Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac turers specific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
How to recognize that Pb Free solder is used

Marked

(Example: Handset P.C.B.)

(Component View)

Note: The location of the PbF mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity. When repairing, the following precautions will help prevent recurring malfunctions. 1. Cover the plastic parts boxes with aluminum foil. 2. Ground the soldering irons. 3. Use a conductive mat on the worktable. 4. Do not touch IC or LSI pins with bare fingers.

3 CAUTION

1. Danger of explosion if battery is incorrectly replaced. 2. Replace only with the same or equivalent type recommended by the manufacturer. 3. Dispose of used batteries according to the manufactures Instructions.

4 OPERATING INSTRUCTIONS

4.1.1.
Note: Use only rechargeable P03P (HHR-4EPT) batteries.

BATTERY

Battery Installation
Insert the batteries negative ( ) terminal first. Close the handset cover.

4.1.2.

Battery Charge
Place the handset on the base unit for about 7 hours before initial use.

4.1.3.

Battery Life

4.2.1.

LOCATION OF CONTROLS

Base Unit

4.2.2.

Handset

Connection

4.4.1.

Guide to Settings
Cross Reference: For Service Hint (P.10)

4.4.2.

For Service Hint
5 DISASSEMBLY INSTRUCTIONS

5.1. Base Unit

Shown in Fig.1 2
To Remove Lower Cabinet Main P.C. Board Screws (2.6 12)..(A) 2 Solders Main P.C. Board

Remove

Shown in Fig.5
To Remove Cabinet Cover Main P.C. Board Screws (2 8)..(B) 2 Follow the procedure. Screw (2 8).(C ) 3 Tapes and Solders Main P.C. Board

Charger Unit

Shown in Fig.6 7
To Remove Lower Cabinet Main P.C. Board
Remove Screws (2.6 14)..(D) 2 Solders Main P.C. Board

6 ASSEMBLY INSTRUCTIONS

Check or Replace Parts IC2,IC3,L1, C43,C78, C75,C69,C48, C72,C66, C67,C76,C57, C73,L3, DA1,R66,R67, C55,C56, R78,R79,C54, C58,C86, R38 IC2,IC3,L1, C43,C78, C75,C69,C48, C72,C66, C67,C76,C57, C73,L3, DA1,R66,R67, C55,C56, R78,R79,C54, C58,C86, R38 IC2,IC3,L1, C43,C78, C75,C69,C48, C72,C66, C67,C76,C57, C73,L3, DA1,R66,R67, C55,C56, R78,R79,C54, C58,C86, R38 IC2,C21,R31, C20,C11, R18,R16,D3, R12,Q2, R7,R8,Q3, R9,R10, D2,C1,C2, R77,IC3, L1,C43,C78, C75,C69, C48,C72,C66, C67,C76, C57,C73,L3, DA1,R66, R67,C55,C56, R78,R79, C54,C58,C86, R38
Items (O)* Transmit Audio Check and Adjustment

Adjustment Point ANT J1

Procedure 1. Configure the DECT tester (CMD60) as follows; <Setting> Test mode: FP Mode: Normal PMID: 00000 2. Execute the command testmode. 3. Initiate connection from DECT tester. 4. Execute the command hookoff. 5. Execute the command openau. 6. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600. 7. Set line voltage to 48V and line current to 40mA. 8. Input audio signal (30mVrms/1kHz tone) to DECT tester. <DECT tester setting> Scramble: On AF Gen. to ADPCM: On AF Meter Input: AF Voltm AF Gen. Frequency: 1000Hz AF Gen. Level: 30mVrms 9. Confirm hearing tone: 330mVrms 100mVrms. 10. Adjust audio level if required. (Make sure current value using getspkrgain. And then execute the command setspkrgain xx, where xx is the value.)
Check or Replace Parts IC2,R32,C22, R23,C80, C14,C13,R22, R21,Q6, R18,R19,R20, C12,D2, C1,C2,R77, R16,D3, R12,Q2,R7,R8 ,R9, R10,Q3,IC3, L1,C43, C78,C75,C69, C48,C72, C66,C67,C76, C57,C73, L3,DA1,R66, R67,C55, C56,R78,R79, C54,C58, C86,R38

(P) (Q)*

Charging Check Audio Check
11. Confirm that the audio distortion at 600R of Tel-simulator is < 5%. 1. Connect Charge Contact 12/2W resistor between charge+ and charge-. 2. Measure and confirm voltage across the resistor is 2.3V 0.2V. 1. Link with Handset. 2. Set line voltage to 48V and line current to 40mA. 3. Input -45dBm/1kHz to MIC of Handset. Measure the Level at Line I/F and distortion level. 4. Confirm that the level is -23 2dBm and that the distortion level is < 5% at TEL Line (600 Load). 5. Input -20dBm/1kHz to Line I/F. Measure the level at Receiver of Handset and distortion level (*Receive volume set to second position from minimum). 6. Confirm that the level is -9 2dBm and that the distortion level is < 5% at Receiver (Volume Middle, 150 Load).

D4,R43,R44

8.2.1. 8.2.1.1.
The Setting Method of JIG (Base Unit)
Preparation Equipment Required
DECT tester: Rohde & Schwarz, CMD 60 is recommended. Frequency counter: it must be precise to be able to measure 1Hz (precision; 4ppm). Hewlett Packard, 53131A is recommended. DC power: it must be able to output at least 1A current under 9V. Digital multi-meter (DMM): it must be able to measure voltage and current. Oscilloscope

8.2.1.2.

JIGs and PC
EEPROM serial JIGs 1. I2C PCB: PQZZTCD420BX 2. RS232C cable: PQZZ1CD705BX 3. Clip cable: PQZZ2CD705BX 4. DC cable: PQZZ3CD705BX PC which runs in DOS mode Batch file CD-ROM for setting: PQZZTCD150FX

8.2.2. 8.2.2.1.

PC Setting Connections

8.2.2.2.

PC Setting
1. Open a window of MS-DOS mode from the start-up menu. 2. Change a directory to the one with RTX_COM contained. 3. Type SET RTX_COM=1 from the keyboard (when COM port 1 is used for the connection). 4. Type doskey. Note: See the table below for frequently used commands.
Command name rdeeprom readid writeid setfreq hookoff hookon Getchk Wreeprom InitBsPIN.bat Function Read the data of EEPROM Read ID (RFPI) Write ID (RFPI) adjust Frequency of RFIC off-hook mode on Base on-hook mode on Base Read checksum write eeprom Initial Base PIN to 0000 Example Type rdeeprom FF, and the data from address to FF is read out. Type readid, and the registered ID is read out. Type writeid E0 0E 98, and the ID 0018 E0 0E 98 is written. Type setfreq nn nn. Type hookoff. Type hookon. Type getchk. Type wreeprom 45". 01 23" is address and 45 is data to be written. Type initBsPIN
Adjustment Standard (Base Unit)
When connecting the Simulator Equipments for checking, please refer to below.

8.3.1.

DECT Tester CMD60 (H) (I) (J) (K) (L) (M)

Component View

AF OSC

AF VOLT METER

R85 A201 JMP2 D7 C77 D4 DA1 D8 SA1 C96 R42 C81

6.3V47uF

C84 C82

JMP5 JMP7 JMP8 JMP6

C87 L59

J1 J2 Q9

C70 ANT R41 C58

C8 L5 R79 C73

C59 CC56 C76 C66 C67 C86 C72

Dummy Handset

L2 R77 C3 R1 R6 C40 C43 C53 C100 C98 L4 R38 R72 C62 Q11 R71 C4 R4 R2 R74 R70 R73 C60 C7 D3 Q3 D11 R59 D5 D10 R35 C36 R57 C35 C34 C33 C32 X1 C103 Q8 C23 C24 C17 C64 R9 C68 R5 C5 R3 R54 C49 C102 C41 C63 C2 R82 C74 R53 JMP4 JMP3 JMP1 C42 R81
R78 L3 C57 C83 C55 L83 L85 R66 1
C1 R7 D2 R11 D13 Q4 D12 B C E Q2 R12 R8 C6 CR58 C50

C78 C69

C93 C94
C88 R88 CC47 C38 R36 C48 L1 R67 C105 C106 C89 R43 18
R61 C30 R30 C29 C19 C18 C33

R15 C15

C27 R33 RC1 4

C107 C90 C95 D9

R44 R68

R25 Q5 C16 R20 C17 C12

C10 R26 R10 R91 R24 Q7 R27 D6 C79 C14 R23 C13 R32 R22 R21 C80 C22 B R16 C11 Q6 C R18 R17 E R56 C51 R19 R55 R28

1. Confirm that the voltage between TP18 and GND is 0V 0.4V.

BBIC Confirmation

1. BBIC Confirmation (Execute the command getchk). 2. Confirm the returned checksum value. Connection of checksum value and program number is shown below.
(D) Charge Control Check & Charge Current Monitor Confirmation
1. Apply 6V between TP20(+) and TP21(-) with current limit of PSU to 250mA. 2. Confirm that the charge current is ON/OFF. 3. SW to decrease current limit of PSU to 100mA.
(E)* Charge Detection (OFF) Confirmation
4. Confirm that the charge current is stable. 1. Stop supplying 6V to TP20(+) and TP21(-). 2. Execute the command charge. 3. Confirm that the returned value is 0x00 (hex).
IC1,D4,L4, L5,Q2,Q3, R6,D2,R22, C26,F1,R21, R4,C33 IC1,D4,L4, L5,Q2,Q3, R6,D2,R22, C26,F1,R21, R4,C33
Items (F)* Battery Monitor Confirmation & Adjustment (Important)
Procedure 1. Apply 2.3V 0.005V between TP3(+) and TP4(-) with DC power. 2. Execute the command deactmac to stabilize the value. 3. Then,execute the command readbatt.The returned value is XX. 4. Confirm that XX is between 98 and A8. 98 < XX < A8(Hex)
Check or Replace Parts IC1,D4,L4, L5,Q2,Q3, R6,D2,R22, C26,F1,R21, R4,C33
(G) Battery low Confirmation (Important)
(If XX is out of range,change BBIC) 1. Apply 2.40V between TP3(+) and TP4(-). 2. Confirm that there is no Speaker sound (Battery low alarm). 3. Apply 2.20V between TP3(+) and TP4(-).
(H)* BBIC Clock Adjustment (Important)
4. Confirm that there is Speaker sound (Battery low alarm). 1. Apply 2.6V between TP 3(+) and TP 4(-) with DC power. 2. Execute the command deactmac. 3. Execute the command conttx. 4. Input Command rdeeprom 01",then you can confirm the current value. 5. Adjust the frequency of TP19 executing the command setfreq 00 xx (where xx is the value).
IC1,F1,R21, R4,C33, C12,C31,R17, R20,C10, C11,D6,D7 IC1,L3,C57, IC3,X1,C16, C17
so that the reading of the frequency counter is 10.368000MHz 10Hz. Remove the Antenna before starting steps from 1 to 5. Replace C58 with RESISTOR (0). Be sure to mount C58 back to the same place after checking. 1. Configure the DECT tester(CMD60) as follows; <Setting> Test mode: PP RFPI: 0102030405 Traffic Channel: 5 Traffic Slot: 4 Mode: Loopback 2. Execute the command testmode. 3. Execute the command regcmd60 4. Initiate connection from DECT tester.

IC1,IC3,C54, C66,C60, L3,C57,C55, C56,C62, R23,R24,C63, C64,C65, R18
5. Confirm that the NTP value at A201 (TP15) is 20dBm ~ 25dBm Follow steps 1 to 4 of (I) above. 5. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data type Fig31.
Sensitivity Receiver Confirmation
IC1,IC3,C54, C66,C60, L3,C57,C55, C56,C62, 6. Adjust the B-Field Modulation if required. (Execute the command Readmod R23,R24,C63, and Writemod xx, where xx is the value.) C64,C65, R18 Follow steps 1 to 4 of (I) above. IC1,IC3,C54, 5. Confirm that the frequency offset is -50kHz ~ +50kHz. C66,C60, L3,C57,C55, C56,C62, R23,R24,C63, C64,C65, R18 Follow steps 1 to 4 of (I) above. IC1,IC3,C54, 5. Set DECT tester power to -88dBm. C66,C60, L3,C57,C55, 6. Confirm that the BER is < 1000ppm. C56,C62, R23,R24,C63, C64,C65, R18 Follow steps 1 to 4 of (I) above. IC1,IC3,C54, 5. Confirm that the Timing accuracy is < 2.0ppm. C66,C60, L3,C57,C55, C56,C62, R23,R24,C63, C64,C65, R18 Follow steps 1 to 4 of (I) above. IC1,IC3,C54, 5. Set DECT tester power to -88dBm. C66,C60, L3,C57,C55, 6. Execute the command readrssi C56,C62, R23,R24,C63, 7. Confirm: 25 < returned value < 43 (hex) (0x34 F (hex)) C64,C65, R18
Items (O)* Receive Audio Check and Confirmation

Adjustment Point TP15

Procedure 1. Configure the DECT tester (CMD60) as follows; <Setting> Test mode: PP Mode: Normal RFPI: 0102030405 2. Execute the command testmode. 3. Execute the command regcmd60 4. Initiate connection from DECT tester. 5. Execute the command openaudio. 6. Confirm that the value of EEPROM address F3F is 02. (If the value is not 02 (by User), set 02 and power off and power on, and return to clause 2.) 7. Input audio signal (50mVrms/1kHz tone) from DECT tester. <DECT tester setting> Scramble: On AF Gen. to ADPCM: On AF Meter Input: AF Voltm AF Gen. Frequency: 1000Hz AF Gen. Level: 50mVrms 8. Confirm hearing tone: 300mVrms 250mVrms (Just check Audio path)
Check or Replace Parts IC1,C67,C68, R17,R20, D7,D6,IC3, C54,C66, C60,L3,C57, C55,C56, C62,R23,R24, C63,C64, C65,R18
Transmit Audio Check and Confirmation
9. Confirm that the audio distortion with DECT tester is < 5%. 1. Configure the DECT tester (CMD60) as follows; <Setting> Test mode: FP Mode: Normal RFPI: 0102030405 2. Execute the command testmode. 3. Execute the command regcmd60. 4. Initiate connection from DECT tester. 5. Execute the command openaudio. 6. Confirm that the value of EEPROM address F3F is 02. (If the value is not 02 (by User), set 02 and power off and power on, and return to clause 2.) 7. Input audio signal (30mVrms/1kHz tone) to DECT tester. <DECT tester setting> Scramble: On AF Gen. to ADPCM: Off AF Meter Input: ADPCM AF Gen. Frequency: 1000Hz AF Gen. Level: 30mVrms 8. Confirm hearing tone: 300mVrms 250mVrms (Just check Audio path)

Bridge Rect

SYEN 10 RF Module

BBIC Interface

CPU EEPROM

Limit Resistor

CHARGE CONTACT

XTAL 10.368 MHz

VUNREG

to AC Adaptor

SCL SDA 41 40

4.0V Reg.

2.65V Reg.
KX-TCD150/152 BLOCK DIAGRAM (BASE UNIT)
15 CIRCUIT OPERATION (BASE UNIT)

15.1. Outline

Base Unit consists of the following ICs as shown in BLOCK DIAGRAM (BASE UNIT) (P.39). DECT BBIC (Base Band IC): IC2 Handling all the audio, signal and data processing needed in a DECT base unit Controlling the DECT specific physical layer and radio section (Burst Module Controller section) ADPCM codec filter for speech encoding and speech decoding (DSP section) Echo-cancellation and Echo-suppression (DSP section) Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section) DTMF receiver (DSP section) Clock Generation for RF Module ADC, DAC, timer, and power control circuitry All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.) RF Module: IC3 PLL Oscillator Detector Compress/Expander First/Second Mixer Amplifier for transmission and reception EEPROM: IC1 Temporary operating parameters (for RF, etc.) Additionally, Power Supply Circuit (+4.0V, +2.65V output) Crystal Circuit (10.368MHz) Charge Circuit Telephone Line Interface Circuit
15.2. Power Supply Circuit
The power is supplied to the DECT BBIC, RF Module, EEPROM, Relay Coil, LED and Charge Contact from AC Adaptor (+6V) as shown in Fig.101. The power supply is as follows:

<Fig.101>

15.3. Telephone Line Interface
<Function> Bell signal detection Clip signal detection ON/OFF hook circuit Audio circuits Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection: In the standby mode, Q2 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the TP3 (A) and TP40 (B) leads (when the telephone rings), the signal is transferred as follows; A C4 R2 R29 IC2 (DLP) [BELL & CLIP] B C3 R1 R30 IC2 (DLP) [BELL & CLIP] ON/OFF hook circuit: In the standby mode, Q2 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an off-hook condition. When IC2 detects a ring signal or press the TALK Key onto the handset, Q3 turns on and then Q2 turns on, thus providing an off-hook condition (active DC current flow through the circuit) and the following signal flow is for the loop current. A D2 Q2 R8 Q6 R19 R20 D2 B [OFF HOOK] Audio circuits: Refer to SIGNAL ROUTE (P.46).
15.4. Transmitter/Receiver
Base Unit and Handset mainly consist of RF Module and DECT BBIC. Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency. Signal Path: *Refer to SIGNAL ROUTE (P.46).

15.4.1. Transmitter Block
The voice signal input from the TEL LINE interface goes to RF Module (IC3) through DECT BBIC (IC2) as shown in BLOCK DIAGRAM (BASE UNIT) (P.39) The voice signal passes through the analog part of IC2 where it is amplified and converted to a digital audio stream signal. The burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc. In IC3, the carrier frequency is changing, and frequency modulated RF signal is generated and amplified, and radiated from antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of Receiver Block.

15.4.2. Receiver Block

The signal of 1.9 GHz band (1.881792 GHz ~ 1.897344 GHz) which is input from antenna is input to IC3 as shown in BLOCK DIAGRAM (BASE UNIT) (P.39). In IC3, the signal of 1.9 GHz band is demodulated, and goes to IC2 as GAP (Generic Access Profile) standard DECT frames. It passes through the decoding section burst switch controller where it separates out the frame information and performs deencryption and de-scrambling as required. It then goes to the DSP section where it is turned back into analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.

15.5. Pulse Dialling

During pulse dialing the hookswitch (Q4,Q5) is used to generate the pulses using the HOOK control signal, which is set high during pulses. To force the line impedance low during the pause intervals between dial pulses, the PULSE_DIAL signal turns on Q12.
16 BLOCK DIAGRAM (HANDSET)

42 EARPIECE 45 D/A

Speech Decoding Speech Encoding
Burst Decoding Burst Encoding

12 RXDA 16 TXDA

RF Module 10
48 RSSI Analog Front End TP5 + CHARGE CONTACTS TPEEPROM SCL 67 SDA 66 VDDBAT 36 SWITCHED SUPPLY SWITCH 28 CPU 4.0V D3 VDDLR 34 53~55, 59, 60 ROWS 17~21 CHARGE CIRCUIT CHARGE 38 CHARGE DETECT ADPCM Codec Filter DSP RF Interface 23 SYRI 13 SYEN

BMC 33 XTAL 10.368 MHz

ON SWITCH

TP3 BATTERY TERMINAL TP4

Pin 63 64

Description ANT1 ANT2

I/O D.O D.O

Hi ANT1_ON ANT2_ON

Hi-z -

Low ANT1_OFF ANT2_OFF

Remarks -

Note: I_PU; Internal Pull-Up, I_PD; Internal Pull-Down

21 CPU DATA (HANDSET)

21.1. IC1 (BBIC)
Pin 55 Description LCD_SEGMENT LCD_COMMON VDD VSS LCD_COMMON LCD_COMMON LCD_COMMON LCD_COMMON LCD_COMMON PA_SW T/R SW RX_DATA SYEN SYDA SYCL TX_DATA KEY_IN KEY_IN KEY_IN KEY_IN KEY_IN (NO USE) Reference clock VDD VSS POWER_SW CHARGE_DET DCDCDRV DCDCCMR RESET VSSO LOAD XTAL VDDPM VDDLO VDDBAT VDDLR CHARGE_START VDDA VSSA LSRN LSRP BANDGAP_REF MICS MICP MICN Reference Voltage RSSI P0.4 AD4N AD4P (NO USE) KEY_STRB KEY_STRB KEY_STRB I/O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.I D.O D.O D.O A.O D.I D.I D.I D.I D.I D.O D.O A.I A.I D.O A.I A.I A.I A.I A.O A.O A.I A.O A.O A.O A.O A.O A.I A.I A.O A.I D.I A.I A.I D.I D.O D.O D.O Hi PA ON Transmit No Key No Key No Key No Key No Key SW OFF Charge Non Active Active Active Active Hi-z Low PA OFF Recieve Key_In Key_In Key_In Key_In Key_In SW_ON No_charge Active Non_Active Non_Active Remarks for charge -

Pin 100

Description LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT KEY_STRB KEY_STRB LCD_SEGMENT LCD_SEGMENT VDD VSS VDD for EEPROM I2DAT I2CLK MODE R2 (NO USE) VBACK/P0.7 LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT VDDLI LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT VSS VDD LCD_SEGMENT (NO USE) Power Select LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT
I/O D.O D.O D.O D.O D.O D.O D.O D.O D.I/O D.I/O D.I D.I D.O D.I D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O
Hi Active Active Low Power -
Low Non_Active Non_Active High Power -

22 ENGINEERING MODE

22.1. Base Unit
Note: *: When you enter the address, please refer to the table below.
Desired Number (hex) 0 1. 9 Input Keys 0 1. 9 Desired Number (hex) A B C D E F Input Keys [R] + 0 [R] + 1 [R] + 2 [R] + 3 [R] + 4 [R] + 5
Items (*2) C-ID (FSK) sensitivity C-ID (DTMF) sensitivity Frequency ID Bell length PULSE Dial speed (10PPS -> 20PPS) Address 0A1D~0A1E 0A 2D 00 00~00 20~0F 12 0F 06 0F 07 0F 0A Default Data 00 6D 60 Given value New Data (3dB up) (6dB up) 00 AE7 (3dB up) (6dB up) 38 3C 14 (2sec) Remarks When hex changes from 006D to 00A4 or 00E7, gain increases by 3dB or 6dB. When hex changes from 34 to 38 or 3C, gain increases by 3dB or 6dB. Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the computer system. This is time until bell stops ringing. (Unit: 100ms) This is pulse make time. (Unit:1ms) This is pulse break time. (Unit:1ms) This is inter-digit time in pulse mode. (Unit:10ms)

64 (10sec) (*1) 1E (3sec) 28 (40msec) (*1) 14 (20msec) 3C (60msec) (*1) 1E (30msec) 4A (740msec) (*1) 2C (440msec)
Bell length PULSE Dial speed (10PPS -> 20PPS) 64(hex) = 100(dec) 100 100msec = 10000msec (10sec) 28(hex) = 40(dec) 40 1msec = 40msec 3C(hex) = 60(dec) 60 1msec = 60msec 4A(hex) = 74(dec) 74 10msec = 740msec
Items C-ID (FSK) sensitivity C-ID (DTMF) sensitivity Frequency ID Bell length PULSE Dial speed (10PPS -> 20PPS) Description FSKGain_shiftgain Foutgains:HPFilter Foutgains Setting value of FREQ_TRIM_REG ID Time until it stops bell. Pulse MakeTime and BreakTime. bMakeTime:Pulse MakeTime Unit: 1ms bBreakTime:Pulse Break Time Unit: 1ms Inter-digit time in Pulse mode. Unit:10ms

22.2. Handset

Note: *: When you enter the address, please refer to the table in Note: (P.51) of ENGINEERING MODE. ex.)
Items (*4) Sending level Receiving level Battery Low Frequency ID Address 0F 35 0F 37 0F 00~00 30~Default Data Adjusted value Adjusted value 9A Given value New Data Given value Given value Possible Adjusted Value MAX (hex) Possible Adjusted Value MIN (hex) Remarks (*1) (*2) (*3)
(*1) When adding 01 (hex) to default value, sending level increases by 1.0dB. ex.)
Item Sending level Default Data 1C -9.0dBm New Data 1D 1B -8.0dBm -10.0dBm
(*2) When reducing 01 (hex) from default value, receiving level increases by 1.0dB. ex.)
Item Receiving level Default Data 5B -23.0dBm New Data 5A 5C -24.0dBm -22.0dBm
(*3) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the Handset. (*4)
Items Sending level Receiving level Battery Low Frequency ID Description Analog Front End MIC Setting for Handset Mode Analog Front End LSR Setting for Handset Mode ADC value for battery low detection Setting value of FREQ_TRIM_REG International Portable Part Equipment Identities
23 HOW TO REPLACE THE FLAT PACKAGE IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

23.1. PREPARATION

PbF (: Pb free) Solder Soldering Iron Tip Temperature of 700F 20F (370C 10C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. Flux Recommended Flux: Specific Gravity 0.82. Type RMA (lower residue, non-cleaning type) Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) (P.4).
23.2. FLAT PACKAGE IC REMOVAL PROCEDURE
1. Put plenty of solder on the IC pins so that the pins can be completely covered. Note: If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the land with some tools like a soldering wire. If some solder is left at the joint on the board, the new IC will not be attached properly.
23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil. 2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
23.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly resolder the bridged portion. 2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
24 CABINET AND ELECTRICAL PARTS (BASE UNIT)
25 CABINET AND ELECTRICAL PARTS (HANDSET)
Note: (*1) The rechargeable Ni-MH battery P03P (HHR-4EPT) is available through sales route of Panasonic. (*2) Attach the spacer (No. 117) to the exact location described above. (*3) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.15).
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
27 ACCESSORIES AND PACKING MATERIALS

27.1. KX-TCD150FXB/FXC

27.2. KX-TCD152FXB
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES

28.1. Base Unit

28.2. Handset

28.3. Charger Unit

29 REPLACEMENT PARTS LIST
1. RTL (Retention Time Limited) Note: The marking (RTL) indicates that the Retention Time is limited for this item. After the discontinuation of this assembly in production, the item will continue to be available for a specific period of time. The retention period of availability is dependant on the type of assembly, and in accordance with the laws governing part and product retention. After the end of this period, the assembly will no longer be available. 2. Important safety notice Components identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufactures parts. 3. The S mark means the part is one of some identical parts. For that reason, it may be different from the installed part. 4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics. 5. RESISTORS & CAPACITORS Unless otherwise specified; All resistors are in ohms () K=1000, M=1000k All capacitors are in MICRO FARADS (F)P=F *Type & Wattage of Resistor
D2 D3 D4 D5 D9 DA1 L1 L3 L4 J1 J2 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R16 R18 R19 R20 R21 R22 R23 R24 R25 R26 R27 R28 R29 R30 R31 R32 R38 R41 R42 B0EDER000009 PQVDRLZ20A B0JAME000095 MA2Z74800L MA111 B0DDCM000001 PQLQR4D4R7K G1C4N7Z00007 G1C2N7Z00008 PFJJ1T007Z PQJJ1B4Y ERJ3GEYJ155 ERJ3GEYJ155 ERJ3GEYJ224 ERJ3GEYJ184 ERJ3GEYJ224 ERJ3GEYJ184 ERJ3GEYJ104 ERJ3GEYJ272 ERJ3GEYJ103 ERJ3GEYJ222 ERJ3GEYJ133 ERJ3GEYJ392 ERJ12YJ220 ERJ12YJ560 ERJ3GEYJ104 ERJ3GEYJ333 ERJ3GEYJ560 PQ4R18XJ100 ERJ3GEYJ391 ERJ3GEYJ103 ERJ3GEYJ681 ERJ3GEYJ751 ERJ3GEYJ101 ERJ3GEYJ101 ERJ3GEYJ101 ERJ3GEYJ560 ERJ3GEYJ330 ERJ3GEYJ101 ERJ3GEYJ221 Ref. No. Part No. PQKF10581Z2 PQHA10023Z PQGT18084Z PQGT18084Y Part Name & Description Remarks CABINET COVER ABS-HB FOOT RUBBER NAME PLATE (for KX-TCD150FXB) (for KX-TCD152FXB) NAME PLATE (for KX-TCD150FXC)

29.1.2. Main P.C.Board Parts
Note: (*1) When replacing IC1 and IC2, data need to be written to it with PQZZTCD150FX.
Ref. No. PCB1 IC1 IC2 Q9 Q2 Q3 Q6 Q7 Q8 Q10 Part No. PQWP1D150FXH PQWICD150EH C2HBAK000012 C0CBAYF00016 B1ACGP000007 PQVTBF822T7 2SD1994A B1ABCE000009 B1ADGE000004 B1ABGE000006 Part Name & Description MAIN P.C.BOARD ASSY (RTL) (ICs) IC (EEPROM) (*1) IC (BBIC) (*1) IC (TRANSISTORS) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) (DIODES) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) (COILS) COIL COIL COIL (JACKS) JACK, MODULATOR JACK, DC (RESISTORS) 1.5M 1.5M 220K 180K 220K 180K 100K 2.7K 10K 2.2K 13K 3.9K 100K 33K 390 10K 220 Remarks

29.1. Base Unit

29.1.1. Cabinet and Electrical Parts
Ref. No. Part No. PQGG10245W3 PQGG10245W4 PQKM10586W2 PQJT10203Z PQKE10356Z2 PQSA10182Z PQSA10132Z PQHG10728Z Part Name & Description GRILLE (for KX-TCD150FXB) (for KX-TCD152FXB) GRILLE (for KX-TCD150FXC) CABINET BODY CHARGE TERMINAL GUIDE, CHARGE TERMINAL ANTENNA, MAIN ANTENNA, SUB RUBBER PARTS, BUZZER Remarks ABS-HB ABS-HB ABS-HB POM-HB
Ref. No. R43 R44 R52 R53 R54 R57 R58 R59 R61 R66 R67 R68 R78 R79 R81 R82 R89 R90 C57 L59 C1 C2 C3 C4 C7 C11 C12 C13 C14 C15 C16 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C32 C33 C34 C35 C36 C37 C38 C40 C41 C42 C48 C49 C50 C53 C54 C56 C58 C59 C66 C67 C69 C72 C73 C74 C76 C78 C83 C89
Part No. ERJ1WYJ330 ERJ1WYJ330 ERJ3GEY0R00 ERJ3GEYJ565 ERJ3GEYJ184 ERJ3GEYJ103 ERJ3GEYJ103 ERJ3GEYJ471 ERJ2GEJ470 ERJ3GEYJ180 ERJ3GEYJ151 PQ4R18XJ221 ERJ3GEYJ151 ERJ3GEYJ180 ERJ3GEYJ565 ERJ3GEYJ184 ERJ3GEYJ102 PQ4R18XJ221 ERJ3GEY0R00 ERJ3GEY0R00 ECKD2H681KB ECKD2H681KB ECQE2223KF ECQE2223KF PQCUV1A225KB ECUV1C223KBV PQCUV1C474KB ECUV1A105KBV PQCUV1C224KB ECEA1HKA100 PQCUV1H154KR ECUV1H100DCV ECUV1H100DCV ECUV1C104KBV ECUV1H100DCV PQCUV1C224KB ECUV1C104KBV ECUV1C104KBV ECEA1CKS100 ECUV1C104KBV ECUV1C104KBV ECUV1C683KBV ECUV1C683KBV ECUV1H182KBV ECUV1H270JCV ECUV1H1R0CCV ECUV1C104KBV ECUV1C333KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECEA1CK101 ECEA0JKA101 ECUV1H030CCV ECUV1H330JCV ECUV1H103KBV ECUV1H100DCV ECUV1H100DCV ECUV1H060DCV ECUV1H100DCV ECUV1H100DCV ECUV1H100DCV ECUV1H020CCV ECUV1A475KB ECUV1H100DCV ECUV1H020CCV ECUV1H100DCV ECUV1H103KBV ECUV1H060DCV ECUV1H020CCV ECJ1VC1H1R5C ECUV1H102KBV
Part Name & Description 0 5.6M 180K 10K 10K 18 5.6M 180K 1K 0 (CAPACITORS) 680P 680P 0.022 0.022 2.2 0.022 0.0.0.15 10P 10P 0.1 10P 0.22 0.1 0.0.1 0.1 0.068 0.068 0.0018 27P 1 0.1 0.033 0.1 0.1 0.100 3P 33P 0.01 10P 10P 6P 10P 10P 10P 2P 4.7 10P 2P 10P 0.01 6P 2P 1.5P 0.001

Remarks

Ref. No. C90 C94 C96 C97 C98 C100 C101 C105 C106 L58 IC3 CN4 S1 SA1 X1
Part No. ECUV1H101JCV ECUV1H0R5CCV ECUV1H100DCV ECUV1H100DCV PQCUV1H0R5CC ECUV1H100DCV ECUV1H100DCV ECUV1H030CCV ECUV1H030CCV ECUV1H020CCV PQLP10268Z L0DACA000024 K0H1BB000018 J0LF00000026 H0D103500003
Part Name & Description 100P 0.5P 10P 10P 0.5P 10P 10P 3P 3P 2P (OTHERS) RF UNIT BUZZER SPECIAL SWITCH, TACTILE VARISTOR (SURGE ABSORBER) CRYSTAL OSCILLATOR

29.2. Handset

29.2.1. Cabinet and Electrical Parts
Ref. No. 111 Part No. PQGP10225V2 PQHS10553Z PQKM10587Z3 PQKM10587Z2 PQHS10554Y PQBC10375Z1 PQSX10310Z PQHS10719Z PQHX11202Z PQJT10204Z PQJT10205Z PQKF10582Z3 PQKF10582Z2 PQJC10056Y PQJC10057Z PQJC10058Z PQGT18093Z PQGT18093Y PQHX11253X PQHS10561Y PQKK10134X3 PQKK10134X2 Part Name & Description PANEL, LCD TAPE, DOUBLE SIDE CABINET BODY (for KXTCD150FXB) (for KX-TCD152FXB) CABINET BODY (for KXTCD150FXC) SPACER, LCD PUSH BUTTON, NAVI KEYBOARD SWITCH NET, MIC INSULATOR TERMINAL (L) TERMINAL (R) CABINET COVER (for KXTCD150FXB) (for KX-TCD152FXB) CABINET COVER (for KXTCD150FXC) BATTERY TERMINAL BATTERY TERMINAL (-) BATTERY TERMINAL (+) NAME PLATE (for KX-TCD150FXB) (for KX-TCD152FXB) NAME PLATE (for KX-TCD150FXC) PLASTIC PARTS, BATTERY COVER SHEET SPACER, BATTERY COVER LID, BATTERY COVER (for KXTCD150FXB) (for KX-TCD152FXB) LID, BATTERY COVER (for KXTCD150FXC) Remarks AS-HB ABS-HB ABS-HB

ABS-HB

ABS-HB ABS-HB

S 118 S

29.2.2. Main P.C.Board Parts
(*2) When replacing the Handset LCD, See How to Replace the Handset LCD (P.15).
Ref. No. PCB100 IC1 IC2 Part No. PQWPCA115FXR C2HBAK000013 PQWICA115EXR B1CFMC000006 B1ADGE000004 UN5216 Part Name & Description MAIN P.C.BOARD ASSY (RTL) (ICs) IC (BBIC) (*1) IC (EEPROM) (*1) (TRANSISTORS) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) (DIODES) Remarks

Q1 Q2 Q3

Ref. No. D1 D3 D4 D6 D7 L2 L3 L4 L5 L6 L7 F1 R1 R2 R3 R4 R5 R6 R7 R8 R11 R17 R18 R19 R20 R21 R22 R23 R25 R26 R27 C2 C3 C4 C5 C6 C7 C8 C14 C15 C16 C17 C18 C20 C21 C22 C23 C24 C26 C27 C28 C29 C30 C33 C54 C56 C57 C58 C60 C62 C63 C64 C65 C67 C68 C69 C70 C71 MIC
Part No. B0JCME000035 MA2Z74800L MAZ83900ML MA2Z74800L MA2Z74800L G1C470M00025 PQLQR4D4R7K G1C100MA0072 G1C100MA0072 PQLQR2M8N2JT PQLQR2M8N2JT PQLQR2M5N6K ERJ3GEYJ222 ERJ8BQJR30 ERJ3GEYJ560 ERJ3GEYJ103 ERJ3GEYJ331 ERJ3GEYJ332 ERJ3GEYJ331 ERJ3GEYJ331 ERJ3GEY0R00 ERJ3GEY0R00 ERJ3GEYJ330 ERJ3GEYJ153 ERJ3GEY0R00 ERJ6RSJR10V ERJ3GEY0R00 ERJ3GEYJ2R2 ERJ2GEJ561 ERJ2GEJ561 ERJ3GEY0R00 ECUV1A475KB ECUV1C104KBV ECUV1C104KBV ECST0JY475 ECUV1H100DCV ECUV1C104KBV ECUV1H100DCV EEE1AA221P EEE1AA221P ECUV1H1R0CCV ECUV1H180JCV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECUV1A225KB ECUV1H100DCV ECUV1H020CCV ECUV1H330JCV F1G1H1R2A561 ECST0JY475 ECUV1A105KBV ECUV1H100DCV ECUV1A105KBV ECUV1H020CCV ECUV1H100DCV ECUV1H100DCV ECUV1H030CCV ECUV1H030CCV ECUV1H100DCV L0CBAB000069