Device list
Pilot Pioneer Device List
Dingli Pilot Pioneer is a powerful network measurement and optimization solution in providing simultaneous test for multi-network for perfecting the air interface of wireless networks. With long-term network optimization experiences and the latest R&D achievements, Pilot Pioneer collects comprehensive GSM, CDMA, UMTS measurements and supports scanner test functionality based on PC and Windows NT/2000/XP/2003 operation system. Supported Networks: GSM/CDMA/EVDO/UMTS/HSDPA/HSUPA Network

Supported Config.

SAGEM 260/290/460/468/490/498, SAMSUNG F400/F408, NOKIA N85/N95/N96/6120/6121/6720.

Recommended Config.

PCTEL Scanner, R&S Scanner
SAGEM 260/290 Single-channel MOS Device,
SAGEM 468/498 NOKIA N85 R&S Scanner NOKIA N85 Multi-channel
460/468/490/498 Single-channel MOS Device, SAMSUNG
F400/F408 Single-channel MOS Device,
NOKIA N85/6120/6121/6720 Single-channel MOS Device, SAGEM 460/468/490/498 Multi-channel MOS Device
MOS Device Support GPS: Compatible with NEMA0183
(voice benchmarking device), SAMSUNG F400/F408 Multi-channel MOS Device, NOKIA N85/6120/6121/6720 Multi-channel MOS Device
Support GPS: Compatible with NEMA0183 LG KX206/216/218/256 PCTEL Scanner, R&S Scanner LG KX 206/218/256 Single-channel MOS Device,
LG 218 R&S Scanner LG 218 Single/Multi-channel MOS Device
LGKX206/218/256 Multi-channel MOS Device (voice benchmarking device)
Support GPS: Compatible with NEMA0183
Data Card: ZTE AC 8710, ANYDATA,Huawei EC226/360
ZTE AC 8710 R&S Scanner Support GPS: Compatible with NEMA0183
Support GPS: Compatible with NEMA0183 SamsungF400/F408, Nokia N85/N95/N96/6120/6121/6720 PCTEL Scanner, R&S Scanner,Comarco Scanner,Anri Scanner
Nokia N85 R&S Scanner NOKIA N85 Multi-channel
SAMSUNG F400/F408 Single-channel MOS Device, NOKIA N85/6120/6121/6720 Single-channel MOS Device, SAMSUNG F400/F408 Multi-channel MOS Device, NOKIA N85/6120/6121/6720 Multi-channel MOS Device

MOS Device

Support GPS: Compatible with NEMA0183 NOKIA N85(HSDPA:3.6Mbps) NOKIA 6720 (HSDPA:10.2 HSUPA:2Mbps)
SAMSUNG S7520 (HSDPA:7.2Mbps)
Huawei E270(HSDPA:7.2Mbps HSUPA:2Mbps) 1 Huawei E180 (HSDPA:7.2 Mbps HSUPA:5.76Mbps)

Huawei E180

www.dinglicom.com
Support GPS: Compatible with NEMA0183 All Rights Reserved HUAWEI E182E (HSPA+:21.6Mbps HSUPA:2Mbps) Support GPS: Compatible with NEMA0183
Dingli Communications Corp.,Ltd.

www.hcdcorp.com

Samsung Licenses NexMod Technology from HCD for Networking and Telecommunications Markets Innovative Memory Solution Combines Small Form Factor with Low Cost and High Performance
SAN JOSE, Calif.--Oct. 7, 2002--Samsung Semiconductor, Inc., the world's leading manufacturer of advanced memory technology, today announced that it has licensed the NexModTM technology from High Connection Density, Inc. (HCD), which provides a small footprint module for RDRAM memory. The Samsung RDRAM NexMod memory module solution provides scalable, high-speed memory in space-constrained applications for networking, communications and other markets. "RDRAM NexMod technology is a great addition to our broad portfolio of leading-edge memory solutions," said Tom Quinn, vice president of marketing for Samsung Semiconductor. "It demonstrates Samsung's commitment to the networking market and proves that high performance RDRAM can be used not only in the PC market, but also for any demanding memory application." The multi-tiered NexMod module, with a small footprint that measures 1.1 inches by 2.0 inches and is under 0.5 inches in height, offers all the circuitry for an entire Rambus channel in a single module. The small form factor and module construction create a situation similar to a "short channel" Rambus design, allowing for potentially higher clock frequencies and better system electrical margins. The NexMod technology, as well as the RDRAM NexMod product, was initially pioneered by HCD to solve the memory needs of applications using network processors that require high-performance packet buffer memory. "HCD is excited to be working together with Samsung Semiconductor to jointly provide an innovative solution that will enable the ever-increasing memory needs of today's networking applications," said Dirk Brown, executive vice president of business development at HCD. The RDRAM NexMod solution has a number of features that distinguish it from traditional SORIMM and RIMM solutions. In addition to placing all the supporting Rambus channel components on one module, it uses demountable area array connectors with lower parasitic impedances, delays and cross talk to improve electrical performance. The NexMod module can either be attached to the main board with pin grid array (PGA) connectors or soldered with ball grid array (BGA) technology. The small footprint module incorporates termination resistors, the Direct Rambus Clock Generator (DRCG), and a Voltage Regulator Module (VRM) on the same modular subsystem as the memory chips. Available memory configurations range from 64MB to 288MB utilizing 288Mb-based RDRAM. Samsung will be sampling the new product in December 2002. Mass production will begin in early 2003.
1267 Borregas Avenue, Sunnyvale, CA 94089-1308 USA

p: 408. 743. 9700

f: 408. 743. 9701
About Samsung Semiconductor, Inc. Samsung Semiconductor, Inc. is a wholly owned US subsidiary of Samsung Electronics Co., Ltd. Headquartered in Seoul, Korea, Samsung Electronics is a mainstay of the global electronics industry. It is the world's leader in DRAM memory, SRAM memory, and TFT-LCD display products for industrial, mobile and desktop computing applications. Samsung Electronics is one of the world's largest semiconductor companies overall with a full line of semiconductor products including Flash memory, microprocessor and custom ASIC components. Samsung Semiconductor, Inc. is located in San Jose, California. For more information, please visit our website: http://www.usa.samsungsemi.com. About High Connection Density, Inc. High Connection Density, Inc. (HCD) develops advanced electronics packaging and connection technologies to provide high frequency and high current, form factor optimized solutions to its customers and licensees. These innovative solutions enable increased performance and reliability of our customers' products. To learn more about HCD products and services, visit the website at www.hcdcorp.com. NexMod is a registered trademark of High Connection Density, Inc. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.