AirborneTM Embedded 802.11b/g SDIO-SPI Radio
WLRG-RA-DP600 Series - SDIO/SPI
Bluetooth Coexistence is provided via three wire interface, and supports Packet Transfer Arbitration (PTA) as specified in the IEEE802.15.2 standard. The Airborne Embedded 802.11b/g SDIOSPI Radio incorporates the most advanced power save technology, enabling original equipment manufacturers (OEMs) to utilize intelligent power control to minimize peak and overall power consumption and maximize battery life. Quatech provides unparalleled software support to OEMs, including radio drivers for Linux, Windows CE, Windows XP, Windows Mobile 5.0/6.0 and other leading real-time operating systems. OEMs count on Quatechs technical expertise and experience to ease 802.11 radio integration and meet their time-to-market goals.

KEY FEATURES

802.11b/g radio SDIO v1.0 (1 & 4 bit), SPI (1 & 4 bit) Based upon Marvell Libertas 88W8686 Chipset 30 pin high density SMT connector Single U.FL RF connector for 802.11b/g Supports WEP, WPA, WPA2 (Home and Enterprise) and 802.1x Supplicants Bluetooth Co-existence 3-wire interface through main connector Advanced Low power modes High vibration mounting holes Supports host downloaded radio firmware Driver supports for WinCE 5.0, Windows Mobile 5.0/6.0, Linux 2.6 and other embedded OSs Small form factor radio module (29mm x 21mm x 6mm) RoHS compliant
High Performance Embedded Radio
Airborne is a line of highly integrated 802.11 radios and modules. The Airborne Embedded 802.11b/g SDIO-SPI Radio delivers a high performance, integrated solution for consumer and industrial wireless applications using the latest IEEE 802.11b/g platform. It delivers a cost and space efficient solution, provided by a small profile design and direct down SMT high density connection to the system board.

Applications

Designed specifically with power, performance and flexibility in mind, the Airborne family of radios are the wireless choice for machine-to-machine (M2M), Medical, Industrial and Mobile Enterprise applications. Quatech supplies the highest performance M2M WiFi radio products available, these are backed with industry leading support and product warranties. Please contact Quatech for further details and connect with reliability and performance.
Interoperable and Advanced Security
The Airborne Embedded 802.11b/g SDIOSPI Radio is a complete high-speed wireless solution that uses the latest 802.11b/g chipset from Marvell Libertas 88W8686. It provides compatibility with the 802.11b DSSS and 802.11g orthogonal frequency division multiplexing (OFDM) standards. The module includes integrated antenna connectors that provide a direct connection from the radio to the antenna. The module is a true upgrade option - no soldered connections are required. It can be upgraded in the field or added to a managed product configuration. As the latest addition to the Airborne Radio family the WLRG-RA-DP600 includes support for full speed SDIO (1 & 4 bit) and SPI, through the Quatech standard 30 pin connector. The WLRG-RA-DP600 family includes full hardware and software support for AES/CCMP, RC4, WEP, WPA and WPA2 encryption. Provision for enterprise level EAP supplicants is fully supported. In addition the module provides the latest 802.11 standards, including QoS and Transit Power Control.

Model Selection Guide

Model No.
Interface SDIO SPI BT CoX*

Supply RoHS VBAT VHIO

802.11b

802.11g

WLRG-RA-DP601 To evaluate all available features and receive evaluation tools, order below. WLEG-RA-DP601
* Bluetooth Coexistence Support
802.11b/g SDIO/SPI Radio Evaluation Kit
WLRG-RA-DP601 radio, SDIO Adapter Card, Tools/Documentation CD, Drivers (Windows CE, XP and Linux)
5675 Hudson Industrial Parkway Hudson, OH 44236 1.800.553.1170 www.quatech.com

Block Diagram

Mechanical Outline

Specifications

Technology Interfaces Frequency IEEE 802.11b/g, WiFi Compliant SDIO v1.0 (1&4 bit), SPI (1 & 4 bit), Bluetooth Coexistence 2.4-2.4835 GHz (US/Canada/Europe) 2.4-2.497 GHz (Japan) DSSS, CCK, OFDM DBPSK, DQPSK, CCK, BPSK, QPSK, 16QAM, 64QAM Infrastructure, ad-hoc US/Canada - 11 channels Europe - 13 France - 4 channels Japan - 14 channels (13 channels for g) 802.11b - 11,5.5,2,1 Mbs 802.11g - 54,48,36,24,18,12,9,6 Mbs CSMA/CA with ACK, RTS, CTS -92dBm -85dBm -87dBm -82dBm -75dBm -70dBm @ 1Mb/s (802.11b) @ 11Mb/s (802.11b) @ 6Mb/s (802.11g) @ 18Mb/s (802.11g) @ 36Mb/s (802.11g) @ 54Mb/s (802.11g)

Modulation Technology Modulation Type Network Access Modes Channels

Wireless Data Rates

MAC Sensitivity

Connectors

Security Protocols 053748-0308 (Molex) 0.50mm (.020") Pitch SlimStack Plug, Surface Mount, Dual Row, Vertical, 3.00mm (.118") Stack Height, 30 Circuits Antenna Supply
Disabled, WEP 64 & 128 bit, WPA (TKIP), WPA (AES), WPA2 (AES), 802.1x (EAP) Supplicant U.FL coaxial connectors, 50 ohms, supports diversity VDD=3.3VDC +/-10%, VHIO= 3.3VDC+/- 10% or 1.8 VDC+/- 10% 802.11g Tx mode current= 161 mA (Typ) 802.11g Rx mode current= 174 mA (Typ) 802.11b Tx mode current= 218 mA (Typ) 802.11b Rx mode current = 146mA (Typ) IEEE Power Save (PSP) Mode = 6mA (Typ) Power Down Mode= 160mA Operating: -30C to +85 C, Storage -50C to + 125C 30 Pin High density SMT Connector (Molex 53748-0308) FCC Part 15 Class B Sub C Intentional Radiator, IOC RSS-210 (Pending)

Radio Connector

052991-0308 (Molex) Board Connector 0.50mm (.020") Pitch SlimStack Receptacle, Surface Mount, Dual Row, Vertical, 3.00mm (.118") Stack Height, 30 Circuits RF Connector U.FL (Hirose) Ultra Small Surface Mount Coaxial Connector DC Characteristics
Operating and Storage Temp Connector Agency Approvals

NEWS RELEASE

For Immediate Release
Quatechs first SDIO/SPI host interface radio is available to customers
QUATECHS EXPANDED LINE OF EMBEDDED 802.11 RADIOS NOW SHIPPING
HUDSON, OHIO June 24, 2008 Quatech, Inc., a leader in wireless machine-tomachine (M2M) networking and device connectivity solutions, is now shipping the recently released SDIO/SPI based interface line of Embedded Airborne 802.11b/g Radio Modules. The Airborne Embedded 802.11b/g Radio Module is Quatechs first SDIO/SPI host interface product and the latest addition to Quatechs advanced line of radios for reliable and high performing machine-to-machine (M2M) communication. The low power radio module delivers high performance and is ideal for integrating the latest WiFi technology into designs for power sensitive and hand-held devices used in industrial, medical, surveillance, telematics and mobile enterprise applications. The Airborne 802.11b/g Radio Module delivers a cost efficient solution provided by a small profile design and direct down SMT high density connection to the system board. The radio is a complete, high speed wireless solution that uses the latest 802.11 b/g Marvell Libertas (88W8686) chipset. The module is a true upgrade option; no soldered connections are required and the module can be upgraded in the field or added to a managed product configuration. The new Airborne 802.11b/g SDIO-SPI Radio provides OEMs with a very compact and low-power embedded wireless solution, said Steve Runkel, CEO of Quatech. This radio is particularly well-suited for M2M applications, including industrial, telematics and medical devices that require the latest enterprise-class security protocols for operation in corporate networks. Supporting the latest media streaming, roaming, power management and security standards, the low power radio module provides industrial-grade technology with advanced power management features. The radio modules powerful encryption feature supports the latest 802.11i security standards and implements AES, WEP, WPA and WPA2 along with a broad range of EAP supplicants. Reference drivers for WIndowsXP, Vista, WinCE, Windows Mobile and Linux are included with Airborne
Embedded Radio Evaluation and Development Kits. The Airborne 802.11b/g Radio Module will also provide connectivity to the family of the Blackfin EZ-Kit Lite Boards and provide support for radio drivers already ported to the Blackfin family of processors. Analog devices is pleased to work with Quatech to offer easy connectivity that enables system designers to readily integrate Quatechs 802.11b/g radio module with the Blackfin family of processors through our Blackfin EZ-Kit Lite boards, Wayne Meyer, Strategic Marketing Manager, General Purpose DSP, Analog Devices said. For sales and ordering information on the Airborne 802.11b/g Radio Module, please visit www.Quatech.com. ##### About Quatech, Inc. Quatech delivers high performance device networking and connectivity solutions to help companies improve their bottom line results. Its products enable reliable machineto-machine (M2M) communications via secure 802.11 wireless or traditional wired networks, with industrial-grade embedded radios, modules, boards and external device servers, and bridges. For local and mobile connections, Quatechs serial adapters provide secure connectivity and port expansion via any interface option. Satisfied customers worldwide rely on Quatechs unique combination of performance and support to improve operations through real-time remote monitoring and control, streamlined systems, and lowest total cost of ownership (TCO). Quatech markets its products through a global network of distributors, resellers, systems integrators and original equipment manufacturers in the transportation, instrumentation and industrial control, homeland security, medical equipment, and logistics markets. Founded in 1983, Quatech is headquartered in Hudson, Ohio. Quatech merged with DPAC Technologies (OTCBB: DPAC) in February 2006. Information concerning DPAC is filed by DPAC with the SEC and is available on the SEC website, www.sec.gov. To learn more about Quatechs complete line of device networking and connectivity solutions, visit www.quatech.com. ##### Media Contact: Jennifer McKeever Quatech, Inc. PH: (330) 655-9000 Email: jennifer.mckeever@quatech.com
Forward-Looking Statements
This press release includes forward-looking statements. You can identify these statements by their forwardlooking words such as "may," "will," "expect," "anticipate," "believe," "guidance," "estimate," "intend," predict," and "continue" or similar words or any connection with any discussion of future events or circumstances or of management's current estimates or beliefs. Forward-looking statements are subject to risks and uncertainties, and therefore results may differ materially from those set forth in those statements. More information about the risks and challenges faced by DPAC Technologies Corp. is contained in the Securities and Exchange Commission filings made by the Company on Form S-4, 10-K, 10-Q or 10-QSB and 8-K. DPAC Technologies Corp. specifically disclaims any obligation to update or revise any forward-looking statements whether as a result of new information, future developments or otherwise.