Product Selection Guide
Samsung Semiconductor, Inc.

Memory & Storage

2H 2010
Samsung offers the industrys broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM products are found in computersfrom ultra-mobile portables to powerful servers and in a wide range of handheld devices such as smartphones and MP3 players. Samsung also delivers the industrys widest line of storage products. These include optical and hard disk drives as well as flash storage, such as the all-flash Solid State Drive and a range of embedded and removable flash storage products.

Markets

Mobile/Wireless

TFT/LCD ODD/HDD

Notebook PCs

Desktop PCs/Workstations

Servers Networking/ Communications Consumer Electronics
www.samsung.com/us/business/components
www.samsung.com/semi/dram DDR3 SDRAM DDR2 SDRAM DDR SDRAM SDRAM Mobile SDRAM RDRAM

Pages 4-13

www.samsung.com/semi/flash SLC Flash MLC Flash SD and microSD Cards Flash Ordering Information

Pages 14-16

HIGH SPEED SRAM
www.samsung.com/semi/sram Asychronous Synchronous NtRAM Late-Write R-R SRAM DDR / II / II+ SRAM QDR / II / II+ SRAM

Pages 17-20

MULTI-CHIP PACKAGE
www.samsung.com/semi/mcp NAND & DRAM OneNAND & DRAM Flex-OneNAND & DRAM OneNAND & DRAM & OneDRAM moviNAND & NAND & DRAM NOR & UtRAM NOR & DRAM

Pages 21-22

Fusion Memory
www.samsung.com/semi/fusion moviNAND OneDRAM

Pages 23

STORAGE
HaManufacturers repsr Flash SSD Solid State Drives www.samsungssd.com Optical SSD Drives SATA Disk www.samsungodd.com Hard Drive External DVD www.samsung.com/hdd Internal DVD Internal COMBO Optical Disc Internal CD

Pages 24-27

www.samsungodd.com

STOR A GE

FU SION
Graphics DDR SDRAM DRAM Ordering Information
DDR3 SDRAM REGISTERED MODULES
Density 1GB 2GB Voltage 1.5V 1.5V Organization 128Mx72 256Mx72 Part Number M393B2873FH0-C(F8/H9/K0*)(04/05) M393B5673FH0-C(F8/H9/K0*)(04/05) M393B5670FH0-C(F8/H9/K0*)(04/05) M393B5173FH0-CF8(04/05) 4GB 1.5V 512Mx72 M393B5170FH0-C(F8/H9/K0*)(04/05) Composition 1Gb (128M x8) * 9 1Gb (128M x8) * 18 1Gb (256M x4) * 18 1Gb (128M x8) * 36 1Gb (256M x4) * 36 Compliance Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Speed (Mbps) 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 Ranks Production Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now
M393B5273CH0-C(F8/H9/K0*)(04/05) 2Gb (256M x8) * 18 M393B5270CH0-C(F8/H9/K0*)(04/05) 2Gb (512M x4) * 18 M393B1K73CH0-CF8(04/05) M393B2K70CM0-CF8(04/05) M393B4G70AM0-CF8(04/05) M393B2873FH0-Y(F8/H9/K0*)(04/05) M393B5673FH0-Y(F8/H9/K0*)(04/05) M393B5670FH0-Y(F8/H9/K0*)(04/05) M393B5173FH0-YF8(04/05) M393B5170FH0-Y(F8/H9/K0*)(04/05) M393B5273CH0-Y(F8/H9/K0*)(04/05) M393B5270CH0-Y(F8/H9/K0*)(04/05) M393B1K73CH0-YF8(04/05) M393B1K70CH0-Y(F8/H9/K0*)(04/05) M393B2K70CM0-YF8(04/05) M393B4G70AM0-YF8(04/05)
04 = IDT B0 register 05 = Inphi C0 register * K0 (1600Mbps) available in ES only

8GB 16GB 32GB 1GB 2GB

1.5V 1.5V 1.5V 1.35V 1.35V
1Gx72 2Gx72 4Gx72 128Mx72 256Mx72
2Gb (256M x8) * 36 4Gb DDP (1024M x4) * 36 8Gb DDP (2048M x4) * 36 1Gb (128M x8) * 9 1Gb (128M x8) * 18 1Gb (256M x4) * 18 1Gb (128M x8) * 36 1Gb (256M x4) * 36 2Gb (256M x8) * 18 2Gb (512M x4) * 18 2Gb (256M x8) * 36 2Gb (512M x4) * 36 4Gb DDP (1024M x4) * 36 8Gb DDP (2048M x4) * 36
M393B1K70CH0-C(F8/H9/K0*)(04/05) 2Gb (512M x4) * 36

512Mx72

8GB 16GB 32GB

Notes:

1.35V 1.35V 1.35V

1Gx72 2Gx72 4Gx72

F7 = DDR3-800 (6-6-6) F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11)

DDR3 SDRAM

www.samsung.com/semi/dram
DDR3 SDRAM VLP REGISTERED MODULES
1GB 2GB 1.5V 1.5V 128Mx72 256Mx72 M392B2873FH0-C(F8/H9)(04/05) M392B5673FH0-C(F8/H9)(04/05) M392B5670FH0-C(F8/H9)(04/05) M392B5170FM0-C(F8/H9)(04/05) 4GB 1.5V 512Mx72 M392B5273CH0-C(F8/H9)(04/05) M392B5270CH0-C(F8/H9)(04/05) 8GB 16GB 1GB 2GB 1.5V 1.5V 1.35V 1.35V 1Gx72 2Gx72 128Mx72 256Mx72 M392B1K73CM0-CF8(04/05) M392B1K70CM0-C(F8/H9)(04/05) M392B2G70AM0-C(F8/H9)(04/05) M392B2873FH0-Y(F8/H9)(04/05) M392B5673FH0-Y(F8/H9)(04/05) M392B5670FH0-Y(F8/H9)(04/05) M392B5170FM0-Y(F8/H9)(04/05) 4GB 1.35V 512Mx72 M392B5273CH0-Y(F8/H9)(04/05) M392B5270CH0-Y(F8/H9)(04/05) 8GB 16GB
1Gb (128M x8) * 9 1Gb (128M x8) * 18 1Gb (256M x8) * 18 2Gb DDP (512M x4) * 18 2Gb (256M x8) * 18 2Gb (512M x4) * 18 4Gb DDP (512M x8) * 18 4Gb DDP (1024M x4) * 18 8Gb DDP (2048M x4) * 18 1Gb (128M x8) * 9 1Gb (128M x8) * 18 1Gb (256M x8) * 18 2Gb DDP (512M x4) * 18 2Gb (256M x8) * 18 2Gb (512M x4) * 18 4Gb DDP (512M x8) * 18 4Gb DDP (1024M x4) * 18 8Gb DDP (2048M x4) * 18
Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free
1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333
Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now

1.35V 1.35V

1Gx72 2Gx72
M392B1K73CM0-YF8(04/05) M392B1K70CM0-Y(F8/H9)(04/05) M392B2G70AM0-Y(F8/H9)(04/05)
04 = IDT B0 register 05 = Inphi C0 register

Density

Voltage

Organization

Part Number

Composition

Compliance

Speed (Mbps)

Ranks Production
DDR3 SDRAM SODIMM MODULES
Organization 128Mx64 256Mx64 512Mx64 1024Mx64 128Mx64 256Mx64 512Mx64 1024Mx64
Part Number M471B2873FHS-C(F8/H9/K0*) M471B5673FH0-C(F8/H9/K0*) M471B5773FHS-C(F8/H9/K0*) M471B5273CH0-C(F8/H9/K0*) M471B1G73AH0-C(F8/H9/K0*) M471B2873FHS-Y(F8/H9/K0*) M471B5673FH0-Y(F8/H9/K0*) M471B5773FHS-Y(F8/H9/K0*) M471B5273CH0-Y(F8/H9/K0*) M471B1G73AH0-Y(F8/H9/K0*)
Composition 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 16 4Gb (512M x8) * 16 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 16 4Gb (512M x8) * 16

DDR3 SDRAM COMPONENTS

Density 1Gb Voltage 1.5V Organization 256M x4 128M x8 512M x4 2Gb 1.5V 256M x8 128M x16 1Gb 2Gb
Part Number K4B1G0446F-HC(F8/H9) K4B1G0846F-HC(F8/H9/K0*) K4B2G0446C-HC(F8/H9) K4B2G0846C-HC(F8/H9/K0*) K4B1G0446F-HC(F8/H9) K4B1G0846F-HC(F8/H9/K0*) K4B2G0446C-HC(F8/H9) K4B2G0846C-HC(F8/H9/K0*)
# Pins-Package 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA
Compliance Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free
Speed (Mbps) 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600
Dimensions Production 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm Now Now Now Now Now Now Now Now
K4B2G1646C-HC(F8/H9/K0*/MA*/NB*) 96 Ball -FBGA

7.5x13.3mm Now

256M x4 128M x8 512M x4 256M x8
F7 = DDR3-800 (6-6-6) MA = DDR3-1866 (13-13-13) F8 = DDR3-1066 (7-7-7) NB = DDR3-2133 (14-14-14) H9 = DDR3-1333 (9-9-9) * K0, MA, and NB are available in ES only K0 = DDR3-1600 (11-11-11)
DDR2 SDRAM REGISTERED MODULES

Density 1GB 2GB 4GB

Organization 128Mx72 256Mx72 512Mx72
Part Number M393T2863FBA-C(E6/F7) M393T5660FBA-C(E6/F7) M393T5663FBA-C(E6/E7) M393T5160FBA-C(E6/F7)
Composition (128M x8)*9 (256M x4)*18 (128M x8)*18 (256M x4)*36
Compliance Lead free Lead free Lead free Lead free
Speed (Mbps) 667/800 667/800 667/800 667/800

Register Y Y Y Y

LPDDR2

Density 512Mb 1Gb 2Gb Type LPDDR2 LPDDR2 LPDDR2 Organization 1CH x32 1CH x32 1CH x32 2CH x32/ch 1CH x32 4Gb LPDDR2 2CH x32/ch Part Number K4P51323EI-AG(1) K4P1G324EE-AG(1) K4P2G324EC-AG(1) K3PE3E300M-XG(1) K3PE3E300A-XG(1) K4P4G304EC-AG(1) K3PE4E400M-XG(1) K3PE4E400M-XG(1) K3PE4E400A-XG(1)
Notes: All products offered at Extended, Low, i-TCSR & PASR & DS (Temp, Power)
Package 168-FBGA, 12x12 PoP 168-FBGA, 12x12 PoP 168-FBGA, 12x12 PoP 216-FBGA, 12x12 PoP 240-FBGA, 14x14 PoP 168-FBGA, 12x12 PoP, DDP 216-FBGA, 12x12 PoP, DDP 216-FBGA, 12x12 PoP, DDP 240-FBGA, 14x14 PoP, DDP
(1) Speed: Mobile-SDR 60: 166MHz, CL3 75: 133MHz, CL3 Mobile-DDR D8: 200MHz, CL3 C6: 166MHz, CL3 LPDDR2 C0: 667Mbps C1: 800Mbps
Power 1.8V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V
Production Now Now Now Now Now Now Now Now Now
Mobile SDR/DDR & LPDDR2
COMPONENT DRAM ORDERING INFORMATION
SAMSUNG Memory DRAM DRAM Type Density Bit Organization
Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) Number of Internal Banks
1. Memory (K) 2. DRAM: 4 3. DRAM Type
B: DDR3 SDRAM D: GDDR SDRAM G: GDDR5 SDRAM H: DDR SDRAM J: GDDR3 SDRAM M: Mobile SDRAM N: SDDR2 SDRAM S: SDRAM T: DDR SDRAM U: GDDR4 SDRAM V: Mobile DDR SDRAM Power Efficient Address W: SDDR3 SDRAM X: Mobile DDR SDRAM Y: XDR DRAM Z: Value Added DRAM
08: x8 15: x16 (2CS) 16: x16 26: x4 Stack (JEDEC Standard) 27: x8 Stack (JEDEC Standard) 30: x32 (2CS, 2CKE) 31: x32 (2CS) 32: x32

9. Package Type

DDR SDRAM L: TSOP II (Lead-free & Halogen-free) H: FBGA (Lead-free & Halogen-free) F: FBGA for 64Mb DDR (Lead-free & Halogen-free) 6: sTSOP II (Lead-free & Halogen-free) T: TSOP II N: sTSOP II G: FBGA U: TSOP II (Lead-free) V: sTSOP II (Lead-free) Z: FBGA (Lead-free) DDR2 SDRAM Z: FBGA (Lead-free) J: FBGA DDP (Lead-free) Q: FBGA QDP (Lead-free) H: FBGA (Lead-free & Halogen-free) M: FBGA DDP (Lead-free & Halogen-free) E: FBGA QDP (Lead-free & Halogen-free) T: FBGA DSP (Lead-free & Halogen-free, Thin) DDR3 SDRAM Z: FBGA (Lead-free) H: FBGA (Halogen-free & Lead-free) Graphics Memory Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 FBGA (Lead Free) Z: 84 FBGA(Lead Free) T: TSOP L: TSOP (Lead Free) A: 136 FBGA B: 136 FBGA(Lead Free) H: FBGA(Hologen Free & Lead Free) E: 100 FBGA(Hologen Free & Lead Free) SDRAM L TSOP II (Lead-free & Halogen-free) N: STSOP II T: TSOP II U: TSOP II (Lead-free) V: sTSOP II (Lead-free)

10. PCB Revision

0: Mother PCB 1: 1st Rev 2: 2nd Rev. 3: 3rd Rev. 4: 4th Rev. A: Parity DIMM S: Reduced PCB U: Low Profile DIMM
6. # of Banks in Comp. & Interface
1: 4K/64mxRef., 4Banks & SSTL-: 8K/ 64ms Ref., 4Banks & SSTL-2 2: 4K/ 64ms Ref., 4Banks & LVTTL (SDR Only) 5: 8K/ 64ms Ref., 4Banks & LVTTL (SDR Only) 5: 4Banks & SSTL-1.8V 6: 8Banks & SSTL-1.8V

11. Temp & Power

C: Commercial Temp. (0C ~ 95C) & Normal Power L: Commercial Temp. (0C ~ 95C) & Low Power

7. Bit Organization

0: x 4 3: x 8 4: x16 6: x 4 Stack (JEDEC Standard) 7: x 8 Stack (JEDEC Standard) 8: x 4 Stack 9: x 8 Stack

12. Speed

CC: (200MHz @ CL=3, tRCD=3, tRP=3) D5: (266MHz @ CL=4, tRCD=4, tRP=4) E6: (333MHz @ CL=5, tRCD=5, tRP=5) F7: (400MHz @ CL=6, tRCD=6, tRP=6) E7: (400MHz @ CL=5, tRCD=5, tRP=5) F8: (533MHz @ CL=7, tRCD=7, tRP=7) G8: (533MHz @ CL=8, tRCD=8, tRP=8) H9: (667MHz @ CL=9, tRCD=9, tRP=9) K0: (800MHz @ CL=10, tRCD=10, tRP=10) 7A: (133MHz CL=3/PC100 CL2)

4. DRAM Component Type

B: DDR3 SDRAM (1.5V VDD) L: DDR SDRAM (2.5V VDD) S: SDRAM T: DDR2 SDRAM (1.8V VDD)

8. Component Revision

A: 2nd Gen. B: 3rd Gen. C: 4th Gen. D: 5th Gen. E: 6th Gen. F: 7th Gen. G: 8th Gen. M: 1st Gen. Q: 17th Gen.
13. AMB Vendor for FBDIMM
0, 5: Intel 1, 6, 8: IDT 9: Montage

SLC Flash

MOQ Family Density Part Number K9FAG08U0M-HCB0 K9FAG08S0M-HCB0 K9KBG08U1M-HCB0 K9KBG08S1M-HCB0 K9WCG08U5M-HCB0 K9WCG08S5M-HCB0 K9QDG08U5M-HCB0 K9QDG08S5M-HCB0 K9NCG08U5M-PCK0 K9WBG08U1M-PCB0 K9WBG08U1M-PIB0 K9KAG08U0M-PCB0 K9KAG08U0M-PIB0 K9F8G08U0M-PCB0 K9F8G08U0M-PIB0 K9WAG08U1D-SCB0 K9WAG08U1D-SIB0 16Gb QDP K9WAG08U1B-PCB0 K9WAG08U1B-PIB0 K9WAG08U1B-KIB0 K9K8G08U0D-SCB0 K9K8G08U0D-SIB0 4Gb Based 8Gb DDP K9K8G08U0B-PCB0 K9K8G08U0B-PIB0 K9K8G08U1B-KIB0 K9F4G08U0D-SCB0 K9F4G08U0D-SIB0 4Gb Mono K9F4G08U0B-PCB0 K9F4G08U0B-PIB0 K9F4G08U0B-KIB0 K9F2G08U0C-SCB0 2Gb Based 2Gb Mono K9F2G08U0C-SIB0 K9F2G08U0B-PCB0 K9F2G08U0B-PIB0 K9F1G08U0D-SCB0 1Gb Based 1Gb Mono K9F1G08U0D-SIB0 K9F1G08U0C-PCB0 K9F1G08U0C-PIB0 K9F1208U0C-PCB0 512Mb Based 512Mb Mono K9F1208U0C-PIB0 K9F1208R0C-JIB0 K9F1208U0C-JIB0 K9F5608U0D-PCB0 256Mb Based 256Mb Mono K9F5608U0D-PIB0 K9F5608R0D-JIB0 K9F5608U0D-JIB0 Package Type BGA BGA BGA BGA BGA BGA BGA BGA TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 HF&LF TSOP1 HF&LF TSOP1 TSOP1 ULGA HF & LF TSOP1 HF&LF TSOP1 HF&LF TSOP1 TSOP1 ULGA HF & LF TSOP1 HF & LF TSOP1 HF& LF TSOP1 TSOP1 ULGA HF & LF TSOP-LF/HF TSOP-LF/HF TSOP1 TSOP1 TSOP-LF/HF TSOP-LF/HF TSOP1 TSOP1 TSOP1 TSOPFBGA(8.5x13) 63 FBGA(8.5x13) TSOP1 TSOPFBGA(9x11) 63 FBGA(9x11) Org. X8 X8 X8 X8 X8 X8 X8 X8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 X8 x8 x8 x8 x8 x8 X8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 Vol(V) 3.3 1.8 3.3 1.8 3.3 1.8 3.3 1.8 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 1.8 3.3 3.3 3.3 1.8 3.3 Tray -xxxx0xx 16Gb Mono 32Gb DDP 16Gb Based 64Gb QDP 128Gb ODP 64Gb DSP 32Gb QDP 8Gb Based 16Gb DDP 8Gb Mono T/R -xxx0Txx E/S E/S E/S E/S E/S E/S E/S E/S M/P M/P M/P M/P M/P M/P M/P C/S C/S M/P M/P M/P C/S C/S M/P M/P M/P C/S C/S M/P M/P M/P C/S C/S M/P M/P C/S C/S M/P M/P M/P M/P M/P M/P M/P M/P M/P M/P Status

9. Mode

0 : Normal 1 : Dual nCE & Dual R/nB 3 : Tri /CE & Tri R/B 4 : Quad nCE & Single R/nB 5 : Quad nCE & Quad R/nB 9 : 1st block OTP A : Mask Option 1 L : Low grade

15. Pre-Program Version

0 : None Serial (1~9, A~Z)

10. Generation

M : 1st Generation A : 2nd Generation B : 3rd Generation C : 4th Generation D : 5th Generation

4~5. Density

12 : 512M 56 : 256M 1G : 1G 2G : 2G 4G : 4G 8G : 8G AG : 16G BG : 32G CG : 64G DG : 128G EG : 256G LG : 24G NG : 96G ZG : 48G 00 : NONE

11. ---- 12. Package

A : COB B : FBGA (Halogen-Free, Lead-Free) C : CHIP BIZ D : 63-TBGA F : WSOP (Lead-Free) G : FBGA H : TBGA (Lead-Free) I : ULGA (Lead-Free) (12*17) J : FBGA (Lead-Free) L : ULGA (Lead-Free) (14*18) M : TLGA N : TLGA2 P : TSOP1 (Lead-Free) Q : TSOP2 (Lead-Free) S : TSOP1 (Halogen-Free, Lead-Free) T : TSOP2 U : COB (MMC) V : WSOP W : Wafer Y : TSOP1 Z : WELP (Lead-Free)

6~7. Organization

00 : NONE 08 : x: x16
Flash Ordering Information
Type Density Organization 2Mx36 4Mx18 1Mx36 36Mb 2Mx18 1Mx36 2Mx18 1Mx18 18Mb 512Kx36 1Mx18 512Kx36 NtRAM 256Kx36 512Kx18 256Kx36 512Kx18 8Mb 256Kx36 512Kx18 256Kx36 512Kx18 512Kx18 256Kx36 4Mb SPB and FT

NOTES:

Part Number K7N643645M K7N641845M K7N323635C K7N321835C K7M323635C K7M321835C K7N161831B K7N163631B K7M161835B K7M163635B K7N803601B K7N801801B K7N803609B K7N801809B K7N803645B K7N801845B K7N803649B K7N801849B K7M801825B K7M803625B K7N403609B K7N401809B K7B401825B
Package 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP 100-TQFP 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP
Operating Mode SPB SPB SPB SPB FT FT SPB SPB FT (SB) FT (SB) SPB SPB SPB SPB SPB SPB SPB SPB FT FT SPB SPB SB
Vdd (V) 2.5 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3 3.3 3.3 3.3 3.3 3.3 2.5 2.5 2.5 2.5 3.3 3.3 3.3 3.3 3.3
Access Time tCD (ns) 2.6, 3.5 2.6, 3.5 2.6, 3.5 2.6, 3.5 7.5 7.5 2.6, 3.5 2.6, 3.5 6.5 6.5 3.5 3.5 2.6 2.6 3.5 3.5 2.6 2.6 6.5 6.3 6.5
Speed tCYC (MHz) 250, 167 250, 167 250, 167 250, 118 250, 167 250, 200 133
I/O Voltage (V) 2.5 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3,2.5 3.3,2.5 3.3,2.5 3.3,2.5 2.5 2.5 2.5 2.5 3.3, 2.5 3.3, 2.5 3.3,2.5 3.3,2.5 3.3, 2.5

Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs

128Kx36 256Kx18 256Kx18

All TQFP products are lead free NtRAM speed recommendations: For 200MHz use 250MHz; For 133MHz use 167MHz NtRAM speed recommendation: Use 7.5ns Access Time use 6.5ns Access Time Recommended SPB speeds are 250MHz and 167MHz Recommended SB Acess Speed is 7.5ns

Late-Write RR SRAM

Density Organization 1Mx36 2Mx18 256Kx36 8Mb 512Kx18 256Kx36 512Kx18 Part Number K7P323674C K7P321874C K7P803611B K7P801811B K7P803666B K7P801866B Package 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA Operating Mode SP SP SP SP SP SP Vdd (V) 1.8 / 2.5V 1.8 / 2.5V 3.3 3.3 2.5 2.5 Access Time tCD (ns) 1.6, 2.0 1.6, 2.0 1.6 1.2 Speed tCYC (MHz) 300,250 300,250 I/O Voltage (V) 1.5 (Max 1.8) 1.5 (Max 1.8) 1.5 (Max.2.0) 1.5 (Max.2.0) 1.5 (Max.2.0) 1.5 (Max.2.0) Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
NtRAM & Late Write RR SRAM

DDR SYNCHRONOUS SRAM

Type Density Organization 512Kx36 1Mx18 256Kx36 512Kx18 Part Number K7D163674B K7D161874B K7D803671B K7D801871B K7I641882M 4Mx18 72Mb 2Mx36 K7I641884M K7J641882M K7I643682M K7I643684M K7J643682M K7I321882C 2Mx18 DDR II CIO/ SIO 36Mb 1Mx36 K7I321884C K7J321882C K7I323682C K7I323684C K7J323682C K7I161882B 1Mx18 18Mb 512Kx36 K7I161884B K7J161882B K7J163682B K7I163682B K7I163684B K7K3218T2C 2Mx18 K7K3218U2C 36Mb K7K3236T2C 1Mx36 DDR II+ CIO 1Mx18 K7K1618U2C 18Mb K7K1636T2C 512Kx36 K7K1636U2C
NOTES: 2B = Burst of 2 4B = Burst of 4 SIO = Separate I/O CIO = Common I/O For DDR II CIO/SIO: C-die use 330, 300, or 250MHz instad of 200MHz or 167MHz using a stable DLL circuit For DDR II+ CIO: 2-clock latency is available. A 2.5-clock latency can be supported on 18Mb at 500Mhz and 36Mb at 450MHz

Package 153-BGA 153-BGA 153-BGA 153-BGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA
Vdd (V) 1.8~2.5 1.8~2.5 2.5 2.5 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8
Access Time tCD (ns) 2.3 2.3 1.7/1.9/2.1 1.7/1.9/2.1 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45 0.45 0.45 0.45 0.45 0.45 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45
Cycle Time (MHz) 330, 300 330, 300 333, 330, 250 333, 330, 250 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250 300,250 300,250 300,250 300,250 300,250 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 400, 333 400, 334 400, 333 400, 334 400, 333 400, 334 400, 333 400, 334
I/O Voltage (V) 1.5~1.9 1.5~1.9 1.5 (Max 2.0) 1.5 (Max 2.0) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5 2.5 1.5 2.5 1.5 2.5 1.5 2.5
Production Status Mass Production Mass Production Not for new designs Not for new designs Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production

Comments

16Mb DDR 8Mb
CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B SIO-2B CIO-2B CIO-4B DDRII + CIO-2B, 2 clocks latancy DDRII + CIO-2B, 2.5 clocks latancy DDRII + CIO-2B, 2 clocks latancy DDRII + CIO-2B, 2.5 clocks latancy DDRII + CIO-2B, 2 clocks latancy DDRII + CIO-2B, 2.5 clocks latancy DDRII + CIO-2B, 2 clocks latancy DDRII + CIO-2B, 2.5 clocks latancy

K7K3236U2C K7K1618T2C

DDR I / II / II+
www.samsung.com/semi/sram

QDR SYNCHRONOUS SRAM

Type Density Organization Part Number K7Q161862B K7Q161864B K7Q163662B K7Q163664B K7R640982M K7R641882M K7R641884M K7R643682M K7R643684M K7R320982C K7R321882C K7R321884C K7R323682C K7R323684C K7R160982B K7R161882B K7R161884B K7R163682B K7R163684B K7S3236T4C 1Mx36 K7S3236U4C 36Mb K7S3218T4C QDR II+ 2Mx18 K7S3218U4C 165-FBGA 1.8 0.45 400, 333 1.5 Mass Production 165-FBGA 1.8 0.45 400, 333 1.5 Mass Production 165-FBGA 1.8 0.45 400, 334 2.5 Mass Production Package 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA Vdd (V) 1.8v / 2.5v 1.8v / 2.5v 1.8v / 2.5v 1.8v / 2.5v 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 Access Time tCD (ns) 2.5 2.5 2.5 2.5 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45 0.45 0.45 0.45 0.45 0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45 Cycle Time 250,200,167 250,200,167 300,250,200,167 250,200,167 300,250,200,167 167, 250, 200 167, 250, 200 200, 300, 250 300, 250, 200 200, 300, 250 250,200,167 250,200,167 300,250,200,167 250,200,167 300,250,200,167 400, 333 I/O Voltage (V) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5 Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Comments QDR I - 2B QDR I - 4B QDR I - 2B QDR I - 4B QDR II-2B QDR II-2B QDR II-4B QDR II-2B QDR II-4B QDR II-2B QDR II-2B QDR II-4B QDR II-2B QDR II-4B QDR II - 2B QDR II - 2B QDR II - 2B QDR II - 4B QDR II + 4B, 2 clocks latancy QDR II + 4B, 2.5 clocks latancy QDR II + 4B, 2 clocks latancy QDR II + 4B, 2.5 clocks latancy QDR II + 4B, 2 clocks latancy QDR II + 4B, 2.5 clocks latancy QDR II - 4B

1Mx18 QDR I 18Mb 512Kx36 8Mx9 72Mb 4Mx18 2Mx36 4Mx9 QDR II 36Mb 2Mx18 1Mx36 2Mx9 18Mb 1Mx18 512Kx36

1Mx18 18Mb 512Kx36

K7S1618T4C

165-FBGA

400, 333

Mass Production

K7S1636U4C
For QDR I, QDR II: 2B = Burst of 2, 4B = Burst of 4 For QDR II (36Mb): C-die use 300, 250MHz or 200MHz instead of 167MHz using a stable DLL circuit For QDR II (72Mb): 2B = Burst of 2 and 250MHz or 200MHz is recommended, 4B = Burst of 4 and 300MHz or 250MHz is recommended For QDR II+: 2-clock latency supported. 2.5-clock latency can be supported with 450MHz speed

QDR I / II / II+

Synchronous SRAM Ordering Information
SAMSUNG Memory Sync SRAM Small Classification Density Density Organization Organization Vcc, Interface, Mode
Packaging Type Speed Speed Temp, Power Package --Generation Vcc, Interface, Mode
1. Memory (K) 2. Sync SRAM: 7 3. Small Classification
A: Sync Pipelined Burst B: Sync Burst D: Double Data Rate I: Double Data Rate II, Common I/O J: Double Data Rate, Separate I/O K: Double Data II+, Common I/O M: Sync Burst + NtRAM N: Sync Pipelined Burst + NtRAM P: Sync Pipe Q: Quad Data Rate I R: Quad Data Rate II S: Quad Data Rate II+
49: 2.5V,LVTTL,Hi SPEED 52: 2.5V,1.5/1.8V,HSTL,Burst2 54: 2.5V,1.5/1.8V,HSTL,Burst4 62: 2.5V/1.8V,HSTL,Burst2 64: 2.5V/1.8V,HSTL,Burst4 66: 2.5V,HSTL,R-R 74: 1.8V,2.5V,HSTL,All 82: 1.8V,HSTL,Burst2 84: 1.8V,HSTL,Burst4 88: 1.8V,HSTL,R-R T2: 1.8V,2Clock Latency,Burst2 T4: 1.8V,2Clock Latency,Burst4 U2: 1.8V,2.5Clock Latency,Burst2 U4: 1.8V,2.5Clock Latency,Burst4
WAFER, CHIP BIZ Level Division 0: NONE,NONE 1: Hot DC sort 2: Hot DC, selected AC sort

14~15. Speed

Sync Burst,Sync Burst + NtRAM < Mode is R-L > (Clock Accesss Time) 65: 6.5ns 70: 7ns 75: 7.5ns 80: 8ns 85: 8.5ns Other Small Classification (Clock Cycle Time) 10: 100MHz 11: 117MHz 13: 133MHz 14: 138MHz 16: 166MHz 20: 200MHz 25: 250MHz 26: 250MHz(1.75ns) 27: 275MHz 30: 300MHz 33: 333MHz 35: 350MHz 37: 375MHz 40: 400MHz(t-CYCLE) 42: 425MHz 45: 450MHz 50: 500MHz (except Sync Pipe)
M: 1st Generation A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation
80: 8M 40: 4M 64: 72M 16: 18M 32: 36M

11. --

09: x9 32: x32

08: x8 18: x18 36: x36

12. Package
H: BGA,FCBGA,PBGA G: BGA, FCBGA, FBGA (LF) F: FBGA E: FBGA (LF) Q: (L)QPF P: (L)QFP(LF) C: CHIP BIZ W: WAFER
16. Packing Type (16 digit)
- Common to all products, except of Mask ROM - Divided into TAPE & REEL (In Mask ROM, divided into TRAY, AMMO packing separately) Type Component Component (Mask ROM) Module Packing Type New Marking TAPE & REEL T Other (Tray, Tube, Jar) 0 (Number) Stack S TRAY Y AMMO PACKING A MODULE TAPE & REEL P MODULE Other Packing M

MCP: NOR/UtRAM

Memory NOR Density 512Mb 256Mb UtRAM Density (Org.) 128Mb 128Mb Voltages (NOR-UtRAM) 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 64Mb 32Mb 1.8V - 1.8V 1.8V - 1.8V MCP Package 107FBGA 107FBGA 56FBGA 84/88FBGA 84/88FBGA Remark

NOR & UtRAM

MCP: NOR/DRAM
Memory NOR & DRAM NOR Density 512Mb DRAM Density (Org.) 128Mb (x16) 256Mb (x16) Voltages (NOR-DRAM) 1.8V - 1.8V 1.8V - 1.8V Package 103FBGA 103FBGA Remark

moviNAND

moviNAND combines high-density MLC NAND Flash with an MMC controller in a single chip that has an MMC interface. moviNAND delivers dense, cost-effectice storage for embedded applications.
Density 2GB 4GB 8GB 16GB 32GB 64GB
Package Type FBGA FBGA FBGA FBGA FBGA FBGA

Org. x8 x8 x8 x8 x8 x8

Vol (V) 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3
Remarks MMC 4.3 & MMC 4.4
Contact your local Samsung rep for availability and ordering information.
Please contact your local Samsung sales representative for the latest product offerings. Note: All parts are lead free

OneDRAM

OneDRAM is a dual-port, low-power DRAM with an SRAM buffer interface and is optimal for high-performance, high-density mobile applications.
Part Number KJA51Z23PC-AAO
Package Type 216FBGA (14x14)
Org. A-port: x16 (SDR/DDR) B-port: x16 (SDR/DDR) A-port: x16 (SDR/DDR) B-port: x16 (SDR/DDR) A-port: x32SDR B-port: x32DDR" A-port: x16DDR

Vol (V)

512Mb KJA51Y23PC-AAO 152FBGA (14x14)

extended

133MHz

KJA1GW25PD-EAO

KJA1GZ45PD-EAO 1Gb KJA1GZ45PD-EAO 240FBGA (14x14)
B-port: x32DDR" A-port: x16DDR B-port: x16DDR" A-port: x16SDR B-port: x32DDR"

166MHz

KJA1GY25PD-EAO
www.samsung.com/semi/fusion
3.5" Hard Disk Drives
Family Capacity (GB) 320 F1DT 1 TB 1 TB 500 F2EG 1 TB 1.5 TB F750 1TB 500 F3EG 750 1TB 1.5 TB 2 TB FRPM Interface SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA-2 SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps Buffer 16 Sector 512 Model HD083GJ HD084GJ HD161GJ HD162GJ HD251HJ HD252HJ HD321HJ HD322HJ HD501IJ HD502IJ HD642JJ HD752LJ HD753LJ HD102UJ HD103UJ HD502HI HD103SI HD154UI HD164GJ HD254GJ HD324HJ HD163GJ HD253GJ HD323HJ HD502HJ HD754JJ HD103SJ HD253GI HD324HI HD503HI HD754JI HD105SI HD153WI HD203WI HD165GJ HD166GJ HD255GJ HD255GJ HD323HJ

Hard Disk Drives

www.samsung.com/semi/hdd
3.5" Enterprise RAID Drives
Family Capacity (GB) F1R TB 250 F3R 1 TB RPM Interface SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps Buffer Sector Model HE252HJ HE322HJ HE502IJ HE642JJ HE753LJ HE103UJ HE253GJ HE502HJ HE754JJ HE103SJ
2.5" Hard Disk Drives
Family Capacity (GB) M7E 160 MMPMT1 TB RPM 5400 Interface SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps Buffer 8 Sector 512 Model HM161GI HM251HI HM321HI HM501JI HM641JI HM120JI HM161JI HM250II HM320HI HM400HI HM500GI HM250HJ HM320HJ HM500JJ HM640JJ HM750LI HM100UI

www.samsung.com/hdd

BD-COMBO
Interface Speed BD ROM READ 8X BD ROM READ 12X SATA BD-ROM READ 4X Slim Tray O Slot O Type H/H H/H Loading Tray Tray Lightscribe X O X O X Medel TS-HB33A / SH-B083A TS-HB33L / SH-B083L TS-HB43A / SH-B123A TS-HB43L / SH-B123L TS-LB23A / SN-B043A TS-LB23B TS-LB23D TS-LB23L / SN-B043L TS-LB23P TS-TB23L
Interface SATA PATA Speed DVD Write 22X DVD Write 20X DVD Write 20X DVD Write 22X DVD Write 22X SATA DVD Write 24X DVD Write 22X DVD Write 16X PATA SATA DVD Write 22X DVD Write 22X DVD Write 24X Type H/H H/H H/H H/H H/H H/H H/H H/H H/H H/H H/H Loading Tray Tray Tray Tray Tray Tray Tray Tray Tray Tray Tray Lightscribe X X X X X X O O O O O Medel TS-H653G TS-H653H TS-H653J TS-H662A / SH-S222A TS-H663C / SH-S223C TS-H663D / SH-S243D TS-H653R TS-H653T TS-H662L / SH-S222L TS-H663L / SH-S223L TS-H663N / SH-S243N TS-L633B / SN-S083B X Tray Slim O SATA DVD Write 8X Slot Tray Ultra Slim Slot X X O X TS-L633C / SH-S083C TS-L633F / SN-S083F TS-L633J TS-L633N / SN-S083N TS-L633R / SN-S083R TS-L633Y TS-T633C / SN-T083C TS-T633P TS-U633F TS-U633J / SU-S083J TS-D633A TS-D633C

Optical Disk Drives

DVD-W Slim External
Interface Speed Type Slim USB 2.0 DVD Write 8X Ultra Slim Slim Loading Tray Tray Tray Slot Lightscribe X X X O Medel SE-S084C SE-S084D SE-S084F SE-T084P

DVD-ROM

Interface Speed DVD 16X SATA DVD 8X DVD 8X Type H/H Slim Utra Slim Loading Tray Tray Tray Lightscribe X X X Medel TS-H353C / SH-D163J TS-L333B TS-L333D TS-U333A

DVD-W Loader

Interface PATA Speed DVD 8X Type H/H Loading Tray Lightscribe X Medel TS-P632F

Memory

DRAM Flash SRAM MCP Fusion

System LSI

ASICs APs Display Drivers Imaging ICs Foundry

Storage

Solid State Drives Hard Drives Optical Disc Drives

LCD Panels

TV Monitors Notebook PC Mobile
Samsung Semiconductor, Inc. 3655 North First Street San Jose, CA 95134-1713
Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products or product specifications with the intent to improve function or design at any time and without notice and is not required to update this documentation to reflect such changes. This publication does not convey to a purchaser of semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages. Copyright 2010. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co., Ltd. All other names and brands may be claimed as the property of others. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. BR-10-ALL-001 Printed 07/10