(V) 2.5 2.5 2.5 2.8 2.8 2.5 2.5 1.8 1.8 2.0 2.0 2.5 2.5 1.8 1.8 1.8 1.8 1.8 1.8 1.8 2.5 2.5
Interface SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_2 SSTL_18 SSTL_18 SSTL_18 SSTL_18 SSTL SSTL_2 SSTL_2
Package 100 TQFP 144 FBGA Leaded 144 FBGA Lead Free 144 FBGA Leaded 144 FBGA Lead Free 144 FBGA Leaded 144 FBGA Lead Free 144 FBGA Leaded 144 FBGA Lead Free 144 FBGA Leaded 144 FBGA Lead Free 66 TSOPII Leaded 66 TSOPII Lead Free 144 FBGA Leaded 144 FBGA Lead Free 144 FBGA Leaded 144 FBGA Lead Free 144 FBGA Leaded 144 FBGA Lead Free 84 FBGA Leaded 66 TSOPII Leaded 66 TSOPII Lead Free
Features** DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR GDDR1 GDDR1 GDDR1 GDDR1 GDDR3 GDDR3 GDDR2 DDR DDR
* clock cycle time ** all products are 4 banks Description 1.25ns (800MHz) 1.429ns (700MHz) 1.667ns (600MHz) 1.818ns (550MHz) 2.0 ns (500MHz) 2.2 ns (450MHz) 2.5 ns (400MHz) 2.67 ns (375MHz) 2.86 ns (350MHz) 3.3 ns (300MHZ) 3.6 ns (275MHz) 3.7 ns (266MHz) 4.0 ns (250MHz) 4.5 ns (222MHz) 5.0 ns (200MHz) 5.5 ns (183MHz) 6.0 ns (166MHz)
DRAM Ordering Information
DRAM ORDERING INFORMATION
K 1 1. 2. 3. Memory (K) DRAM : 4 Small Classification A : Advanced Dram Technology C : Network-DRAM D : DDR SGRAM E : EDO F : FP G : SGRAM H : DDR SDRAM J : GDDR3 SDRAM M : Mobile SDRAM N : DDR SGRAM P : FP(Quad CAS) Q : EDO(Quad CAS) R : Direct RDRAM S : SDRAM T : DDR SDRAM V : VRAM W : WRAM X : Mobile DDR SDRAM Y : YDRAM Z : Value Added DRAM 4~5. Density, Refresh 11 : 1G,64K/16ms 15 : 16M,1K/16ms 16 : 16M,2K/32ms 17 : 16M,4K/64ms 26 : 128M,4K/32ms 27 : 128M,16K/32ms 28 : 128M,4K/64ms 32 : 32M,2K/32ms 40 : 4M,512/8ms 41 : 4M,1K/16ms 44 : 144M,16K/32ms 50 : 512M,32K/16ms 51 : 512M,8K/64ms 52 : 512M,8K/32ms 54 : 256M,16K/16ms 55 : 256M,4K/32ms 56 : 256M,8K/64ms 57 : 256M,16K/32ms 58 : 256M,8K/32ms 0 : TTL,5.0V,5.0V 1 : TTL,5.0V,5.0V 2 : LVTTL,3.3V,3.3V 3 : LVTTL,3.0V,3.0V 4 : LVTTL,2.5V,2.5V 7 : SSTL-2,3.3V,2.5V 8 : SSTL-2,2.5V,2.5V 9 : RSL,2.5V,2.5V A : SSTL,2.5V,1.8V H : SSTL-2 DLL,3.3V,2.5V J : LVTTL,3.0V,1.8V L : LVTTL,2.5V,1.8V M : LVTTL,1.8V,1.5V N : LVTTL,1.5V,1.5V P : LVTTL,1.8V,1.8V Q : SSTL,1.8V,1.8V R : SSTL-2,2.8V,2.8V

8M bit 4M bit

2M bit
UTRAM (HIGH DENSITY & LOW POWER)
Density 32M bit Part Number K1S321615M K1S321611C K1S321615A K1S161615M K1S1616B1M Organization 2Mx16 2Mx17 2Mx16 1Mx16 1Mx16 Vcc (V) 1.8 Speed (ns) 70 Operating Temp E I E I I Operating Current (mA) 35 Standby Current (uA) 60 Package 48-TBGA 48-FBGA 48-TBGA 48-TBGA 48-TBGA Production Status EOL Mass Production Mass Production Mass Production Mass Production

16M bit

HIGH SPEED (4M BIT) ASYNCHRONOUS FAST SRAM
Density 4M bit Part Number K6R4016C1D K6R4016V1D K6R4004C1D K6R4004V1D K6R4008C1D K6R4008V1D K6R3024V1D K6R1008V1D K6R1008C1D K6R1004V1D K6R1004C1D K6R1016V1D K6R1016C1D Organization 256Kx16 256Kx16 1Mx4 1Mx4 512Kx8 512Kx8 128x24 128x8 128x8 256x4 256x4 64x16 64x16 Vcc (V) 5 3.3.3.3 3.3 3.3.3.Speed (ns) 10, 12 8, 10 10, 12 8, 10 10, 12 8, 10 9, 10, 12 8, 10, 12 10, 12, 15 8, 10, 12 10, 12, 15 8, 10, 12 10, 12, 15 Operating Temp C,I C,L,I,P C,I C,I C,I,P C,I C,I C,I C,I C,I C,I C,I C,I Operating Current (mA) 65, 55 80, 65 65, 55 80, 65 65, 55 80, 65 170,150,130 170,150,130 170,150,130 170,150,130 170,150,130 170,150,130 170,150,130 Standb y Current (uA) 20, 5 20, 5(1.2) 20, 5 20, 5 20, 5 20, 5 40,15 20,5 20,5 20,5 20,5 20,5 20,5 Package 44SOJ, 44TSOP2, 48TBGA 44SOJ, 44TSOP2, 48TBGA 32 SOJ 32 SOJ 36 SOJ, 44 TSOPSOJ, 44 TSOP2 119PBGA 32SOJ,32TSOP2 32SOJ,32TSOP2 32SOJ 32SOJ 44SOJ,44TSOP2,48TBGA 44SOJ,44TSOP2,48TBGA Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production

3M bit 1M bit

SPB & FT (32M BIT) SRAM
Part Number K7A323600M K7A321800M K7B323625M K7B321825M Organization 1Mx36 2Mx18 1Mx36 2Mx18 Operating Mode SPB SPB SB SB Vdd (V) 3.3 3.3 3.3 3.3 Access Time tCD(ns) 2.6, 3.1, 4.0 2.6, 3.1, 4.0 6.5, 7.5 6.5, 7.5 Speed tCYC (MHz) 250, 200, 138 250, 200, 138 133, 118, 100 133, 118, 100 I/O Voltage (V) 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 Package 100TQFP 100TQFP 100TQFP 100TQFP Production Status Mass Production Mass Production Mass Production Mass Production Comments 2E1D 2E1D -
NOTES: 1. 2E1D stands for 2 cycle Enable and 1 cycle Disable
SPB & FT (16M BIT) SRAM
Part Number K7A163600A K7A163601A K7A161800A K7A161801A K7B163625A K7B161825A Organization 512Kx36 512Kx36 1Mx18 1Mx18 512Kx36 1Mx18 Operating Mode SPB SPB SPB SPB SB SB Vdd (V) 3.3 3.3 3.3 3.3 3.3 3.3 Access Time tCD (ns) 2.6, 3.1, 3.5, 4.0 2.6, 3.1, 3.5, 4.0 2.6, 3.1, 3.5, 4.0 2.6, 3.1, 3.5, 4.0 7.5, 8.5 7.5, 8.5 Speed tCYC (MHz) 250, 167, 138 200, 167 250, 167, 138 200, 167 118, 100 118, 100 I/O Voltage (V) 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 Package 100TQFP 100TQFP 100TQFP 100TQFP 100TQFP 100TQFP Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Comments 2E1D 2E2D 2E1D 2E2D -

Part Number K7N161801A K7N163601A K7N163645A K7N161845A K7M161825A K7M163625A Organization 1Mx18 512Kx36 512Kx36 1Mx18 1Mx18 512Kx36 Operating Mode SPB SPB SPB SPB FT(SB) FT(SB) Access Time Vdd (V) tCD(ns) 3.3 3.3 2.5 2.5 3.3 3.3 2.6, 3.2, 3.5, 4.2 2.6, 3.2, 3.5, 4.2 2.6, 3.2, 3.5, 4.2 2.6, 3.2, 3.5, 4.2 6.5, 7.5 6.5, 7.5 Speed tCYC (MHz) 250, 200, 167, 133 250, 200, 167, 133 250, 200, 167, 133 250, 200, 167, 133 133, 117 133, 117 I/O Voltage (V) 3.3, 2.5 3.3, 2.5 2.5 2.5 3.3, 2.5 3.3, 2.5 Package 100TQFP, 165FBGA 100TQFP, 165FBGA 100TQFP, 165FBGA 100TQFP, 165FBGA 100TQFP 100TQFP Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
SPB & FT (8M BIT) NTRAM
Part Number K7N803601B K7N801801B K7N803609B K7N801809B K7N803645B K7N801845B K7N803649B K7N801849B K7M801825B K7M803625B Organization 256Kx36 512Kx18 256Kx36 512Kx18 256Kx36 512Kx18 256Kx36 512Kx18 512Kx18 256Kx36 Operating Mode SPB SPB SPB SPB SPB SPB SPB SPB FT FT Access Time Vdd (V) tCD(ns) 3.3 3.3 3.3 3.3 2.5 2.5 2.5 2.5 3.3 3.3 3.5, 4.2 3.5, 4.2 2.6 2.6 3.5, 4.2 3.5, 4.2 2.6 2.6 6.5,7.5 6.5,7.5 Speed tCYC (MHz) 167,133 167,250 167,133 167,250 133,117 133,117 I/O Voltage (V) 3.3,2.5 3.3,2.5 3.3,2.5 3.3,2.5 2.5 2.5 2.5 2.5 3.3, 2.5 3.3, 2.5 Package 100TQFP 100TQFP 100TQFP 100TQFP 100TQFP 100TQFP 100TQFP 100TQFP 100TQFP 100TQFP Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
SPB & FT (4M BIT) NTRAM
Part Number K7N403601B K7N401801B K7N403609B K7N401809B Organization 128Kx36 256Kx18 128Kx36 256Kx18 Operating Mode SPB SPB SPB SPB Vdd (V) 3.3 3.3 3.3 3.3 Access Time tCD(ns) 3.5, 4.2 3.5, 4.2 2.6, 3.0 2.6, 3.0 Speed tCYC (MHz) 167,133 167,133 250,200 250,200 I/O Voltage (V) 3.3,2.5 3.3,2.5 3.3,2.5 3.3,2.5 Package 100 TQFP 100 TQFP 100 TQFP 100 TQFP Production Status Mass Production Mass Production Mass Production Mass Production
LATE WRITE R-R (16M BIT) SRAM
Part Number K7P161866A K7P163666A Organization 1Mx18 512Kx36 Operating Mode SP SP Vdd (V) 2.5 2.5 Access Time tCD(ns) 2 1.6 Speed tCYC (MHz) 250 300,250 I/O Voltage (V) 1.5 (Max 1.9) 1.5 (Max.1.9) Package 119BGA 119BGA Production Status Mass Production Mass Production

LF35 L35H L35

ASIC CORE LIBRARY
Samsungs deliverables for embedded cores include Verilog/VHDL models, synthesis models, and wire-bonded test chips, including packaged ARM core, TeakDSPCore, Video Encoder/Decoder, and Ethernet10/100BT MAC/PHY. A software development toolkit, featuring an assembler, a debugger, a compiler and a linker is available. Samsungs ASIC Core Library arsenal provides the following cores and macrocells: I/O LIBRARY --------0.35m-------- 0.25m STD90 / STDM90 STD110 A A A A A A NA G A NA NA NA A A NA NA AR AR A AR G G A NA G AR A A A A A A AR AR AR A D NA A A 0.18m STD130 A A A G NA NA AR AR AR AR AR NA AR A A AR AR AR NA A --------0.13m-------STD150HS A A A G NA NA AR G AR G G NA AR A A AR G AR NA A STD150G A A A G NA NA AR AR AR G G NA AR A A AR G AR NA A STD150LP A A A G NA NA AR AR AR G G NA AR A A AR G AR NA A

I/O I/O-IP

CMOS, TTL I/O Buffers 3/5V tolerant Slew control PVT impedance control True 5V I/O AGP4X ATA5 ATA6 CardBus/PCI GTL HSTL IEEE1284 LVDS OSC (KHz) OSC (MHz) PCI PECL SSTL Ultra2- SCSI (LVD) USB1.1
NOTES: * I/O review sheet (I/O interface for I/O-IP review sheet in NCTS (New Cell Traveler Sheet) 1 A = Available 6 E = Under development (design and layout will be finished by the date) 2 AR = Available upon Request 7 F = Scheduled (design and layout will be finished by the date) 3 B = Under test (test will be finished by the date) 8 G = Will be developed based upon customer's request (SEC has more than 90% confidence for silicon result) 4 C = In fabrication line (fab. out date) 9 TBD = To Be Determined 5 D = GDS is available but silicon has not been verified 10 NA = Not Available (SEC has more than 90% confidence in silicon result) * For further information, please contact: jhprk@samsung.co.kr

ASIC DIGITAL CORE

DSP Cores
SSP1820 (OAK Compatible 16-Bit DSP Core) TeakLite (TeakLite Compatible 16-Bit DSP Core) Teak (Teak Compatible 16-Bit DSP Core)

CPU Cores

SAM17(8)X (ARM7TDMI Compatible RISC Processor) SAM40X (ARM9TDMI Compatible RISC Processor) SAM42X (ARM920T Compatible RISC Processor) SAM44X (ARM940T Compatible RISC Processor)

Interface Cores

USB1.1 Function Controller USB2.0 Function Controller USB1.1 Host Controller USB FS OTG Controller USB2.0 Phy (L18) USB2.0 Phy (L13)

BUS Architecture

AMBA2.0 (Micro Pack v2.0) AMBA3.0 (ADK)
ARM920T (ARM920T Compatible RISC Processor) ARM940T (ARM940T Compatible RISC Processor) ARM926EJS (ARM926EJ-S Compatible RISC Processor) ARM1020E (ARM1020E Compatible RISC Processor) ETM9 (Embedded Trace Macrocell for ARM9 core) ETM7 (Embedded Trace Macrocell for ARM7 core) ARM946E-S (ARM946E-S Compatible RISC Processor) ARM7TDMI-S (ARM7TDMI-S Compatible RISC Processor) ARM1136JF-S (ARM1136JF-S Compatible RISC Processor)

IEEE1394a Link IEE1394a DV Link IEEE1394a Phy (L18) PCI Bridge PCI Device PCI2AHB Ethernet MAC (10/100)
ASIC LINE-UP TABLE FOR COMPILED MEMORY
STD90 L35 SPSRAM SPSRAMBW SPSRAMR DPSRAM DPSRAMBW DPSRAMR SPARAM SPARAMBW ARFRAM SRFRAM DROM @ Active MROM @ Met-2 VROM @ Via-1 FIFO CAM HCSPSRAM HCVROM @ Via-1 HD A A NA A NA NA A NA NA NA A A NA NA NA NA NA HD A A NA A NA NA A NA A NA A A NA NA NA NA NA STD110 -----L25----LP A NA NA A NA NA A NA NA NA A A NA NA NA NA NA MDL120 LD25 HD HD A A A A NA A A A NA A NA NA NA NA NA A NA A NA NA A A A A NA NA NA A NA A NA A NA A STD130 -----L18----LP A A NA A A NA NA NA NA NA NA NA NA NA NA NA NA HD A A A A A NA NA A NA NA A A NA A A NA NA STDL130 -----L18L----LP A A NA A A NA NA NA NA NA NA NA NA NA NA NA NA HD A A A A A A NA NA NA A NA NA A AR AR AR AR STDH150 -----L13HS----LP NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA STD150 -----L13G-----HD LP A A A A A A A A A A A A NA NA NA NA NA NA A NA NA NA NA NA A NA AR NA A NA A NA A NA STDL150 -----L13LP----HD LP AR A AR A AR A AR A AR A AR A AR NA AR NA NA NA A NA NA NA NA NA A NA AR NA AR NA AR NA AR NA
NOTES: A = Available AR = Available Upon Request E = Under Development (design and layout will be finished by the date) NA = Not Available

ASIC MIXED SIGNAL IP

High Resolution and Performance for Mixed Signal Cores (Based on Silicon Proven)
ADC: 1.8V 8-bit 250MHz ADC 1.8V 10-bit 150MHz ADC 3.3V 14-bit 80MHz ADC" DAC: 3.3V 8-bit 300MHz DAC 3.3V 12-bit 80MHz DAC 3.3V 14-bit 40NHz DAC" 1.2V 8-bit 80MHz DAC" PLL : 3.3V 800MHz FSPLL 1.8V 200MHz Pixel Clock Gen 1.2V 230MHz Dithered PLL" CODEC : 3.3V 16-bit Audio DAC 3.3V 16-bit Audio CODEC" CODEC : 2.5V 16-bit Audio DAC PLL : 1.2V 100M/300M/500M FSPLL DAC : 1.2V 8-Bit 2MHz DAC The Shortest TAT for Customer Specific Cores
Low Voltage Mixed Signal Cores for SoC
ADC : 1.2V 8-Bit 30MHz ADC 1.2V 10-bit 100MHz ADC"
Full Customer Support Specific Cores
Support for Various Kinds of MSC Architectures
ASIC DESIGN TOOLS AND METHODOLOGY / ASIC PACKAGING AND TESTABILITY
Advanced delay predictors, non-linear modeling, and comprehensive EDA tool support (Synopsys, Cadence, Mentor, WattWatcher, Avant!) are integral components of Samsungs ASIC design tools and methodology. This integration enables designers to minimize design development time and die size, while maximizing chip-level performance and reliability. Advanced deep submicron tools include Static Timing Analysis Signoff, Formal Verification, and Physical Synthesis. The ASIC business is more than silicon and packaging, yet a company with strength in packaging is a tremendous asset in delivering a quality product and assuring fast time-to-volume. Samsungs packaging technology covers the gamut of package types and pin counts to accommodate function, power dissipation, and high levels of integration. Samsungs own packaging portfolio is enhanced by its partnership with Amkor, resulting in a wide variety of packaging options (PQFP, TQFP, PLCC, PBGA, mini BGA, flex BGA, SuperBGA and CSP). Samsungs renowned quality is applied to its ASIC business through support of comprehensive test methodologies, such as IEEE 1149.1, Scan ATPG, RAMBIST, Fault Grading, IDDQ, and Mixed Signal Testing.

NOTES: 1. 2.

Segment 60

Common 34 16

CG ROM (Ch.) 10160 (254) 10160 (254) 10080 (236) 8320 (224) 8400 (240) 9600 (240) 9600 (240) 9600 (240) 9600 (240) 9600 (240) 9600 (240) 10240 (256) 10240 (256) 21760 (544) 8320 (224)
CGRAM (Ch.) 80 (2) 80 (2) 512 (8) 512 (8) 512 (8) 160 (4) 512 (8) 512 (8) 512 (8) 512 (8) 512 (8) 160 (4) 320 (8) 80 (6) 512 (8)
Interface (Bit) 4/8 4/8 4/8 4/8 4/8 4/8 1/4 1/4 1/4 1/4 1/4 1/4 1/4 1/4 4/8
VDD (V) 2.4~5.5 2.4~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.4~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.4~5.5 2.4~5.5 2.2~3.6 2.7~5.5

Vlcd (Max. V) 7 10

DC/DC Convert (Times)
2 2~3 2~3 2~3 2~3 2~3 2~4
Package Au bump chip Au bump chip Bare die/64QFP Bare die/80QFP Bare die/Au bump chip Au bump chip/TCP Au bump chip Bare die Bare die Bare die Bare die/TCP Bare die Au bump chip/TCP Au bump chip/TCP Au bump chip Bare die/
Devices marked with an asterisk (*) are under development. TCP (Tape Carrier Package)
Bare die is equivalent term with bare chip, pellet or die. COF (Chip On Film) is available in case of TCP.
STN GRAPHIC LCD DRIVER ICS
Part Number S6BS6B0086 S6B0715 S6B0717 S6B0718 S6B0719 S6B0723 S6B0724 S6B0725 S6B0728 S6B0741 S6B0755 S6B0756 S6B0759 S6B2400 S6B0794 S6B0796 S6B1713

Notes: 1. 2.

Segment V V 240 132

Common 65

DDRAM (Bits) Interface (Bit) 1 4.5~5.5 1/4 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 4/8 4/8 1/8
VDD (V) 4.5~5.2.7~5.5 2.4~5.5 2.4~5.5 2.4~3.6 2.4~3.6 2.4~5.5 2.4~5.5 2.4~3.6 2.4~3.6 1.8~3.3 1.8~3.3 1.8~3.3 1.8~3.3 1.8~3.3 2.4~5.5 2.4~5.5 2.4~5.5
DC/DC Convert Vlcd (Max. V) (Times) 15
Package Bare die/100QFP/100TQFP
2~4 2~5 3~6 3~6 2~5 2~5 2~5 3~7 3~6 3~5 2~4 3~6 3~5
Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP TCP Au bump chip Au bump chip Au bump chip/TCP TCP Au bump chip/TCP Au bump chip Au bump chip/TCP Au bump chip Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP

NOTES:

ROM Nibble 1
RAM I/O Pins (Int/Ext) 32 15/19
Interrupt Timer/ Counters SIO -
LCD ADC Max. OSC. (Seg/Com) (Bit x Ch) (Bit x Ch) Vdd (V) (oC) 6MHz 1.8 ~ 3.6
Oper. Temp. Other Features -20 ~ 85

6MHz 6MHz

1.8 ~ 3.6 1.8 ~ 3.6

-20 ~ 85 -20 ~ 85

BT/WT/8Tx2

1.8 ~ 5.5

-25 ~ 85
3/2 3/3 3/3 3/4 5/4 2/2 3/3
BT/WT/8TC BT/WT/ WDT/8T BT/WT/ WDT/8T/16T BT/WT/8TC BT/WT/WDT/8T/16T BT/WT/8TC BT/WT/8TC

Yes Yes Yes Yes Yes

32/4 26/4 40/8 80/16 32/4 32/4
Comx4 Comx2 Comx2 Comx3 -
6MHz 6MHz 6MHz 6MHz 6MHz 6MHz 6MHz
1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 2.0 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5
-25 ~ 85 -25 ~ 85 -25 ~ 85 -25 ~ 85 -25 ~ 85 -25 ~ 85 -25 ~ 85
4/4 3/3 2/3 4/4 5/3 4/3 3/3
BT/WT/8TC/16TC BT/WT/8TCx2 BT/WT/WDT/8T BT/WT/ WDT/8T BT/WT/WDT/8Tx2 BT/WT/8Tx2 BT/WT/WDT/8Tx2

Yes Yes Yes Yes -

56/16 60/12 28/4 28/4 -

8x4 8x4 8x6 -

1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 2.0 ~ 5.5 1.8 ~ 5.5

BT/WT/WDT/8Tx2

2/2 4/3 5/4 2/2 4/4
BT/WDT/8T BT/WT/WDT/8Tx2 BT/WT/WDT/ 8T/16T BT/WT/8TC BT/WT/WDT/8TCx2

Yes Yes -

60/16 32/4 -

1.8 ~ 5.5 1.8 ~ 5.5

-25 ~ 85 -25 ~ 85 -25 ~ 85 -25 ~ ~ 70
6MHz 1.8 ~ 5.5 6MHz 1.8 ~ 5.5 3.58MHz 2.7 ~ 5.5
1. * Under Development. Contact Samsung Sales offices for availability. 2. (1) ( ) : S/W supported PWM. 3. Abbreviations: SIO = Serial Input/Output ADC = Analog to Digital converter PWM = Pulse Width Modulation ZCD = Zero Cross Detection Cuircuit DAC = Digital to Analog converter Com = Comparator DTMF = Dual Tone Multi Frequency FSK = Frequency Shift Keying 8TC / 16TC = 8-bit / 16-bit Timer/Counter BT / WT / WDT = Basic / Watch / Watchdog timer
8-BIT MICROCONTROLLER FAMILY
Part Number Package Type ROM RAM Interrupt Kbytes Bytes I/O Pins (Int/Ext) 1/12 4/10 Timer/ Counter BT/WDT/8T BT/WT/8TCx2 Serial LCD ADC PWM(1) Max. OSC. Interface (Seg/Com) (Bit x Ch) (Bit x Ch) Freq. Vdd (V) SIO 16x8 10x4 (8x1) 4MHz 8MHz 4.5 ~ 5.5 2.0 ~ 5.5 Oper. Temp. -25~ 85 -25 ~ 85 S3C9xxx (KS86) Series S3C9004DZ0-DPB4 40DIP S3C9228AZ0-AQB8 42SDIP S3C9228AZ0-QZR8 44QFP S3C9228AZ0-LRR8 48ELP S3P9234XZ0-QTR4 * 64QFP S3C9404DZ0-AVB4 30SDIP S3C9404DZ0-SOB4 32SOP S3C9414XZ0-AMB4 24SDIP S3C9414XZ0-SMB4 24SOP S3C9428XZ0-SNB4 28SOP S3C9428XZ0-SOB4 32SOP S3C9428XZ0-AVB4 30SDIP S3C9428XZ0-SNB8 28SOP S3C9428XZ0-SOB8 32SOP S3C9428XZ0-AVB8 30SDIP S3C9434XZ0-DIB4 18DIP S3C9434XZ0-DKB4 20DIP S3C9434XZ0-SKB4 20SOP S3C9444XZ0-SCB4 8SOP S3C9444XZ0-DCB4 8DIP S3C9454AZ0-DHB4 16DIP S3C9454AZ0-SHB4 16SOP S3C9454AZ0-DKB4 20DIP S3C9454AZ0-SKB4 20SOP S3C9464XZ0-SCB4* 8SOP S3C9464XZ0-DCB4* 8DIP S3C9474XZ0-DKB4* 20DIP S3C9474XZ0-SKB4* 20SOP S3C9488XZ0-AOB8* 32SDIP S3C9488XZ0-SOB8* 32SOP S3C9488XZ0-AQB8* 42SDIP S3C9488XZ0-QZR8* 44QFP S3C9498XZ0-SNB8* 28SOP S3C9498XZ0-SOB8* 32SOP S3C9498XZ0-AVB8* 30SDIP S3C9688XZ0-AQB8* 42SDIP S3C9688XZ0-QZR8* 44QFP S3P9698XZ0-DHB8* 16DIP S3P9698XZ0-SHB8* 16SOP S3P9698XZ0-DKB8* 20DIP S3P9698XZ0-SKB8* 20SOP

208 208

5/7 3/3 3/3 5/4
BT/WT/8TCx2 BT/WDT/8Tx2 BT/WDT/8Tx2 BT/WDT/8Tx2

SIO IIC, SIO

32/4 -

8x8 10x5 10x12

(10x1) (10x1)

8MHz 10MHz 10MHz

2.0 ~ 5.5 2.7 ~ 5.5 2.7 ~ 5.5 1.8 ~ 5.5
-25 ~ 85 -25~ 85 -25~ 85 -25~ 85

12x2,(8x1) 16MHz

BT/WDT/8T

3.0 ~ 5.5

-25~ 85

1/2 2/2

BT/8TC BT/8TC

10x3 10x9

10MHz 10MHz

2.0 ~ 5.5 2.0 ~ 5.5

-25~ 85 -25~ 85

7/2 7/3

BT/8TC BT/8TC BT/8TX1
LIN, UART LIN, UART UART 19/8

10x3 10x9 10x9

10x1 8x1

10MHz 10MHz 10MHz

2.0 ~ 5.5 2.0 ~ 5.5 2.2 ~ 5.5

-40~ 85 -40~ 85 -25 ~ 85

38/36/26 6/4

BT/8TCx3/16TC

SIO UART

12x1(8x1) 16MHz

1.8~5.5

15/14 10/14

BT/WDT/8T 8BT/8WDT/8TC

USB USBSIO

4.0 ~ 5.25 4.0 ~ 5.25
Package ROM Part Number Type S3C9xxx (KS86) Series S3C80A5AZ0-SMB8 24SOP S3C80A5AZ0-AMB8 24SDIP S3C80A5AZ0-SMB5 24SOP S3C80A5AZ0-AMB5 24SDIP S3C80B5XZ0-SMB8 24SOP S3C80B5XZ0-AMB8 24SDIP S3C80B5XZ0-SMB5 24SOP S3C80B5XZ0-AMB5 24SDIP S3C80C5XZ0-SMB8 24SOP S3C80C5XZ0-AMB8 24SDIP S3C80C5XZ0-SMB5 24SOP S3C80C5XZ0-AMB5 4SDIP S3C80D5XZ0-SMB8 24SOP S3C80D5XZ0-AMB8 24SDIP S3C80DXZ0-SMB5 24SOP S3C80D5XZ0-AMB5 24SDIP S3C80E7XZ0-AOB5 32SDIP S3C80E7XZ0-SOB5 32SOP S3C80E7XZ0-DPB5 40DIP S3C80E7XZ0-AOB7 32SDIP S3C80E7XZ0-SOB7 32SOP S3C80E7XZ0-DPB7 40DIP S3C80F9XZ0-SOB7 32SOP S3C80F9XZ0-AQB7 42SDIP S3C80F9XZ0-QZR7 44QFP / 48ELP S3C80F9XZ0-SOB9 32SOP S3C80F9XZ0-AQB9 42SDIP S3C80F9XZ0-QZR9 44QFP S3C80F9XZ0-LRR9 48ELP S3C80G9XZ0-SOB7 32SOP S3C80G9XZ0-AQB7 42SDIP S3C80G9XZ0-QZR7 44QFP S3C80G9XZ0-SOB9 32SOP S3C80G9XZ0-AQB9 42SDIP S3C80G9XZ0-QZR9 44QFP 32SOP S3C8095DZ0-SOB5 S3C8095DZ0-AOB5 32SDIP S3C8235BZ0-QTR8 64QFP 64LQFP S3C8235BZ0-ETR8 S3C8235BZ0-QTR5 64QFP 64LQFP S3C8235BZ0-ETR5 S3C8245AZ0-TWR8 80TQFP S3C8245AZ0-QWR8 80QFP S3C8245AZ0-TWR5 80TQFP S3C8245AZ0-QWR5 80QFP S3C8249XZ0-TWR7 80TQFP S3C8249XZ0-QWR7 80QFP S3C8249XZ0-TWR7 80TQFP S3C8249XZ0-QWR7 80QFP RAM Interrupt Timer/ Serial Interface LCD ADC PWM(1) Max. OSC. Freq. 8MHz Vdd (V) Oper. Temp. Kbytes Bytes I/O Pins (Int/Ext) Counter 26 5/12 BT/WDT/8Tx2/16T 8x1 8MHz 2.1~5.5 -25 ~ 19 5/8 BT/WDT/8Tx2/16T 8x1 8MHz 2.0 ~ 3.6 -25 ~ 19 5/8 BT/WDT/8Tx2/16T 8x1 4MHz 1.7 ~ 3.6 -25 ~ 19 5/8 BT/WDT/8Tx2/16T 8x1 4MHz 1.7 ~ 3.6 -25 ~ 19 5/8 BT/WDT/8Tx2/16T (Seg/Com) (Bit x Ch) (Bit x Ch) 8x1

BT/8TX4/16TX2 BT/8TCx2/16TCx2 BT/8TCx2/16TCx2/8Tx2 BT/8TCX4/16TCX2 BT/8TC/8T 16TCX2/WT BT/WT/WDT/ 8T/16T BT/WT/WDT/8T/16T BT/8TC/8T/12C
UARTX2, SIO 10X8 UARTX2, SIO 10x8 UARTX2, SIO48/8 UART UART,SIO SIO IICx2 56/34 -
14x2,(8x2) 12MHz 8x4 8x2,(8x2) 8*1(DAC) 10MHz 10x8 10X8 10x4 10x4 8x4 8*1(DAC) (8X1) 8x7
2.7-5.5 30MHz 2.7~5.5 10MHz 12MHz 3.58MHz 3.58MHz 12MHz
-25 ~ 85 4.5 ~ 5.5 -25 ~ 85 2.7~5.5 2.7~5.5 2.7 ~ 5.5 2.7-5.5 4.0 ~ 5.5 -25 ~ 85
-25 ~ 85 -25 ~ - - 70 -25 ~ 85

36/34 9/1/7 1/7 7/3

100QFP 42SDIP 44QFP 42SDIP 44QFP 42SDIP 44QFP 42SDIP 44QFP 32SDIP 42SDIP 42SDIP 42SDIP

BT/8TC/8T/12C

M/M IIC, Slave IIC

272 272

6/3 5/4 5/2 5/4
BT/8TC/8T/12C BT/8TCx2 BT/WDT/8Tx2 BT/WDT/8Tx2

4x4 8x4 4x2 4x4

8x6 14x2,8x4 (8x1) 14x1 14x2,8x4 (8x1)

12MHz 8MHz 8MHz 8MHz

4.0 ~ 5.5 4.5 ~ 5.5 4.5 ~ 5.5 4.5 ~ 5.5
-25 ~ 85 -20 ~ 85 -20~ 85 -20 ~ 85
1. * Under Development. Contact Samsung Sales offices for availability. 2 (1) ( ) : S/W supported PWM. 3 Abbreiations:. ADC = Analog to Digital converter SIO = Serial Input/Output LVR=Low Voltage Reset FSK=Freqency Shift Keying ZCD = Zero Cross Detection Cuircuit LVD=Low Voltage Detector CAS=CPE Alerting Signal DTMF = Dual Tone Multi Frequency SDT=Stuttered Dial Tone LIN=Local Interface Network Com = Comparator RDS=Radio Data System 4 Timer/Counters: BT / WT / WDT = Basic / Watch / Watchdog timer, 8T / 16T = 8-bit / 16-bit Timer/Counter
DAC = Digital to Analog converter PWM = Pulse Width Modulation
Calm RISC Microcontrollers
CALM RISC MICROCONTROLLER FAMILY
Part Number Full Code by PKG) Package Type ROM RAM I/O Interrupt Timer/ Counter Serial Interface LCD (Seg/Com) ADC DAC PWM(1) Max. Osc. Min Exe. Time (ns) Vdd (V) Oper. Temp. Kbytes Bytes Pins (Int/Ext) (Bit x Ch) (Bit x Ch) (Bit x Ch) Freq.
S3CBxxx, S3CCxxx, S3CKxxx Series
S3CB42FXZ0-QXRF S3CB42FXZ0-TXRF S3CC410XZ0-EER0 S3CC410XZ0-YER0 100QFP 100TQFP 208LQFP 208FBGA 10K 1K 1K 2.5K 8/9 13/8 9/4 8/5 9/4 7/7 BT, WT, 8TC x 3 BT, WT, 16TC x 1, 8TC x 2 BT, WT, 16TC x 2, 8TC x 2 8BT, WDT, 16TC BT, WT, 16TC x 2, 8TC x 2 BT, WT, 16TC x 1, 8TC x 1 SIO SIO SIO SIO SIO SIO 36/8 64/16 30/4 56/16 32/4 16/8 10x4 10x1 10x8 14x1 10x8 10x4 10x1 9x1 10x1 10x1 8x1 8x2 40MHz 8MHz 125 2.0~3.6 2.0~3.6 2.0~5.5 2.3~3.6 2.0~5.5 2.0~3.6 -25~85 -25~85 -25~85 0~70 -25~85 -25~85 88K 73 18/48K 65 11/8 BT, WT, 16TC x 1 (8TC x 2) BT, WT, 16TC x 3 SIO/UART/IIC/IIS 1024x1024 pixels 8x8 80MHz 12.5 3.0~3.6 -20~75 UART/SIO/IIC/IIS 8x6 40MHz 25 3.0~3.6 -25~85

S3CC11BXZ0-QXRF* 100QFP S3CC11BXZ0-TXRF* 100TQFP S3CK11FXZ0-C0CF* 117 Pellet S3CK215AZ0-QWR5 80QFP S3FK519XZ0-QXR9* 100QFP S3FK519XZ0-QAR9* 128QFP S3CK225XZ0-QTR5 64QFP

8x2, 16x1 8MHz 8x1

14.32MHz 125

8x2, 16x1 8MHz 16x1 8MHz

S3CK318XZ0-QZR8* 44QFP
1. ( ) = S/W supported PWM. ZCD = Zero Cross Detection Cuircit 2. Abbreviations: ADC = Analog to Digital Converter DTMF = Dual Tone Multi Frequency DAC = Digital to Analog Converter SIO = Serial Input/Output PWM = Pulse Width Modulation 3. Timer/Counters: BT / WT / WDT = Basic / Watch / Watchdog timer 8TC / 16TC = 8-bit / 16-bit Timer/Counter 4. * Under Development. Contact you local Samsung Sales office for availability.

Com = Comparator

Microcontroller Ordering Information
MICROCONTROLLER ORDERING INFORMATION
S 1 1. System LSI (S) 2. Large Classification : Microcontroller(3) 3. Small Classification X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 X 15 X 16 X 17 X 18 5~6. Application Category 9~10. Mask Option
0n : General Purpose 2n : LCD 4n : General A/D
1n : Voice 3n : Audio 5n : Telecom 9n : Special (IC Card) Cn : C Nn : Intel Application
11. " - " 12. Package Type
6n : PC & Peripheral,OA 7n : VFD C : MASK ROM F : FLASH 3 : MCP

4. Core

E : EVA-CHIP P : OTP
8n : Video An : General Purpose-1 Fn : Telecom-1 Zn : Assignment Code
A : SDIP C : CHIP BIZ E : LQFP G : BGA J : BQFP L : ELP N : COB Q : QFP
B : LGA D : DIP F : WQFP H : CSP K : UELP M : QFPH P : PLCC S : SOP V : TEBGA Y : FBGA
1 : 51 4-bit 3 : 17 16-bit 5 : 32-bit ARM: 57 4-bit 9 : 86 8-bit B : 8-bit CALM RISC MAC
2 : 32-bit ARM: 32 32-bit 6 : 56 4-bit 8 : 88 8-bit A : 15 Other
* "n" : Serial No (1Z) 7. Rom Master
0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte F : 256K byte H : 512K byte K : 1M byte
1 : 1K byte 3 : 12K byte 5 : 16K byte 7 : 24K byte 9 : 32K byte B : 64K byte D : 128K byte G : 384K byte J : 1M byte
T : TQFP W : WAFER Z : SBGA

13. Package Pin

C : 16-bit CALM RISC MAC D : 32-bit CALM RISC MAC I : CUSTOM MCU J : SC-200 K : 8-bit CALM RISC L : 16-bit CALM RISC R : 128-bit CALM RISC S : SC-100
" Refer to Next Page "

14. Packing

15. ROM Size

*1st Version X

S 1 13. Package Pin X 3 X 4 X 5 X 6 X 7 - PLCC X 8 X 9 X X 12 X 13 X 14 X 15 X 16 X 17 X 18
T : Tape & Reel Z : 44 C : 144 G : 256 U : 304 Z : 44 H : 16 M : 24 I : 18 N : 28 D : 160 R : 48 W : 80 S : Tape & Reel Reverse C : Chip Biz D : Chip Biz (3 Inch tray) E : Chip Biz (4 Inch tray) F : Chip Biz (Reverse) W : WF Biz Draft Wafer X : WF Biz Full Cutting 7 : Tape & Reel (Pb-Free PKG) 8 : Tray (Pb-Free PKG) 9 : Tube (Pb-Free PKG)

Wafer/CHIP BIZ = 0(NONE)

- SDIP

C : 52

B : 56 Q : 42
M : 24 T : 64 C : 83 H : 16 N : 28 D : 160 J : 176 W : 80
O : 32 V : 30 J : 176 I : 18 P : 40 E : 208 R : 48 X : 100
A : 128 E : 208 T : 64 X : 100

A : 88

C:8 K : 20

- LQFP

C:8 K : 20 O : 32

- TQFP

C : 144 G : 256 T : 64

- WQFP

A : 128 X : 100

- TEBGA

T : 64
W : : 0K byte 1 : 1K byte 2 : 2K byte 3 : 12K byte 4 : 4K byte 5 : 16K byte 6 : 6K byte 7 : 24K byte

X : 492

- FBGA

A : 272

B : 416
A : 337 D : 160 G : 285 L : 400 Q : 289

- SBGA

B : 81 E : 208 H : 320 O : 272 T : 64
C : 144 F : 180 K : 105 P : 504
8 : 8K byte 9 : 32K byte A : 48K byte B : 64K byte C : 96K byte D : 128K byte E : Extemded F : 256K byte G : 384K byte H : 512K byte J : 1M byte M : Military X : Special MK3 MK2 Z : Special MK1 * Smart Card IC : EEPROM Size * X,Y,Z : Special Marking ( MASKROM) K : 1M byte N : Industrial Y : Special

J : 176

- BQFP

B : 132

A : 432

- WAFER

R : 48

- QFPH

T : 64 F : 240 D : 8CNCL

0 : None

1 : Cust1

2 : Cust2

D : 160
B : Tube U : Bulk R : Tray

EEPROMS

SERIAL EEPROMS
Write Cycle Part Number S524A40X20-RCT0 S524A40X21-DCB0 S524A40X21-SCB0 S524A40X21-SCT0 S524A40X41-DCB0 S524A40X41-SCB0 S524A40X41-SCT0 S524A60X51-DCB0 S524A60X51-SCB0 S524A60X51-SCT0 S524A60X81-DCB0 S524A60X81-SCB0 S524A60X81-SCT0 S524AB0X91-DCB0 S524AB0X91-SCB0 S524AB0X91-SCT0 S524AB0XB1-DCB0 S524AB0XB1-DCB1 S524AB0XB1-DCB2 S524AD0XF1-RCT0
Density (bit) 2K 2K 2K 2K 4K 4K 4K 16K 16K 16K 8K 8K 8K 32K 32K 32K 64K 64K 64K 256K
Write Protection by Hardware & Software by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware
Vopr (V) 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5
Time (Max) 5 ms 5ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Interface I2C BUS I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus
Package 8TSSOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8TSSOP

Production Plan In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production
1. Temperature: -25 ~ 70c 2 All products offer 100-year data retention, a 16M page buffer, and two-wired serial I2C-bus interfaces. 3 All products operate at 100KHz, 400KHz clock frequency.
EEPROMS Ordering Information
EEPROMS ORDERING INFORMATION
K 1 1. System LSI (S) 2. Large Classfication : MOS (5) 3. Small Classification X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 13. Temp X 15 X 16 X 17 X 18 9. EEPROM Size
0 : 0K bit 2 : 2K bit 8 : 8K bit 9 : 32K bit F : 256K bit

10. Write Protection

1 : 1K bit 4 : 4K bit 5 : 16K bit B : 64K bit H : 512K bit

0 : Normal I : -4085C

C : -2570C
2 : EEPROM Y : Memory Card

4. Interface Pro.

B : Tube R : Tray S : Tape & Reel Reverse D : Chip Biz (3 Inch tray) E : Chip Biz (4 Inch tray) F : Chip Biz (Reverse) W : WF Biz Draft Wafer X : WF Biz Full Cutting
4 : IIC 5 : SPI or Asynchronous

5. Voltage Option

N : No W/P 1 : H/W Only 0 : H/W & S/W C : 2.55.5 L : 2.05.5
12. Package Type 11. " - "

A : 1.85.5 H : 4.55.5

6. EEPROM Master
7 : Tape & Reel (Pb-Free PKG) 8 : Tray (Pb-Free PKG) A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA

15. Customer

0 : 0K bit 4 : 1K/2K/4K bit 6 : 8K/16K bit B : 32K/64K bit E : 512K bit

7. Reserved

2 : 1K/2K bit 5 : 16K bit 8 : 4K/8K bit D : 128K/256K bit
1 : TEBGA B : BGA D : DIP F : BCC H : LPQ4 K : SBGA M : QFPH P : PLCC R : TSSOP T : TQFP W : WAFER Z : STBGA

9 : Tube (Pb-Free PKG)

0 : None 1 : Bonding Opt.: Bonding Opt.: Bonding Opt.4 B : Special Marking 2 D : Special Marking 4 F : Special Marking 6 L : No Logo N : ANAM Assembly 3 : Bonding Opt.3 A : Special Marking 1 C : Special Marking 3 E : Special Marking 5 K : Reliability Test M : No Marking Z : Customer Option

0 : none

A~Z *1st Version X

Optical Media Solutions

COMBO DRIVE

SM-352 SM-348

Recording Capacity 52X 24X 52X CD-RW + 16X DVD-ROM 48X 24X 48X CD-RW + 16X DVD-ROM Drive Loading Type Interface Type Internal Type EIDE/ATAPI Motorized Tray Type Average Access Time Dimensions (WxHxDmm) Buffer Memory Drive Mounting Supported Disc
CD-RW Disc 700/650MB (Type 80/74) CDR Disc 800/700/650MB (Type 90/80/74)

Optical Media Solutions and Hard Disk Drives (HDD)

COMBO SLIM DRIVE

SN-324
Recording Capacity 24X 24X 24X CD-RW + 8X DVD-ROM Drive Loading Type Interface Type Internal Type EIDE/ATAPI Drawer Type Average Access Time DVD: 110ms CD: 100ms Dimensions (WxHxDmm) Buffer Memory Drive Mounting Supported Disc
CD-RW Disc 700/650MB Type 80/74 CDR Disc 800/700/650MB (Type 90/80/74)

128 x 12.7 x 129 2MB

Horizontal/Vertical DVD-R. DVD-RW, DVD-RAM, DVD-ROM, DVD-Video, CD-R, CD-RW, CD-DA, CD-ROM, CD-ROM/XA, VideoCD, CD-I, Photo CD, CD-EXTRA, CD-TEXT

CD-ROM SLIM DRIVE

SN-124
Drive Type Internal Type 24X Multi-Read CD-ROM Slim Drive Disc Loading Diameter Interface Type 80mm / 120mm EIDE/ATAPI Drawer Type Average Access Time 110ms Dimensions (WxHxDmm) Buffer Memory Drive Mounting Supported Disc

128 x 12.7 x 129 128KB

Horizontal/Vertical CD-R, CD-RW, CD-DA, CD-ROM, CD-ROM/XA, VideoCD, CD-I, Photo CD, CD-EXTRA, CD-TEXT

ULTRA SLIM COMBO DRIVE

SU-408
Recording Capacity CD-RW Disc 700/650MB Type 80/74 CDR Disc 800/700/650/ 550MB (Type 90/80/74/63) Drive Type Internal Type Interface EIDE/ATAPI Loading Type Drawer Type Average Access Time DVD: 110ms CD: 100ms Dimensions (WxHxDmm) 128 x 9.5 x 129 Buffer Memory 2MB Drive Mounting Supported Disc
Horizontal/Vertical DVD-R. DVD-RW, DVD-ROM, DVD-Video, CD-R, CD-RW, CD-DA, CD-ROM, CD-ROM/XA, VideoCD, CD-I, Photo CD, CD-EXTRA, CD-TEXT

HARD DISK DRIVES (HDD)

Capacity SpinPoint V Series 80GB 120GB 160GB VL40P Series 40GB P80 Series 80GB 120GB 160GB P40 Series 40GB P80 Series SATA 80GB 120GB 160GB P40 Series SATA 40GB V80 Series Rotational Speed 5400 rpm 5400 rpm 5400 rpm 5400 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm P/N SV0802N SV1203N SV1604N SV0411N SP0802N SP1203N SP1604N SP0411N SP0812C SP1213C SP1614C SP0411C # of Head # of Disk Interface ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 S-ATA S-ATA S-ATA S-ATA Buffer Size 2MB / 8MB 2MB / 8MB 2MB / 8MB 2 MB 2MB / 8MB 2MB / 8MB 2MB / 8MB 2MB 8MB 8MB 8MB 2MB