Optical Storage Devices The comprehensive line of optical storage products coming out of Samsungs manufacturing facilities in South Korea and the Philippines leads the industry. Supported by logistics centers around the world, this operation taps into Samsungs manufacturing expertise, global marketing & sales reach and well-known skills in advanced technology development. Launched in 1994, Samsungs optical storage operation has been growing at 100% per year and offers a broad selection of DVD and CD drives in various configurations. For example, Samsung was the first to introduce a blazing-fast DVD drive with 18x multi-format recording. Samsungs products include special features such as auto ball balancing, speed-adjustment technology, tilt-actuator compensation and acoustic noise suppression. The Samsung product line has received numerous best awards from the worlds top 10 PC Hard Disk Drives Samsung has the industrys fastest-growing hard drive business, as seen in the companys recent move into third place worldwide. The storage business was launched in 1988 when Samsung shipped the worlds first 20-megabyte and 40-megabyte hard drives. Now Samsung operates the worlds most automated hard disk drive factory, which is located in Kumi, South Korea, and applies its technology development skills to advancing its products. Utilizing its R&D center in San Jose, California, Samsung has patented several new storage technologies that include advanced acoustic noise suppression, in which Samsungs hard drives are unequalled. Its ISO-9001/14001-certified factory ensures high quality levels and operating efficiencies that consistently lower costs for customers. Samsung focuses on the largest computing market segments that require small, high-density disk drives. These include small business, the enterprise and the home, where hard drives for gaming systems is a fast-growing area. For example, users in all these segments can store and play back virtually unlimited amounts of digital music and movie data with a new 400-gigabyte Samsung drive that also offers fast, reliable data transmission. suppliers and leading computer publications.

Summer 2006

Samsung Storage Products

For more information:

Samsung Semiconductor, Inc. 3655 North First Street San Jose CA 95134-1713 www.usa.samsungsemi.com
2006. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time without notice. Samsung and Samsung Semiconductor Inc. are trademarks of Samsung Electronics Co., Ltd. All other names and brands are the property of their respective owners. CA-06-STOR-001 Printed 7/06
Samsung is a leading worldwide supplier of hardware components for digital devices, bringing to its line of storage solutions the same technology and manufacturing expertise seen in its memory, logic and display components.
Storage Products Reference Card
Highly Reliable, High-Capacity Storage Solutions from a World Leader in Technology
Hard Disk Drives Optical Storage Devices

Hard Disk Storage

3.5 Hard Disk Drives
Model SV1203N SV1604N HA250JC SP0411N SP0401N SP0411C SP0802N SP0822N SP1203N SP1604N SP1624N SP0812N SP0842N SP1213N SP1614N SP1644N SP0812C SP1213C SP1614C HD040GJ HD080HJ HD120IJ HD160JJ SP2014N SP2514N SP2004C SP2504C HD300LD HD400LD HD300LJ HD400LJ 6 # of Heads PATA/2MB PATA/2MB SATA 1.5Gb/s PATA/2MB PATA/8MB SATA 1.5Gb/s SATA 3.0Gb/s PATA/ 8MB SATA 3.0Gb/s PATA/ 8MB SATA 3.0Gb/s Capacity 120GB 160GB 250GB 40GB 40GB 40GB 80GB 80GB 120GB 160GB 160GB 80GB 80GB 120GB 160GB 160GB 80GB 120GB 160GB 40GB 80GB 120GB 160GB 200GB 250GB 200GB 250GB 300GB 400GB 300GB 400GB RPMs 5400 rpm 5400 rpm 5400 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm 7200 rpm # of Disks 3 Interface ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 S-ATA 1.5G ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 ATA-133 S-ATA 1.5G S-ATA 1.5G S-ATA 1.5G S-ATA 3G S-ATA 3G S-ATA 3G S-ATA 3G ATA-133 ATA-133 S-ATA 3G S-ATA 3G ATA-133 ATA-133 S-ATA 3G S-ATA 3G Buffer Size 2MB 2MB 2MB 2MB 2MB 2MB 2MB 2MB 2MB 2MB 2MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB Seek Time 8.9ms 8.9ms 8.9ms 10ms 10ms 10ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms 8.9ms MTBF 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 500K hrs 600K hrs 600K hrs 600K hrs 600K hrs 600K hrs 600K hrs

SpinPoint V Series SpinPoint P Series SpinPoint T series
V80 Series V120 CE Series P40 Series P80 Series P80 SD Series P120 Series T133 Series

2.5 Hard Disk Drives

SATA 1.5Gb/s SATA 1.5Gb/s
SpinPoint M Series (3.0Gb/s)
M40 Series M40S Series M60 Series
Capacity 40GB 60GB 80GB 40GB 60GB 80GB 40GB 60GB 80GB 100GB 120GB 40GB 60GB 80GB 100GB 120GB
RPMs 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm 5400 rpm
Model MP0402H MP0603H MP0804H HM040HI HM060II HM080JI HM040HC HM060HC HM080IC HM100JC HM120JC HM041HI HM060HI HM080II HM100JI HM120JI

# of Heads 4 4

# of Disks 2 2
Interface ATA-6 ATA-6 ATA-6 S-ATA S-ATA S-ATA ATA-6 ATA-6 ATA-6 ATA-6 ATA-6 S-ATA S-ATA S-ATA S-ATA S-ATA
Buffer Size 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB 8MB
Seek Time 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms 12ms
MTBF 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs 330K hrs

Optical Storage

SN-M242C Basic Specs
Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 128 x 12.7 x 129 Interface: P-ATA 2MB buffer memory

Seek Time (Average)

CD-ROM/R/RW:120ms DVD-Single:130ms DVD-Dual:140ms DVD-DL(R):140ms DVDR/RW:140ms DVD-RAM:250ms

Drive Speed

Disc Supported List
Read Speed CD-ROM Max. 24X (3,600KB/sec) CD-RW Max. 24X (3,600KB/sec) DVD-Single Max. 8X (10,800KB/sec) DVD-Dual Max. 6 (10,800KB/sec) CD CD-DA; CD-ROM; CD-ROM XA; CD-I; CD-Extra/CD-Plus; Video-CD; CD-R; CD-RW & HSRW; Super Audio CD; US & US+ RW

Media Capacity

Write Speed
CD-R Max. 24X (3,600KB/sec) CD-RW Max. 10X (1,500KB/sec) US-RW Max. 24X (3,600KB/sec) US+ CD-RW Max. 24X (3,600KB/sec)
DVD-ROM; DVD-Dual; DVD-Video; DVD-R; DVD+R; DVD+RW; DVD-RW
650 MB CD-ROM (read only) 80mm CD (horizontal mount only) 800/700/650/ CD-Recordable (read & write) 700/650MB CD-Rewritable (read & write) 700/650MB High-Speed CDRewritable (read & write) 700/650MB Ultra & Ultra+ Speed CD-Rewritable (read & write) 5/9/10/18 G DVD-Single/Dual (PTP, OTP) (read only) 3.9/4.7 G DVD-R (read only) 4.7G DVD+R (read only) DVDRW (read only) 80mm DVD

SN-S082D Basic Specs

Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 128 x 12.7 x 127 Interface: P-ATA 2MB buffer memory
CD-ROM:130ms NS CD-RW:130ms HS/US CD-RW:130ms DVD-Single:130ms DVD-Dual:150ms DVD-R/+R:150ms DVD-RW/+RW:150ms
Read Speed CD-ROM Max. 24X (3,600KB/sec) CD-R Max. 24X (3,600KB/sec) NS CD-RW Max. 24x HS/US CD-RW Max.24x DVD-Single Max. 8x DVD-Double Max. 6x DVD-R/+R Max. 8x DVD-RW/+RW Max. 6x DVD-RAM 5x Write Speed CD
CD-DA; CD-ROM; CD-ROM XA; CD CD-I/FMV; CD-Extra/CD-Plus; Video-CD; CD-R; CD-RW & HSRW; US & US + RW; Super Audio CD; 650MB CD-ROM (read only) 120mm/80mm CD 800/700/650MB CD-Recordable (read & write) 700/650MB CD-Rewritable (read & write) 700/650MB High-Speed CDRewritable (read & write) 700/650MB Ultra & Ultra+ Speed CDRewritable (read & write) DVD CD-R Max. 24X (3,600KB/sec) NS CD-RW 4X (600KB/sec) HS CD-RW Max. 10X (1,500KB/sec) US/US+ RW Max. 24X DVD+R Max. 8X DVD+RW Max. 8X (8x media) Max. 4x (4x media) DVD+R DL Max. 6x DVD-R Max. 8X DVD-R DL Max, 6x DVD-RW Max 6X (6x media), Max. 4x (4x media) DVD-ROM; DVD-Video; DVD-R; DVD DVD+R; DVDRW; DVD+R DL; DVD-R DL; support DVD-R/RW CPRM (read/write); DVD-RAM (read only) 5/9/10/18 G DVD-Single/Dual (PTP, OTP) (read only) 3.9/4.7 G DVD-R (read only) 4.7G DVD+R (read only) DVDRW (read only) 80mm DVD

SH-S182D Basic Specs

Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 148.2 x 42 x 170 Interface: P-ATA 2MB buffer memory
CD-ROM/R/RW:110ms DVD-Single:130ms DVD-Dual:140ms DVDR/RW:140ms

Read Speed

CD-DA; CD-ROM; CD-ROM XA; CD CD-I; CD-Extra/CD-Plus; VideoCD; CD-R; CD-RW 120mm CD-ROM (read only) 80mm CD (horizontal mount only) 800/700/650MB CD-Recordable (read & write) 700/650MB Low/High/Ultra-Speed CD Rewritable (read & write)
CD DVD-ROM Max.16X (21,600KB/sec) DVD-RAM Max.12X (16200KB/sec) DVD-Dual DVD RW Max. 8X (10,800KB/sec) DVDR Max. 12X (16,200KB/sec) DVDR DL Max. 8X (10,800KB/sec) CD-ROM Max. 48X (7,200 KB/sec) CD-R/CD-RW Max. 40X (6,000 KB/sec) DVD-RAM Max. 12X (16,200 KB/sec) DVD DVD+R Max. 18X (24,300KB/sec) DVD-R Max.18X (24,300KB/sec) DVDRW Max. 8X (10,800KB/sec), 6X (8,100KB/sec) DVDR Double L Max. 8X (10,800/sec) CD-R Max. 48X (7,200KB/sec) HS-RW Max. 10X (1,500KB/sec) US-RW Max. 32X (4,800KB/sec)
DVD-ROM; DVD-Video; DVD-R; DVD DVD+R; DVD_R DL; DVDRW; DVD-RAM
5/9/10/18G DVD-Single/Dual (PTP, OTP) (read only) 3.9/4.7G DVD-ROM (read only) DVDRW, DVDR, DVDR DL (read & write) 80mm DVD (horizontal mount only)

SH-S182M Basic Specs

Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 148.2 x 42 x 170 Interface: P-ATA (Light Scribe) 2MB buffer memory
DVD-ROM; DVD-Video; DVD-R; DVD DVD+R; DVD_R DL; DVDRW; DVD-RAM

Refresh 4K 4K 4K 4K 4K 4K 4K 4K 4K 4K 4K 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K
(3)~(4) Speed: Mobile-SDRAM 60: 166MHz, CL 3 75: 133MHz, CL 3 80: 125MHz, CL 3 1H: 105MHz, CL 2 1L: 105MHz, CL 3 15: 66MHz, CL 2 & 3
Power 3.0V 2.5V 1.8V 3.0V 2.5V 3.0V 2.5V 1.8V 3.0V 2.5V 1.8V 3.0V 2.5V 1.8V 1.8V 3.0V 2.5V 1.8V 1.8V 3.0V 2.5V 1.8V 1.8V 3.0V 2.5V 1.8V 1.8V
# Pins TSOP/BGA FBGA-54balls FBGA-54balls FBGA-54balls FBGA-90balls FBGA-90balls FBGA-54balls FBGA-54balls FBGA-54balls FBGA-90balls FBGA-90balls FBGA-90balls FBGA-54balls FBGA-54balls FBGA-54balls FBGA-60balls FBGA-90balls FBGA-90balls FBGA-90balls FBGA-90balls FBGA-54balls FBGA-54balls FBGA-54balls FBGA-60balls FBGA-90balls FBGA-90balls FBGA-54balls FBGA-54balls
Mobile-DDR C3: 133MHz, CL 3 C2: 100MHz, CL 3 C0: 66MHz, CL 3
NOTES: (1) Package: Leaded / Lead Free G/A: 52balls FBGA Mono R/B: 54balls FBGA Mono X /Z: 54balls BOC Mono J /V: 60(72)balls FBGA Mono 0.5pitch L /F: 60balls FBGA Mono 0.8pitch S / D: 90balls FBGA Monolithic (11mm x 13mm)
E : Extended(-25~85C), Normal N : Extended, Low, i-TCSR G : Extended, Low, i-TCSR & PASR & DS I : Industrial(-40~85C), Normal P : Industrial, Low H : Industrial, Low, i-TCSR & PASR & DS
GRAPHICS DDR SDRAM COMPONENTS
Type GDDR4 GDDR3 Density 512Mb 512Mb 512Mb 256Mb GDDR2 512Mb 256Mb 256Mb 128Mb Org 16Mx32 16Mx32 16Mx32 8Mx32 32Mx16 16Mx16 16Mx16 4Mx32 Die E C E G C G H G I 8Mx16
NOTES: * clock cycle time
07 0.71ns 08 0.83ns 09 0.90ns 1A 1ns (1000MHz) 11 1.11ns (900MHz)
Part Number K4U52324Q K4J52324Q K4J52324Q K4J55323Q K4N51163Q K4N56163Q K4D551638 K4D26323Q K4D263238 K4D263238 K4D263238 K4D261638
Package 136 FBGA 136 FBGA 136 FBGA 136 FBGA 136 FBGA 136 FBGA 136 FBGA 84 FBGA 84 FBGA 84 FBGA 66 TSOPII 144 FBGA 144 FBGA 144 FBGA 100 TQFP 66 TSOPII
VDD/VDDQ 1.8/1.8V 1.8/1.8V 2.0/2.0V 1.8/1.8V 1.9/1.9V 1.8/1.8V 2.0/2.0V 1.8/1.8V 1.8/1.8V 2.0/2.0V 2.35~2.7V 1.8/1.8V 2.5/2.5V 2.5/2.5V 2.5/2.5V 2.5/2.5V
Speed Bin (MHz) 1100/1200/1400 500/600/700 800/900/1000 700/800 900/1000 700/800 900/1000 300/350/400 350/400 450/500 200/250 300/350 300/350 200/250 200/250 200/250
Remarks CS now EOL'd EOL'd CS now CS now

EOL'd EOL'd

CL-tRCD-tRP 3-3-3 for 200Mhz
** all products are 4 banks
12 1.25ns (800MHz) 14 1.429ns (700MHz) 16 1.667ns (600MHz) 20 2.0 ns (500MHz) 22 2.2 ns (450MHz) 25 2.5 ns (400MHz) 2A 2.86 NS (350MHz) 33 3.3 ns 40 4.0 ns 50 5.0 ns (200MHz)

16Mbit

HIGH-SPEED (4Mbit) ASYNCHRONOUS FAST SRAM
Density 4Mbit Part Number K6R4016C1D K6R4016V1D K6R4004C1D K6R4004V1D K6R4008C1D K6R4008V1D K6R3024V1D K6R1008V1D K6R1008C1D K6R1004V1D K6R1004C1D K6R1016V1D K6R1016C1D Organization 256Kx16 256Kx16 1Mx4 1Mx4 512Kx8 512Kx8 128x24 128x8 128x8 256x4 256x4 64x16 64x16 Vcc (V) 5 3.3.3.3 3.3 3.3.3.Speed (ns) 10, 12 8, 10 9, 10, 12 8, 10, 12 10, 12, 15 8, 10, 12 10, 12, 15 8, 10, 12 10, 12, 15 Operating Temp I I I I I I C,I C,I C,I C,I C,I C,I C,I Operating Current (mA) 65, 55 80, 65 65, 55 80, 65 65, 55 80, 65 170,150,130 170,150,130 170,150,130 170,150,130 170,150,130 170,150,130 170,150,130 Standby Current (uA) 20, 5 20, 5(1.2) 20, 5 20, 5 20, 5 20, 5 40,15 20,5 20,5 20,5 20,5 20,5 20,5 Package 44SOJ, 44TSOP2, 48TBGA 44SOJ, 44TSOP2, 48TBGA 32 SOJ 32 SOJ 36 SOJ, 44 TSOPSOJ, 44 TSOP2 119PBGA 32SOJ,32TSOP2 32SOJ,32TSOP2 32SOJ 32SOJ 44SOJ,44TSOP2,48TBGA 44SOJ,44TSOP2,48TBGA Production Status Mass Production Mass Production EOL EOL Mass Production Mass Production EOL EOL EOL EOL EOL EOL EOL

3Mbit 1Mbit

NOTE: Ordering Information: http://www.samsung.com/Products/Semiconductor/Support/Label_CodeInfo/Async_SRAM.pdf
Asynchronous SRAM Ordering Information
ASYNCHRONOUS SRAM ORDERING INFORMATION
K 1 1. Memory (K) 2. Async SRAM: 6 3. Small Classification E: Corner Vcc/Vss + Fast SRAM F: fCMOS Cell + LPSRAM H: High Speed(LPSRAM) X: High Voltage(LPSRAM) J: BICMOS L: Poly Load Cell + LPSRAM R: Center Vcc/Vss + Fast SRAM T: TFT Cell + LPSRAM 4~5. Density 06: 64K 10: 1M 30: 3M 60: 6M 6~7. Organization 01: x1 16: x16 32: x32 8. Vcc 5: 1.5V Q: VDD 3.0V/VDDQ 1.8V R: 1.65V~2.2V S: 2.5V T: 2.7V~3.6V V: 3.3V W: 2.2V~3.3V 9. Mode 1: CS Low Active 2: CS1, CS2 - Dual Chip Select Signal 3: Single Chip Select with /LB,/UB(tOE) 4: Single Chip Select with /LB,/UB(tCS) 5: Dual Chip Select with /LB,/UB(tOE) 6: Dual Chip Select with /LB,/UB(tCS) 7: I/Os Control with /BYTE 8: CDMA Function 9: Multiplexed Address A: Mirror Chip Option 13. 1st Chip Speed - COMMON (Temp,Power) A: Automotive,Normal B: Commercial,Low Low C: Commercial,Normal D: Extended,Low Low E: Extended,Normal F: Industrial,Low Low I: Industrial,Normal L: Commercial,Low M: Military,Normal N: Extended,Low P: Industrial,Low Q: Automotive,Low R: Industrial,Super Low T: Extended,Super Low U: Commercial,Ultra Super Low 0: NONE,NONE - WAFER, CHIP BIZ Level Division 0: NONE,NONE 1: Hot DC sort 2: Hot DC,selected AC sort 3: Cold/Hot DC,selected AC sort C: 5.0V 04: x4 18: x18 08: x8 24: x24 * Exception - 1MFSRAM B-ver 32-SOJ-300 > S 28-SOJ-300 > S - 512K/1M/2M/4M LPSRAM 32-TSOP1-0813.4F > Y 32-TSOP1-0813.4 > Y 32-TSOP1-0813.4R > N - 4M LPSRAM 32-TSOP2-400F > V 32-TSOP2-400R > M 08: 256K 16: 16M 32: 32M 64: 64M 09: 512K 20: 2M 40: 4M 80: 8M X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 X 15 X 16 X 17 X 18 10. Generation M: 1st Generation A: 2nd Generation C: 4th Generation E: 6th Generation G: 8th Generation 11. " ----" 12. Package A: TBGA(LF) C: CHIP BIZ E: TBGA G: SOP J: SOJ L: TSOP1-0813.4F(LF) P: TSOP1-0820F(LF) Q: TSOP2-400R(LF) T: TSOP W: WAFER B: SOP(LF) D: DIP F: FBGA H: BGA K: SOJ(LF) B: 3rd Generation D: 5th Generation F: 7th Generation H: 9th Generation 14~15. Speed (tAA) - fCMOS Cell + LPSRAM & Poly Load Cell + LPSRAM & TFT Cell + LPSRAM 10: 100ns 12: 120ns 15: 150ns 25: 25ns(only fCMOS Cell) 30: 300ns 35: 35ns(except Poly Load Cell) 45: 45ns(except fCMOS Cell) 55: 55ns 60: 60ns(only fCMOS Cell) 70: 70ns 85: 85ns 90: 90ns(only fCMOS Cell) DS: Daisychain Sample - High Speed (LPSRAM) 20: 20ns 25: 25ns - High Voltage (LPSRAM) 55: 55ns 70: 70ns 85: 85ns - Corner Vcc/Vss + Fast SRAM 10: 10ns 12: 12ns 13: 13ns 15: 15ns 17: 17ns 20: 20ns 25: 25ns 30: 30ns 35: 35ns 45 :45ns - BICMOS & Center Vcc/Vss + Fast SRAM 06: 6ns 08: 8ns 09: 9ns 10: 10ns 12: 12ns 13: 13ns 15: 15ns 17: 17ns 20: 20ns 25: 25ns 30: 30ns(only Center Vcc/Vss + Fast SRAM) 35: 35ns(only Center Vcc/Vss + Fast SRAM) 7A: 7.2ns(only BICMOS) 8A: 8.6ns(only BICMOS) DS: Daisychain Sample - Async SRAM COMMON 00: NONE (Containing Wafer, CHIP BIZ, Exception code) 16. Packing Type (16 digit) - Common to all products, except of Mask ROM - Divided into TAPE & REEL(In Mask ROM, divided into TRAY, AMMO Packing Separately) Type Packing Type New Marking T 0 (Number) S Y A P M

Part Number K7K1618T2C K7K1636T2C Organization 1Mx18 512Kx36 Vdd (V) 1.8 1.8 Access Time tCD (ns) 0.45 0.45 Cycle Time (MHz) 400, 333 400, 333 I/O Voltage (V) 1.5 1.5 Production Package 165FBGA 165FBGA Status Q3`06 (E/S) Q3`06 (E/S) Comments DDRII + CIO-2B DDRII + CIO-2B
NOTES:Offer 2-clock latency now; we can also support 2.5-clock latency with 500MHz speed based on demand.
DDR II+ CIO/SIO (36Mbit) SRAM
Part Number K7K3218T2C K7K3236T2C Organization 2Mx18 1Mx36 Vdd (V) 1.8 1.8 Access Time tCD (ns) 0.45 0.45 Cycle Time (MHz) 400, 333 400, 333 I/O Voltage (V) 1.5 1.5 Production Package 165FBGA 165FBGA Status Q3`06 (E/S) Q3`06 (E/S) Comments DDRII + CIO-2B DDRII + CIO-2B

QDR I, II (18Mbit) SRAM

Part Number K7R160982B K7R161882B K7R161884B K7Q161862B K7Q161864B K7R163682B K7R163684B K7Q163662B K7Q163664B
Organization 2Mx9 1Mx18 1Mx18 1Mx18 1Mx18 512Kx36 512Kx36 512Kx36 512Kx36
Vdd (V) 1.8 1.8 1.8 1.8v / 2.5v 1.8v / 2.5v 1.8 1.8 1.8v / 2.5v 1.8v / 2.5v
Access Time tCD (ns) 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.45,0.50 2.5 2.5 0.45,0.45,0.50 0.45,0.45,0.45,0.50 2.5 2.5
Cycle Time (MHz) 250,200,167 250,200,167 300,250,200,167 250,200,167 300,250,200,167
I/O Voltage (V) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8
Package 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA
Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
Comments QDR II - 2B QDR II - 2B QDR II - 4B QDR I - 2B QDR I - 4B QDR II - 2B QDR II - 4B QDR I - 2B QDR I - 4B

QDR II (36Mbit) SRAM

Part Number K7R320982M K7R321882M K7R321884M K7R323682M K7R323684M K7R320982C K7R321882C K7R321884C K7R323682C K7R323684C Organization 4Mx9 2Mx18 2Mx18 1Mx36 1Mx36 4Mx9 2Mx18 2Mx18 1Mx36 1Mx36 Vdd (V) 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 Access Time tCD (ns) 0.45,0.50 0.45,0.50 0.45,0.45,0.50 0.45,0.50 0.45,0.45,0.50 0.45 0.45 0.45 0.45 0.45 Cycle Time (MHz) 200,167 200,167 250,200,167 200,167 250,200,167 300, 250, 200 300, 250, 200 333, 300, 250 300, 250, 200 333, 300, 250 I/O Voltage (V) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 Package 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA Production Status EOL in Q4`06 EOL in Q4`06 EOL in Q4`06 EOL in Q4`06 EOL in Q4`06 Q3`06 (C/S) Q3`06 (C/S) Q3`06 (C/S) Q3`06 (C/S) Q3`06 (C/S) Comments QDR II-2B QDR II-2B QDR II-4B QDR II-2B QDR II-4B QDR II-2B QDR II-2B QDR II-4B QDR II-2B QDR II-4B

NOTES: 2B = Burst of 2 4B = Burst of 4 C-die will support high-speed bins only 300, 250, 200MHz, which can cover slow-speed bin (167MHz) using stable DLL circuit.

QDR II (72Mbit) SRAM

Part Number K7R640982M K7R641882M K7R641884M K7R643682M K7R643684M Organization 8Mx9 4Mx18 4Mx18 2Mx36 2Mx36 Vdd (V) 1.8 1.8 1.8 1.8 1.8 Access Time tCD (ns) 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.45,0.50 Cycle Time (MHz) 250,200,167 250,200,167 300,250,200,167 250,200,167 300,250,200,167 I/O Voltage (V) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 Production Package 165FBGA 165FBGA 165FBGA 165FBGA 165FBGA Status Mass Production Mass Production Mass Production Mass Production Mass Production Comments QDR II-2B QDR II-2B QDR II-4B QDR II-2B QDR II-4B
NOTES: 2B = Burst of 2 4B = Burst of 4 The recommended speed bins are 250MHz, 200MHz for 2B part, 300MHz, 250MHz for 4B part.

QDR II+ (18Mbit) SRAM

Part Number K7S1618T4C K7S1636T4C Organization 1Mx18 512Kx36 Vdd (V) 1.8 1.8 Access Time tCD (ns) 0.45 0.45 Cycle Time (MHz) 400, 333 400, 333 I/O Voltage (V) 1.5 1.5 Production Package 165FBGA 165FBGA Status Q3`06 (E/S) Q3`06 (E/S) Comments QDR II + 4B QDR II + 4B
NOTES: Offer 2-clock latency now; we can also support 2.5-clock latency with 500MHz speed based on demand.

QDR II+ (36Mbit) SRAM

Part Number K7S3218T4C K7S3236T4C Organization 1Mx36 2Mx18 Vdd (V) 1.8 1.8 Access Time tCD (ns) 0.45 0.45 Cycle Time (MHz) 400, 333 400, 333 I/O Voltage (V) 1.5 1.5 Production Package 165FBGA 165FBGA Status Q3`06 (E/S) Q3`06 (E/S) Comments QDR II + 4B QDR II + 4B
Synchronous SRAM Ordering Information
SYNCHRONOUS SRAM ORDERING INFORMATION
K 1 1. Memory (K) 2. Sync SRAM: 7 3. Small Classification A: Sync Pipelined Burst B: Sync Burst C: Custom Product D: Double Data Rate I: Double Data Rate II, Common I/O J: Double Data Rate, Separate I/O K: Double Data II+, Common I/O L: Late Select M: Sync Burst + NtRAM N: Sync Pipelined Burst + NtRAM P: Sync Pipe Q: Quad Data Rate I R: Quad Data Rate II S: Quad Data Rate II+ 4~5. Density 10: 1M 20: 2M 40: 4M 64: 72M 6~7. Organization 08: x8 18: x18 36: x36 72: x72 8~9. Vcc, Interface, Mode 00: 3.3V,LVTTL,2E1D WIDE 01: 3.3V,LVTTL,2E2D WIDE 08: 3.3V,LVTTL,2E2D Hi SPEED 09: 3.3V,LVTTL,Hi SPEED 11: 3.3V,HSTL,R-R 12: 3.3V,HSTL,R-L 14: 3.3V,HSTL,R-R Fixed ZQ 22: 3.3V,LVTTL,R-R 23: 3.3V,LVTTL,R-L 25: 3.3V,LVTTL,SB-FT WIDE 30: 1.8/2.5/3.3V,LVTTL,2E1D 31: 1.8/2.5/3.3V,LVTTL,2E2D 35: 1.8/2.5/3.3V,LVTTL,SB-FT 44: 2.5V,LVTTL,2E1D 45: 2.5V,LVTTL,2E2D 49: 2.5V,LVTTL,Hi SPEED 52: 2.5V,1.5/1.8V,HSTL,Burst2 54: 2.5V,1.5/1.8V,HSTL,Burst4 09: x9 32: x32 44: x144 80: 8M 16: 18M 32: 36M 44: 144M 10. Generation M: 1st Generation A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation Z: TEMPORARY CODE 11. -- 12. Package H: BGA,FCBGA,PBGA G: BGA, FCBGA, FBGA (LF) F: FBGA E: FBGA (LF) Q: (L)QPF P: (L)QFP(LF) C: CHIP BIZ W: WAFER 13. Temp, Power - COMMON (Temp,Power) 0: NONE,NONE (Containing of Error handling code) A: Automotive,Normal B: Commercial,Low Low C: Commercial,Normal E: Extended,Normal I: Industrial,Normal - WAFER, CHIP BIZ Level Division 0: NONE,NONE X 3 X 4 X 5 X 6 X 7 X 8 X 9 X X 12 X 13 X 14 X 15 X 16 X 17 X 18 62: 2.5V/1.8V,HSTL,Burst2 64: 2.5V/1.8V,HSTL,Burst4 66: 2.5V,HSTL,R-R 70: 2.5V,HSTL,4-1-1-1 71: 2.5V,HSTL,3-1-1-1 73: 1.5V,1.8V,HSTL,All 74: 1.8V,2.5V,HSTL,All 80: 1.8V,LVCMOS,2E1D 82: 1.8V,HSTL,Burst2 84: 1.8V,HSTL,Burst4 85: 1.8V,LVCMOS,2E2D,Hi SPEED 88: 1.8V,HSTL,R-R 91: 1.5V,HSTL,All 95: 1.0V,HSTL,All T2: 1.8V,2Clock Latency,Burst2 T4: 1.8V,2Clock Latency,Burst4 U2: 1.8V,2.5Clock Latency,Burst2 U4: 1.8V,2.5Clock Latency,Burst4 14~15. Speed - Sync Burst,Sync Burst + NtRAM & < Mode is R-L >(Clock Accesss Time) 10: 10ns(Sync Burst, Sync Burst + NtRAM) 38: 3.8ns 43: 4.3ns 48: 4.8ns 50: 5ns(Only Sync Pipe) 55: 5.5ns 60: 6ns 65: 6.5ns 67: 6.7ns 70: 7ns 75: 7.5ns 80: 8ns 85: 8.5ns 90: 9ns - Other Small Classification (Clock Cycle Time) 10: 100MHz 11: 117MHz 13: 133MHz 14: 138MHz 15: 150MHz 16: 166MHz 17: 175MHz 18: 183MHz 19: 143MHz 20: 200MHz 21: 200MHz(2.0ns) 22: 225MHz 25: 250MHz 26: 250MHz(1.75ns) 27: 275MHz 30: 300MHz 33: 333MHz 35: 350MHz 36: 366MHz(t-CYCLE) 37: 375MHz 40: 400MHz(t-CYCLE) 42: 425MHz 45: 450MHz 50: 500MHz(except Sync Pipe) 6A: 600MHz 6F: 650Mhz(Only CSRAM) 7F: 750MHz 16. Packing Type (16 digit) - Common to all products, except of Mask ROM - Divided into TAPE & REEL(In Mask ROM, divided into TRAY, AMMO Packing Separately) Type Packing Type New Marking T 0 (Number) S Y A P M

1: Hot DC sort

2: Hot DC, selected AC sort

MCP: NAND/DRAM

DENSITY FLASH DRAM Memory Combination FLASH VCC (V) DRAM ORGANIZATION FLASH DRAM Part No. Size PACKAGE INFORMATION Type
256Mb 128Mb ND256128 256Mb 256Mb ND256256 256Mb 512Mb ND256512 256Mb 1Gb NDD256512512 128Mb ND256128 256Mb ND256256 512Mb 256Mb ND512256
512Mb 512Mb NDD512256256 ND512512

1Gb 1Gb

256Mb NND512512256 512Mb NNDD512512256256

NND512512512

NDD1G256256 ND1G512

1Gb 2Gb

1Gb ND1G512512 512Mb NNDD1G1G256256

NND1G1G512

NNDD1G1G512512
1.8V 1.8V 2.65V 3.0V 3.3V 3.0V 1.8V 1.8V 2.65V 1.8V 2.65V 1.8V 2.65V 2.65V 2.65V 1.8V 1.8V 2.65V 2.65V 1.8V 3.0V 2.65V 1.8V 1.8V 2.65V 1.8V 1.8V(L) 3.0V 2.65V 2.65V 1.8V 1.8V(L) 1.8V(L) 1.8V(L) 2.65V(L) 3.3V(L) 1.8V(L) 1.8V(L) 2.65V 2.65V 1.8V(L) 2.65V 2.65V 1.8V 2.65V 2.65V(L)
1.8V 1.8V 1.8V 2.5V 3.3V 2.5V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 3.0V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 2.65V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 3.0V 1.8V 2.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 3.0V
x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8
x16 x16 x16 x32 x32 x16 x16 x16 x16 x16 x16 x32 x32 x32 x16 x32 x16(D) x16 x16 x16 x16 x32 x32 x16 x16 x32 x32 x32 x16 x32 x32 x16 x32 x16 x32 x16 x32 x32 x16 x32 x32(D) x16 x32 x32 x32 x32
K5D5629ACC-D0900000 K5D5657ACB-D0900000 K5D5657DCB-D090000 K5D5613HCA-D090000 K5D5613VCM-D090000 KAL005005M-DGYY000 K5D5629ACC-D090000 K5D5657ACB-D090000 K5D5657DCB-D090000 K5D1257ACB-D090000 K5D1257DCA-D090000 K5D1258ACM-D090000 K5D1258DCM-D090000 KAL003004M-DG55000 K5D1212DCA-D090000 K5D1213ACM-D090000 K5E1212ACB-D075000 KAG00K007A-DGG5000 KBE00F003A-D411000 KBE00G003M-D429000 KBE00J006A-D411000 KBE00F005A-D411000 KBE00G005A-D411000 KAG004003M-DDD5000 KAG00K003M-DGG5000 KAG00400SM-DDDY000 KAL00T00KM-DG55000 KAL00Z00LM-DA55000 K5D1G12DCM-D090000 K5D1G13DCM-D090000 K5D1G13ACD-D075000 K5D1G12ACM-D090000 K5E1G13ACM-D075000 KAL00X00VM-D1YY000 KBE00S005M-D411000 KBE00U006M-D411000 KBE00H005M-D411000 KBE00H00BM-D413000 KAG006003M-DGG5000 KAG006003M-DGG5000 KAG001002M-DGGY000 KAG006003A-D115000 KAG00600SA-D115000 KBE00500AM-D437000 KBE00S00AA-D435000 KBE00100GM-431000

10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.2 10.5x13x1.2 10.5X13X1.4 10.5x13x1.2 10.5x13x1.2 10.5x13x1.2 10.5x13x1.2 10.5x13x1.4 11.5x13x1.2 10.5x13x1.4 10.5x13x1.4 10.5x13x1.2 10.5x13x1.2 11.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 11.5x13x1.2 11.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.2 12.0x14x1.4 11.5x13x1.2 10.5x13x1.4 12x14x1.4 12x14x1.4 11.5x13x1.4 11.5x13x1.4 12.0x14x1.4 12.0x14x1.4 11.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 10.5x13x1.4 11.5x13x1.4
107FBGA 107FBGA 107FBGA 137FBGA 137FBGA 137FBGA 107FBGA 107FBGA 107FBGA 107FBGA 107FBGA 137FBGA 137FBGA 137FBGA 107FBGA 137FBGA 202FBGA 107FBGA 107FBGA 107FBGA 107FBGA 137FBGA 137FBGA 107FBGA 107FBGA 137FBGA 137FBGA 137FBGA 107FBGA 137FBGA 137FBGA 107FBGA 137FBGA 137FBGA 137FBGA 107FBGA 137FBGA 137FBGA 107FBGA 137FBGA 137FBGA 107FBGA 137FBGA 137FBGA 137FBGA 137FBGA
NOTES: 1. N = NAND, D= DRAM memory combination indicates the type, density, and number of die stacks in the MCP. (Ex. NDD256256256 = 256Mb NAND + 256Mb DRAM + 256Mb DRAM). 2. When ordering Tape and Reel, please indicate by the letter "T" on the 3rd to last field in the part number. (Ex. K5D5629ACC-D090T00) 3. (D) Denotes DDR SDRAM packaged in MCP 4. (L) Denotes Large Block NAND packaged in MCP
MCP: NOR/SRAM AND NOR/UtRAM
DENSITY FLASH SRAM Memory Combination FLASH VCC (V) SRAM FLASH SRAM BOOT ORGANIZATION NOR OPR. Part No. PACKAGE INFORMATION Size Type

4Mb 8Mb 8Mb 32Mb

RS3204 RS3208 RS3208 RU6432 RU12832 RU12864

32Mb 64Mb

128Mb 32Mb 128Mb 64Mb
256Mb 64Mb RU25664 256Mb 128Mb RU256128
3.0V 3.0V 3.0V 3.0V 3.0V 3.0V 3.0V 3.0V 1.8V 3.0V 1.8V 3.0V 1.8V
3.0V 3.0V 3.0V 3.0V 3.0V 3.0V 3.0V 3.0V 1.8V 3.0V 1.8V 3.0V 2.6/1.8V
x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x16 x16 x16 x16 x16 x16 x16 x16
BOTTOM TOP BOTTOM TOP BOTTOM TOP BOTTOM TOP/BOT TOP TOP/BOT TOP TOP/BOT TOP/BOT
Async. No Page Async. No Page Async. No Page Async. No Page Async. No Page Async. No Page Async. No Page Async. Page Mode Sync Mux Async Page Mode Sync Async Page Mode Async Page Mode
K5A3240CBM-F755000 K5A3281CTM-D755000 K5A3281CBM-D755000 K5A3281CTM-D755000 K5A3281CBM-D755000 K5J6332CTM-D770000 K5J6332CBM-D770000 K5L2931CAM-D770000 K5N2828ATM-SS66000 K5L2963CAM-D770000 K5L2864ATM-DF66000 K5L5563CAM-D770000 K5L5527CAM-D770000
8x11x1.2 8x11x1.2 8x11x1.2 8x11x1.2 8x11x1.2 8x11.6x1.4 8x11.6x1.4 8x11.6x1.2 8.0x9.2x1.2 8x11.6x1.2 8x12x1.4 8x11.6x1.2 8x11.6x1.2
69FBGA 69FBGA 69FBGA 69FBGA 69FBGA 69FBGA 69FBGA 64FBGA 56FBGA 64FBGA 115FBGA 84FBGA 84FBGA
NOTES: 1. R= NOR, S= SRAM, U= UtRAM Memory combination indicates the type, density, and number of die stacks in the MCP. (Ex. RRU646432 = 64Mb NOR + 64Mb NOR + 32Mb UtRAM). 2. When ordering Tape and Reel, please indicate by the letter "T" on the 3rd to last field in the part number. (Ex. K5D5629ACC-D090T00) 3. All NOR Flash have demuxed Add/Data lines unless otherwise indicated in NOR OPR column. 4. All packages are pin compatible to Spansion's MCP pin out.

CD CD-DA; CD-ROM; CD-ROM XA; CD-I/FMV; CD-Extra/CDPlus; Video-CD; CD-R; CDRW & HSRW; US & US + RW; Super Audio CD
CD 650MB CD-ROM (read only) 120mm/80mm CD 800/700/650MB CD-Recordable (read & write) 700/650MB CD-Rewritable (read & write) 700/650MB High-Speed CD-Rewritable (read & write) 700/650MB Ultra & Ultra+ Speed CD-Rewritable (read & write)
DVD-ROM; DVD-Video; DVD-R; DVD+R; DVDRW; DVD+R DL; DVD-R DL; support DVD-R/RW CPRM (read/write); DVD-RAM (read only)
5/9/10/18 G DVD-Single/Dual (PTP, OTP) (read only) 3.9/4.7 G DVD-R (read only) 4.7G DVD+R (read only) DVDRW (read only) 80mm DVD

SH-S182D

Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 148.2 x 42 x 170 Interface: P-ATA 2MB buffer memory
CD-ROM/R/RW:110ms DVD-Single:130ms DVD-Dual:140ms DVDR/RW:140ms

Read Speed

CD-DA; CD-ROM; CD-ROM XA; CD-I; CD-Extra/CD-Plus; Video-CD; CD-R; CD-RW
CD 120mm CD-ROM (read only) 80mm CD (horizontal mount only) 800/700/650MB CD-Recordable (read & write) 700/650MB Low/High/Ultra-Speed CD Rewritable (read & write)
DVD-ROM Max.16X (21,600KB/sec) CD DVD-RAM Max.12X (16200KB/sec) DVD-Dual DVD RW Max. 8X (10,800KB/sec) DVDR Max. 12X (16,200KB/sec) DVDR DL Max. 8X (10,800KB/sec) CD-ROM Max. 48X (7,200 KB/sec) CD-R/CD-RW Max. 40X (6,000 KB/sec) DVD-RAM Max. 12X (16,200 KB/sec) DVD DVD+R Max. 18X (24,300KB/sec) DVD-R Max.18X (24,300KB/sec) DVDRW Max. 8X (10,800KB/sec), 6X (8,100KB/sec) DVDR Double L Max. 8X (10,800/sec) CD-R Max. 48X (7,200KB/sec) HS-RW Max. 10X (1,500KB/sec) US-RW Max. 32X (4,800KB/sec)
DVD-ROM; DVD-Video; DVD-R; DVD+R; DVD_R DL; DVDRW; DVD-RAM
5/9/10/18G DVD-Single/Dual (PTP, OTP) (read only) 3.9/4.7G DVD-ROM (read only) DVDRW, DVDR, DVDR DL (read & write) 80mm DVD (horizontal mount only)

SH-S182M

Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 148.2 x 42 x 170 Interface: P-ATA (Light Scribe) 2MB buffer memory
ASIC FOUNDRY TECHNOLOGY LIBRARY
Technology G/HS/LP/RF/MS G/HS/LP/RF Logic (Embedded DRAM) MDL (Embedded Flash) MFL (Embedded Flash) BiCMOS L09 L06 L13 LD13 LD18 LFS13 LF18 LF13 BH3515 BH3505 BH1805 BH1305 BS3550 BS1850 BS13200 Process 90nm 65nm (Common Platform) 0.13um 0.13um 0.18um 0.13um 0.18um 0.13um 0.35um 0.35um 0.18um 0.13um 0.35um 0.18um 0.13um Core Voltage 1.0~1.2V 1.0~1.2V 1.2~1.5V 1.0~1.5V 1.8V 1.0~1.5V 1.8V 1.0~1.5V 15V 5V 1.8V 1.2V~1.5V 3.3V 1.8V 1.2V~1.5V I/O Voltage 1.8~3.3V 1.8V~2.5V 2.5~3.3V 2.5~3.3V 3.3V/5V 2.5~3.3V 3.3V/5V 2.5~3.3V 3.3V/5V 3.3V/5V 3.3V/5V 2.5/3.3V 3.3V/5V 2.5~3.3V 2.5~3.3V Cell Size SRAM : 0.79~1.25 um2 SRAM : 0.499~0.676 um2 SRAM : 1.85~2.43 um2 DRAM : 0.34 um2 DRAM : 0.45 um2 Flash : <0.28 um2 Flash : 0.63 um2 Flash : 0.45 um2

11. " - "

L : Customer Option 10 M : Customer Option 11 N : Customer Option 12 P : Customer Option 13 - WAFER 0 : BUMP
Z : No Grinding (CHIP / Wafer)

LCD Driver ICs

STN CHARACTER LCD DRIVER ICs
Part Number S6A0031 S6A0032 S6A0065 S6A0069 S6A0070 S6A0071 S6A0072 S6A0073 S6A0074 S6A0075 S6A0078 S6A0079 S6A0090 S6A0093 S6A0094* S6A0067 S6A2068 Segment Common 16 CG ROM (Ch.) 10160 (254) 10160 (254) (236) 8320 (224) 8400 (240) 9600 (240) 9600 (240) 9600 (240) 9600 (240) 9600 (240) 9600 (240) 10240 (256) 10240 (256) 21760 (544) 8320 (224) CGRAM (Ch.) 80 (2) 80 (2) 512 (8) 512 (8) 512 (8) 160 (4) 512 (8) 512 (8) 512 (8) 512 (8) 512 (8) 160 (4) 320 (8) 80 (6) 512 (8) Interface (Bit) 8-Apr 8-Apr 8-Apr 8-Apr 8-Apr 8-Apr 4-Jan 4-Jan 4-Jan 4-Jan 4-Jan 4-Jan 4-Jan 4-Jan 8-Apr VDD (V) 2.4~5.5 2.4~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.4~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.4~5.5 2.4~5.5 2.2~3.6 2.7~5.5 2.7~5.5 Vlcd (Max. V) 10 DC/DC Convert (Times) Package Au bump chip Au bump chip Bare die/64QFP Bare die/80QFP Bare die/Au bump chip Au bump chip/TCP Au bump chip Bare die Bare die Bare die Bare die/TCP Bare die Au bump chip/TCP Au bump chip/TCP Au bump chip Bare die/100QFP Bare die/
2 2~3 2~3 2~3 2~3 2~3 2~4
NOTES: Devices marked with an asterisk (*) are under development. TCP (Tape Carrier Package)
Bare die is equivalent term with bare chip, pellet or die. COF (Chip On Film) is available in case of TCP.
STN GRAPHIC LCD DRIVER ICs
Part Number S6B0107 S6B0086 S6B0715 S6B0717 S6B0718 S6B0719 S6B0723 S6B0724 S6B0725 S6B0728 S6B0741 S6B0755 S6B0756 S6B0759 S6B2400 S6B0794 S6B0796 S6B1713 Segment V Common DDRAM (Bits) Interface (Bit) 1 4-Jan 8580 8-Jan 6500 8-Jan 9256 8-Jan 16800 8-Jan 8580 8-Jan 8580 8-Jan 6860 8-Jan 16896 8-Jan 33024 8-Jan 8320 8-Jan 6240 8-Jan 10368 8-Jan 12480 8-Jan 8-Apr 8-Apr 8580 8-Jan VDD (V) 4.5~5.5 2.7~5.5 2.4~5.5 2.4~5.5 2.4~3.6 2.4~3.6 2.4~5.5 2.4~5.5 2.4~3.6 2.4~3.6 1.8~3.3 1.8~3.3 1.8~3.3 1.8~3.3 1.8~3.3 2.4~5.5 2.4~5.5 2.4~5.5 Vlcd (Max. V) DC/DC Convert (Times) Package
2~4 2~5 3~6 3~6 2~5 2~5 2~5 3~7 3~6 3~5 2~4 3~6 3~5
Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP TCP Au bump chip Au bump chip Au bump chip/TCP TCP Au bump chip/TCP Au bump chip Au bump chip/TCP Au bump chip Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP

55(24)

289FBGA

59(24)

WDT/16TCx4 Internal 16TC

UARTx3 SPIx2/IIC/IIS

332FBGA

60(19)

UARTx2(IrDA) SPI/IIC/IIS IrDA(v1.1)

337FBGA

61(16)
UARTx3(IrDA) SPIx2/IIC/IIS IrDA(v1.1)

416FBGA

69(23)
UARTx4(IrDA) SPIx2/IIC/IIS IrDA(v1.1)

400FBGA

CMOS IMAGE SENSORS
Part Number S5K53BE S5KA3A S5K3AA S5K4AA S5K5AA S5K3BAF S5K3B1F S5K4BA S5K3C1F
Type SOC SOC SOC SOC SOC SOC CIS SOC CIS

* O/F: Optical Format

Resol. VGA VGA SXGA SXGA SXGA UXGA UXGA UXGA QXGA
O/F 1/5.8" 1/10" 1/3.2" 1/4" 1/5" 1/3.2" 1/3.2" 1/4" 1/2.7"

Pixels Horizontal 2048

Pixels Vertical 1536
Pixel Size 4 2.25 3.5 2.8 2.25 2.8 2.8 2.25 2.5
Package wafer or die wafer or die wafer or die wafer or die wafer or die wafer or die wafer or die wafer or die wafer or die
Production Status MP Sampling MP MP Sampling Sampling Sampling MP Under Development
Image Sensors/Microcontrollers
4-BIT MICROCONTROLLER FAMILY
Part Name Package Type S3C1xxx (KS51) Series S3C1840DZ0-DKB1 20DIP S3C1840DZ0-SKB1 20SOP S3C1840DZ0-SMB1 24SOP S3C1850DZ0-SMB1 24SOP S3C1860XZ0-DKB1 20DIP S3C1860XZ0-SKB1 20SOP S3C7xxx (KS57) Series S3C7048DZ0-AQB4 42SDIP S3C7048DZ0-QZR4 44QFP S3C7048DZ0-AQB8 42SDIP S3C7048DZ0-QZR8 44QFP S3C70F4XZ0-AVB4 30SDIP S3C70F4XZ0-SOB4 32SOP S3C7235DZ0-QWR8 80QFP S3C7235DZ0-QWR5 S3C72H8XZ0-QTR8 64QFP S3C72K8XZ0-QWR8 80QFP S3C72M9XZ0-QAR5 128QFP S3C72M9XZ0-QAR7 S3C72M9XZ0-QAR9 S3C72N5XZ0-QWR8 80QFP S3C72N5XZ0-QWR5 S3C72P9XZ0-QXR5 100QFP S3C72P9XZ0-QXR7 S3C72P9XZ0-QXR9 S3C72Q5XZ0-QXR8 100QFP S3C72Q5XZ0-QXR5 S3C7324XZ0-QTR4 64QFP S3C7335XZ0-QWR8 80QFP S3C7335XZ0-QWR5 S3C7414DZ0-AQB4 42SDIP S3C7414DZ0-QZR4 44QFP S3C7515DZ0-ATB5 64SDIP S3C7515DZ0-QTR5 64QFP S3C7528DZ0-AQB4 42SDIP S3C7528DZ0-QZR4 44QFP S3C7528DZ0-AQB8 42SDIP S3C7528DZ0-QZR8 44QFP S3C7544XZ0-AMB4 24SDIP S3C7544XZ0-SMB4 24SOP S3C7559XZ0-ATB9 64SDIP S3C7559XZ0-QTR9 64QFP S3C7565XZ0-QXR5 100QFP S3C7588AZ0-C0C8 44Pellet
NOTES: *Under development. Contact Samsung sales office for availability. (1) ( ) S/W supported PWM (2) SIO mode can be selected by S/W (3) Flash: Writing endurance is 10K times (4) MTP: Writing endurance is 100 times Abbreviations: ADC=Analog to Digital Converter DTMF=Dual Tone Multi Frequency CAS=CPE Alerting Signal PWM=Pulse Width Modulation SIO=Serial Input/Output 8T/16T=8-bit /16-bit Timer BT/WT/WDT=Basic/Watch/Watchdog Timer DAC=Digital to Analog Converter ZCD=Zero Cross Detection circuit Com=Comparator FSK=Frequency Shift Keying

5/7 3/3 5/4

BT/WT/8TCx2 BT/WDT/8Tx2 BT/WDT/8Tx2

32/4 8x8 (10x1)

8MHz 10MHz

2.0~5.5 2.7~5.5 1.8~5.5

S3P9234X S3P9404D S3P9428X

IIC, SIO

12x2, (8x1) 16MHz

BT/WDT/8T

3.0~5.5

S3P9434X

208 208

6 14/18

1/2 2/2

BT/8TC BT/8TC

10x3 10x9 8x1

10MHz 10MHz

2.0~5.5 2.0~5.5

S3F9444X(4) S3F9454B(4)

26/36/38

2.2~5.5

S3F9488X(4)

22/24/26

BT/8TCx4/16TC

SIO, UART

12x1, (8x1) 8MHz

2.0~5.5

S3F9498X(4)

368 208

8/15 15/14
BT/WT/8TC/16TCx2 SIO BT/WDT/8T USB

8x1, 16x2

12MHz 6MHz

2.0 ~5.5

S3F94A5X(4)

4.0~5.25 S3P9688X

BT/WDT/8Tx2/16T

2.0~3.6

S3P80A5A

1.7~3.6

S3P80B5X

S3P80C5X

BT/8TC/16TC

2.0~5.0

S3P80F9X

S3P80G9X

272 272

12/10 14/10

BT/8T/16T BT/8T/16Tx2 COMx4

8x1 8x1

8MHz 8MHz
1.95~3.6 S3F80J9X(3) 1.95~3.6 S3F80JBX(3)
Part Name Package ROM Type Kbytes S3C8xxx (KS88) Series S3C80JBXZ0-AQBB S3C80JBXZ0-SOBB S3C80L4XZ0-AOB4 S3C80L4XZ0-SOB4 S3C80L4XZ0-SNB4 S3C80M4XZ0-DKB4 S3C80M4XZ0-SKB4 S3C80M4XZ0-DHB4 S3C80M4XZ0-SHB4 S3C8235BZ0-QTR8 S3C8235BZ0-ETR8 S3C8235BZ0-QTR5 S3C8235BZ0-ETR5 S3C8245AZ0-TWR8 S3C8245AZ0-QWR8 S3C8245AZ0-TWR5 S3C8245AZ0-QWR5 S3C8249XZ0-TWR7 S3C8249XZ0-QWR7 S3C8249XZ0-TWR9 S3C8249XZ0-QWR9 S3C825ACZ0-TWRA S3C825ACZ0-QWRA S3C826AXZ0-QCRA S3C8274XZ0-QTR4 S3C8274XZ0-ETR4 S3C8275XZ0-QTR5 S3C8275XZ0-ETR5 S3C8278XZ0-QTR8 S3C8278XZ0-ETR8 S3C8285XZ0-QWR5 S3C8285XZ0-TWR5 S3C8289XZ0-QWR9 S3C8289XZ0-TWR9 S3C828BXZ0-QWRB S3C828BXZ0-TWRB S3C82E5XZ0-QZR5 S3C82E5XZ0-TBR5 S3C82F5XZ0-QXR5 S3C82F5XZ0-TXR5 S3C830AXZ0-QXRA S3C831BXZ0-QXRB S3C831BXZ0-TXRB S3C8325XZ0-QWR5 S3C8325XZ0-TWR5 S3F833BXZ0-QXRB S3F834BXZ0-TXRB S3C8454XZ0-TWR4 S3C8454XZ0-QWR4 S3C8469XZ0-ATB5 S3C8469XZ0-QTR5 S3C8469XZ0-LTR5 S3C8469XZ0-ATB9 S3C8469XZ0-QTR9 S3C8469XZ0-LTR9 S3C8475XZ0-AQB8 S3C8475XZ0-QZR8 S3C8475XZ0-AQB5 S3C8475XZ0-QZR5 S3C848AXZZ-ATBA S3C848AXZZ-QTRA 42SDIP 32SOP 32SDIP 32SOP 28SOP 20DIP 20SOP 16DIP 16SOP 64QFP 64LQFP 64QFP 64LQFP 80TQFP 80QFP 80TQFP 80QFP 80TQFP 80QFP 80TQFP 80QFP 80TQFP 80QFP 144QFP 64QFP 64LQFP 64QFP 64LQFP 64QFP 64LQFP 80QFP 80TQFP 80QFP 80TQFP 80QFP 80TQFP 44QFP 48TQFP 100QFP 100TQFP 100QFP 100QFP 100TQFP 80QFP 80TQFP 100QFP RAM Bytes I/O Pins Interrupt Timer/ (Int/Ext) Counter Serial Interface LCD (Seg/Com) ADC PWM(1) (Bit x Ch) (BitxCh) Max. OSC. Freq. Vdd (V) OTP or Flash Equivalent

- TQFP

H: 16 M: 24

I: 18 N: 28

C: MASK ROM F: FLASH 3: MCP

4. Core

E: EVA-CHIP P: OTP
1: 51 4-bit 2: 32-bit ARM9 3: 17 16-bit 4: 32 32-bit 5: 32-bit ARM10 6: 56 4-bit 7: 57 4-bit 8: 88 8-bit 9: 86 8-bit A: 15 Other B: 8-bit CALM RISC MAC C: 16-bit CALM RISC MAC D: 32-bit CALM RISC MAC I: CUSTOM MCU J: SC-200 K: 8-bit CALM RISC L: 16-bit CALM RISC R: 128-bit CALM RISC S: SC-100
5~6. Application Category
A: SDIP C: CHIP BIZ E: LQFP G: BGA J: BQFP L: ELP N: COB Q: QFP T: TQFP W: WAFER Z: SBGA

3. Package Pin

A: 128 X: 100

- TEBGA

X: 492

- FBGA

A: 337 D: 160 G: 285 L: 400 Q: 289

- SBGA

B: 81 E: 208 H: 320 O: 272 T: 64
C: 144 F: 180 K: 105 P: 504

A: 432

- WAFER

Wafer/CHIP BIZ = 0(NONE)

- SDIP
0: None O: 32 V: 30 J: 176 I: 18 P: 40 E: 208 R: 48 X: 100

14. Packing

1: Cust1

2: Cust2

B: 56 Q: 42
M: 24 T: 64 C: 83 H: 16 N: 28 D: 160 J: 176 W: 80

C: 8 K: 20

- LQFP
0n: General Purpose 2n: LCD 4n: General A/D 6n: PC & Peripheral,OA 8n: Video An: General Purpose-1 Fn: Telecom-1 Zn: Assignment Code
* "n": Serial No (1Z) 7. Rom Master
1n: Voice 3n: Audio 5n: Telecom 7n: VFD 9n: Special (IC Card) Cn: C Nn: Intel Application

C: 144 G: 256 T: 64

- WQFP

A: 272

B: 416
B: Tube U: Bulk R: Tray T: Tape & Reel S: Tape & Reel Reverse C: Chip Biz D: Chip Biz (3 Inch tray) E: Chip Biz (4 Inch tray) F: Chip Biz (Reverse) W: WF Biz Draft Wafer X: WF Biz Full Cutting 7: Tape & Reel (Pb-Free PKG) 8: Tray (Pb-Free PKG) 9: Tube (Pb-Free PKG)

15. ROM Size

J: 176

- BQFP

B: 132
0: 0K byte 2: 2K byte 4: 4K byte 6: 6K byte 8: 8K byte A: 48K byte C: 96K byte F: 256K byte H: 512K byte K: 1M byte
1: 1K byte 3: 12K byte 5: 16K byte 7: 24K byte 9: 32K byte B: 64K byte D: 128K byte G: 384K byte J: 1M byte

- QFPH

T: 64 F: 240 D: 8CNCL Z: 44 C: 144 G: 256 U: 304 Z: 44 D: 160 R: 48 W: 80

D: 160

- PLCC
*1st Version X 9~10. Mask Option
A: 128 E: 208 T: 64 X: 100
0: 0K byte 1: 1K byte 2: 2K byte 3: 12K byte 4: 4K byte 5: 16K byte 6: 6K byte 7: 24K byte 8: 8K byte 9: 32K byte A: 48K byte B: 64K byte C: 96K byte D: 128K byte E: Extended F: 256K byte G: 384K byte H: 512K byte J: 1M byte K: 1M byte M: Military N: Industrial X: Special MK3 Y: Special MK2 Z: Special MK1 * Smart Card IC: EEPROM Size * X,Y,Z: Special Marking ( MASKROM)

30.0" WQXGA LTB300M1-P01 Wide QXGA 2,560 x 1,600 641.3 x 400.8 0.251 S-PVA 16.7M 1,000:8ms 72% 90/90/90/90 Dual TMDS CCFL 677.3 x 436.8 x 42.3 5,100 Now

LCD TV / A.V.

HD LCD TV / A.V. - 23", 26", 32", 40", 46"
23",26",32",40",46" HD
23" LTA230W2-L01 Resolution WXGA Number of Pixels 1,366 x 768 Active Area (mm) 508.1 x 285.7 Pixel Pitch (mm) 0.372 Wide V/A Technology PVA Number of Colors 16.7M Color Gamut 72 Contrast Ratio 1,200:1 Brightness (cd/m2) 450 Response Time (ms at 25C) 8 (G/G) Interface LVDS (1 ch.) Outline Dimensions (mm) 546.0 x 318.3 x 47.3 Weight (kg) 3.0 Production Q306 26" LTA260W3-L01 WXGA 1,366 x 768 575.8 x 323.7 0.422 PVA 16.7M 72 1,200:8 (G/G) LVDS (1 ch.) 626.0 x 373.0 x 48.0 4.5 Q306 32" LTA320WT-L16 WXGA 1,366 x 768 697.7 x 392.2 0.511 S-PVA 16.7M 72 1,200:8 (G/G) LVDS (1 ch.) 760.0 x 450.0 x 50.0 7.0 Q306 40" LTA400WT-L11 WXGA 1,366 x 768 885.2 x 497.7 0.648 S-PVA 16.7M 72 1,200:8 (G/G) LVDS (1 ch.) 952.0 x 551.0 x 50.1 11.5 Now 46" LTA460WT-L03 WXGA 1,366 x 768 1,018.1 x 572.5 0.746 S-PVA 16.7M 72 1,200:8 (G/G) LVDS (1 ch.) 1,083.0 x 627.0 x 56.5 15.0 Q306
LTA400WS-LH1 WXGA 1,366 x 768 885.2 x 497.7 0.648 S-PVA 16.7M 92 1,200:8 (G/G) LVDS (1 ch.) 952.0 x 551.0 x 50.1 11.5 Now
LTA460WT-LH1 WXGA 1,366 x 768 1,018.1 x 572.5 0.746 S-PVA
92 1,200:8 (G/G) LVDS (1 ch.) 1,083.0 x 627.0 x 50.0 10.0 Q306
NOTES: Viewing Angle (H/V): PVA-178/178, S-PVA-180/180 G/G - Gray to gray response time The specifications represent the main model of each product and are subject to change without prior notice.
FULL-HD LCD TV / A.V. - 40", 46, 52, 57
40", 46, 52, 57 Full-HD
Resolution Number of Pixels Active Area (mm) Pixel Pitch (mm) Wide V/A Technology Number of Colors
46 LTA400HS-LH1 WUXGA 1,920 x 1,080 885.6 x 498.2 0.461 S-PVA 16.7M 92 1,200:8 (G/G) LVDS (2 ch.) 952.0 x 551.0 x 47.6 11.5 Now LTA460HS-LH3 WUXGA 1,920 x 1,080 1,018.1 x 572.7 0.530 S-PVA 16.7M 92 1,200:6 (G/G) LVDS (2 ch.) 1,083.0 x 627.0 x 50.0 15.5 Q306
52 LTA520HT-LH1 WUXGA 1,920 x 1,080 1,152.0 x 648.0 0.600 S-PVA 1.07B 92 1,000:8 (G/G) LVDS (2 ch.) 1,236.0 x 719.2 x 57.5 23.0 Q306
57 LTA570HS-L01 WUXGA 1,920 x 1,080 1,251.4 x 703.9 0.651 S-PVA 1.07B 72 1,200:8 (G/G) LVDS (2 ch.) 1,328.4 x 765.3 x 63.0 30.0 Now
LTA400HS-L01 WUXGA 1,920 x 1,080 885.6 x 498.2 0.461

NOTES: TMR: Transmissive with Micro-Reflectivity mSWV+:mobile Super Wide View (mPVA) Specifications represent the main model of each product and are subject to change without prior notice.

Mobile AV

MOBILE AV
Mini PCs/CNS/Car TVs/P-DVDs/Industrial Applications
Specifications LTV350QV-F04 LTV350QV-F0A 3.50 320xRGBx240 TMR 16.7M 24 bit RGB I/F 400 200mW LED -30~70 -20~70 70.08x52.56 LTV350QV-F0E 3.50 320xRGBx240 TMR 16.7M 24 bit RGB I/F 400 TBD LED -30~70 -20~70 70.08x52.56 LTV350QV-F0F 3.50 320xRGBx240 TMR 16.7M 24 bit RGB I/F 400 200mW LED -30~70 -20~70 70.08x52.56 LTV350QV-F0G 3.50 320xRGBx240 TMR 16.7M 24 bit RGB I/F 400 200mW LED -30~70 -20~70 70.08x52.56 LTE400WQ-F01 4.00 480x272xRGB TMR 16.7M 24 bit RGB I/F 400 400mW LED -30~70 -20~60 87.84x49.78 LTE400WQ-F02 4.00 480x272xRGB TMR 16.7M 24 bit RGB I/F 530 390mW LED -30~70 -20~60 87.84x49.78 98.3x62.6x4.85 Now Now LTA120W1-T02 12.0 800xRGBx480 Transmissive 262K 6 bit RGB 957 6.84W CCFL -30~70 0~70 265.8x149.52 283.1x171.4x13.0 Now 4Q '06 LTE400WQ-E01 4.00 480x272xRGB Transflective 16.7M 24 bit RGB I/F 530 3400mW LED -30~70 -20~60 87.84x49.78 98.3x62.6x4.85 Now Now
Display Size (inch) 3.50 Resolution 320xRGBx240 Display Mode TMR Display Colors 16.7M Interface 24 bit RGB I/F Brightness (cd/m2) 250 Contrast Ratio 300 Panel Power 400 Consumption B/L Power 150mW Consumption Light Source LED Storage Temperature 30~70 (C) Operation Temperature -20~70 (C) Active Area (mm) 70.08x52.56 Module Dimensions 76.90x63.90x3.15 (mm) Mass Production Now Remarks Now Specifications LTE430WQ-F07
76.90*63.90x4.25 76.90*63.90x4.25 76.90x63.90x3.15 76.90*63.90x4.25 98.3x62.6x3.8 Now Now LTE480WQ-F01 4.80 480x272xRGB TMR 16.7M 24 bit RGB I/F LED -30~70 -20~60 105.84x59.98 Now Now LTP500WV-F03 5.00 800xRGB*480 TMR 262K 18 bit RGB I/F LED -30~70 -20~60 109.2x65.52 Now 3Q '06 LTE700WQ-F05 7.0 480x234xRGB TMR 16.7M 24 bit RGB I/F 87 3.8W CCFL -20~70 -10~60 154.08x86.58 Now 3Q '06 LTP700WV-F01 7.0 800x480xRGB TMR 16.7M 24 bit RGB I/F TBD TBD LED -20 ~ 70 -10 ~ 60 152.4x91.44 163.2x104x3.4 3Q '06 4Q '06 Now Now LTP700WV-F02 7.0 800x480xRGB TMR 16.7M 24 bit RGB I/F TBD TBD CCFL -20 ~ 70 -10 ~ 60 152.4x91.44 165x104x5.4 3Q '06 4Q '06
Display Size (inch) 4.30 Resolution 480x272xRGB Display Mode TMR Display Colors 16.7M Interface 24 bit RGB I/F Brightness (cd/m2) 350 Contrast Ratio 400 Panel Power 80 Consumption B/L Power 480 Consumption Light Source LED Storage Temperature -30~70 (C) Operation Temperature --20~60 (C) Active Area (mm) 95.04x53.86 Module Dimensions 105.3x67.2x3.95 (mm) Mass Production Now Remarks Now