Optical Storage Devices The comprehensive line of optical storage products coming out of Samsungs manufacturing facilities in South Korea and the Philippines leads the industry. Supported by logistics centers around the world, this operation taps into Samsungs manufacturing expertise, global marketing & sales reach and well-known skills in advanced technology development. Launched in 1994, Samsungs optical storage operation has been growing at 100% per year and offers a broad selection of DVD and CD drives in various configurations. For example, Samsung was the first to introduce a blazing-fast DVD drive with 18x multi-format recording. Samsungs products include special features such as auto ball balancing, speed-adjustment technology, tilt-actuator compensation and acoustic noise suppression. The Samsung product line has received numerous best awards from the worlds top 10 PC Hard Disk Drives Samsung has the industrys fastest-growing hard drive business, as seen in the companys recent move into third place worldwide. The storage business was launched in 1988 when Samsung shipped the worlds first 20-megabyte and 40-megabyte hard drives. Now Samsung operates the worlds most automated hard disk drive factory, which is located in Kumi, South Korea, and applies its technology development skills to advancing its products. Utilizing its R&D center in San Jose, California, Samsung has patented several new storage technologies that include advanced acoustic noise suppression, in which Samsungs hard drives are unequalled. Its ISO-9001/14001-certified factory ensures high quality levels and operating efficiencies that consistently lower costs for customers. Samsung focuses on the largest computing market segments that require small, high-density disk drives. These include small business, the enterprise and the home, where hard drives for gaming systems is a fast-growing area. For example, users in all these segments can store and play back virtually unlimited amounts of digital music and movie data with a new 400-gigabyte Samsung drive that also offers fast, reliable data transmission. suppliers and leading computer publications.

Summer 2006

Samsung Storage Products

For more information:

Samsung Semiconductor, Inc. 3655 North First Street San Jose CA 95134-1713 www.usa.samsungsemi.com
2006. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time without notice. Samsung and Samsung Semiconductor Inc. are trademarks of Samsung Electronics Co., Ltd. All other names and brands are the property of their respective owners. CA-06-STOR-001 Printed 7/06
Samsung is a leading worldwide supplier of hardware components for digital devices, bringing to its line of storage solutions the same technology and manufacturing expertise seen in its memory, logic and display components.
Storage Products Reference Card
Highly Reliable, High-Capacity Storage Solutions from a World Leader in Technology
Hard Disk Drives Optical Storage Devices

Hard Disk Storage

3.5 Hard Disk Drives
Model SV1203N SV1604N HA250JC SP0411N SP0401N SP0411C SP0802N SP0822N SP1203N SP1604N SP1624N SP0812N SP0842N SP1213N SP1614N SP1644N SP0812C SP1213C SP1614C HD040GJ HD080HJ HD120IJ HD160JJ SP2014N SP2514N SP2004C SP2504C HD300LD HD400LD HD300LJ HD400LJ 6 # of Heads PATA/2MB PATA/2MB SATA 1.5Gb/s PATA/2MB PATA/8MB SATA 1.5Gb/s SATA 3.0Gb/s PATA/ 8MB SATA 3.0Gb/s PATA/ 8MB SATA 3.0Gb/s Capacity 120GB 160GB 250GB 40GB 40GB 40GB 80GB 80GB 120GB 160GB 160GB 80GB 80GB 120GB 160GB 160GB 80GB 120GB 160GB 40GB 80GB 120GB 160GB 200GB 250GB 200GB 250GB 300GB 400GB 300GB 400GB RPMs 5400 rpm 5400 rpm 5400 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm # of Disks 3 Interface ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 S-ATA 1.5G ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 S-ATA 1.5G S-ATA 1.5G S-ATA 1.5G S-ATA 3G S-ATA 3G S-ATA 3G S-ATA 3G ATA-133 ATA-133 S-ATA 3G S-ATA 3G ATA-133 ATA-133 S-ATA 3G S-ATA 3G Buffer Size 2MB 2MB 2MB 2MB 2MB 2MB 2MB 2MB 2MB 2MB 2MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB Seek Time 8.9ms 8.9ms 8.9ms 10ms 10ms 10ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms MTBF 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 600K hrs 600K hrs 600K hrs 600K hrs 600K hrs 600K hrs

SpinPoint V Series SpinPoint P Series SpinPoint T series
V80 Series V120 CE Series P40 Series P80 Series P80 SD Series P120 Series T133 Series

2.5 Hard Disk Drives

SATA 1.5Gb/s SATA 1.5Gb/s
SpinPoint M Series (3.0Gb/s)
M40 Series M40S Series M60 Series
Capacity 40GB 60GB 80GB 40GB 60GB 80GB 40GB 60GB 80GB 100GB 120GB 40GB 60GB 80GB 100GB 120GB
RPMs 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm
Model MP0402H MP0603H MP0804H HM040HI HM060II HM080JI HM040HC HM060HC HM080IC HM100JC HM120JC HM041HI HM060HI HM080II HM100JI HM120JI

# of Heads 4 4

# of Disks 2 2
Interface ATA-6 ATA-6 ATA-6 S-ATA S-ATA S-ATA ATA-6 ATA-6 ATA-6 ATA-6 ATA-6 S-ATA S-ATA S-ATA S-ATA S-ATA
Buffer Size 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB
Seek Time 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms
MTBF 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs

Optical Storage

SN-M242C Basic Specs
Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 128 x 12.7 x 129 Interface: P-ATA 2MB buffer memory

Seek Time (Average)

CD-ROM/R/RW:120ms DVD-Single:130ms DVD-Dual:140ms DVD-DL(R):140ms DVDR/RW:140ms DVD-RAM:250ms

Drive Speed

Disc Supported List
Read Speed CD-ROM Max. 24X (3,600KB/sec) CD-RW Max. 24X (3,600KB/sec) DVD-Single Max. 8X (10,800KB/sec) DVD-Dual Max. 6 (10,800KB/sec) CD CD-DA; CD-ROM; CD-ROM XA; CD-I; CD-Extra/CD-Plus; Video-CD; CD-R; CD-RW & HSRW; Super Audio CD; US & US+ RW

Media Capacity

Write Speed
CD-R Max. 24X (3,600KB/sec) CD-RW Max. 10X (1,500KB/sec) US-RW Max. 24X (3,600KB/sec) US+ CD-RW Max. 24X (3,600KB/sec)
DVD-ROM; DVD-Dual; DVD-Video; DVD-R; DVD+R; DVD+RW; DVD-RW
650 MB CD-ROM (read only) 80mm CD (horizontal mount only) 800/700/650/ CD-Recordable (read & write) 700/650MB CD-Rewritable (read & write) 700/650MB High-Speed CDRewritable (read & write) 700/650MB Ultra & Ultra+ Speed CD-Rewritable (read & write) 5/9/10/18 G DVD-Single/Dual (PTP, OTP) (read only) 3.9/4.7 G DVD-R (read only) 4.7G DVD+R (read only) DVDRW (read only) 80mm DVD

SN-S082D Basic Specs

Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 128 x 12.7 x 127 Interface: P-ATA 2MB buffer memory
CD-ROM:130ms NS CD-RW:130ms HS/US CD-RW:130ms DVD-Single:130ms DVD-Dual:150ms DVD-R/+R:150ms DVD-RW/+RW:150ms
Read Speed CD-ROM Max. 24X (3,600KB/sec) CD-R Max. 24X (3,600KB/sec) NS CD-RW Max. 24x HS/US CD-RW Max.24x DVD-Single Max. 8x DVD-Double Max. 6x DVD-R/+R Max. 8x DVD-RW/+RW Max. 6x DVD-RAM 5x Write Speed CD
CD-DA; CD-ROM; CD-ROM XA; CD CD-I/FMV; CD-Extra/CD-Plus; Video-CD; CD-R; CD-RW & HSRW; US & US + RW; Super Audio CD; 650MB CD-ROM (read only) 120mm/80mm CD 800/700/650MB CD-Recordable (read & write) 700/650MB CD-Rewritable (read & write) 700/650MB High-Speed CDRewritable (read & write) 700/650MB Ultra & Ultra+ Speed CDRewritable (read & write) DVD CD-R Max. 24X (3,600KB/sec) NS CD-RW 4X (600KB/sec) HS CD-RW Max. 10X (1,500KB/sec) US/US+ RW Max. 24X DVD+R Max. 8X DVD+RW Max. 8X (8x media) Max. 4x (4x media) DVD+R DL Max. 6x DVD-R Max. 8X DVD-R DL Max, 6x DVD-RW Max 6X (6x media), Max. 4x (4x media) DVD-ROM; DVD-Video; DVD-R; DVD DVD+R; DVDRW; DVD+R DL; DVD-R DL; support DVD-R/RW CPRM (read/write); DVD-RAM (read only) 5/9/10/18 G DVD-Single/Dual (PTP, OTP) (read only) 3.9/4.7 G DVD-R (read only) 4.7G DVD+R (read only) DVDRW (read only) 80mm DVD

SH-S182D Basic Specs

Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 148.2 x 42 x 170 Interface: P-ATA 2MB buffer memory
CD-ROM/R/RW:110ms DVD-Single:130ms DVD-Dual:140ms DVDR/RW:140ms

Read Speed

CD-DA; CD-ROM; CD-ROM XA; CD CD-I; CD-Extra/CD-Plus; VideoCD; CD-R; CD-RW 120mm CD-ROM (read only) 80mm CD (horizontal mount only) 800/700/650MB CD-Recordable (read & write) 700/650MB Low/High/Ultra-Speed CD Rewritable (read & write)
CD DVD-ROM Max.16X (21,600KB/sec) DVD-RAM Max.12X (16200KB/sec) DVD-Dual DVD RW Max. 8X (10,800KB/sec) DVDR Max. 12X (16,200KB/sec) DVDR DL Max. 8X (10,800KB/sec) CD-ROM Max. 48X (7,200 KB/sec) CD-R/CD-RW Max. 40X (6,000 KB/sec) DVD-RAM Max. 12X (16,200 KB/sec) DVD DVD+R Max. 18X (24,300KB/sec) DVD-R Max.18X (24,300KB/sec) DVDRW Max. 8X (10,800KB/sec), 6X (8,100KB/sec) DVDR Double L Max. 8X (10,800/sec) CD-R Max. 48X (7,200KB/sec) HS-RW Max. 10X (1,500KB/sec) US-RW Max. 32X (4,800KB/sec)
DVD-ROM; DVD-Video; DVD-R; DVD DVD+R; DVD_R DL; DVDRW; DVD-RAM

5/9/10/18G DVD-Single/Dual (PTP, OTP) (read only) 3.9/4.7G DVD-ROM (read only) DVDRW, DVDR, DVDR DL (read & write) 80mm DVD (horizontal mount only)

SH-S182M Basic Specs

Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 148.2 x 42 x 170 Interface: P-ATA (Light Scribe) 2MB buffer memory
DVD-ROM; DVD-Video; DVD-R; DVD DVD+R; DVD_R DL; DVDRW; DVD-RAM

2. A2 = DDR266 (133MHz @ Cl=2)
3. Type: 184-pin Package: TSOP components
DDR SDRAM 1U DIMM MODULES: REGISTERED
Density 256MB 256MB 512MB 512MB 512MB 512MB 1GB 1GB 1GB 1GB 1GB 2GB 2GB 4GB 4GB Org 32Mx72 32Mx72 64Mx72 64Mx72 64Mx72 64Mx72 128Mx72 128Mx72 128Mx72 128Mx72 128Mx72 256Mx72 256Mx72 512Mx72 512Mx72 Speed (Mbps) 266/266 266/266/333/400 266/266 266/266/333/400 266/266 266/266/333 266/266 266/266/333/400 266/266 266/266 266/266/333 266/266 266/266/333 266/266 266/266/333 Composition (32Mx8)*9 (32Mx8)*9 (32Mx8)*18 (32Mx8)*18 (64Mx8)*9 (64Mx8)*9 (St.128Mx4)*18 (64Mx4)*36 (64Mx8)*18 (128Mx4)*18 (128Mx4)*18 (St. 256Mx4)*18 (128Mx4)*36 (St. 512Mx4)*18 (St. 512Mx4)*18 Part Number M312L3223ETS -C(L)B0/A2 M312L3223EG0 - C(L)B0/A2/B3/CC M312L6423ETS - C(L)B0/A2 M312L6423EG0 - C(L)B0/A2/B3/CC M312L6523BTS - CB0/A2 M312L6523BG0 - CB0/A2/B3 M312L2828ET0 - C(L)B0/A2 M312L2820EG0 - C(L)B0/A2/B3/CC M312L2923BTS - CB0/A2 M312L2920BTS - CB0/A2 M312L2920BG0 - CB0/A2/B3 M312L5628BT0 - CB0/A2 M312L5720BG0 - CB0/A2/B3 M312L5128MT0 - CB0/A2 M312L5128MG0 - CB0/A2/B3 Component Package TSOP FBGA TSOP FBGA TSOP FBGA TSOP FBGA TSOP TSOP FBGA TSOP FBGA TSOP FBGA

5. Type: 184-pin

# Banks Module 2

DDR DRAM SODIMM MODULES

Density 128MB 256MB 256MB 512MB 512MB 1GB 1GB Org 16Mx64 32Mx64 32Mx64 64Mx64 64Mx64 128Mx64 128Mx64 Speed (Mbps) 266/266/333/400 266/266/333/400 266/266/333/400 266/266/333/400 266/266/333/400 266/266/333 266/266/333 Composition (16M x 16)*4 (16M x 16)*8 (32M x 16)*4 (32M x 8)*16 (32M x 16)*8 (64M x 8)*16 (64M x 16)*8 Part Number M470L1624FT0 - C(L)B0/A2/B3/CC M470L3224FT0 - C(L)B0/A2/B3/CC M470L3224BT0 - C(L)B0/A2/B3/CC M470L6423EN0 - C(L)B0/A2/B3/CC M470L6524BT0 - C(L)B0/A2/B3/CC M470L2923BN0 - C(L)B3/A2/B0 M470L2824MT0 - C(L)B3/A2/B0 Component Package TSOP TSOP TSOP Shrink TSOP Shrink TSOP Shrink TSOP Shrink TSOP # Banks Module 2
5. Type: 200-pin, Double Sided 6. Height(in): 1.25

DDR2 DRAM COMPONENTS

Density 256Mb 256Mb 512Mb 512Mb 512Mb 1Gb 1Gb
NOTES: 1. CCC - DDR2 -400 (3-3-3)
Org x4 x8 x4 x8 x16 x4 x8
Speed (Mbps) 400/533 400/533 400/533 400/533 400/533 400/533 400/533
2. CD5 - DDR2 -533 (4-4-4)
Part Number K4T56043QF-(CCC/CD5) K4T56083QF-(CCC/CD5) K4T51043QB-(CCC/CD5) K4T51083QB-(CCC/CD5) K4T51163QB-(CCC/CD5) K4T1G044QM-(CCC/CD5) K4T1G084QM-(CCC/CD5)

3. Voltage: 1.8V

DDR2 SDRAM DIMM MODULES: UNBUFFERED
Density 256MB 512MB 256MB 512MB 1GB 512MB 1GB 2GB

NOTES: 1. CC = 400Mbps

Org 32Mx64 64Mx64 32Mx64 64Mx64 128Mx64 64Mx64 128Mx64 256Mx64
Speed (Mbps) 400/533 400/533 400/533 400/533 400/533 400/533 400/533 400/533

K 2 X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 X 15 X 16 X 17 X 18
Packing Type (16 digit) - Common to all products, except of Mask ROM - Divided into TAPE & REEL(In Mask ROM, divided into TRAY, AMMO Packing Separately) Type Component Packing Type TAPE & REEL Other (Tray, Tube, Jar) Stack Component (Mask ROM) Module TRAY AMMO PACKING MODULE TAPE & REEL MODULE Other Packing New Marking T 0 (Number) S Y A P M N Old Marking R 1 (Number)
NAND Flash Memory & Ordering Information
N A N D F L A S H M E M O RY 14a
NAND FLASH DISCETE COMPONENTS
Density 64Mb 128Mb 256Mb 512Mb 1Gb 2Gb 4Gb 8Gb Part Number K9F6408U0C-TCB0 K9F2808U0C-YCB0 K9F5608U0C-YCB0 K9F1208U0A-YCB0 K9F1G08U0A-YCB K9F2G08U0M-YCB K9K4G08U0M-YCB K9W8G08U1M-YCB Organization EOL 16Mx8 32Mx8 64Mx8 128Mx8 256Mx8 512Mx8 1024Mx8 Speed (ns) EOL 30 Voltage EOL 2.7-3.6V 2.7-3.6V 2.7-3.6V 2.7-3.6V 2.7-3.6V 2.7-3.6V 2.7-3.6V Package EOL TSOP48 TSOP48 TSOP48 TSOP48 TSOP48 TSOP48 TSOP48

NAND FLASH SMART MEDIA

Density 8MB 16MB 32MB 64MB 128MB Part Number K9S6408V0C-SSB0 K9S2808V0C-SSB0 K9S5608V0C-SSB0 K9S1208V0A-SSB0 K9D1G08V0A-SSB0 Organization EOL 16Mx8 32Mx8 64Mx8 128Mx8 Speed (ns) EOL Voltage EOL 3.3V 3.3V 3.3V 3.3V Package EOL COB-22 COB-22 COB-22 COB-22
NAND FLASH COMPACT FLASH CARDS (CFC)
Density 32MB 64MB 128MB 256MB Part Number MC56C0321CY1-2CD00 MC12C0641AY1-2CD00 MC12C1281AY1-2CD00 MC12C2561AY1-2CD00 Temperature Commercial Commercial Commercial Commercial Voltage 2.7-3.6V 2.7-3.6V 2.7-3.6V 2.7-3.6V Package CF-Type I CF-Type I CF-Type I CF-Type I
NAND FLASH ORDERING INFORMATION
K 1 1. Memory (K) 2. NAND Flash : 9 3. Small Classification (SLC : Single Level Cell, MLC : Multi Level Cell, SM : SmartMedia, S/B : Small Block) 1 : SLC 1 Chip XD Card 2 : SLC 2 Chip XD Card 4 : SLC 4 Chip XD Card A : SLC + Muxed I/F Chip B : Muxed I/F Chip S : SLC Single SM D : SLC Dual SM Q : 4CHIP SM T : SLC SINGLE (S/B) E : SLC DUAL (S/B) R : SLC 4DIE STACK (S/B) 12 : 512M 28 : 128M 40 : 4M 64 : 64M 1G : 1G 4G : 4G 00 : NONE 6~7. Organization 00 : NONE 16 : x: x: 16M 32 : 32M 56 : 256M 80 : 8M 2G : 2G 8G : 8G X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 8. Vcc C : 5.0V(4.5V~5.5V) D : 2.65V(2.4V ~ 2.9V) E : 2.3V~3.6V Q : 1.8V(1.7V ~ 1.95V) T : 2.4V~3.0V U : 2.7V~3.6V V : 3.3V(3.0V~3.6V) W : 2.7V~5.5V,3.0V~5.5V 0 : NONE 9. Mode O : Normal 1 : Dual nCE & Dual Rn/B 4 : Quad nCE & Single RnB A : Mask Option 1 X 15 X 16 X 17 X 18 F : SLC Normal G : MLC Normal K : SLC Die Stack W : SLC 4 Die Stack J : Non-Muxed One Nand U : 2 STACK MSP V : 4 STACK MSP 4~5. Density
NAND Flash Ordering Information
K 1 10. Generation M : 1st Generation A : 2nd Generation B : 3rd Generation C : 4th Generation D : 5th Generation Y : Partial NAND((2nd) Z : Partial NAND(1st) M : 1st Generation A : 2nd Generation B : 3rd Generation C : 4th Generation D : 5th Generation Y : Partial NAND((2nd) Z : Partial NAND(1st) 11. "w" C : Commercial S : SmartMedia B : SmartMedia BLUE 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 17~18. Customer "Customer List Reference" I : Industrial (To last page) X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 X 15 X 16 X 17 X 18 12. Package A : COB C : CHIP BIZ E : TSOP1(LF,1217) G : FBGA J : FBGA(LF) L : LGA P : TSOP1(LF) R : TSOP2-R T : TSOP2 W : WAFER 13. Temp B : TBGA D : 63-TBGA F : WSOP1(LF) H : TBGA(LF) K : TSOP1(1217) M : tLGA Q : TSOP2(LF) S : SMARTMEDIA V : WSOP Y : TSOP: Reserved 16. Packing "Packing Type Reference 14. Bad Block B : Include Bad Block D : Daisychain Sample K : Sandisk Bin L : 1~5 Bad Block N : Ini. All Good, Add. 10 Blocks S : All Good Block 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 15. NAND-Reserved

LATE WRITE R-R (16M BIT) SRAM
Part Number K7P161866A K7P163666A Organization 1Mx18 512Kx36 Operating Mode SP SP Vdd (V) 2.5 2.5 Access Time tCD(ns) 2 1.6 Speed tCYC (MHz) 250 300,250 I/O Voltage (V) 1.5 (Max 1.9) 1.5 (Max.1.9) Package 119BGA 119BGA Production Status Mass Production Mass Production
LATE WRITE R-R (8M BIT) SRAM
Part Number K7P801811B K7P801866B K7P803611B K7P803666B K7P801822B K7P803622B Organization 512Kx18 512Kx18 256Kx36 256Kx36 512Kx18 256Kx36 Operating Mode SP SP SP SP SP SP Vdd (V) 3.3 2.5 3.3 2.5 3.3 3.3 Access Time tCD(ns) 1.5,1.6,2.0 1.5,1.6,2.0 1.5,1.6,2.0 1.5, 1.6, 2.0 1.5, 1.6, 2.0 3.3,2.5,2.0 Speed tCYC (MHz) 333,300,250 333,300.25 333,300,250 333, 300,250 333, 300,250 250,200,166 I/O Voltage (V) 1.5 (Max.2.0) 1.5 (Max.2.0) 1.5 (Max.2.0) 1.5 (Max 2.0) 2.5/3.3 2.5/3.3 Package 119BGA 119BGA 119BGA 119BGA 119BGA 119BGA Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
LATE WRITE R-R &R-L (4M BIT) SRAM
Part Number K7P401822B K7P401823B K7P403622B Organization 256Kx18 256Kx18 128Kx36 Operating Mode SP SP SP Vdd (V) 3.3 3.3 3.3 Access Time tCD(ns) 2.5,2.7,3.0 6.5 2.5,2.7,3.0 Speed tCYC (MHz) 250,200,250,200,167 I/O Voltage (V) 2.5/3.3 2.5/3.3 2.5/3.3 Package 119BGA 119BGA 119BGA Production Status Mass Production Mass Production Mass Production

DDR1 (16MB) SRAM

Part Number K7D161874B K7D163674B Organization 1Mx18 512Kx36 Vdd (V) 1.8~2.5 1.8~2.5 Access Time tCD (ns) 2.3 2.3 Cycle Time (MHz) 330/300 330/300 I/O Voltage (V) 1.5 1.5 Package 153BGA 153BGA Production Status ES Samples ES Samples

DDR1 (8MB) SRAM

Part Number K7D803671B K7D801871B Organization 256Kx36 512Kx18 Vdd (V) 2.5 2.5 tCD (ns) 1.7/1.9/2.1 1.7/1.9/2.1 Access Time (MHz) 333/330/250 333/330/250 Cycle Time Voltage (V) 1.5(Max 2.0) 1.5(Max 2.0) I/O Package 153BGA 153BGA Production Status Mass Production Mass Production

DDR1 (16MB) CIO/SIO SRAM

Number K7I161882B K7I161884B K7J161882B K7J163682B K7I163682B K7I163684B Part Organization 1Mx18 1Mx18 1Mx18 512Kx36 512Kx36 512Kx36 Vdd (V) 1.8 1.8 1.8 1.8 1.8 1.8 tCD (ns) 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.50
2. 4B stands for Burst of 4
Access Time (MHz) 250,200,167 250,200,167 250,200,167 250,200,167 250,200,167 250,200,167
Cycle Time Voltage (V) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8
I/O Package 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA
Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
Comments CIO-2B CIO-4B SIO-2B SIO-2B CIO-2B CIO-4B
NOTES: 1. 2B stands for Burst of 2

3. SIO is Separate I/O

4. CIO is Common I/O

QDR (16M BIT) SRAM

Part Number K7R160982B K7R161882B K7R161884B K7Q161852A K7Q161854A K7Q161882A K7Q161884A K7Q161862B K7Q161864B K7R163682B K7R163684B K7Q163652A K7Q163654A K7Q163682A K7Q163684A K7Q163662B K7Q163664B Organization 2Mx9 1Mx18 1Mx18 1Mx18 1Mx18 1Mx18 1Mx18 1Mx18 1Mx18 512Kx36 512Kx36 512Kx36 512Kx36 512Kx36 512Kx36 512Kx36 512Kx36 Vdd (V) 1.8 1.8 1.8 2.5 2.5 1.8 1.8 1.8v / 2.5v 1.8v / 2.5v 1.8 1.8 2.5 2.5 1.8 1.8 1.8v / 2.5v 1.8v / 2.5v Access Time tCD (ns) 0.45,0.50 0.45,0.50 0.45,0.45,0.50 2.5,3.0 2.5,3.0 2.7,3.0 2.5,3.0 2.5 2.5 0.45,0.50 0.45,0.45,0.50 2.5,3.0 2.5,3.0 2.7,3.0 2.5,3.0 2.5 2.5 Cycle Time (MHz) 200,167 200,167 250,200,167 167,133 167,133 167,133 167,167 200,167 250,200,167 167,133 167,133 167,133 167,167 I/O Voltage (V) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 Package 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 169FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Comments QDR II - 2B QDR II - 2B QDR II - 4B QDR I - 2B QDR I - 4B QDR I - 2B QDR I - 4B QDR I - 2B QDR I - 4B QDR II - 2B QDR II - 4B QDR I - 2B QDR I - 4B QDR I - 2B QDR I - 4B QDR I - 2B QDR I - 4B

DDR2 CIO/SIO (32MB) SRAM

Number K7I321882M K7I321884M K7J321882M K7I323682M K7I323684M K7J323682M Part Organization 2Mx18 2Mx18 2Mx18 1Mx36 1Mx36 1Mx36 Vdd (V) 1.8 1.8 1.8 1.8 1.8 1.8 tCD (ns) 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.50
Comments CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B

QDR (32M BIT) SRAM

Part Number K7R320982M K7R321882M K7R321884M K7R323682M K7R323684M Organization 4Mx9 2Mx18 2Mx18 1Mx36 1Mx36 Vdd (V) 1.8 1.8 1.8 1.8 1.8 Access Time tCD (ns) 0.45,0.50 0.45,0.50 0.45,0.45,0.50 0.45,0.50 0.45,0.45,0.50 Cycle Time (MHz) 200,167 200,167 250,200,167 200,167 250,200,167 I/O Voltage (V) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 Package 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Comments QDR II-2B QDR II-2B QDR II-4B QDR II-2B QDR II-4B
SRAM Ordering Information
ASYNCHRONOUS SRAM ORDERING INFORMATION
K 1 1. Memory (K) 2. Async SRAM : 6 3. Small Classification E : Corner Vcc/Vss + Fast SRAM F : fCMOS Cell + LPSRAM H : High Speed(LPSRAM) X : High Voltage(LPSRAM) J : BICMOS L : Poly Load Cell + LPSRAM R : Center Vcc/Vss + Fast SRAM T : TFT Cell + LPSRAM 4~5. Density 06 : 64K 10 : 1M 30 : 3M 60 : 6M 6~7. Organization 01 : x: x: x32 8. Vcc 5 : 1.5V Q : VDD 3.0V/VDDQ 1.8V R : 1.65V~2.2V S : 2.5V V : 3.3V 9. Mode 1 : CS Low Active 2 : CS1, CS2 - Dual Chip Select Signal 3 : Single Chip Select with /LB,/UB(tOE) 4 : Single Chip Select with /LB,/UB(tCS) 5 : Dual Chip Select with /LB,/UB(tOE) 6 : Dual Chip Select with /LB,/UB(tCS) 7 : I/Os Control with /BYTE 8 : CDMA Function 9 : Multiplexed Address A : Mirror Chip Option 10. Generation M : 1st Generation A : 2nd Generation B : 3rd Generation C : 4th Generation D : 5th Generation JULY 2004 BR-04-ALL-005 SAMSUNG SEMICONDUCTOR, INC. T : 2.7V~3.6V W : 2.2V~3.3V 13. 1st Chip Speed - COMMON (Temp,Power) A : Automotive,Normal B : Commercial,Low Low C : Commercial,Normal D : Extended,Low Low E : Extended,Normal F : Industrial,Low Low I : Industrial,Normal L : Commercial,Low M : Military,Normal N : Extended,Low P : Industrial,Low Q : Automotive,Low R : Industrial,Super Low T : Extended,Super Low U : Commercial,Ultra Super Low 0 : NONE,NONE 17~18. Customer (Special handling) code 16. Packing Packing Type Reference U : 3.0V C : 5.0V 04 : x: x: x: x: 256K 16 : 16M 32 : 32M 64 : 64M 09 : 512K 20 : 2M 40 : 4M 80 : 8M * Exception - 1MFSRAM B-ver 32-SOJ-300 > S 28-SOJ-300 > S - 512K/1M/2M/4M LPSRAM 32-TSOP1-0813.4F > Y 32-TSOP1-0813.4 > Y 32-TSOP1-0813.4R > N - 4M LPSRAM 32-TSOP2-400F > V 32-TSOP2-400R > M A : TBGA(LF) C : CHIP BIZ E : TBGA G : SOP J : SOJ L : TSOP1-0813.4F(LF) P : TSOP1-0820F(LF) Q : TSOP2-400R(LF) T : TSOP W : WAFER R : TSOP-R U : TSOP2-400(LF) Z : UBGA B : SOP(LF) D : DIP F : FBGA H : BGA K : SOJ(LF) 11. " ----" 12. Package X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 X 15 X 16 X 17 X 18 E : 6th Generation F : 7th Generation G : 8th Generation H : 9th Generation - WAFER, CHIP BIZ Level Division 0 : NONE,NONE 1 : Hot DC sort 2 : Hot DC,selected AC sort 3 : Cold/Hot DC,selected AC sort 14~15. Speed (tAA) - fCMOS Cell + LPSRAM & Poly Load Cell + LPSRAM & TFT Cell + LPSRAM 10 : 100ns 12 : 120ns 15 : 150ns 25 : 25ns(only fCMOS Cell) 30 : 300ns 35 : 35ns(except Poly Load Cell) 45 : 45ns(except fCMOS Cell) 55 : 55ns 60 : 60ns(only fCMOS Cell) 70 : 70ns 85 : 85ns 90 : 90ns(only fCMOS Cell) DS : Daisychain Sample - High Speed (LPSRAM) 20 : 20ns - High Voltage (LPSRAM) 55 : 55ns 10 : 10ns 15 : 15ns 25 : 25ns 45 :45ns - BICMOS & Center Vcc/Vss + Fast SRAM 06 : 6ns 10 : 10ns 15 : 15ns 25 : 25ns 30 : 30ns(only Center Vcc/Vss + Fast SRAM) 35 : 35ns(only Center Vcc/Vss + Fast SRAM) 7A : 7.2ns(only BICMOS) 8A : 8.6ns(only BICMOS) DS : Daisychain Sample - Async SRAM COMMON 00 : NONE (Containing Wafer, CHIP BIZ, Exception code) 08 : 8ns 12 : 12ns 17 : 17ns 09 : 9ns 13 : 13ns 20 : 20ns 70 : 70ns 12 : 12ns 17 : 17ns 30 : 30ns 85 : 85ns 13 : 13ns 20 : 20ns 35 : 35ns - Corner Vcc/Vss + Fast SRAM 25 : 25ns

14~15. Speed

Packing Type (16 digit) Common to all products, except of Mask ROM Divided into TAPE & REEL (In Mask ROM, divided into TRAY, AMMO Packing Separately) ) Type Component Packing Type TAPE & REEL Other (Tray, Tube, Jar) Stack Component (Mask ROM) Module TRAY AMMO PACKING MODULE TAPE & REEL MODULE Other Packing New Marking T 0 (Number) S Y A P M N Old Marking R 1 (Number)

SYSTEM LSI

SECTION B
ASIC ASIC ORDERING INFORMATION LCD DRIVER IC LCD DRIVER IC ORDERING INFORMATION MOBILE APPLICATION PROCESSORS HDTV / SET-TOP BOX PRODUCTS MICROCONTROLLERS (MCU) MICROCONTROLLERS (MCU) ORDERING INFORMATION EEPROMS EEPROMS ORDERING INFORMATION OPTICAL MEDIA SOLUTIONS HARD DISK DRIVES
3b 6b 7b 8b 9b 10b 11b 12b 13b 17b
18b 19b 20b 21b 22b 23b 23b

BR-04-ALL-006

S YS T E M L S I

SAMSUNG ASIC

The best solution from design to chip

Partnership Service

Customer
Super Hot TAT On-Site Support
System-on-a-chip design & design methodology Very deep-sub-micron design methodology

System Integration

Design Methodology
Differentiated Core Technology
Memory Cores DRAM Flash SRAM ROM Mixed Signal Cores ADC/DAC CODEC/PLL LVDS/AFE Processor Cores ARM920T/940T ARM94GE/92GEJ ARM1020E Teak/Teaklite High Speed Interface Cores USB1.1/2.0 IEEE1394 Gigabit Ethernet SerDcs

ASIC TECHNOLOGY LIBRARY

Technology Name LF13 LD13 L13 Library Name(s) MFL150 MDL150 STDH150 STDH150HD STD150 STD150HS STD150HVT STD150OD STD150HVTOD STDL150 LF18 LD18 L18 MFL130 MDL130 STD130 STD131 STDL130 STDL131 L25 STD110 STDM110 STD111 MFL90 STDH90 STD90 Description 0.13m Merged Flash Memory with Logic 0.13m Merged DRAM with Logic 0.13m High-Speed Standard Cell with L13HS 0.13um High-Density Standard Cell with L13HS 0.13m High-Density Standard Cell with L13G 0.13um High-Speed Standard Cell with L13G "0.13um Low-Leakage and High-Density Standard Cell with L13G High-VTH option" "0.13um High-Speed Standard Cell with L13G Over-Drive option" "0.13um Low-Leakage and High-Density Standard Cell with L13G High-VTH and Over-Drive option" "0.13m Low Leakage and High-Density Standard Cell with L13LP" 0.18m Merged Flash Memory with Logic 0.18m Merged DRAM with Logic 0.18m High-Density Standard Cell with L18 0.18m High-Speed Standard Cell with L18 "0.18m Low Leakage and High-Density Standard Cell with L18LP" "0.18um Low Leakage and High Performance Standard Cell with L18LP" 0.25m High-Density Standard Cell 0.25m Low Voltage High-Density Standard Cell 0.25m High Performance Standard Cell 0.35m Merged Flash Memory with Logic 0.35m High-Density Standard Cell with dual gate oxide 0.35m High-Density Standard Cell Core Voltage (Nominal) (V) 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.5 1.5 1.5 1.8 1.8 1.8 1.8 1.8 1.8 2.5 1.8 2.5 3.3 3.3 3.3 Core Voltage Tolerance (V) -0.1 -0.1 -0.1 -0.1 -0.1 -0.1 -0.1 -0.1 -0.1 -0.1 -0.15 -0.15 -0.15 -0.15 -0.15 -0.15 -0.2 -0.15 -0.2 -0.3 -0.3 -0.3 I/O Receive Voltage (V) 2.5/3.3/5.0T 2.5/3.3/5.0T 2.5/3.3/5.0T 2.5/3.3/5.0T 2.5/3.3/5.0T 2.5/3.3/5.0T 2.5/3.3/5.0T 2.5/3.3/5.0T 2.5/3.3/5.0T 1.5/2.5/3.3/5.0T 1.8/2.5/3.3/5.0T 1.8/2.5/3.3/5.0T 1.8/2.5/3.3/5.0T 1.8/2.5/3.3/5.0T 1.8/2.5/3.3/5.0T 1.8/2.5/3.3/5.0T 2.5/3.3/5.0 2.5/3.3/5.0 2.5/3.3/5.0 3.3/5.0 3.3/5.0 3.3/5.0 I/O Drive Voltage (V) 2.5/3.3 2.5/3.3 2.5/3.3 2.5/3.3 2.5/3.3 2.5/3.3 2.5/3.3 2.5/3.3 2.5/3.3 1.5/2.5/3.3 1.8/2.5/3.3 1.8/2.5/3.3 1.8/2.5/3.3 1.8/2.5/3.3 1.8/2.5/3.3 1.8/2.5/3.3 2.5/3.3 2.5/3.3 2.5/3.3 3.3 3.3/5.0 3.3 Maximum Vgs (V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3.3

ASIC FOUNDRY TECHNOLOGY LIBRARY
L13 L09 LD18 LD13 LF18 LF13 LFS13 BiCMOS BH3515 BH3505 BH1805 BH1305 RF (SiGe BiCMOS) BS3550 BS1850 BS13200 Technology Logic - G/HS/LP/RF/MS MDL (Embedded DRAM) MFL (Embedded Flash) Process 0.13um 90nm 0.18um 0.13um 0.18um 0.13um 0.13um 0.35um 0.35um 0.18um 0.13um 0.35um 0.18um 0.13um Core Voltage 1.2~1.5V 1.0~1.2V 1.8V 1.0~1.5V 1.8V 1.0~1.5V 1.0~1.5V 15V 5V 1.8V 1.2V~1.5V 3.3V 1.8V 1.2V~1.5V I/O Voltage 2.5~3.3V 1.8~3.3V 3.3V/5V 2.5~3.3V 3.3V/5V 2.5~3.3V 2.5~3.3V 3.3V/5V 3.3V/5V 3.3V/5V 2.5/3.3V 3.3V/5V 2.5~3.3V 2.5~3.3V Cell Size SRAM : 1.85~2.43 um2 SRAM : 0.79~1.25 um2 DRAM : 0.45 um2 DRAM : 0.34 um2 Flash : 0.63 um2 Flash : 0.45 um2 Flash : <0.28 um2
fT : 50GHz fT : 120GHz fT : 200GHz

ASIC LEGACY FOUNDRY

Product CMOS Legacy Hi Voltage CMOS EEPROM CIS Technology 2.0m ~ 0.5m 0.8m ~ 0.13m 0.8m ~ 0.35m 0.8m ~ 0.5m Feature S/D Poly, D/TLM S/D Poly, D/TLM D Poly, D/TLM S/D Poly, D/TLM Production Foundry Foundry Foundry Foundry Comments 5V with Mixed Signal (Optional) 12, 13V, 15V, 20V, 30V, 45V B&W, RGB, Full Color
ASIC Ordering Information
ASIC ORDERING INFORMATION
K 1 1. System LSI (S) 2. Large Classification : ASIC (4) 3. Small Classification X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 14. Packing X 15 X 16 X 17 X 18 12. Package Type
B : BGA D : DIP F : BCC H : SBGA K : CTBGA M : QFPH
C : CHIP BIZ E : LQFP G : PQ2 J : ELP L : TBGA P : PLCC R : TSSOP T : TQFP V : SSOP X : ETQF Z : TEBGA
B : Tube R : Tray S : Tape & Reel Reverse D : Chip Biz (3 Inch tray) E : Chip Biz (4 Inch tray) W : WF Biz Draft Wafer X : WF Biz Full Cutting
U : Bulk T : Tape & Reel C : Chip Biz
3 : MCP C : COT D : MDL F : MFL H : Gate Array T : Embeded Cell

L : STD Cell

Q : QFP S : SOP U : LGA W : WAFER Y : FBGA

13. Reserved

7 : Tape & Reel (Pb-Free PKG) 8 : Tray (Pb-Free PKG) 9 : Tube (Pb-Free PKG)

15. Custom

Serial No

8. Version

*1st Version X 9~10. Mask Option 11. " - " - PKG Option
Modify- Bonding , Marking , EDS Option , PKG Type or PKG Option => Serial Number (0,1,2,3.A,B,C.)

Yes Yes -

60/16 32/4 -

1.8 ~ 5.5 1.8 ~ 5.5

-25 ~ 85 -25 ~ 85 -25 ~ 85 -25 ~ ~ 70
6MHz 1.8 ~ 5.5 6MHz 1.8 ~ 5.5 3.58MHz 2.7 ~ 5.5
1. * Under Development. Contact Samsung Sales offices for availability. 2. (1) ( ) : S/W supported PWM. 3. Abbreviations: SIO = Serial Input/Output ADC = Analog to Digital converter PWM = Pulse Width Modulation ZCD = Zero Cross Detection Cuircuit DAC = Digital to Analog converter Com = Comparator DTMF = Dual Tone Multi Frequency FSK = Frequency Shift Keying 8TC / 16TC = 8-bit / 16-bit Timer/Counter BT / WT / WDT = Basic / Watch / Watchdog timer
8-BIT MICROCONTROLLER FAMILY
Part Number Package Type ROM RAM Interrupt Kbytes Bytes I/O Pins (Int/Ext) 1/12 4/10 Timer/ Counter BT/WDT/8T BT/WT/8TCx2 Serial LCD ADC PWM(1) Max. OSC. Interface (Seg/Com) (Bit x Ch) (Bit x Ch) Freq. Vdd (V) SIO 16x8 10x4 (8x1) 4MHz 8MHz 4.5 ~ 5.5 2.0 ~ 5.5 Oper. Temp. -25~ 85 -25 ~ 85 S3C9xxx (KS86) Series S3C9004DZ0-DPB4 40DIP S3C9228AZ0-AQB8 42SDIP S3C9228AZ0-QZR8 44QFP S3C9228AZ0-LRR8 48ELP S3P9234XZ0-QTR4 * 64QFP S3C9404DZ0-AVB4 30SDIP S3C9404DZ0-SOB4 32SOP S3C9414XZ0-AMB4 24SDIP S3C9414XZ0-SMB4 24SOP S3C9428XZ0-SNB4 28SOP S3C9428XZ0-SOB4 32SOP S3C9428XZ0-AVB4 30SDIP S3C9428XZ0-SNB8 28SOP S3C9428XZ0-SOB8 32SOP S3C9428XZ0-AVB8 30SDIP S3C9434XZ0-DIB4 18DIP S3C9434XZ0-DKB4 20DIP S3C9434XZ0-SKB4 20SOP S3C9444XZ0-SCB4 8SOP S3C9444XZ0-DCB4 8DIP S3C9454AZ0-DHB4 16DIP S3C9454AZ0-SHB4 16SOP S3C9454AZ0-DKB4 20DIP S3C9454AZ0-SKB4 20SOP S3C9464XZ0-SCB4* 8SOP S3C9464XZ0-DCB4* 8DIP S3C9474XZ0-DKB4* 20DIP S3C9474XZ0-SKB4* 20SOP S3C9488XZ0-AOB8* 32SDIP S3C9488XZ0-SOB8* 32SOP S3C9488XZ0-AQB8* 42SDIP S3C9488XZ0-QZR8* 44QFP S3C9498XZ0-SNB8* 28SOP S3C9498XZ0-SOB8* 32SOP S3C9498XZ0-AVB8* 30SDIP S3C9688XZ0-AQB8* 42SDIP S3C9688XZ0-QZR8* 44QFP S3P9698XZ0-DHB8* 16DIP S3P9698XZ0-SHB8* 16SOP S3P9698XZ0-DKB8* 20DIP S3P9698XZ0-SKB8* 20SOP

208 208

5/7 3/3 3/3 5/4
BT/WT/8TCx2 BT/WDT/8Tx2 BT/WDT/8Tx2 BT/WDT/8Tx2

SIO IIC, SIO

32/4 -

8x8 10x5 10x12

(10x1) (10x1)

8MHz 10MHz 10MHz

2.0 ~ 5.5 2.7 ~ 5.5 2.7 ~ 5.5 1.8 ~ 5.5
-25 ~ 85 -25~ 85 -25~ 85 -25~ 85

12x2,(8x1) 16MHz

BT/WDT/8T

3.0 ~ 5.5

-25~ 85

1/2 2/2

BT/8TC BT/8TC

10x3 10x9

10MHz 10MHz

2.0 ~ 5.5 2.0 ~ 5.5

-25~ 85 -25~ 85

7/2 7/3

BT/8TC BT/8TC BT/8TX1
LIN, UART LIN, UART UART 19/8

10x3 10x9 10x9

10x1 8x1

10MHz 10MHz 10MHz

2.0 ~ 5.5 2.0 ~ 5.5 2.2 ~ 5.5

-40~ 85 -40~ 85 -25 ~ 85

38/36/26 6/4

BT/8TCx3/16TC

SIO UART

12x1(8x1) 16MHz

1.8~5.5

15/14 10/14

BT/WDT/8T 8BT/8WDT/8TC

USB USBSIO

4.0 ~ 5.25 4.0 ~ 5.25
Package ROM Part Number Type S3C9xxx (KS86) Series S3C80A5AZ0-SMB8 24SOP S3C80A5AZ0-AMB8 24SDIP S3C80A5AZ0-SMB5 24SOP S3C80A5AZ0-AMB5 24SDIP S3C80B5XZ0-SMB8 24SOP S3C80B5XZ0-AMB8 24SDIP S3C80B5XZ0-SMB5 24SOP S3C80B5XZ0-AMB5 24SDIP S3C80C5XZ0-SMB8 24SOP S3C80C5XZ0-AMB8 24SDIP S3C80C5XZ0-SMB5 24SOP S3C80C5XZ0-AMB5 4SDIP S3C80D5XZ0-SMB8 24SOP S3C80D5XZ0-AMB8 24SDIP S3C80DXZ0-SMB5 24SOP S3C80D5XZ0-AMB5 24SDIP S3C80E7XZ0-AOB5 32SDIP S3C80E7XZ0-SOB5 32SOP S3C80E7XZ0-DPB5 40DIP S3C80E7XZ0-AOB7 32SDIP S3C80E7XZ0-SOB7 32SOP S3C80E7XZ0-DPB7 40DIP S3C80F9XZ0-SOB7 32SOP S3C80F9XZ0-AQB7 42SDIP S3C80F9XZ0-QZR7 44QFP / 48ELP S3C80F9XZ0-SOB9 32SOP S3C80F9XZ0-AQB9 42SDIP S3C80F9XZ0-QZR9 44QFP S3C80F9XZ0-LRR9 48ELP S3C80G9XZ0-SOB7 32SOP S3C80G9XZ0-AQB7 42SDIP S3C80G9XZ0-QZR7 44QFP S3C80G9XZ0-SOB9 32SOP S3C80G9XZ0-AQB9 42SDIP S3C80G9XZ0-QZR9 44QFP 32SOP S3C8095DZ0-SOB5 S3C8095DZ0-AOB5 32SDIP S3C8235BZ0-QTR8 64QFP 64LQFP S3C8235BZ0-ETR8 S3C8235BZ0-QTR5 64QFP 64LQFP S3C8235BZ0-ETR5 S3C8245AZ0-TWR8 80TQFP S3C8245AZ0-QWR8 80QFP S3C8245AZ0-TWR5 80TQFP S3C8245AZ0-QWR5 80QFP S3C8249XZ0-TWR7 80TQFP S3C8249XZ0-QWR7 80QFP S3C8249XZ0-TWR7 80TQFP S3C8249XZ0-QWR7 80QFP RAM Interrupt Timer/ Serial Interface LCD ADC PWM(1) Max. OSC. Freq. 8MHz Vdd (V) Oper. Temp. Kbytes Bytes I/O Pins (Int/Ext) Counter 26 5/12 BT/WDT/8Tx2/16T 8x1 8MHz 2.1~5.5 -25 ~ 19 5/8 BT/WDT/8Tx2/16T 8x1 8MHz 2.0 ~ 3.6 -25 ~ 19 5/8 BT/WDT/8Tx2/16T 8x1 4MHz 1.7 ~ 3.6 -25 ~ 19 5/8 BT/WDT/8Tx2/16T 8x1 4MHz 1.7 ~ 3.6 -25 ~ 19 5/8 BT/WDT/8Tx2/16T (Seg/Com) (Bit x Ch) (Bit x Ch) 8x1

14x2,(8x2) 12MHz 8x4 8x2,(8x2) 8*1(DAC) 10MHz 10x8 10X8 10x4 10x4 8x4 8*1(DAC) (8X1) 8x7
2.7-5.5 30MHz 2.7~5.5 10MHz 12MHz 3.58MHz 3.58MHz 12MHz
-25 ~ 85 4.5 ~ 5.5 -25 ~ 85 2.7~5.5 2.7~5.5 2.7 ~ 5.5 2.7-5.5 4.0 ~ 5.5 -25 ~ 85
-25 ~ 85 -25 ~ - - 70 -25 ~ 85

36/34 9/1/7 1/7 7/3

100QFP 42SDIP 44QFP 42SDIP 44QFP 42SDIP 44QFP 42SDIP 44QFP 32SDIP 42SDIP 42SDIP 42SDIP

BT/8TC/8T/12C

M/M IIC, Slave IIC

272 272

6/3 5/4 5/2 5/4
BT/8TC/8T/12C BT/8TCx2 BT/WDT/8Tx2 BT/WDT/8Tx2

4x4 8x4 4x2 4x4

8x6 14x2,8x4 (8x1) 14x1 14x2,8x4 (8x1)

12MHz 8MHz 8MHz 8MHz

4.0 ~ 5.5 4.5 ~ 5.5 4.5 ~ 5.5 4.5 ~ 5.5
-25 ~ 85 -20 ~ 85 -20~ 85 -20 ~ 85
1. * Under Development. Contact Samsung Sales offices for availability. 2 (1) ( ) : S/W supported PWM. 3 Abbreiations:. ADC = Analog to Digital converter SIO = Serial Input/Output LVR=Low Voltage Reset FSK=Freqency Shift Keying ZCD = Zero Cross Detection Cuircuit LVD=Low Voltage Detector CAS=CPE Alerting Signal DTMF = Dual Tone Multi Frequency SDT=Stuttered Dial Tone LIN=Local Interface Network Com = Comparator RDS=Radio Data System 4 Timer/Counters: BT / WT / WDT = Basic / Watch / Watchdog timer, 8T / 16T = 8-bit / 16-bit Timer/Counter
DAC = Digital to Analog converter PWM = Pulse Width Modulation
Calm RISC Microcontrollers
CALM RISC MICROCONTROLLER FAMILY
Part Number Full Code by PKG) Package Type ROM RAM I/O Interrupt Timer/ Counter Serial Interface LCD (Seg/Com) ADC DAC PWM(1) Max. Osc. Min Exe. Time (ns) Vdd (V) Oper. Temp. Kbytes Bytes Pins (Int/Ext) (Bit x Ch) (Bit x Ch) (Bit x Ch) Freq.
S3CBxxx, S3CCxxx, S3CKxxx Series
S3CB42FXZ0-QXRF S3CB42FXZ0-TXRF S3CC410XZ0-EER0 S3CC410XZ0-YER0 100QFP 100TQFP 208LQFP 208FBGA 10K 1K 1K 2.5K 8/9 13/8 9/4 8/5 9/4 7/7 BT, WT, 8TC x 3 BT, WT, 16TC x 1, 8TC x 2 BT, WT, 16TC x 2, 8TC x 2 8BT, WDT, 16TC BT, WT, 16TC x 2, 8TC x 2 BT, WT, 16TC x 1, 8TC x 1 SIO SIO SIO SIO SIO SIO 36/8 64/16 30/4 56/16 32/4 16/8 10x4 10x1 10x8 14x1 10x8 10x4 10x1 9x1 10x1 10x1 8x1 8x2 40MHz 8MHz 125 2.0~3.6 2.0~3.6 2.0~5.5 2.3~3.6 2.0~5.5 2.0~3.6 -25~85 -25~85 -25~85 0~70 -25~85 -25~85 88K 73 18/48K 65 11/8 BT, WT, 16TC x 1 (8TC x 2) BT, WT, 16TC x 3 SIO/UART/IIC/IIS 1024x1024 pixels 8x8 80MHz 12.5 3.0~3.6 -20~75 UART/SIO/IIC/IIS 8x6 40MHz 25 3.0~3.6 -25~85
S3CC11BXZ0-QXRF* 100QFP S3CC11BXZ0-TXRF* 100TQFP S3CK11FXZ0-C0CF* 117 Pellet S3CK215AZ0-QWR5 80QFP S3FK519XZ0-QXR9* 100QFP S3FK519XZ0-QAR9* 128QFP S3CK225XZ0-QTR5 64QFP

14. Packing

15. ROM Size

*1st Version X

S 1 13. Package Pin X 3 X 4 X 5 X 6 X 7 - PLCC X 8 X 9 X X 12 X 13 X 14 X 15 X 16 X 17 X 18
T : Tape & Reel Z : 44 C : 144 G : 256 U : 304 Z : 44 H : 16 M : 24 I : 18 N : 28 D : 160 R : 48 W : 80 S : Tape & Reel Reverse C : Chip Biz D : Chip Biz (3 Inch tray) E : Chip Biz (4 Inch tray) F : Chip Biz (Reverse) W : WF Biz Draft Wafer X : WF Biz Full Cutting 7 : Tape & Reel (Pb-Free PKG) 8 : Tray (Pb-Free PKG) 9 : Tube (Pb-Free PKG)

Wafer/CHIP BIZ = 0(NONE)

- SDIP

C : 52

B : 56 Q : 42
M : 24 T : 64 C : 83 H : 16 N : 28 D : 160 J : 176 W : 80
O : 32 V : 30 J : 176 I : 18 P : 40 E : 208 R : 48 X : 100
A : 128 E : 208 T : 64 X : 100

A : 88

C:8 K : 20

- LQFP

C:8 K : 20 O : 32

- TQFP

C : 144 G : 256 T : 64

- WQFP

A : 128 X : 100

- TEBGA

T : 64
W : : 0K byte 1 : 1K byte 2 : 2K byte 3 : 12K byte 4 : 4K byte 5 : 16K byte 6 : 6K byte 7 : 24K byte

X : 492

- FBGA

A : 272

B : 416
A : 337 D : 160 G : 285 L : 400 Q : 289

- SBGA

B : 81 E : 208 H : 320 O : 272 T : 64
C : 144 F : 180 K : 105 P : 504
8 : 8K byte 9 : 32K byte A : 48K byte B : 64K byte C : 96K byte D : 128K byte E : Extemded F : 256K byte G : 384K byte H : 512K byte J : 1M byte M : Military X : Special MK3 MK2 Z : Special MK1 * Smart Card IC : EEPROM Size * X,Y,Z : Special Marking ( MASKROM) K : 1M byte N : Industrial Y : Special

J : 176

- BQFP

B : 132

A : 432

- WAFER

R : 48

- QFPH

T : 64 F : 240 D : 8CNCL

0 : None

1 : Cust1

2 : Cust2

D : 160
B : Tube U : Bulk R : Tray

EEPROMS

SERIAL EEPROMS
Write Cycle Part Number S524A40X20-RCT0 S524A40X21-DCB0 S524A40X21-SCB0 S524A40X21-SCT0 S524A40X41-DCB0 S524A40X41-SCB0 S524A40X41-SCT0 S524A60X51-DCB0 S524A60X51-SCB0 S524A60X51-SCT0 S524A60X81-DCB0 S524A60X81-SCB0 S524A60X81-SCT0 S524AB0X91-DCB0 S524AB0X91-SCB0 S524AB0X91-SCT0 S524AB0XB1-DCB0 S524AB0XB1-DCB1 S524AB0XB1-DCB2 S524AD0XF1-RCT0

Density (bit) 2K 2K 2K 2K 4K 4K 4K 16K 16K 16K 8K 8K 8K 32K 32K 32K 64K 64K 64K 256K
Write Protection by Hardware & Software by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware by Hardware
Vopr (V) 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5 1.8 ~ 5.5
Time (Max) 5 ms 5ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Interface I2C BUS I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus I2C Bus
Package 8TSSOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8DIP 8SOP 8SOP (T&R) 8TSSOP
Production Plan In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production In Production
1. Temperature: -25 ~ 70c 2 All products offer 100-year data retention, a 16M page buffer, and two-wired serial I2C-bus interfaces. 3 All products operate at 100KHz, 400KHz clock frequency.
EEPROMS Ordering Information
EEPROMS ORDERING INFORMATION
K 1 1. System LSI (S) 2. Large Classfication : MOS (5) 3. Small Classification X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 13. Temp X 15 X 16 X 17 X 18 9. EEPROM Size
0 : 0K bit 2 : 2K bit 8 : 8K bit 9 : 32K bit F : 256K bit

10. Write Protection

1 : 1K bit 4 : 4K bit 5 : 16K bit B : 64K bit H : 512K bit

0 : Normal I : -4085C

C : -2570C
2 : EEPROM Y : Memory Card

4. Interface Pro.

B : Tube R : Tray S : Tape & Reel Reverse D : Chip Biz (3 Inch tray) E : Chip Biz (4 Inch tray) F : Chip Biz (Reverse) W : WF Biz Draft Wafer X : WF Biz Full Cutting
4 : IIC 5 : SPI or Asynchronous

5. Voltage Option

N : No W/P 1 : H/W Only 0 : H/W & S/W C : 2.55.5 L : 2.05.5
12. Package Type 11. " - "

A : 1.85.5 H : 4.55.5

6. EEPROM Master
7 : Tape & Reel (Pb-Free PKG) 8 : Tray (Pb-Free PKG) A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA

15. Customer

0 : 0K bit 4 : 1K/2K/4K bit 6 : 8K/16K bit B : 32K/64K bit E : 512K bit

7. Reserved

2 : 1K/2K bit 5 : 16K bit 8 : 4K/8K bit D : 128K/256K bit
1 : TEBGA B : BGA D : DIP F : BCC H : LPQ4 K : SBGA M : QFPH P : PLCC R : TSSOP T : TQFP W : WAFER Z : STBGA

Arizona

California

Colorado

Connecticut
State/Country Florida City Altamonte Springs Clearwater Deerfield Beach Deerfield Beach Deerfield Beach Lake Mary Miami Tampa Tampa Georgia Illinois Duluth Duluth Itasca Itasca Itasca Schaumburg Schaumburg Schaumburg Indianapolis Overland Park Lenexa Columbia Columbia Columbia Columbia Columbia Burlington Tewksbury Wilmington Wilmington Wilmington Guadalajara, Jalisco Livonia Plymouth Eden Prairie Eden Prairie Eden Prairie Mendota Heights St. Louis Marlton Pine Brook Pine Brook Company All American All American All American Arrow - Bell Jaco Electronics Arrow - Zeus All American Corporate Jaco Electronics Jaco Electronics Corporate Sales Arrow - Bell Jaco Electronics Arrow - Bell Arrow - Zeus Arrow Components All American Jaco Electronics Jaco Electronics Arrow - Bell All American Arrow - Bell All American Arrow - Bell Arrow Components Arrow - Zeus Jaco Electronics Jaco Electronics Jaco Electronics Arrow - Bell Arrow - Zeus Arrow Components Jaco Electronics All American Arrow - Bell All American Arrow - Bell Arrow Components Jaco Electronics Arrow - Bell All American Arrow - Bell Arrow Components Phone 407-261-1304 727-532-9800 954-429-2800 954-429-8200 954-425-0304 800-776-5226 407-333-3055 305-651-8282 813-854-6360 813-854-2351 770-497-1300 770-446-1300 630-250-0500 630-595-9730 630-285-6090 847-303-1995 847-303-0700 847-882-1700 317-913-1100 913-851-5900 913-541-9542 410-309-6262 410-309-0686 410-309-0899 410-309-1541 410-995-6620 781-273-2800 978-640-0010 800-225-0818 978-658-0900 978-658-4776 978-694-6650 011-52-3-678-9294 734-464-2202 734-455-0850 952-944-2151 952-828-5350 952-828-5300 651-452-7464 314-567-6888 856-596-6666 973-882-8358 973-882-8358 Fax 407-261-1330 727-538-5567 954-429-0391 954-428-3991 954-425-8077 407-333-9681 305-620-7831 813-891-4056 813-891-4056 770-476-1493 770-446-2991 630-250-0916 630-595-9896 630-285-6096 847-303-1996 847-303--882-8904 317-570-1344 913-851-5905 913-752-2612 410-309-6273 410-309-0699 410-309-0898 410-309-1560 410-995-6032 781-270-0070 978-640-0755 978-694-1724 978-694-2199 978-694-6652 011-52-3-678-9200 734-464-2433 734-455-6656 952-944-9803 952-828-5399 952-828-5420 651-452-7502 314-567-1164 856-797-1700 973-882-9109 973-882-9109

Indiana Kansas Maryland

Massachusetts
Mexico Michigan Minnesota

Missouri New Jersey

State/Country New York City Hauppauge Hauppauge Hauppauge Hauppauge Melville Purchase Purchase Rochester Rochester Raleigh Raleigh Raleigh Centerville Centerville Solon Warrenville Heights Tulsa Beaverton Beaverton Beaverton Horsham Horsham Pittsburgh Austin Carrollton Carrollton Carrollton Richardson Richardson Midvale Salt Lake City Bellevue Bellevue Bothell Brookfield Waukesha Company All American Arrow - Bell Arrow Components Jaco Electronics - Corp Arrow - Bell Arrow - Zeus Arrow - Zeus - Corporate All American Arrow - Bell All American Arrow - Bell Jaco Electronics Arrow - Bell Arrow - Zeus Arrow - Bell All American Arrow - Bell All American Arrow - Bell Jaco Electronics Arrow - Bell Arrow Components Arrow - Bell All American Arrow - Bell Arrow - Zeus Arrow Components All American Jaco Electronics All American Arrow - Bell Arrow - Bell Arrow Components All American Arrow - Bell All American Phone 631-434-9000 631-851-2300 631-493-2200 631-273-5500 631-391-4256 914-701-7400 914-701-7400 585-292-6700 716-427-0300 919-851-6566 919-876-3132 919-876-7767 800-768-2868 937-428-7300 888-645-7364 440-248-9996 216-514-0625 918-252-7537 503-531-3333 503-629-8090 503-626-1439 800-245-5226 215-956-4800 215-956-4850 724-327-1130 512-335-2280 972-380-6464 972-380-4330 972-250-5300 972-231-5300 972-234-5565 801-565-8300 801-973-8555 425-643-9992 425-649-6238 425-806-4800 262-879-0434 262-798-5007 Fax 631-434-9394 631-851-2360 631-493-2240 631-273-5799 631-391-4280 914-701-4262 914-251-1583 585-292-6755 716-427-0735 919-851-8734 919-878-9517 919-876-6964 937-428-7359 937-428-7346 440-248-5490 216-514-0822 918-254-0917 503-531-3695 503-645-0611 503-626-0979 215-675-9875 215-956-4855 724-327-4181 512-335-2282 972-248-7208 972-447-2222 972-930-1374 972-437-0353 972-238-7068 801-565-9983 801-973-8909 425-643-9709 425-649-6249 425-806-9900 262-879-0474 262-798-7055

North Carolina

Oklahoma Oregon

Pennsylvania

Utah Washington

Wisconsin

SALES OFFICES 8c

Samsung Sales Offices