Samsung Semiconductor, Inc.

Product Selection Guide

Memory and Storage January 2009
Samsung offers the industrys broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, ash and SRAM products are found in computersfrom ultra-mobile portables to powerful servers and in a wide range of handheld devices such as smartphones and MP3 players. Samsung also delivers the industrys widest line of storage products. These inlcude optical and hard disk drives as well as ash storage, such as the all-ash Solid State Drive and a range of embedded and removable ash storage products.
SAMSUNG PRODUCT OFFERINGS

Markets

Mobile/Wireless

TFT/LCD

ODD/HDD

Notebook PCs

Desktop PCs/Workstations
Servers Networking/ Communications Consumer Electronics

www.samsung.com/semi/us

www.samsung.com/semi/dram

Pages 4-14 D RAM

www.samsung.com/semi/flash

Pages 15-19 FLASH

www.samsung.com/semi/sram

Pages 20 -25 SRAM

MULTI-CHIP PACKAGE

www.samsung.com/semi/mcp

Pages 26-27

FUSION MEMORY

FUSION MEMORY www.samsung.com/semi/fusion
Page 28 F U S I ON Pages 29-33 ST OR A GE
Optical Disk Drives www.samsungodd.com

STORAGE

HaManufacturers repsr Solid State Drives www.samsungssd.com Optical Disk Drives www.samsungodd.com Hard Disk Drives www.samsung.com/hdd
DDR3 SDRAM REGISTERED MODULES
Density 1GB 2GB 2GB 4GB 4GB 8GB 1GB 2GB 2GB 4GB 4GB 8GB 8GB 16GB 1GB 2GB 1GB 1GB 2GB 4GB

NOTES:

Organization 128Mx72 256Mx72 256Mx72 512Mx72 512Mx72 1Gx72 128Mx72 256Mx72 256Mx72 512Mx72 512Mx72 1Gx72 1Gx72 2Gx72 128Mx64 256Mx64 128Mx64 128Mx64 256Mx64 512Mx64
F7= DDR3-800 (6-6-6) F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) Voltage = 1.5V
Part Number M393B2873DZ1-C(F7/F8/H9) M393B5673DZ1-C(F7/F8/H9) M393B5670DZ1-C(F7/F8/H9) M393B5173DZ1-C(F7/F8) M393B5170DZ1-C(F7/F8/H9) M393B1G70DJ1-C(F7/F8) M393B2873EH1-C(F7/F8/H9) M393B5673EH1-C(F7/F8/H9) M393B5670EH1-C(F7/F8/H9) M393B5173EH1-C(F7/F8) M393B5170EH1-C(F7/F8/H9) M393B1G70EM1-C(F7/F8) M393B1K70BH1-C(F7/F8/H9) M393B2K70BM1-C(F7/F8) M471B2874DZ1-C(F7/F8/H9) M471B5673DZ1-C(F7/F8/H9) M471B2873EH1-C(F8/H9) M471B2874EH1-C(F8/H9) M471B5673EH1-C(F8/H9) M471B5273BH1-C(F8/H9)
Composition 1Gb (128M x8)*9 1Gb (128M x8)*18 1Gb (256M x4)*18 1Gb (128M x8)*36 1Gb (256M x4)*36 2Gb (512M x4)*36 1Gb (128M x8)*9 1Gb (128M x8)*18 1Gb (256M x8)*18 1Gb (128M x8)*36 1Gb (256M x4)*36 2Gb (512M x4)*36 2Gb (512M x4)*36 4Gb (1024M x4)*36 1Gb (64M x16)*8 1Gb (128M x8)*16 1Gb (128M x8)*8 1Gb (64M x16)*8 1Gb (128M x8)*16 2Gb (256M x8)*16
Compliance RoHS RoHS RoHS RoHS RoHS RoHS RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS RoHS RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free
Speed (Mbps) 800/1066/1333 800/1066/1333 800/1066/1333 800/1066 800/1066/1333 800/1066 800/1066/1333 800/1066/1333 800/1066/1333 800/1066 800/1066/1333 800/1066 800/1066/1333 800/1066 800/1066/1333 800/1066/1333 1066/1333 1066/1333 1066/1333 1066/1333

Banks 2 2

DDR3 SDRAM UNBUFFERED MODULES

Density 1GB 2GB 1GB 2GB 4GB Organization 128Mx64 256Mx64 128Mx64 256Mx64 512Mx64 Part Number M378B2873DZ1-C(F8/H9) M378B5673DZ1-C(F8/H9) M378B2873EH1-C(F8/H9) M378B5673EH1-C(F8/H9) M378B5273BH1-C(F8/H9) Composition 1Gb (128M x8)*8 1Gb (128M x8)*16 1Gb (128M x8)*8 1Gb (128M x8)*16 2Gb (256M x8)*16 Compliance RoHS RoHS RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free Speed (Mbps) 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 Module Ranks 2
DDR3 SDRAM UNBUFFERED MODULES (ECC)
Density 1GB 2GB 1GB 2GB 4GB Organization 128Mx72 256Mx72 128Mx72 256Mx72 512Mx72 Part Number M391B2873DZ1-C(F8/H9) M391B5673DZ1-C(F8/H9) M391B2873EH1-C(F8/H9) M391B5673EH1-C(F8/H9) M391B5273BH1-C(F8/H9) Composition 1Gb (128M x8)*9 1Gb (128M x8)*18 1Gb (128M x8)*9 1Gb (128M x8)*18 2Gb (256M x8)*18 Compliance RoHS RoHS RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free Speed (Mbps) 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 Module Ranks 2

JANUARY 2009

DDR3 SDRAM COMPONENTS
1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 2Gb
256M x4 128M x8 64M x16 256M x4 128M x8 64M x16 512M x4 256M x8 128M x16
K4B1G0446D-HC(F7/F8/H9) K4B1G0846D-HC(F7/F8/H9) K4B1G1646D-HC(F7/F8/H9) K4B1G0446E-HC(F7/F8/H9) K4B1G0846E-HC(F7/F8/H9) K4B1G1646E-HC(F7/F8/H9) K4B2G0446B-HC(F7/F8/H9) K4B2G0846B-HC(F7/F8/H9) K4B2G1646B-HC(F7/F8/H9)
82 Ball -FBGA 82 Ball -FBGA 100 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 96 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 96 Ball -FBGA
RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free RoHS & Halogen Free
800/1066/1333 800/1066/1333 800/1066/1333 800/1066/1333 800/1066/1333 800/1066/1333 800/1066/1333 800/1066/1333 800/1066/1333
9x11mm 9x11mm 9x13.3mm 7.5x11mm 7.5x11mm 7.5x13.3mm 9x11.5mm 9x11.5mm 9x13.3mm
DDR2 SDRAM REGISTERED MODULES
Module Density 512MB Organization 64Mx72 Part Number M393T6553GZA-C(E6/F7) M393T6553GZ3-C(CC/D5) M393T2950GZA-C(E6/F7) M393T2950GZ3-C(CC/D5) 1GB 128Mx72 M393T2953GZA-C(E6/F7) M393T2953GZ3-C(CC/D5) M393T2863QZA-C(E6/F7) M393T2863EHA-C(E6/F7/E7) M393T5750GZA-C(E6/F7) M393T5750GZ3-C(CC/D5) 2GB 256Mx72 M393T5660QZA-C(E6/F7/E7) M393T5660EHA-C(E6/F7/E7) M393T5663QZA-C(E6/F7/E7) M393T5663EHA-C(E6/F7/E7) 4GB 512Mx72 M393T5160QZA-C(E6/F7/E7) M393T5160EHA-C(E6/F7/E7) M393T1G60QJA-C(D5/E6) 8GB 1Gx72 M393T1G60EMA-C(D5/E6) M393T1K66AZA-C(E6/F7)
NOTES: CC=PC2-3200 (DDR2-400 @ CL=3) E6=PC2-5300 (DDR2-667 @ CL=5) F7=PC2-6400 (DDR2-800 @ CL=6) E7=PC2-6400 (DDR2-800 @ CL=5) D5=PC2-4200 (DDR2-533 @ CL=4) Voltage = 1.8V Module Height = 1.2"
Parity Speed (Mbps) 667/800 400/533 667/800 400/533 667/800 400/533 667/800 667/800 667/800 400/533 667/800 667/800 667/800 667/800 667/800 667/800 533/667 533/667 667/800 Register Y N Y N Y N Y Y Y N Y Y Y Y Y Y Y Y Y Rank 2 Production Now Now Now Now Now Now Now Jan`09 Now Now Now Jan`09 Now Jan`09 Now Jan`09 Now Jan`09 Now

50: Intel C1 AMB 60: IDT D1 AMB 80 : IDT L4 AMB 90: Montage D1 AMB
Compliance Lead free Lead free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free Lead free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free Lead free
Speed (Mbps) 667/800 667/800 667/800 667/667/800 667/800 667/800 667/667/800 667/800 667/667/800 667/800 667/667 667/667/800 667/667 667/800 667
Voltage 1.8V 1.8V 1.8V 1.8V 1.55V 1.55V 1.8V 1.8V 1.8V 1.55V 1.55V 1.8V 1.8V 1.55V 1.55V 1.8V 1.8V 1.55V 1.55V 1.8V 1.55V 1.8V 1.8V 1.55V 1.55V 1.8V 1.55V

Rank 2

Production Now Now Now Jan`09 Now Mar`09 Now Now Jan`09 Now Feb '09 Now Feb '09 Now Feb '09 Now Mar`09 Now Mar`09 Now Now Now Mar`09 Now Mar`09 Now Now
800 Speed option would be limited along with AMB type. Module Height = 1.2"
DDR2 SDRAM UNBUFFERED MODULES
Density 512MB Organization 64Mx64 Part Number M378T6553GZS-C(E6/F7/E7) M378T6464QZ3-C(E6/F7/E7) M378T2953GZ3-C(E6/F7/E7) 1GB 128Mx64 M378T2863QZS-C(E6/F7/E7) M378T2863EHS-C(E6/F7/E7) 2GB 4GB
Composition (64M x8)*8 (64M x16)*4 (64M x8)*16 (128M x8)*8 (128M x8)*8 (128M x8)*16 (128M x8)*16 (256M x8)*16
Voltage = 1.8V Module Height =1.2"
Compliance Lead free Lead free Lead free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free
Speed (Mbps) 667/800 667/800 667/800 667/800 667/800 667/800 667/800 667/800

Rank 2 2

Production Now Now Now Now Now Now Now Now

256Mx64 512Mx64

M378T5663QZ3-C(E6/F7/E7) M378T5663EH3-C(E6/F7/E7) M378T5263AZ3-C(E6/F7)
E6=PC2-5300 (DDR2-667 @ CL=5) E7=PC2-6400 (DDR2-800 @ CL=5) F7=PC2-6400 (DDR2-800 @ CL=6)
DDR2 SDRAM UNBUFFERED MODULES (ECC)
Module Density 512MB 1GB Organization 64Mx72 128Mx72 Part Number M391T6553GZ3-C(E6/F7/E7) M391T2863QZ3-C(E6/F7/E7) M391T2863EH3-C(E6/F7/E7) M391T5663QZ3-C(E6/F7/E7) M391T5663EH3-C(E6/F7/E7) M391T5263AZ3-C(E6/F7) Composition (64M x8)*9 (128M x8)*9 (128M x8)*9 (128M x8)*18 (128M x8)*18 (256M x8)*18
Compliance Lead free Lead free Lead free & Halogen free Lead free Lead free & Halogen free Lead free
Speed (Mbps) 667/800 667/800 667/800 667/800 667/800 667/800
Production Now Now Jan '09 Now Jan '09 Now

2GB 4GB

DDR2 SDRAM SODIMM MODULES
Module Density 512MB Organization 64Mx64 Part Number M470T6554GZ3-C(E6/F7/E7) M470T6464QZ3-C(E6/F7/E7) M470T2953GZ3-C(E6/F7/E7) 1GB 128Mx64 M470T2864QZ3-C(E6/F7/E7) M470T2864EH3-C(E6/F7/E7) 2GB 4GB

4Gb based

4Gb mono
Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead free

www.samsung.com/semi/ash

SLC NAND FLASH
MOQ Family Density Tech Part Number Package Type TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 ULGA TSOP1 TSOP1 ULGA HF & LF TSOP1 TSOP1 ULGA TSOP1 TSOP1 ULGA HF & LF TSOP1 TSOP1 ULGA TSOP1 TSOP1 ULGA HF & LF TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOPFBGA(9.5x12) TSOP1 TSOP1 TSOP1 TSOPFBGA(8.5x13) 63 FBGA(8.5x13) TSOP1 TSOPFBGA(9x11) 63 FBGA(9x11) Org. Vol(V) Tray -xxxx0xx 64Gb DSP 32Gb QDP 8Gb Based 4KB/page 16Gb DDP 8G mono 51nm K9NCG08U5M-PCB0 K9WBG08U1M-PCB0 K9WBG08U1M-PIB0 K9KAG08U0M-PCB0 K9KAG08U0M-PIB0 K9F8G08U0M-PCB0 K9F8G08U0M-PIB0 K9WAG08U1A-PCB0 63nm 16Gb QDP K9WAG08U1A-PIB0 K9WAG08U1A-IIB0 K9WAG08U1B-PCB0 59nm K9WAG08U1B-PIB0 K9WAG08U1B-KIB0 K9K8G08U0A-PCB0 63nm 4Gb Based 2KB/page 8Gb DDP K9K8G08U0A-PIB0 K9K8G08U1A-IIB0 K9K8G08U0B-PCB0 59nm K9K8G08U0B-PIB0 K9K8G08U1B-KIB0 K9F4G08U0A-PCB0 63nm 4Gb K9F4G08U0A-PIB0 K9F4G08U0A-IIB0 K9F4G08U0B-PCB0 59nm K9F4G08U0B-PIB0 K9F4G08U0B-KIB0 K9F2G08U0A-PCB0 63nm 2Gb 2Gb 59nm K9F2G08U0A-PIB0 K9F2G08U0B-PCB0 K9F2G08U0B-PIB0 K9F1G08U0B-PCB0 63nm 1Gb 1Gb K9F1G08U0B-PIB0 K9F1G08R0B-JIB0 59nm K9F1G08U0C-PCB0 K9F1G08U0C-PIB0 K9F1208U0C-PCB0 512Mb 512Mb 63nm K9F1208U0C-PIB0 K9F1208R0C-JIB0 K9F1208U0C-JIB0 K9F5608U0D-PCB0 256Mb 256Mb 90nm K9F5608U0D-PIB0 K9F5608R0D-JIB0 K9F5608U0D-JIB0 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 3.3 3.3 3.3 3.3 3.3 1.8 3.3 3.3 3.3 3.3 1.8 3.3 3.3 3.3 1.8 3.1,960 1,120 1,1,000 1,280 1,280 1,000 1,000 1,000 1,000 1,000 2,000 1,000 1,000 1,000 1,000 2,000 2,000 1,000 1,000 2,000 2,000 59nm C-die coming Oct'08: K9F1G08U0CPCB0000; B-die EOL: LTBO due Mar'09 59nm C-die coming Oct'08: K9F1G08U0CPIB0000; B-die EOL: LTBO due Mar'09 1.8v B-die supported through 2009 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.960 T/R -xxx0Txx 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 2,000 1,000 1,000 2,000 1,000 1,000 2,000 1,000 1,000 2,000 1,000 1,000 2,000 1,000 1,000 2,000 1,000 qualify 59nm B-die: K9F2G08U0B-PCB0000; A-die EOL: LTBO due Dec'08 qualify 59nm B-die: K9F2G08U0B-PIB0000; A-die EOL: LTBO due Dec'08 qualify 59nm B-die: K9F4G08U0B-PCB0000; A-die EOL: LTBO due Dec'08 qualify 59nm B-die: K9F4G08U0B-PIB0000; A-die EOL: LTBO due Dec'08 A-die EOL: LTBO due Dec'08 qualify 59nm B-die: K9K8G08U0B-PCB0000; A-die EOL: LTBO due Dec'08 qualify 59nm B-die: K9K8G08U0B-PIB0000; A-die EOL: LTBO due Dec'08 A-die EOL/LTBO due Dec'08 qualify 59nm B-die: K9WAG08U1B-PCB0000; A-die EOL:LTBO due Dec'08 qualify 59nm B-die: K9WAG08U1B-PIB0000; A-die EOL: LTBO due Dec'08 A-die EOL: LTBO due Dec'08 Remarks
Please contact your local Samsung sales representative for latest product offerings.

Note: All parts are lead free
Solid State Drives (SSD)*
Application Interface Size 1.8" SATA II SLC 3.0Gb/sec Connector Thin uSATA Den. 32GB 64GB 32GB 64GB 32GB 64GB 64GB 128GB 64GB 128GB 64GB 128GB 64GB 2.5" PM800 SLIM (caseless) SS410 SATA II 3.0Gb/sec SLC 2.5" uSATA Thin SATA 128GB 256GB 64GB 128GB 25GB 50GB 50GB 64GB 50GB 100GB 8GB UMPC/Low-Cost PC SATA II MLC UM410 HALF SLIM Thin SATA 16GB 32GB
*Please contact Marketing for the latest offerings.

Comp. 8Gb

Part Number MCBQE32G8MPP-0VA00 MCCOE64G8MPP-0VA00 MCBQE32G5MPP-0VA00 MCCOE64G5MPP-0VA00 MCBQE32GFMPP-MVA00 MCBQE64GFMPP-MVA00 MMCRE64G8MPP-0VA00 MMCQE28G8MUP-0VA00 MMCRE64G5MPP-0VA00 MMDOE28G5MPP-0VA00
2.5" SLIM (caseless) 1.8"

Thin SATA

Thin uSATA

16Gb 16Gb

PC/Notebook
2.5" SLIM (caseless)

SATA II MLC 3.0Gb/sec

MMCRE64GFMPP-MVA00 MMCQE28GFMPP-MVA00 MMCRE64G5MXP-0VB00
MMCRE28G5MXP-0VB00 MMDOE56G5MXP-0VB00
MMCRE64GFMXP-MVB00 MMCRE28GFMXP-MVB00 MCBQE25G5MPQ-0VA03 MCCOE50G5MPQ-0VA03 MCBQE32G5MPQ-0VA03 MCCOE64G5MPQ-0VA03 MCBQE50G5MXP-0VB03 MCCOE00G5MXP-0VB03 MMAGE08GSMPP-MVA00

Server/Storage

2.5"
MMBRE16GSMPP-MVA00 MMCRE32GSMPP-MVA00
SD and MicroSD FLASH CARDS
Flash Cards Type Density 1GB SD 2GB 4GB 8GB 16G MLC M-die Component Family 8Gb MLC B-die Ver. Controller SKYMEDI SKYMEDI SKYMEDI SKYMEDI SMI 512MB 4Gb MLC A-die SMI SMI 1GB MicroSD (without adapter) 2GB 8Gb MLC B-die SKYMEDI SKYMEDI SKYMEDI SKYMEDI SKYMEDI SKYMEDI SKYMEDI SKYMEDI Manuf. Site STS STS STS STS STS ATP SPIL SPIL STS SPIL STS STS SPIL STS STS Part Number MM8GF01GWBCA-2MA00 MMAGF02GWMCA-2NA00 MMAGF04GWMCA-2NA00 MMAGF08GWMCA-2NA00 MM4GR512UACA-2PA00 MM4GR512UACU-2PA00 MM4GR512UACY-2PA00 MM8GR01GUBCY-2MA00 MM8GR01GUBCA-2MA00 MM8GR02GUBCY-2MA00 MM8GR02GUBCA-2MA00 MMAGR02GUDCA-2MA00 MM8GR04GUBCY-2MA00 MMAGR04GUDCA-2MA00 MMAGR08GUDCA-2MA135 MOQ

8Gb MLC 16G MLC

B-die M-die B-die M-die M-die

4GB 8GB

8Gb MLC 16G MLC 16G MLC
Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead free.
FLASH PRODUCT ORDERING INFORMATION
SAMSUNG Memory NAND Flash Small Classication Density Density Organization Organization Vcc
Pre-Program Version Customer Bad Block Temp Package --Generation Mode
1. Memory (K) 2. NAND Flash : 9 3. Small Classification
(SLC : Single Level Cell, MLC : Multi Level Cell)

8. Vcc

UtRAM2

HIGH-SPEED ASYNCHRONOUS SRAM
Density Organization Part Number K6R4016C1D K6R4016V1D K6R4004C1D K6R4004V1D K6R4008C1D K6R4008V1D # Pins-Package 44-SOJ, 44-TSOP2 44-SOJ, 44-TSOP2 32-SOJ 32-SOJ 36-SOJ, 44-TSOP2 36-SOJ, 44-TSOP2 Vcc (V) 5 3.3.3.3 Speed (ns) 10, 12 8, 10 Operaring Temp I I I I I I Operating Current (mA) 65, 55 80, 65 65, 55 80, 65 65, 55 80, 65 Operating Current (mA) 20, 5 20, 5 (1.2) 20, 5 20, 5 20, 5 20, 5 Production Status Mass Production Mass Production EOL EOL Mass Production Mass Production

256Kx16

512Kx8
SYNCHRONOUS PIPELINED BURST AND FLOW-THRU
Density Organization Part Number # PinsPackage 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP Operating Mode SPB SB SPB SB SPB SPB SB SPB SPB SB SPB SPB SB SPB SPB SB SPB SPB SB SPB SPB SPB SB Vdd (V) Access Time tCD (ns) 3.1 7.5 3.1 7.5 2.6, 3.5 3.1 7.5 2.6, 3.5 3.1 7.5 2.6 3.5 6.5 2.6 3.5 6.5 2.4 3.5 6.5 3.5 2.4 3.5 6.5 Speed tCYC (MHz) 250, 117 250, I/O Voltage (V) 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3,2.5 3.3,2.5 3.3,2.5 3.3,2.5 3.3,2.5 3.3,2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs 2E1D 2E1D 2E1D 2E1D 2E1D 2E1D 2E1D 2E1D 2E1D 2E1D 2E2D Comments

2Mx18 36Mb 1Mx36

K7A321830C K7B321835C K7A323630C K7B323635C K7A163630B
3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3
2E1D Ind Temp only 2E1D Ind Temp only 2E1D 2E2D

512Kx36 18Mb 1Mx18

K7A163631B K7B163635B K7A161830B K7A161831B K7B161835B K7A803609B

256x36 8Mb 512x18

K7A803600B K7B803625B K7A801809B K7A801800B K7B801825B K7A403609B

128Kx32 4Mb

K7A403600B K7B403625B K7A403200B K7A401809B

256Kx18

K7A401800B K7B401825B
All TQFP products are Lead Free 2E1D = 2-cycle Enable and 1-cycle Disable 2E2D = 2-cycle Enable and 2-cycle Disable SPB speed recommendations: For 200MHz use 250MHz; For 133MHz use 167MHz SB speed recommendation: Use 7.5ns Access Time use 6.5ns Access Time
Density Organization Part Number # PinsPackage 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP 100-TQFP 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP Operating Mode SPB SPB SPB SPB FT FT SPB SPB FT (SB) FT (SB) SPB SPB SPB SPB SPB SPB SPB SPB FT FT SPB SPB Vdd (V) Access Time tCD (ns) 2.6, 3.5 2.6, 3.5 2.6, 3.5 2.6, 3.5 7.5 7.5 2.6, 3.5 2.6, 3.5 6.5 6.5 3.5 3.5 2.6 2.6 3.5 3.5 2.6 2.6 6.5 6.5 3.0 3.0 Speed tCYC (MHz) 250, 167 250, 167 250, 167 250, 118 250, 167 250, 200 I/O Voltage (V) 2.5 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3,2.5 3.3,2.5 3.3,2.5 3.3,2.5 2.5 2.5 2.5 2.5 3.3, 2.5 3.3, 2.5 3.3,2.5 3.3,2.5 Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs

2Mx36 4Mx18 1Mx36

K7N643645M K7N641845M K7N323635C K7N321835C K7M323631C K7M321831C K7N161831B K7N163631B K7M161835B K7M163635B K7N803601B K7N801801B K7N803609B K7N801809B K7N803645B K7N801845B K7N803649B K7N801849B K7M801825B K7M803625B K7N403609B K7N401809B
2.5 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3 3.3 3.3 3.3 3.3 3.3 2.5 2.5 2.5 2.5 3.3 3.3 3.3 3.3

2Mx18 1Mx36 2Mx18 1Mx18

512Kx36 1Mx18 512Kx36 256Kx36 512Kx18 256Kx36 512Kx18
256Kx36 512Kx18 256Kx36 512Kx18 512Kx18 256Kx36

128Kx36 256Kx18

All TQFP products are Lead Free NtRAM speed recommendations: For 200MHz use 250MHz; For 133MHz use 167MHz NtRAM speed recommendation: Use 7.5ns Access Time use 6.5ns Access Time Recommended SPB speeds are 250MHz and 167MHz Recommended SB Acess Speed is 7.5ns

LATE-WRITE RR AND R-L

Type Density Organization Part Number # PinsPackage 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA Operating Mode SP SP SP SP SP SP SP SP SP Vdd (V) Access Time tCD (ns) 1.6, 2.0 1.6, 2.0 1.6 1.6 2.0 2.0 2.5,2.7,3.0 2.5,2.7,3.0 6.5 Speed tCYC (MHz) 300,250 300,250 250,200,167 250,200,I/O Voltage (V) 1.5 (Max 1.8) 1.5 (Max 1.8) 1.5 (Max.2.0) 1.5 (Max.2.0) 1.5 (Max.2.0) 1.5 (Max.2.0) 2.5/3.3 2.5/3.3 2.5/3.3 Production Status C/S C/S Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs

32Mb LateWrite R-R

1Mx36 2Mx18 256Kx36
K7P323674C K7P321874C K7P803611B K7P801811B K7P803666B K7P801866B K7P403622B K7P401822B K7P401823B
1.8 / 2.5V 1.8 / 2.5V 3.3 3.3 2.5 2.5 3.3 3.3 3.3

512Kx18 256Kx36 512Kx18

LateWrite R-R and R-L
128Kx36 4Mb 256Kx18 256Kx18

DDR SYNCHRONOUS SRAM

Type Density Organization 512K x36 1M x18 256K x36 512K x18 Part Number K7D163674B K7D161874B K7D803671B K7D801871B K7I641882M 4M x18 72Mb 2M x36 K7I641884M K7J641882M K7I643682M K7I643684M K7J643682M K7I321882C 2M x18 DDR II CIO/ SIO 36Mb 1M x36 K7I321884C K7J321882C K7I323682C K7I323684C K7J323682C K7I161882B 1M x18 18Mb 512K x36 K7I161884B K7J161882B K7J163682B K7I163682B K7I163684B 36Mb DDR II+ CIO 18Mb
# PinsPackage 153-BGA 153-BGA 153-BGA 153-BGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA
Vdd (V) 1.8~2.5 1.8~2.5 2.5 2.5 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8
Access Time tCD (ns) 2.3 2.3 1.7/1.9/2.1 1.7/1.9/2.1 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45 0.45 0.45 0.45 0.45 0.45 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45 0.45 0.45 0.45
Cycle Time (MHz) 330, 300 330, 300 333, 330, 250 333, 330, 250 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 333,300,250 333,300,250 333,300,250 333,300,250 333,300,250 333,300,250 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 450, 400, 333 450, 400, 333 450, 400, 333 450, 400, 333

Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
Comments QDR II-2B QDR II-2B QDR II-4B QDR II-2B QDR II-4B QDR II-2B QDR II-2B QDR II-4B QDR II-2B QDR II-4B QDR II - 2B QDR II - 2B QDR II - 4B QDR I - 2B QDR I - 4B QDR II - 2B QDR II - 4B QDR I - 2B QDR I - 4B QDR II + 4B QDR II + 4B QDR II + 4B QDR II + 4B
2M x36 QDR II 4M x9 2M x18

1M x36 2M x9

1.8v / 2.5v 2.5 1.8v / 2.5v 2.5 1.8 1.8 0.45,0.45,0.50 0.45,0.45,0.45,0.50
1.8v / 2.5v 2.5 1.8v / 2.5v 2.5 1.8 1.8 1.8 1.8 0.45 0.45 0.45 0.45
1M x36 2M x18 1M x18 512K x36
K7S3218T4C K7S3236T4C K7S1618T4C K7S1636T4C
For QDR I, QDR II: 2B = Burst of 2, 4B = Burst of 4 For QDR II (36Mb): C-die use 300, 250MHz or 200MHz instead of 167MHz using a stable DLL circuit For QDR II (72Mb): 2B = Burst of 2 and 250MHz or 200MHz is recommended, 4B = Burst of 4 and 300MHz or 250MHz is recommended For QDR II+: 2-clock latency supported. 2.5-clock latency can be supported with 450MHz speed
SYNCHRONOUS SRAM ORDERING INFORMATION
SAMSUNG Memory Sync SRAM Small Classication Density Density Organization Organization Vcc, Interface, Mode
Packaging Type Speed Speed Temp, Power Package --Generation Vcc, Interface, Mode
1. Memory (K) 2. Sync SRAM: 7 3. Small Classification
A: Sync Pipelined Burst B: Sync Burst D: Double Data Rate I: Double Data Rate II, Common I/O J: Double Data Rate, Separate I/O K: Double Data II+, Common I/O M: Sync Burst + NtRAM N: Sync Pipelined Burst + NtRAM P: Sync Pipe Q: Quad Data Rate I R: Quad Data Rate II S: Quad Data Rate II+
49: 2.5V,LVTTL,Hi SPEED 52: 2.5V,1.5/1.8V,HSTL,Burst2 54: 2.5V,1.5/1.8V,HSTL,Burst4 62: 2.5V/1.8V,HSTL,Burst2 64: 2.5V/1.8V,HSTL,Burst4 66: 2.5V,HSTL,R-R 74: 1.8V,2.5V,HSTL,All 82: 1.8V,HSTL,Burst2 84: 1.8V,HSTL,Burst4 88: 1.8V,HSTL,R-R T2: 1.8V,2Clock Latency,Burst2 T4: 1.8V,2Clock Latency,Burst4 U2: 1.8V,2.5Clock Latency,Burst2 U4: 1.8V,2.5Clock Latency,Burst4

WAFER, CHIP BIZ Level Division 0: NONE,NONE 1: Hot DC sort 2: Hot DC, selected AC sort

14~15. Speed

Sync Burst,Sync Burst + NtRAM < Mode is R-L > (Clock Accesss Time) 65: 6.5ns 70: 7ns 75: 7.5ns 80: 8ns 85: 8.5ns Other Small Classification (Clock Cycle Time) 10: 100MHz 11: 117MHz 13: 133MHz 14: 138MHz 16: 166MHz 20: 200MHz 25: 250MHz 26: 250MHz(1.75ns) 27: 275MHz 30: 300MHz 33: 333MHz 35: 350MHz 37: 375MHz 40: 400MHz(t-CYCLE) 42: 425MHz 45: 450MHz 50: 500MHz (except Sync Pipe)
M: 1st Generation A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation
80: 8M 40: 4M 64: 72M 16: 18M 32: 36M

11. --

09: x9 32: x32

08: x8 18: x18 36: x36

12. Package
H: BGA,FCBGA,PBGA G: BGA, FCBGA, FBGA (LF) F: FBGA E: FBGA (LF) Q: (L)QPF P: (L)QFP(LF) C: CHIP BIZ W: WAFER
16. Packing Type (16 digit)
- Common to all products, except of Mask ROM - Divided into TAPE & REEL (In Mask ROM, divided into TRAY, AMMO packing separately) Type Packing Type New Marking Component TAPE & REEL T Other (Tray, Tube, Jar) 0 (Number) Stack S Component TRAY Y (Mask ROM) AMMO PACKING A Module MODULE TAPE & REEL P MODULE Other Packing M
8~9. Vcc, Interface, Mode
00: 3.3V,LVTTL,2E1D WIDE 01: 3.3V,LVTTL,2E2D WIDE 08: 3.3V,LVTTL,2E2D Hi SPEED 09: 3.3V,LVTTL,Hi SPEED 11: 3.3V,HSTL,R-R 12: 3.3V,HSTL,R-L 14: 3.3V,HSTL,R-R Fixed ZQ 22: 3.3V,LVTTL,R-R 23: 3.3V,LVTTL,R-L 25: 3.3V,LVTTL,SB-FT WIDE 30: 1.8/2.5/3.3V,LVTTL,2E1D 31: 1.8/2.5/3.3V,LVTTL,2E2D 35: 1.8/2.5/3.3V,LVTTL,SB-FT 44: 2.5V,LVTTL,2E1D 45: 2.5V,LVTTL,2E2D

13. Temp, Power

COMMON (Temp,Power) 0: NONE,NONE (Containing of error handling code) C: Commercial,Normal E: Extended,Normal I: Industrial,Normal

MCP: NAND/DRAM

NAND Density 512Mb DRAM Density/Organization 256Mb (x16,x32) 512Mb (x16,x32) 256Mb (x16,x32) 1Gb 512Mb (x16,x32) 1Gb (x32) 2Gb 4Gb 512Mb (x16,x32) 1Gb (x16,x32) 1Gb (x32) Voltage (NAND-DRAM) 2.7V/1.8V - 1.8V 2.7V/1.8V - 1.8V *3.0V/1.8V - 1.8V *2.7V/1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 2.7V - 1.8V MCP Package 107/137FBGA 107/137FBGA 107/137FBGA 107/137FBGA 137FBGA 107/137FBGA 107/137FBGA 137FBGA 119/152FBGA 152/160/168FBGA 137FBGA PoP Package 120FBGA 120/136FBGA 152FBGA 119/152FBGA

MCP: OneNAND/DRAM

Data Transfer Rate MAX Media Type DVD+R DVD+RW DVD+R DUAL DVD-R DUAL DVD-R DVD-RW DVD-ROM (Single) DVD-ROM (Dual) CD-ROM CD-R US-RW HS-RW CD-RW DVD-RAM Data transfer mode Interface Buffer Memory Drive Install Form Size (W * H * L) Buffer Protection Lead Free Light Scribe Write 22X (29.7 MB/sec) 8X (10.8MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 22X (29.7 MB/sec) 6X (8.1MB/sec) 48X (7.2MB/sec) 32X (4.8MB/sec) 10X (1.5MB/sec) 4X (5.4MB/sec) 12X (16.2MB/sec) Read 16X (21.6MB/sec) 12X (16.2MB/sec) 12X (16.2MB/sec) 12X (16.2MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 48X (7.2MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 12X (16.2MB/sec)
Ultra DMA Mode 2: 33.3MB/sec, Multiword DMA mode2: 16.6MB/sec, PIO Mode 4: 16.7MB/sec ATA/ATAPI (E-IDE) 2M Horizontal / Vertical 148.2mm (W) x 42mm (H) X 170mm (D) with bezel yes yes no

www.samsungodd.com

SH-S223Q Optical Storage
1. DISC SUPPORT - READ: MASTERED DISC, CD-R, CD-RW, DVD-ROM, DVD-R 3.95GB, DVD-R 4.7GB Authoring, DVD-R 4.7GB General, DVD-RW 4.7GB, DVD-RW 8.5 GB(Double-layer), DVD+R 4.7GB, DVD+R 8.5GB(Double-layer), DVD+RW 4.7GB, DVD-RAM 4.7GB/2.6GB - WRITE: DVD 4.7GB(DVDR, DVDRW, DVD-RAM), Double LayerR, Double Layer-RW, CD-R, CD-RW - Print: DVD+/-R ( LF Media [Label/Data Side] / Non LF Media [Data Side] ) - (Optional) 2. DATA FORMAT: - CD: CD-DA, CD-ROM, MIXED-CD, CD-ROM XA, ENHANCED-CD, CD-EXTRA/CD+, Photo-CD, VIDEO-CD, CD-TEXT, CD-G, Multi-Session - DVD: DVD-RAM, DVD-ROM, DVD-VIDEO, Multi-Session(Read/Write), Multi-Border(Read)
Data Transfer Rate MAX Media Type DVD+R DVD+RW DVD+R DUAL DVD-R DUAL DVD-R DVD-RW DVD-ROM (Single) DVD-ROM (Dual) CD-ROM CD-R US-RW HS-RW CD-RW DVD-RAM Access Time Data transfer mode Interface Buffer Memory Drive Install Form Size (W * H * L) Buffer Protection Lead Free Light Scribe Write 22X(29.7 MB/sec) 8X (10.8MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 22X(29.7 MB/sec) 6X (8.1MB/sec) 48X (7.2MB/sec) 32X (4.8MB/sec) 10X (1.5MB/sec) 4X (0.6MB/sec) 12X (16.2MB/sec) SATA 1.5Gbps Serial-ATA 2M Horizontal / Vertical 148.2mm (W) X 170mm (D) X 42mm (H) with bezel Applied Applied Applied Read 16X (21.6MB/sec) 12X (16.2MB/sec) 12X (16.2MB/sec) 12X (16.2MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 48X (7.2MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 12X (16.2MB/sec)
CD 110ms (Random), DVD 130ms (Random)

SH-S223F Optical Storage

Data Transfer Rate MAX Media Type DVD+R DVD+RW DVD+R DUAL DVD-R DUAL DVD-R DVD-RW DVD-ROM (Single) DVD-ROM (Dual) CD-ROM CD-R US-RW HS-RW CD-RW DVD-RAM Access Time Data transfer mode Interface Buffer Memory Drive Install Form Size (W * H * L) Buffer Protection Lead Free Light Scribe Write 22X(29.7 MB/sec) 8X (10.8MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 22X(29.7 MB/sec) 6X (8.1MB/sec) 48X (7.2MB/sec) 32X (4.8MB/sec) 10X (1.5MB/sec) 4X (0.6MB/sec) 12X (16.2MB/sec) SATA 1.5Gbps Serial-ATA 2M Horizontal / Vertical 148.2mm (W) x 42mm (H) X 170mm (D) with Bezel yes yes no JANUARY 2009 www.samsungodd.com Read 16X (21.6MB/sec) 12X (16.2MB/sec) 12X (16.2MB/sec) 12X (16.2MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 16X (21.6MB/sec) 12X (16.2MB/sec) 48X (7.2MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 40X (6.0MB/sec) 12X (16.2MB/sec)

SN-S083M Optical Storage

CD 150ms (Random), DVD 160ms (Random) Ultra DMA Mode 2: 33.3MB/sec, Multiword DMA mode2: 16.6MB/sec, PIO Mode 4: 16.7MB/sec Serial-ATA 2M Horizontal / Vertical 128 (W) x 12.7 (H) x 127 (D) without Bezel yes yes yes

SN-S082H Optical Storage

- CD: CD-DA, CD-ROM, MIXED-CD, CD-ROM XA, ENHANCED-CD, CD-EXTRA/CD+, Photo-CD, VIDEO-CD, CD-TEXT, CD-G, Multi-Session - DVD: DVD-RAM, DVD-ROM, DVD-VIDEO, Multi-Session(Read/Write), Multi-Border(Read/Write)
Data Transfer Rate MAX Media Type DVD+R DVD+RW DVD+R DUAL DVD-R DUAL DVD-R DVD-RW DVD-ROM (Single) DVD-ROM (Dual) CD-ROM CD-R US-RW HS-RW CD-RW DVD-RAM Data transfer mode Interface Buffer Memory Drive Install Form Size (W * H * L) Buffer Protection Lead Free Light Scribe Write 8X (10.8MB/sec) 8X (10.8MB/sec) 6X (8.1MB/sec) 6X (8.1MB/sec) 8X (10.8MB/sec) 6X (8.1MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 10X (1.5MB/sec) 4X (0.6MB/sec) 5X (6.75MB/sec) Read 8X (10.8MB/sec) 8X (10.8MB/sec) 8X (10.8MB/sec) 8X (10.8MB/sec) 8X (10.8MB/sec) 8X (10.8MB/sec) 8X (10.8MB/sec) 8X (10.8MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 5X (6.75MB/sec)
Ultra DMA Mode 2: 33.3MB/sec, Multiword DMA mode2: 16.6MB/sec, PIO Mode 4: 16.7MB/sec ATA/ATAPI(E-IDE) 2M Horizontal 128 (W) x 12.7 (H) x 127 (D) without Bezel yes yes no www.samsungodd.com

SN-M242D Optical Storage

CD-DA, CD-ROM, Video CD, CD-I/FMV, CD-ROM XA, Multi-Session Disc, DVD-ROM, DVD-VIDEO, DVDR,DVDRW, CD-R,CD-RW, DVD-RAM
Data Transfer Rate MAX Media Type DVD+R DVD+RW DVD+R DUAL DVD-R DUAL DVD-R DVD-RW DVD-ROM (Single) DVD-ROM (Dual) CD-ROM CD-R US-RW HS-RW CD-RW DVD-RAM Data transfer mode Interface Buffer Memory Drive Install Form Size (W * H * L) Buffer Protection Lead Free Light Scribe Write 24X (3.6MB/sec) 24X (3.6MB/sec) 10X (1.5MB/sec) 4X (0.6MB/sec) Read 8X (10.8MB/sec) 8X (10.8MB/sec) 6X (8.1MB/sec) 6X (8.1MB/sec) 8X (10.8MB/sec) 8X (10.8MB/sec) 8X (10.8MB/sec) 6X (8.1MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 24X (3.6MB/sec) 5X (6.75MB/sec)
Ultra DMA Mode 2: 33.3MB/sec, Multiword DMA mode2: 16.6MB/sec, PIO Mode 4: 16.7MB/sec ATA/ATAPI (E-IDE) 2M Horizontal / Vertical 128 X 12.7 X 129.0 yes yes no
[USB 2.0] SE-S084B Optical Storage
1. DISC TYPE READ: MASTERED DISC, CD-R, CD-RW, DVD-ROM, DVD+R 4.7GB, DVD+R DL 8.5GB, DVD+RW 4.7GB, DVD-R 3.95GB, DVD-R 4.7GB Authoring, DVD-R 4.7GB General, DVD-R DL 8.5GB, DVD-RW, DVD-RAM 4.7GB WRITE: DVD4.7GB(DVDR/RW, DVD-RAM), DVDR DL(8.5GB), CD-R/RW Print: CD-R, DVD+/-R Light Scribe Media 2. DATA FORMAT: CD: CD-DA, CD-ROM, MIXED-CD, CD-ROM XA, ENHANCED-CD, CD-EXTRA/CD+, Photo-CD, VIDEO-CD, CD-TEXT, CD-G, Multi-Session DVD: DDVD-RAM, DVD-ROM, DVD-VIDEO, Multi-Session (Read/Write), Multi-Border(Read/Write) 3. Recording mode CD-R/RW: DAO, TAO, SAO, Packet Write(RW) DVD+R/RW: Sequential, Random(RW) DVD-R/RW: Incremental, DAO, Restricted Overwrite(RW) DVD-RAM: Random

CA49-LT-1

Full detailed report
(ISO/IEC 24734 Office Category Test)
Model: WorkForce 310 All-in-One
Printing device and test setting
Test Start Date and Time Tester Color or B/W Configuration (Option) Temperature and Humidity Voltage Test End Date and Time 2009/01/28 , 4:00 pm Harada Kazue/Onishi Tadashi Color Printing device Option wasn't used 25 / 21% Within Rating voltage 2009/01/28 , 6:00 pm

Modes and Settings

Print Quality mode B&W settings Setting N set count Collating function
Default Activated (Driver, select "Black/Grayscale") Activated (Application, select "count up" or "count down") Activated (Application, select "collate") Default Default Rear paper input Front exit tray Default (face up) N/A
Paper sending direction Paper type setting

Paper path

Paper feeding Paper exit Output orientation Duplexing unit
Manufacturer Weight Size Paper type/Name
Fuji Xerox 64g/m2 Letter PPC/V604

Test system parameters

Test system Computer Processor System Chip Set System Board System Memory Hard Drive and Subsystem Video system Optical Drive I/O Subsystem USB Subsystem Software Operating System Printing Application EPSON Direct Endeavor Pro4300 Intel Core2Duo E6850 Intel P35 Express chipset ASUSTeK: IPIBL-CHBIOS : AMI Version 0121 2GB, 800MHz, DDR2, SanMaxTechnologies p/nSMD-1G48H1P-8E2 320GB,(Samsung HD161HJ 160GB 7200rpm)2SATA/3000 Sapphire Radeon HD2400L/P/RW 256MB dedicated video memory. PLDS DH-48C2S SATA USB keyboard and mouse System board USB controller , USB2.0 Microsoft Windows Vista Home Premium Edition Adobe Reader 9.0.0 Microsoft Office Excel2007 Microsoft Office Word2007 Print Driver Test Files Location Printing Device Connection USB Version 6.60 Office Category files, hard drive USB 2.0 Keyboard and mouse were connected.
Application setting deviations from default.
Changing from default. Excel and Word Adobe Reader "Scale Content for A4 or 8.5 x 11" Paper size" set to off. "Paper Scaling" set to "None".

Summary Report

Office Category Test Simplex Average Duplex Average Simplex Average Duplex Average FSOT [seconds] 56 N/A 19 N/A ESAT [ppm/ipm] 5.5 N/A 16 N/A

Color (Default)

B&W mode
Notes 1) All printing device and print driver setting were default mode. 2) For the B&W result, the print driver was set to "Black/Grayscale"

Full Report

FSOT Office Category Test [seconds] 1set test EFTP [ppm/ipm] 1set+30 seconds (# sets) 4.0 PDF 62 3.8 (2 sets) Word Simplex Excel 75 3.(6 sets) 9.2 Simplex Excel Word set+4 minutes (# sets) 4.1 4.1 PDF (3 sets) (17 sets) 19 ESAT Office Category Test [ppm/ipm] [seconds] 1set test FSOT EFTP [ppm/ipm] 1set+30 seconds (# sets) set+4 minutes (# sets) ESAT [ppm/ipm]
Average Color (Default) PDF

56 N/A N/A N/A N/A

5.5 B&W mode

Average

19 N/A

N/A N/A

Word Duplex Excel

N/A Duplex