SKiiP 1202 GB 061 - 360 CTV Absolute Maximum Ratings
Symbol Visol 4) Top ,Tstg Conditions AC, 1min Operating / stor. temperature

Values 2500 -25.+-40.+75

Units V C V V A C A A A kAs2 V V kHz kV/s
IGBT and Inverse Diode VCES VCC 5) Operating DC link voltage IC IGBT Tj 3) IGBT + Diode IF Diode IFM Diode, tp < 1 ms IFSM Diode, Tj = 150 C, 10ms; sin I2t (Diode) Diode, Tj = 150 C, 10ms Driver VS1 Stabilized Power Supply VS2 Non-stabilized Power Supply fsmax Switching frequency dV/dt Primary to secondary side
SKiiPPACK SK integrated intelligent Power PACK halfbridge SKiiP 7,9) 1202 GB 061 - 360 CTV

Preliminary Data

Case S3

Characteristics

Symbol IGBT11) V(BR)CES ICES VTO rT VCesat VCesat Eon + Eoff CCHC LCE Conditions

min. VCES

typ. 18 2,
max. 1,2 0,94 1,4 2,6 2,60 108/153 1,72 1,0,78 0,8 0,033 0,063 36
Units V mA mA V m V V mJ nF nH V V mJ V m K/W K/W K/KW mA mA s A A C V
Driver without supply VGE = 0, Tj = 25 C VCE = VCES Tj = 125 C Tj = 125 C Tj = 125 C IC = 1200A, Tj = 125 C IC = 1200A, Tj = 25 C VCC=300/400V,IC=1200A Tj = 125 C per Phase, AC side Top, Bottom Tj = 125 C Tj = 25 C Tj = 125 C
Inverse Diode 2) VF = VEC IF= 1200A; VF= VEC IF= 1200A Eon + Eoff IF= 1200A; VTO Tj = 125 C rT Tj = 125 C
Features Short circuit protection, due to evaluation of current sensor signals Isolated power supply Low thermal impedance Optimal thermal management with integrated heatsink Pressure contact technology with increased power cycling capability, compact design Low stray inductance High power, small losses Over-temperature protection
Thermal Characteristics Rthjs10) per IGBT Rthjs10) per Diode Rthsa6,10) P16 heatsink; see case S3 Driver IS1 Supply current 15V-supply IS2 Supply current 24V-supply tinterlock-driver Interlock-time SKiiPPACK protection ITRIPSC Short circuit protection ITRIPLG Ground fault protection TTRIP Over-temp. protection UDCTRIP 9) UDC-protection Mechanical Data M1 DC terminals, SI Units M2 AC terminals, SI Units by SEMIKRON
260+470*fs /fsmax+1,3*IAC/A 200+320*fs /fsmax+1,0*IAC/A 2, 10
Theatsink = 25 C, unless otherwise specified CAL = Controlled Axial Lifetime Technology (soft and fast) without driver Driver input to DC link / AC output to DC link / AC output to heatsink with Semikron-DC link (low inductance) other heatsinks on request C - Integrated current sensors T - Temperature protection V - 15 V or 24 V power supply AC connection busbars must be connected by the user; copper busbars available on request options available for driver: U - DC link voltage sense F Fiber optic connector s referenced to temperature sensor NPT-technology with homogenous current-distribution B 7 25
PIN-array - halfbridge driver SKiiPPACK 3-fold type GB
X1: Pin 3 signal shield BOT IN
remark connected to GND, when shielded cable is used positive 15V CMOS logic; 10 k impedance, dont connect when using fiber optic LOW = NO ERROR; open Collector Output; max. 30 V / 15 mA dont connect when using fiber optic, propagation delay 1 s min. pulsewidth error-memory-reset 8 s positive 15V CMOS logic; 10 k impedance dont connect when using fiber optic LOW = NO ERROR = DCB < 115 + 5C open collector Output; max. 30 V / 15 mA low output voltage < 0,6 V high output voltage max. 30 V 24 VDC (20 - 30 V) dont supply with 24 V, when using + 15 VDCIN supply voltage monitoring threshold 19,5 V 15 VDC + 4 % dont supply with 15 V, when using + 24 VDCIN supply voltage monitoring threshold 13 V GND for power supply and GND for digital signals

ERROR OUT1)

TOP IN4) Overtemp. OUT1)
+ 24 VDC IN + 24 VDC IN + 15 VDC IN + 15 VDC IN GND GND
Temp. analog OUT or UDC when using option U UDC analog OUT2) actual DC-link voltage, 9 V refer to UDCmax max. output current 5 mA; overvoltage trip level 9 V GND aux3) I analog OUT GND for analog signals current actual value; 8,0 V refer to IC @ 25 C overcurrent trip level 10 V 125 % IC @ 25 C current value > 0 SKiiP is source current value < 0 SKiiP is sink

X10: halfbridge 1 (HB1) OUT Pin Signal Collector TOP (HB1) Gate TOP (HB1) Emitter TOP (HB1) Collector BOT (HB1) Gate BOT (HB1) Emitter BOT (HB1)
X11: halfbridge 2 (HB2) OUT Pin Signal Temp.-Sensor (HB2)1 Temp.-Sensor (HB2)2 Collector TOP (HB2) Gate TOP (HB2) Emitter TOP (HB2) Collector BOT (HB2) Gate BOT (HB2) Emitter BOT (HB2)
X12: halfbridge 3 (HB3) OUT Pin Signal Collector TOP (HB3) Gate TOP (HB3) Emitter TOP (HB3) Collector BOT (HB3) Gate BOT (HB3) Emitter BOT (HB3)
type GAL as type GB except - PIN X1-4: connect this pin to GND - TOP switch does not exist
type GAR as type GB except - PIN X1-2: connect this pin to GND - BOTTOM switch does not exist
Open collector output, external pull up resistor necessary 2) When using option U the analog temperature signal is not available 3) GND aux = reference for analog output signals 4) high (min) 11,2 V low (max) 5,4 V

by SEMIKRON

B 7 11

SKiiPPACK 3 - GB; GD

Weight without heatsink: 2,72 kg P16: 6,6 kg SKiiPPACK 3 - GB with F-option