PACKAGE IC REMOVAL PROCEDURE 23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
23.4. BRIDGE MODIFICATION PROCEDURE 24 CABINET AND ELECTRICAL PARTS (BASE UNIT) 25 CABINET AND ELECTRICAL PARTS (HANDSET) 26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT) 27 ACCESSORIES AND PACKING MATERIALS 27.1. KX-TCD150FXB/FXC 27.2. KX-TCD152FXB
30 FOR SCHEMATIC DIAGRAM 30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT)) 30.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT)) SCHEMATIC DIAGRAM (BASE UNIT) 32 SCHEMATIC DIAGRAM (HANDSET) 33 SCHEMATIC DIAGRAM (CHARGER UNIT) 34 CIRCUIT BOARD (BASE UNIT) 34.1. Component View 34.2. Flow Solder Side View 35 CIRCUIT BOARD (HANDSET) 35.1. Component View 35.2. Flow Solder Side View 36 CIRCUIT BOARD (CHARGER UNIT) 36.1. Component View 36.2. Flow Solder Side View 77 77
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES 61 28.1. Base Unit 28.2. Handset 28.3. Charger Unit 29 REPLACEMENT PARTS LIST 29.1. Base Unit 29.2. Handset 29.3. Charger Unit 29.4. Accessories and Packing Materials 29.5. Fixtures and Tools 65
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note: In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead. We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu). This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used. Caution PbF solder has a melting point that is 50F ~70F (30C ~ 40C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700F 20F (370C 10C). In case of using high temperature soldering iron, please be careful not to heat too long. PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100F (600C). If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible and be sure that any remaining is melted prior to applying the Pb solder. When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).

Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac turers specific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
How to recognize that Pb Free solder is used

Marked

(Example: Handset P.C.B.)

(Component View)

Note: The location of the PbF mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity. When repairing, the following precautions will help prevent recurring malfunctions. 1. Cover the plastic parts boxes with aluminum foil. 2. Ground the soldering irons. 3. Use a conductive mat on the worktable. 4. Do not touch IC or LSI pins with bare fingers.

3 CAUTION

1. Danger of explosion if battery is incorrectly replaced. 2. Replace only with the same or equivalent type recommended by the manufacturer. 3. Dispose of used batteries according to the manufactures Instructions.

4 OPERATING INSTRUCTIONS

4.1.1.
Note: Use only rechargeable P03P (HHR-4EPT) batteries.

BATTERY

Battery Installation
Insert the batteries negative ( ) terminal first. Close the handset cover.

4.1.2.

Battery Charge
Place the handset on the base unit for about 7 hours before initial use.

4.1.3.

Battery Life

4.2.1.

LOCATION OF CONTROLS

Base Unit

4.2.2.

Handset

Connection

4.4.1.

Guide to Settings
Cross Reference: For Service Hint (P.10)

4.4.2.

For Service Hint
5 DISASSEMBLY INSTRUCTIONS

5.1. Base Unit

Shown in Fig.1 2
To Remove Lower Cabinet Main P.C. Board Screws (2.6 12)..(A) 2 Solders Main P.C. Board

Remove

Shown in Fig.5
To Remove Cabinet Cover Main P.C. Board Screws (2 8)..(B) 2 Follow the procedure. Screw (2 8).(C ) 3 Tapes and Solders Main P.C. Board

Charger Unit

Shown in Fig.6 7
To Remove Lower Cabinet Main P.C. Board
Remove Screws (2.6 14)..(D) 2 Solders Main P.C. Board

6 ASSEMBLY INSTRUCTIONS

Items (O)* Transmit Audio Check and Adjustment

Adjustment Point ANT J1

Procedure 1. Configure the DECT tester (CMD60) as follows; <Setting> Test mode: FP Mode: Normal PMID: 00000 2. Execute the command testmode. 3. Initiate connection from DECT tester. 4. Execute the command hookoff. 5. Execute the command openau. 6. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600. 7. Set line voltage to 48V and line current to 40mA. 8. Input audio signal (30mVrms/1kHz tone) to DECT tester. <DECT tester setting> Scramble: On AF Gen. to ADPCM: On AF Meter Input: AF Voltm AF Gen. Frequency: 1000Hz AF Gen. Level: 30mVrms 9. Confirm hearing tone: 330mVrms 100mVrms. 10. Adjust audio level if required. (Make sure current value using getspkrgain. And then execute the command setspkrgain xx, where xx is the value.)
Check or Replace Parts IC2,R32,C22, R23,C80, C14,C13,R22, R21,Q6, R18,R19,R20, C12,D2, C1,C2,R77, R16,D3, R12,Q2,R7,R8 ,R9, R10,Q3,IC3, L1,C43, C78,C75,C69, C48,C72, C66,C67,C76, C57,C73, L3,DA1,R66, R67,C55, C56,R78,R79, C54,C58, C86,R38

(P) (Q)*

Charging Check Audio Check
11. Confirm that the audio distortion at 600R of Tel-simulator is < 5%. 1. Connect Charge Contact 12/2W resistor between charge+ and charge-. 2. Measure and confirm voltage across the resistor is 2.3V 0.2V. 1. Link with Handset. 2. Set line voltage to 48V and line current to 40mA. 3. Input -45dBm/1kHz to MIC of Handset. Measure the Level at Line I/F and distortion level. 4. Confirm that the level is -23 2dBm and that the distortion level is < 5% at TEL Line (600 Load). 5. Input -20dBm/1kHz to Line I/F. Measure the level at Receiver of Handset and distortion level (*Receive volume set to second position from minimum). 6. Confirm that the level is -9 2dBm and that the distortion level is < 5% at Receiver (Volume Middle, 150 Load).

D4,R43,R44

8.2.1. 8.2.1.1.
The Setting Method of JIG (Base Unit)
Preparation Equipment Required
DECT tester: Rohde & Schwarz, CMD 60 is recommended. Frequency counter: it must be precise to be able to measure 1Hz (precision; 4ppm). Hewlett Packard, 53131A is recommended. DC power: it must be able to output at least 1A current under 9V. Digital multi-meter (DMM): it must be able to measure voltage and current. Oscilloscope

1. Confirm that the voltage between TP18 and GND is 0V 0.4V.

BBIC Confirmation

1. BBIC Confirmation (Execute the command getchk). 2. Confirm the returned checksum value. Connection of checksum value and program number is shown below.
(D) Charge Control Check & Charge Current Monitor Confirmation
1. Apply 6V between TP20(+) and TP21(-) with current limit of PSU to 250mA. 2. Confirm that the charge current is ON/OFF. 3. SW to decrease current limit of PSU to 100mA.
(E)* Charge Detection (OFF) Confirmation
4. Confirm that the charge current is stable. 1. Stop supplying 6V to TP20(+) and TP21(-). 2. Execute the command charge. 3. Confirm that the returned value is 0x00 (hex).
IC1,D4,L4, L5,Q2,Q3, R6,D2,R22, C26,F1,R21, R4,C33 IC1,D4,L4, L5,Q2,Q3, R6,D2,R22, C26,F1,R21, R4,C33
Items (F)* Battery Monitor Confirmation & Adjustment (Important)
Procedure 1. Apply 2.3V 0.005V between TP3(+) and TP4(-) with DC power. 2. Execute the command deactmac to stabilize the value. 3. Then,execute the command readbatt.The returned value is XX. 4. Confirm that XX is between 98 and A8. 98 < XX < A8(Hex)
Check or Replace Parts IC1,D4,L4, L5,Q2,Q3, R6,D2,R22, C26,F1,R21, R4,C33
(G) Battery low Confirmation (Important)
(If XX is out of range,change BBIC) 1. Apply 2.40V between TP3(+) and TP4(-). 2. Confirm that there is no Speaker sound (Battery low alarm). 3. Apply 2.20V between TP3(+) and TP4(-).
(H)* BBIC Clock Adjustment (Important)
4. Confirm that there is Speaker sound (Battery low alarm). 1. Apply 2.6V between TP 3(+) and TP 4(-) with DC power. 2. Execute the command deactmac. 3. Execute the command conttx. 4. Input Command rdeeprom 01",then you can confirm the current value. 5. Adjust the frequency of TP19 executing the command setfreq 00 xx (where xx is the value).
IC1,F1,R21, R4,C33, C12,C31,R17, R20,C10, C11,D6,D7 IC1,L3,C57, IC3,X1,C16, C17
so that the reading of the frequency counter is 10.368000MHz 10Hz. Remove the Antenna before starting steps from 1 to 5. Replace C58 with RESISTOR (0). Be sure to mount C58 back to the same place after checking. 1. Configure the DECT tester(CMD60) as follows; <Setting> Test mode: PP RFPI: 0102030405 Traffic Channel: 5 Traffic Slot: 4 Mode: Loopback 2. Execute the command testmode. 3. Execute the command regcmd60 4. Initiate connection from DECT tester.
IC1,IC3,C54, C66,C60, L3,C57,C55, C56,C62, R23,R24,C63, C64,C65, R18
5. Confirm that the NTP value at A201 (TP15) is 20dBm ~ 25dBm Follow steps 1 to 4 of (I) above. 5. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data type Fig31.
Sensitivity Receiver Confirmation
IC1,IC3,C54, C66,C60, L3,C57,C55, C56,C62, 6. Adjust the B-Field Modulation if required. (Execute the command Readmod R23,R24,C63, and Writemod xx, where xx is the value.) C64,C65, R18 Follow steps 1 to 4 of (I) above. IC1,IC3,C54, 5. Confirm that the frequency offset is -50kHz ~ +50kHz. C66,C60, L3,C57,C55, C56,C62, R23,R24,C63, C64,C65, R18 Follow steps 1 to 4 of (I) above. IC1,IC3,C54, 5. Set DECT tester power to -88dBm. C66,C60, L3,C57,C55, 6. Confirm that the BER is < 1000ppm. C56,C62, R23,R24,C63, C64,C65, R18 Follow steps 1 to 4 of (I) above. IC1,IC3,C54, 5. Confirm that the Timing accuracy is < 2.0ppm. C66,C60, L3,C57,C55, C56,C62, R23,R24,C63, C64,C65, R18 Follow steps 1 to 4 of (I) above. IC1,IC3,C54, 5. Set DECT tester power to -88dBm. C66,C60, L3,C57,C55, 6. Execute the command readrssi C56,C62, R23,R24,C63, 7. Confirm: 25 < returned value < 43 (hex) (0x34 F (hex)) C64,C65, R18

Items (O)* Receive Audio Check and Confirmation

Adjustment Point TP15

Procedure 1. Configure the DECT tester (CMD60) as follows; <Setting> Test mode: PP Mode: Normal RFPI: 0102030405 2. Execute the command testmode. 3. Execute the command regcmd60 4. Initiate connection from DECT tester. 5. Execute the command openaudio. 6. Confirm that the value of EEPROM address F3F is 02. (If the value is not 02 (by User), set 02 and power off and power on, and return to clause 2.) 7. Input audio signal (50mVrms/1kHz tone) from DECT tester. <DECT tester setting> Scramble: On AF Gen. to ADPCM: On AF Meter Input: AF Voltm AF Gen. Frequency: 1000Hz AF Gen. Level: 50mVrms 8. Confirm hearing tone: 300mVrms 250mVrms (Just check Audio path)
Check or Replace Parts IC1,C67,C68, R17,R20, D7,D6,IC3, C54,C66, C60,L3,C57, C55,C56, C62,R23,R24, C63,C64, C65,R18
Transmit Audio Check and Confirmation
9. Confirm that the audio distortion with DECT tester is < 5%. 1. Configure the DECT tester (CMD60) as follows; <Setting> Test mode: FP Mode: Normal RFPI: 0102030405 2. Execute the command testmode. 3. Execute the command regcmd60. 4. Initiate connection from DECT tester. 5. Execute the command openaudio. 6. Confirm that the value of EEPROM address F3F is 02. (If the value is not 02 (by User), set 02 and power off and power on, and return to clause 2.) 7. Input audio signal (30mVrms/1kHz tone) to DECT tester. <DECT tester setting> Scramble: On AF Gen. to ADPCM: Off AF Meter Input: ADPCM AF Gen. Frequency: 1000Hz AF Gen. Level: 30mVrms 8. Confirm hearing tone: 300mVrms 250mVrms (Just check Audio path)
IC1,C8,R7, R8,C6, C7,C5,R5, R1,C4, IC3,C54,C66, C60,L3, C57,C55,C56, C62,R23, R24,C63,C64, C65,R18
Audio Check and Confirmation
9. Confirm that the audio distortion with DECT tester is < 5%. 1. Link to BASE which is connected to Line Simulator. 2. Set line voltage to 48V and line current to 40mA. 3. Input -45dBm/1KHz to MIC and measure Line output level. 4. Confirm that the level is -23 2dBm and that the distortion level is < 5% at TEL Line (600 Load). 5. Input -20dBm/1KHz to Line I/F and measure Receiving level at SP+ and SP-. 6. Confirm that the level is -9 2dBm and that the distortion level is < 5% at Receiver. (vol = middle, 150 Load)

9.2.1. 9.2.1.1.

The Setting Method of JIG (Handset)
DECT tester: Rohde & Schwarz, CMD 60 is recommended. Frequency counter: it must be precise to be able to measure 1Hz (precision; 4ppm). Hewlett Packard, 53131A is recommended. DC power: it must be able to output at least 1A current under 2.4V for Handset, 9V for JIG. Digital multi-meter (DMM): it must be able to measure voltage and current. Oscilloscope

9.2.1.2.

EEPROM serial JIGs 1. I2C PCB: PQZZTCD420BX 2. RS232C cable: PQZZ1CD705BX 3. Clip cable: PQZZ2CD705BX 4. DC cable: PQZZ3CD705BX PC which runs in DOS mode. Batch file CD-ROM for setting: PQZZTCD150FX

9.2.2. 9.2.2.1.

9.2.2.2.
Command name rdeeprom readid writeid setfreq Getchk Wreeprom Function Read the data of EEPROM Read ID (RFPI) Write ID (RFPI) adjust Frequency of RFIC Read checksum write eeprom Example Type rdeeprom FF, and the data from address to FF is read out. Type readid, and the registered ID is read out. Type writeid E0 0E 98, and the ID 0018 E0 0E 98 is written. Type setfreq nn nn. Type getchk. Type wreeprom 45". 01 23" is address and 45 is data to be written.
Adjustment Standard (Handset)
Power Key TP17 Oscilloscope TP16

(F) (G)

AF VOLT METER BATTERY TP3 2.7V/2W (A) Digital Volt Meter GND TP14
X1 R18 TP16 TP12 C20 TP30

DC POWER 2.30 - 2.60V

(I) (J) (K) (L) (M) (N) (O) (P) DECT tester A (201) TP15 CMD60 ANT GND

BATTERY-

R19 D5 C25 C23 C24 TP3 Q3 TP14 TP17 TP13 R100 TP19 Q1 D3 R2

TP20 CHARGE

L4 C18 C62 RF1 R6

Dummy Base Unit

for KX-TCD150R KX-TCA115

L7 C66

C54 C59 LC58

AF Genelator

R27 C21 D1 C51 C27

D6 R20 C68 C5

C7 R5 R7 R1 C4

L3 R24

C16 C26 C28 C29 C17 R22 C6 R8

6.3V47 F

TP2 SP

D7 C30 C8

R21 TP18

R11 R16 C22

GND 8 TPTP22

C69 L6 TP1 SP

17 C71 C61 C70 C56 R26 R25 C63

26 C64 A

C67 R17

(D) (E)

DC 6V SDL SDA GND GND (*1) Digital (B) Volt Meter TP18 I2C PCB (JIG) PC (C) (E) (F) (H) (I) (O) (P)

PQUP11176W

CHARGETP21
TP19 SPSP+ 150 AF Volt Meter Oscilloscope GND Frequency (H) Counter

Current Probe

(D) Oscilloscope
(A) - (P) is referred to Check Point (Handset) (P.31)
(*1) Refer to Connections (P.34)
10 THINGS TO DO AFTER REPLACING IC
Cautions: Since this page is common to each country, it may not apply to some models in your country. The contents below are the minimum adjustments required for operation.

10.1. Base Unit

IC Programs for Voice processing, interface for RF and EEPROM EEPROM Adjustment parameter data (country version batch file, default batch file, etc.) BBIC Necessary Adjustment 1. Clock adjustment: Refer to Check Point (E). (*1) 1. Default batch file: Execute the command Default4KB. 2. Country version batch file: Execute the command 150XXvYY. (*2) 3. Clock adjustment: Refer to Check Point (E). (*1)

Note: (*1) Refer to Check Point (Base Unit) (P.23) (*2) XX: country code, YY: revision number XX and YY vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIGs and PC (P.27).

10.2. Handset

BBIC IC Programs for Voice processing, interface for RF and EEPROM Necessary Adjustment 1. Clock adjustment: Refer to Check Point (H). (*3) 2. 4.0 V setting and battery low detection: Refer to Check Point (A), (F) and (G). (*3) 1. Default batch file: Execute the command Default. 2. Default batch file (remaining); Execute the command 115ADJvYY. (*4) 3. Melody Initialize batch file; Execute the Command InitMelodies143vYY 4. Country version batch file: Execute the command 115XXvYY. (*4) 5. Clock adjustment: Refer to Check Point (H). (*3) 6. 4.0 V setting and battery low detection: Refer to Check Point (A), (F) and (G). (*3)
EEPROM Adjustment parameter data (country version batch file, default batch file, etc.)
Note: (*3) Refer to Check Point (Handset) (P.31) (*4) XX: country code, YY: revision number XX and YY vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIGs and PC (P.34).

11 RF SPECIFICATION

11.1. Base Unit
Item TX Power Modulation Frequency Offset RX Sensitivity Timing Accuracy RSSI Level Value More than 20 dBm ~ 25 dBm 340 kHz/div ~ 402 kHz/div -50 kHz ~ +50 kHz < 1000 ppm < 2.0 ppm 0x34 hex F hex Refer to -. * Check Point (Base Unit) (H) Check Point (Base Unit) (I) Check Point (Base Unit) (J) Check Point (Base Unit) (K) Check Point (Base Unit) (L) Check Point (Base Unit) (M)
*: Refer to Check Point (Base Unit) (P.23)

11.2. Handset

Item TX Power Modulation Frequency Offset RX Sensitivity Timing Accuracy RSSI Level Value More than 20 dBm ~ 25 dBm 340 kHz/div ~ 402 kHz/div -50 kHz ~ +50 kHz < 1000 ppm < 2.0 ppm 0x34 hex F hex Refer to -. ** Check Point (Handset) (I) Check Point (Handset) (J) Check Point (Handset) (K) Check Point (Handset) (L) Check Point (Handset) (M) Check Point (Handset) (N)
**: Refer to Check Point (Handset) (P.31)

12 HOW TO CHECK THE HANDSET SPEAKER
1. Prepare the digital voltmeter, and set the selector knob to ohm meter. 2. Put the probes at the speaker terminals as shown below.

13 FREQUENCY TABLE (MHz)

Channel No BASE UNIT Transmit Frequency Receive Frequency 1897.344 1897.344 1895.616 1895.616 1893.888 1893.888 1892.160 1892.160 1890.432 1890.432 1888.704 1888.704 1886.976 1886.976 1885.248 1885.248 1883.520 1883.520 1881.792 1881.792 HANDSET Transmit Frequency Receive Frequency 1897.344 1897.344 1895.616 1895.616 1893.888 1893.888 1892.160 1892.160 1890.432 1890.432 1888.704 1888.704 1886.976 1886.976 1885.248 1885.248 1883.520 1883.520 1881.792 1881.792
Note: Channel No. 10: In the Test Mode on Base Unit and Handset.
14 BLOCK DIAGRAM (BASE UNIT)

J1 ANT1 ANT2

to Tel_Line A B
Hook Switch Audio D/A Speech Decoding ADPCM Codec Filter DSP HOOK 27 DTXAF DTXAF BMC RF Interface RSSI SYRI Burst Decoding Analog Front End RINGER TXAF 28 RXAF 24 A/D Speech Encoding Burst Building TXDA RXDA 12

Bridge Rect

SYEN 10 RF Module

BBIC Interface

CPU EEPROM

Limit Resistor

CHARGE CONTACT

XTAL 10.368 MHz

VUNREG

to AC Adaptor

SCL SDA 41 40

4.0V Reg.

2.65V Reg.
KX-TCD150/152 BLOCK DIAGRAM (BASE UNIT)
15 CIRCUIT OPERATION (BASE UNIT)

15.1. Outline

Base Unit consists of the following ICs as shown in BLOCK DIAGRAM (BASE UNIT) (P.39). DECT BBIC (Base Band IC): IC2 Handling all the audio, signal and data processing needed in a DECT base unit Controlling the DECT specific physical layer and radio section (Burst Module Controller section) ADPCM codec filter for speech encoding and speech decoding (DSP section) Echo-cancellation and Echo-suppression (DSP section) Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section) DTMF receiver (DSP section) Clock Generation for RF Module ADC, DAC, timer, and power control circuitry All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.) RF Module: IC3 PLL Oscillator Detector Compress/Expander First/Second Mixer Amplifier for transmission and reception EEPROM: IC1 Temporary operating parameters (for RF, etc.) Additionally, Power Supply Circuit (+4.0V, +2.65V output) Crystal Circuit (10.368MHz) Charge Circuit Telephone Line Interface Circuit

15.2. Power Supply Circuit
The power is supplied to the DECT BBIC, RF Module, EEPROM, Relay Coil, LED and Charge Contact from AC Adaptor (+6V) as shown in Fig.101. The power supply is as follows:

<Fig.101>

15.3. Telephone Line Interface
<Function> Bell signal detection Clip signal detection ON/OFF hook circuit Audio circuits Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection: In the standby mode, Q2 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the TP3 (A) and TP40 (B) leads (when the telephone rings), the signal is transferred as follows; A C4 R2 R29 IC2 (DLP) [BELL & CLIP] B C3 R1 R30 IC2 (DLP) [BELL & CLIP] ON/OFF hook circuit: In the standby mode, Q2 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an off-hook condition. When IC2 detects a ring signal or press the TALK Key onto the handset, Q3 turns on and then Q2 turns on, thus providing an off-hook condition (active DC current flow through the circuit) and the following signal flow is for the loop current. A D2 Q2 R8 Q6 R19 R20 D2 B [OFF HOOK] Audio circuits: Refer to SIGNAL ROUTE (P.46).
15.4. Transmitter/Receiver
Base Unit and Handset mainly consist of RF Module and DECT BBIC. Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency. Signal Path: *Refer to SIGNAL ROUTE (P.46).
15.4.1. Transmitter Block
The voice signal input from the TEL LINE interface goes to RF Module (IC3) through DECT BBIC (IC2) as shown in BLOCK DIAGRAM (BASE UNIT) (P.39) The voice signal passes through the analog part of IC2 where it is amplified and converted to a digital audio stream signal. The burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc. In IC3, the carrier frequency is changing, and frequency modulated RF signal is generated and amplified, and radiated from antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of Receiver Block.

15.4.2. Receiver Block

The signal of 1.9 GHz band (1.881792 GHz ~ 1.897344 GHz) which is input from antenna is input to IC3 as shown in BLOCK DIAGRAM (BASE UNIT) (P.39). In IC3, the signal of 1.9 GHz band is demodulated, and goes to IC2 as GAP (Generic Access Profile) standard DECT frames. It passes through the decoding section burst switch controller where it separates out the frame information and performs deencryption and de-scrambling as required. It then goes to the DSP section where it is turned back into analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.

15.5. Pulse Dialling

During pulse dialing the hookswitch (Q4,Q5) is used to generate the pulses using the HOOK control signal, which is set high during pulses. To force the line impedance low during the pause intervals between dial pulses, the PULSE_DIAL signal turns on Q12.
16 BLOCK DIAGRAM (HANDSET)

42 EARPIECE 45 D/A

Speech Decoding Speech Encoding
Burst Decoding Burst Encoding

12 RXDA 16 TXDA

RF Module 10
48 RSSI Analog Front End TP5 + CHARGE CONTACTS TPEEPROM SCL 67 SDA 66 VDDBAT 36 SWITCHED SUPPLY SWITCH 28 CPU 4.0V D3 VDDLR 34 53~55, 59, 60 ROWS 17~21 CHARGE CIRCUIT CHARGE 38 CHARGE DETECT ADPCM Codec Filter DSP RF Interface 23 SYRI 13 SYEN

BMC 33 XTAL 10.368 MHz

ON SWITCH

TP3 BATTERY TERMINAL TP4

KEYPAD COLUMNS
LCD 14 Seg Display pin 2, 5~9 COM 0~5 segment 0~29
pin1, 90~100, 87, 78~84, 72~76, 61, 62, 56~58
KX-TCA115 BLOCK DIAGRAM (HANDSET)
17 CIRCUIT OPERATION (HANDSET)

17.1. Outline

Handset consists of the following ICs as shown in BLOCK DIAGRAM (HANDSET) (P.43). DECT BBIC (Base Band IC): IC1 All data signals (forming/analyzing ACK or CMD signal) All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD) RF Module: IC3 PLL Oscillator Detector Compress/Expander Amplifier for transmission and reception EEPROM: IC2 Temporary operating parameters (for RF, etc.)
17.2. Power Supply Circuit/Reset Circuit
Circuit Operation: When power on the Handset, the voltage is as follows; BATTERY(2.2 V ~ 2.6V: TP3) TP14(4V) IC3(6, 25), D3 IC1(37) IC1(39, 63) (2.65V) The Reset signal generates R19, C23 and 2.65V.

17.3. Charge Circuit

Circuit Operation: When charging the handset on the Base Unit, the charge current is as follows; DC+(5.5V ~ 6V) D4 R43, R44 CHARGE+(Base) CHARGE+(Handset) L4 Q2 F1 BATTERY+. Battery. BATTERY- R21 GND L5 CHARGE-(Handset) CHARGE-(Base) GND DC-(GND) In this way, the BBIC on Handset detects the fact that the battery is charged. The charge current is controlled by switching Q2 of Handset. Refer to Fig.101 in Power Supply Circuit (P.41).
17.4. Battery Low/Power Down Detector
Circuit Operation: Battery Low and Power Down are detected by BBIC which check the voltage from battery. The detected voltage is as follows; Battery Low Battery voltage: V(Batt) < 2.3V The BBIC detects this level and " Power Down Battery voltage: V(Batt) < 2.2V The BBIC detects this level and power down. " starts flashing and battery alarm starts ringing.

Item Sending level Default Data 1C -9.0dBm New Data 1D 1B -8.0dBm -10.0dBm
(*2) When reducing 01 (hex) from default value, receiving level increases by 1.0dB. ex.)
Item Receiving level Default Data 5B -23.0dBm New Data 5A 5C -24.0dBm -22.0dBm
(*3) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the Handset. (*4)
Items Sending level Receiving level Battery Low Frequency ID Description Analog Front End MIC Setting for Handset Mode Analog Front End LSR Setting for Handset Mode ADC value for battery low detection Setting value of FREQ_TRIM_REG International Portable Part Equipment Identities
23 HOW TO REPLACE THE FLAT PACKAGE IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

23.1. PREPARATION

PbF (: Pb free) Solder Soldering Iron Tip Temperature of 700F 20F (370C 10C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. Flux Recommended Flux: Specific Gravity 0.82. Type RMA (lower residue, non-cleaning type) Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) (P.4).
23.2. FLAT PACKAGE IC REMOVAL PROCEDURE
1. Put plenty of solder on the IC pins so that the pins can be completely covered. Note: If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the land with some tools like a soldering wire. If some solder is left at the joint on the board, the new IC will not be attached properly.
23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil. 2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.
23.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly resolder the bridged portion. 2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
24 CABINET AND ELECTRICAL PARTS (BASE UNIT)
25 CABINET AND ELECTRICAL PARTS (HANDSET)
Note: (*1) The rechargeable Ni-MH battery P03P (HHR-4EPT) is available through sales route of Panasonic. (*2) Attach the spacer (No. 117) to the exact location described above. (*3) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.15).
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
27 ACCESSORIES AND PACKING MATERIALS

27.1. KX-TCD150FXB/FXC

27.2. KX-TCD152FXB
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES

28.1. Base Unit

28.2. Handset

28.3. Charger Unit

29 REPLACEMENT PARTS LIST
1. RTL (Retention Time Limited) Note: The marking (RTL) indicates that the Retention Time is limited for this item. After the discontinuation of this assembly in production, the item will continue to be available for a specific period of time. The retention period of availability is dependant on the type of assembly, and in accordance with the laws governing part and product retention. After the end of this period, the assembly will no longer be available. 2. Important safety notice Components identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufactures parts. 3. The S mark means the part is one of some identical parts. For that reason, it may be different from the installed part. 4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics. 5. RESISTORS & CAPACITORS Unless otherwise specified; All resistors are in ohms () K=1000, M=1000k All capacitors are in MICRO FARADS (F)P=F *Type & Wattage of Resistor
D2 D3 D4 D5 D9 DA1 L1 L3 L4 J1 J2 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R16 R18 R19 R20 R21 R22 R23 R24 R25 R26 R27 R28 R29 R30 R31 R32 R38 R41 R42 B0EDER000009 PQVDRLZ20A B0JAME000095 MA2Z74800L MA111 B0DDCM000001 PQLQR4D4R7K G1C4N7Z00007 G1C2N7Z00008 PFJJ1T007Z PQJJ1B4Y ERJ3GEYJ155 ERJ3GEYJ155 ERJ3GEYJ224 ERJ3GEYJ184 ERJ3GEYJ224 ERJ3GEYJ184 ERJ3GEYJ104 ERJ3GEYJ272 ERJ3GEYJ103 ERJ3GEYJ222 ERJ3GEYJ133 ERJ3GEYJ392 ERJ12YJ220 ERJ12YJ560 ERJ3GEYJ104 ERJ3GEYJ333 ERJ3GEYJ560 PQ4R18XJ100 ERJ3GEYJ391 ERJ3GEYJ103 ERJ3GEYJ681 ERJ3GEYJ751 ERJ3GEYJ101 ERJ3GEYJ101 ERJ3GEYJ101 ERJ3GEYJ560 ERJ3GEYJ330 ERJ3GEYJ101 ERJ3GEYJ221 Ref. No. Part No. PQKF10581Z2 PQHA10023Z PQGT18084Z PQGT18084Y Part Name & Description Remarks CABINET COVER ABS-HB FOOT RUBBER NAME PLATE (for KX-TCD150FXB) (for KX-TCD152FXB) NAME PLATE (for KX-TCD150FXC)

29.1.2. Main P.C.Board Parts
Note: (*1) When replacing IC1 and IC2, data need to be written to it with PQZZTCD150FX.
Ref. No. PCB1 IC1 IC2 Q9 Q2 Q3 Q6 Q7 Q8 Q10 Part No. PQWP1D150FXH PQWICD150EH C2HBAK000012 C0CBAYF00016 B1ACGP000007 PQVTBF822T7 2SD1994A B1ABCE000009 B1ADGE000004 B1ABGE000006 Part Name & Description MAIN P.C.BOARD ASSY (RTL) (ICs) IC (EEPROM) (*1) IC (BBIC) (*1) IC (TRANSISTORS) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) (DIODES) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) (COILS) COIL COIL COIL (JACKS) JACK, MODULATOR JACK, DC (RESISTORS) 1.5M 1.5M 220K 180K 220K 180K 100K 2.7K 10K 2.2K 13K 3.9K 100K 33K 390 10K 220 Remarks

29.1. Base Unit

29.1.1. Cabinet and Electrical Parts
Ref. No. Part No. PQGG10245W3 PQGG10245W4 PQKM10586W2 PQJT10203Z PQKE10356Z2 PQSA10182Z PQSA10132Z PQHG10728Z Part Name & Description GRILLE (for KX-TCD150FXB) (for KX-TCD152FXB) GRILLE (for KX-TCD150FXC) CABINET BODY CHARGE TERMINAL GUIDE, CHARGE TERMINAL ANTENNA, MAIN ANTENNA, SUB RUBBER PARTS, BUZZER Remarks ABS-HB ABS-HB ABS-HB POM-HB
Ref. No. R43 R44 R52 R53 R54 R57 R58 R59 R61 R66 R67 R68 R78 R79 R81 R82 R89 R90 C57 L59 C1 C2 C3 C4 C7 C11 C12 C13 C14 C15 C16 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C32 C33 C34 C35 C36 C37 C38 C40 C41 C42 C48 C49 C50 C53 C54 C56 C58 C59 C66 C67 C69 C72 C73 C74 C76 C78 C83 C89
Part No. ERJ1WYJ330 ERJ1WYJ330 ERJ3GEY0R00 ERJ3GEYJ565 ERJ3GEYJ184 ERJ3GEYJ103 ERJ3GEYJ103 ERJ3GEYJ471 ERJ2GEJ470 ERJ3GEYJ180 ERJ3GEYJ151 PQ4R18XJ221 ERJ3GEYJ151 ERJ3GEYJ180 ERJ3GEYJ565 ERJ3GEYJ184 ERJ3GEYJ102 PQ4R18XJ221 ERJ3GEY0R00 ERJ3GEY0R00 ECKD2H681KB ECKD2H681KB ECQE2223KF ECQE2223KF PQCUV1A225KB ECUV1C223KBV PQCUV1C474KB ECUV1A105KBV PQCUV1C224KB ECEA1HKA100 PQCUV1H154KR ECUV1H100DCV ECUV1H100DCV ECUV1C104KBV ECUV1H100DCV PQCUV1C224KB ECUV1C104KBV ECUV1C104KBV ECEA1CKS100 ECUV1C104KBV ECUV1C104KBV ECUV1C683KBV ECUV1C683KBV ECUV1H182KBV ECUV1H270JCV ECUV1H1R0CCV ECUV1C104KBV ECUV1C333KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECEA1CK101 ECEA0JKA101 ECUV1H030CCV ECUV1H330JCV ECUV1H103KBV ECUV1H100DCV ECUV1H100DCV ECUV1H060DCV ECUV1H100DCV ECUV1H100DCV ECUV1H100DCV ECUV1H020CCV ECUV1A475KB ECUV1H100DCV ECUV1H020CCV ECUV1H100DCV ECUV1H103KBV ECUV1H060DCV ECUV1H020CCV ECJ1VC1H1R5C ECUV1H102KBV