Seiko Epson Semiconductor Product Quality Assurance Guidebook

Rev.1.5

NOTICE
No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic products under the control of the Foreign Exchange and Foreign Trade Law of Japan and may require an export license from the Ministry of Economy, Trade and Industry or other approval from another government agency. All other product names mentioned herein are trademarks and/or registered trademarks of their respective companies. SEIKO EPSON CORPORATION 2009, All rights reserved.

Table of Contents

1. QUALITY MANAGEMENT SYSTEM CERTIFICATION..1 2. QUALITY ASSURANCE SYSTEM...2
Quality assurance for new product development....2 Design verification (FMEA)..... 4 Design evaluation test facility control... 4 Problem experience..... 4 Immature stage process control..... 4 Product safety assurance.... 4 Technology Qualification..... 4
3. STRUCTURE OF DOCUMENT CONTROL...5 4. PRODUCT TRACEABILITY...6 5. QUALITY CONTROL IN MANUFACTURING PROCESSES..8
(1) Incoming inspection.....8 (2) Process control.....9 (3) Statistical process control (SPC)....12 (4) Operator certification.....13
6. PROCESS CHANGE CONTROL...14 7. PLANT AND MEASURING EQUIPMENT CONTROL..15
(1) Plant control.....15 (2) Measuring equipment control....15 (3) Measurement system analysis (MSA)...17
NON-CONFORMANCE CONTROL, CORRECTIVE ACTION, AND PREVENTIVE MEASURES.18
(1) Non-conforming product control in manufacturing processes...18 (2) Control of non-conforming products identified at customers or on the market..19 (3) Corrective action.....20 (4) Preventive Measures....20
9. CONTINUOUS IMPROVEMENTS...21 10. SUPPLIER CONTROL...22
(1) Supplier selection....22 (2) Daily control.....22 (3) Periodic control.....22
11. INTERNAL AUDITS....23 12. DISCONTINUATION OF MANUFACTURE...23 13. CLEANLINESS ACTIVITIES....24
(1) Importance of cleanliness activities....24 (2) Cleanliness goals.....24
Seiko Epson Semiconductor Product Quality Assurance Guidebook (Rev.1.5)
1) Increase quality (eliminate quality problems and complaints attributable to foreign matter). 24 2) Increase yield rates and contribution to F costs reduction... 24 3) Preventive maintenance and life extension of production plant.. 24 4) Improve Customer Satisfaction.... 24 (3) Cleanliness activity support details....25 1) Training (New employee training and basic training).... 25 2) Cleanliness support in each production line.... 25 3) Supplier cleanliness support.... 25
1. QUALITY MANAGEMENT SYSTEM CERTIFICATION
Seiko Epsons Semiconductor Operations Division has attained and maintain ISO 9001:2000 and ISO/TS 16949 certification. Company Seiko Epson, Corp. (Semiconductor Operations Division) ISO/TS16949 Initial certification: 9 May, 2006 Certification ISO9001: 2000 Attained Initial certification: 10 October, 1993
2. QUALITY ASSURANCE SYSTEM
Quality assurance for new product development From planning and development to design, prototype production, mass production, and delivery, Seiko Epson has established a system to review quality at key points to precisely identify customer requirements and provide quality products in a timely manner. These quality reviews are incorporated into activities to maintain and improve product quality. The companys quality assurance system is illustrated on the following page. Planning and development stage Quality assurance starts with listening to customer comments at the planning and development stage. The product takes shape as the performance, reliability, and delivery schedule demanded or expected by customers and the market are promptly and accurately identified. Aspects such as circuit technology, manufacturing technology, manufacturing capacity, and quality assurance are all examined from various perspectives. Design stage In the subsequent design phase, we maintain close communications with the customer to ensure the incorporation of customer requirements into design work. Design work incorporates past circuit data, process data, quality data, and field information. To ensure high quality design, design rules play an ever-increasing role in each aspect of design, including circuit design, pattern design, process design, package design, and reliability design. Prototype production stage Once design is complete, work shifts to prototype production. But designs must be verified before the start of prototype production. This involves FMEA in the prototype phase to evaluate latent effects. A meeting is held to present and discuss analysis results, allowing the multi-functional team assembled from the various sections involved to examine them from various perspectives. The points and issues to be evaluated during prototype production are identified here before a decision to proceed with prototype production. Before mass production Products are subjected to approval review based on prototype evaluation results, in-house design verification, and reliability tests, etc., as well as the results of customer evaluations, when necessary. Mass production can begin once product qualification has been granted in the product qualification DR. Evaluations are performed at approved test facilities in accordance with Seiko Epson qualification criteria. Mass production stage The overall quality system is reviewed by monitoring and reviewing initial quality using immature stage process control where necessary during the mass production phase, ensuring continued improvements in the quality management system.

Quality Assurance System Diagram
Customer Development Sales
Product Control Product Planning Purchasing Administration

Design

Quality Engineering Assurance

Manufacturing

Development
Analyze customer needs & market trends Mid-term business strategy and annual schedule Development & planning review committee Development & planning DR Development DR

Standard product

Inquiries for custom-order products
Request to examine inquiry Master slice
Examine inquiry details Examine inquiry details Decision to accept or decline order Decision to accept or decline order

Response to customer

Decision to accept or decline order

Planning

Master slice Product planning Form multi-role team Determine DR rank
Planning committee Planning DR
Product plan (sales sheet) Product plan (production sheet) Product plan (plan summary sheet) Product plan (technology sheet)
New product briefing session
Design guideline confirmation session
Design verification Design verification

Prototype review

Prototype

Prototype report meeting

Evaluation/ confirmation Sample provision

Design evaluation

Individual technical evaluation
Individual evaluation (reliability test)
Measuring system analysis
Submit sample to client and create PPAP request documents

Approval

Product qualification DR

Confirmation

Submit Check receipt
Specifications list Special electrical standards Test program
Delivery specifications manual

Mass production

Manufacturing standards

Work standards

Orders

Order receipt

Overall schedule Materials purchasing Production instruction
Shipping DR Immature stage process control Shipping

Complaints

Delivery schedule complaints Quality complaints

Market

Investigation/Corrective action/Lot identification

Response Report Response

Overall DR
The main points of the Seiko Epson quality assurance system are described below. Design verification (FMEA) To help prevent latent defects, FMEA is used in design verification for products with a significant proportion of new technology elements. FMEA is used in both process design (PFMEA) and product design (DFMEA) and helps build in-house knowledge while streamlining work procedures. Design evaluation test facility control Seiko Epson design evaluation is undertaken at approved test facilities. The equipment used in evaluations must be calibration controlled in the same way as equipment used in production. Its also subject to measurement system analysis (MSA). Evaluation staff are registered to ensure accurate evaluation results. Problem experience Details of past problems and experience in dealing with problems are maintained in a database to prevent recurrence. This database is used to determine check points when developing new products and launching similar products. Confirmation of check points extracted from this database is a DR requirement. Immature stage process control Immature stage process control is applied when necessary to monitor full productivity by confirming that the initial requirements are met in the early stages of mass production run. These activities ensure a stable run of mass production products at an early stage. Product safety assurance Safety and environmental regulations applying to product safety in the relevant destination countries are analyzed together with individual requirements from customers at each DR stage. These are incorporated into evaluation items to ensure compliance with laws and to resolve safety and environmental issues. Technology Qualification New technology elements at the time of product approval and 4M change approval are controlled by registration in a database publication within the division. These form materials for determining the newness at the new product planning stage and also form important points in determining subsequent evaluation guidelines.

3. STRUCTURE OF DOCUMENT CONTROL
Seiko Epson administers a system in which employee duties are clearly defined and work procedures specified and documented to ensure delivery of quality products that meet customer requirements.
(Specifies individuals and tasks)
(Specifies items and processes)

Rules: Standards:

Specify specific task. Specify work procedures or tasks and actions to satisfy standards based on rules.

Quality manual

Standard specification drawings
Standard specification drawings: Specify items and processes based on
Standards (Work process standards)

rules. Work standards:

Records
Stipulate detailed duties and work procedures prescribed in standards.
Standards are currently in the process of shifting to electrical control to ensure users can always reference current versions. This transition will also prevent accidental use of discontinued standards by immediately removing them following revisions. Revision histories are maintained for each standard to prevent changes without checking for later versions.
Quest digital standard control system

4. PRODUCT TRACEABILITY

Lot numbers are printed on the front of the package or included on chip tray labels. Note that lot numbers may be simplified if the package size limits the number of characters that can be printed. Tracing is still possible even with simplified numbers.
<Typical lot number marked on package> (1) (2) (3) (4) <Key> (1) (2) (3) (4) (5) Epson control code Manufacture year code: Last two digits of year (2003 in this example) Manufacture week code: Week counted from first Thursday of manufacture year (in accordance with ISO 8601) (Week 9 in this example) (6) (7) (8) (9) Epson control codes (5) (6) (7) (8) (9)
This code allows tracing of manufacturing history and raw materials. The scope of traceability is shown below.

Traceability system

Customer Sales Section Production Control Section Internal control code Lot number Flow history Processing location Manufacturing Section
Product name Lot number Delivery date P/O number
P/O number Product code Quantity Lot number Reference number

Lot traveler

Processing date Equipment used Worker Process inspection results Trouble sheet
Raw materials Equipment operating status

Scope of traceability

5. QUALITY CONTROL IN MANUFACTURING PROCESSES

Product quality and reliability is built in during the manufacturing processes. Quality is controlled by paying particular attention to the following points in order to prevent latent defects in devices. Incoming inspection: Process control: Operator certification Each of these is explained below. (1) Incoming inspection The quality of raw materials used in manufacturing processes must be confirmed to maintain product quality and reliability. The following activities are performed to ensure this. Selection of manufacturers of raw materials used in manufacturing processes together with regular meetings (See 10. Supplier Control for detailed information.) Incoming inspection for all raw materials Materials that have not been inspected are not used in mass production. The main items subject to incoming inspection are shown below, together with inspection methods. Control of materials received Control of manufacturing processes
Use of statistical methods
Process control Control points are determined within the actual manufacturing process to ensure that quality is an integral part of the process. Process control involves specifying these control points and control methods. The output is checked from key processes, and this data is subjected to variation control using statistical process control (SPC). The data is fed back continually to support improvement activities. (See 5. (3) Use of statistical methods (SPC) for detailed information.) Seiko Epson creates control plans to summarize these control items. One example is shown below.
Another key element of process control is manufacturing plant control. Manufacturing plants are controlled through daily and periodic inspections, and the inspection results are used to implement continuous improvements that enhance preventive maintenance. Flowcharts are shown for a wafer process and typical FCBGA/PFBGA package assembly process to illustrate manufacturing process quality control more clearly. The flowcharts are used to create flow forms for each product, which are then used for control and manufacture.
Wafer process Process Control point
Wafer Washing Oxidation Nitride film formation Mask Film inspection Photoresist Photolithography Inspection Gas Ion injection Heat treatment process
Resistivity, thickness, flatness, scratches Surface washing extent Temperature, atmosphere, time

Pattern dimensions, defect density External appearance, film thickness Resist thickness, deformation, focus check External appearance, dimensions
Accelerating voltage, injection amount Temperature, atmosphere, time

Gas, Sputtering Target

Diffusion inspection
External appearance, sheet resistance, C-V test
Metallization Conductive layer inspection Passivation Device parameter measurement Wafer probe test
Vacuum, temperature External appearance, film thickness, step section inspection External appearance, debris Electrical properties (e.g., Vth, )
Circuit electrical properties

PFBGA product

Process Control point
Wafer Dicing Substrate Blades wear control, purified water

Die attaching Gold wire

External appearance

Wire bonding Mold resin

Temperature, US power, wire bonding appearance, bonding strength
Molding Laser marking Flux Solder ball
Temperature, pressure, visual appearance Visual appearance of marking
Solder ball attaching Solder ball washing Substrate mounting Substrate dicing Package selection Electrical testing Visual inspection Warehousing Shipping
Temperature, visual appearance, bond strength Visual appearance Visual appearance Number of cut lines, purified water control Storage orientation, visual appearance Electrical parameters, functions Visual appearance
Statistical process control (SPC) SPC control is applied to special characteristics to determine the extent of variation within manufacturing processes and to identify fluctuations in the early stages. The data obtained is then fed back to the process to assist with process maintenance control. SPC optimizes individual processes and process types to achieve consistent product quality. A typical control chart is shown below.
Clicking on this alarm point in the system allows inspection of the defect status. This defect status is retained as a record. The display can be switched from time-based to machine number display, reducing the time required to detect and resolve problems and ensuring consistent process control.

Operator certification Employees involved in manufacturing processes are subject to operator certification. Workers undergo training in various operational details and are allowed to participate in actual operations only after certification and confirmation for the specified level of the certification test. Workers are recertified annually to maintain worker skills.
Training process for new employees
Group training (company-wide training) Off-JT Group training (division training) Recertification Confirmation

Basic training

At least one day 1 to 15 weeks (depending on skill level) Retraining

Basic practice OJT

Certification test Pass Work duties
6. PROCESS CHANGE CONTROL
Process improvements are performed on a daily basis in the mass production phase to achieve even better product quality and reliability and to improve productivity. Accordingly, process changes are unavoidable in such cases. Process change plans are prepared in advance by the originating section, after which the plan and evaluation details are examined by the multi-functional team, which determines whether the customer must be notified. The change is implemented following evaluation and confirmation that there are no effects on the product. This enables process control and quality. Process changes deemed to affect quality and reliability for the customer are reported in advance to the customer for approval.

4M change process

Originating section, related sections 4M change proposal Advance study meeting Purpose, plan, 4M rank, determine need for ECN 4M rank, decision on need for ECN, evaluation item progress schedule confirmation Multi-functional team Quality Assurance Section Admin receipt Customer/Sales Section

Proposal approval

Advance notification (where necessary)
Amendments to detailed plan

Plan approval

Prototype/evaluation

Admin receipt

4M change approval DR
Change approval Technical certification registration
For foundry items Approval For mass production

Shipping DR

Shipping approval
Customer evaluation approval

Shipping

7. PLANT AND MEASURING EQUIPMENT CONTROL
(1) Plant control Equipment used in manufacturing processes is rigorously inspected following selection for the relevant process. Equipment accuracy is checked in daily or periodic inspections following approval for mass production use. (2) Measuring equipment control Ensuring traceability Measuring equipment used for measurements to check built-in quality and measuring equipment used in design validation and testing/inspection is calibrated. The calibration process ensures traceability in accordance with national standards. Calibrations are performed both in-house and by external calibration organizations. In-house calibration is performed to in-house primary standards whose traceability to national standards has been confirmed by certified employees with calibration training. External calibration is carried out by contractors subject to control similar to suppliers or manufacture contractors using quality systems confirmed to be appropriate for traceability and calibration work.

International/national standards
International Bureau of Weights and Measures
National Institute of Advanced Industrial Science and Technology Japan Electric Meters Inspection Corporation, Japan Quality Assurance Organization, etc.
Standard primary standard
Standard primary standards such as current/voltage generating equipment, standard signal generating equipment, standard resistances
External calibration period

Measuring equipment

Each measuring equipment
Measuring equipment identification tags Measuring equipment subject to calibration is identified using one of the tags shown below to ensure that everyone uses only the correct equipment. Measuring equipment available for use is identified by tags 1 and 2. These are used to maintain and control the calibration status under the periodic calibration system.
1. Calibration equipment control tag Indicates the calibration control number.
2. Calibrated tag Indicates the calibrator, date calibrated and next scheduled calibration date.
3. Engineering use only tag Indicates use is prohibited for mass production.
4. Do not use tag Indicates use is prohibited due to calibration non-conformance.
Measurement system analysis (MSA) Even measurement systems that have been calibrated with confirmed traceability to national standards can still produce variations in results obtained due to different measurers and ambient conditions. Measurement system analysis (MSA) is therefore used to minimize these factors and ensure the high reliability of measurement systems used. This analyzes bias, linearity, consistency, repeatability, and reproducibility to statistically evaluate measurement equipment.
8. NON-CONFORMANCE CONTROL, CORRECTIVE ACTION, AND PREVENTIVE MEASURES
(1) Non-conforming product control in manufacturing processes Products in manufacturing processes that fail to meet the specified standards are classified as non-conforming and are handled as shown below using product labeling and trouble sheets.
Process defect disposition
Product Dept. Engineering Section Quality Assurance Section

Defect occurrence

Product flow stopped Issue trouble sheet

Decision

Action

Trouble sheet retained

If loss is expensive If same process errors occur frequently on same type of machine If identified as serious defect by Engineering Section Chief To major quality problem flowchart

Control of non-conforming products identified at customers or on the market Please contact the Seiko Epson Sales Section if non-conformance is detected by customers after shipping. Problems are promptly analyzed as shown in the flowchart below before reporting the results to the customer.
Customer non-conformance analysis flowchart
Customer Sales Section Quality Assurance Section Related section
Non-conformance occurrence
Issue analysis request form

Analysis

Analysis/Action/Shared learning
Receive investigation report
Report via investigation report
Create/issue investigation report
If processing cost is high Client defect approved by Quality Assurance Section Chief (E.g., if similar defect occurs frequently in the market or in customer processes)
To major quality problem flowchart
Conducting analysis using FIB
Corrective action Problems arising in manufacturing processes or at customer sites identified as posing the risk of large amount of loss, as constituting serious problems, or as problems requiring shared learning, are subjected to separate registration control as major quality problems. The details recorded for major quality problems includes not just causal investigation and action, but also shared learning throughout the related section to confirm corrective action status and confirm completion.
Major quality problem action flowchart
From process problem (from Engineering Section) From customer problem (from Quality Assurance Section)
Issue quality problem analysis sheet
Identify problem Determine phenomenon Analyze true cause Corrective action Check effectiveness Shared learning to related sections Feedback to quality system
Section in charge: Quality Assurance Section
Review and follow-up at quality meeting Patrol
Preventive Measures One preventive measure involves collating the analysis results of past problem cases and adding these to check points highlighted in reviews for examination by the multi-functional team. Another major activities is the use of FMEA. These activities are used to prevent problem recurrence.
9. CONTINUOUS IMPROVEMENTS
At the start of each fiscal year, a business plan is established based on the review results for the previous year, customer demands, and the company-wide policy. This plan includes quality policies and quality targets. This business plan is then used to draw up individual section plans and individual worker objectives. To achieve quality targets, current conditions are identified at yield improvement meetings and quality meetings with follow-up on the status of corrective action. This information is reported to management. These overall activities to attain quality targets are used to promote continuing improvement and to increase product quality.

Progress follow-up

Quality policies Review of previous fiscal year Company-wide policy Customer demanded quality

Business plan Including quality targets
Individual section implementation plan Individual worker implementation plan

Operation

Progress follow-up and task identification Management review Quality meeting Monthly quality report Implementation plan check

10. SUPPLIER CONTROL

Suppliers are generally categorized into suppliers of materials and components and manufacturing subcontractors. In both cases, maintaining quality is of prime importance, and suppliers are subject to the following three types of control. Supplier selection Daily control Periodic control (1) Supplier selection When a request is issued to use a new supplier, selection is made by checking the technical capabilities of the supplier and determining whether it has a quality assurance system in place to ensure delivery of products of consistent quality. Following selection, products are evaluated and the factory is audited from a number of perspectives by the related sections to evaluate the supplier. Following confirmation that the supplier meets standards of adequacy, a quality assurance standard is prepared and used to establish a quality assurance system. (2) Daily control The occurrence of quality problems or process changes are reported by the specified forms in accordance with the quality assurance standard. The number of problems is a major point considered in the supplier evaluations incorporated into periodic control procedures, as mentioned below. (3) Periodic control Suppliers are evaluated at each fiscal year based on QCD (quality, cost, delivery) results. These results are used to determine the supplier control level for the current year, and guidance is administered when necessary, including audits. In addition, periodic meetings, etc. are held at frequent intervals to ensure cooperation from suppliers to improve quality.

11. INTERNAL AUDITS

Internal audits are performed to confirm that the quality management system is being operated effectively and to create an even better quality system. Regular audits are performed annually, covering all shifts for manufacturing processes. Partial or total audits may also be implemented from time to time when deemed necessary by the quality system manager. The results of these audits are used to improve the quality management system. The internal audit results are one of input to management review.
12. DISCONTINUATION OF MANUFACTURE
The manufacture of existing products may be discontinued due to manufacturing facility reorganization or product quality improvements. In these cases, the customer is generally notified approximately one year in advance. The flowchart for the discontinuation of manufacture is shown below.

End of Life flowchart

Originating section Business Administration Section Related sections Sales Section Customer
Request for discontinuation of manufacture

Registration on manufacture discontinuation list

Confirmation of details

Notification of discontinuation of manufacture
Decision on discontinuation of manufacture

Approval receipt

Activities for discontinuation of manufacture
13. CLEANLINESS ACTIVITIES
Support for cleanliness activities also forms part of the duties of the Quality Assurance Department. These activities are described below. (1) Importance of cleanliness activities Seiko Epson products have achieved an outstanding reputation among our customers for performance and reliability. The most important factor for integrating this reliability and quality is maintaining and controlling cleanliness in the environment in which products are made. Activities that ensure cleanliness in the factory will become even more important in the future, with the ever-increasing precision of products and demand for higher levels of quality control. Cleanliness activities for semiconductor manufacturer are particularly important, since particles or impurity ions encountered during the manufacturing processes can greatly affect product yield rates and reliability. (2) Cleanliness goals The four points below constitute the goals of cleanliness activities and support the production workfloor. 1) Increase quality (eliminate quality problems and complaints attributable to foreign matter) This is treated as a major cleanliness item that helps prevent any direct inconvenience to the customer. 2) Increase yield rates and contribution to F costs reduction Reduce foreign matter and impurities to avoid generating non-conformances or products requiring reworking. While this also reduces failure costs for Seiko Epson, the primary goal is to enable provision of products to customers at low cost and with short lead times. 3) Preventive maintenance and life extension of production plant The emphasis is on tackling problems at the source from the early stages, with daily inspections performed to avoid effects on production and delivery schedules caused by plant stoppages when problems arise. Intensive maintenance extends the life of plant equipment and allows sustained production with depreciated plant equipment, which in turn makes it possible to continue providing low-cost products to customers. 4) Improve Customer Satisfaction In addition to the importance of maintaining a clean manufacturing environment, winning esteem from our customers helps boost our own levels of satisfaction. Creating products from the customers perspective is important for ensuring reliability and long-term use with peace of mind. This is why all divisions within Seiko Epson incorporate cleanliness activities into their daily

production activities, always aware of their vital nature. (3) Cleanliness activity support details The following multi-faceted support is provided to ensure high quality product manufacture: 1) Training (New employee training and basic training) Good quality products require both a good manufacturing environment and a workforce with high awareness and knowledge of cleanliness. Product quality reflects workforce quality. Training is vitally important. New employees receive cleanliness training as part of the training program for new employees. Cleanliness training is also provided at the appropriate intervals for every employee. 2) Cleanliness support in each production line Instruction and support is provided for semiconductor manufacturing lines through cleanliness diagnosis and patrols. 3) Supplier cleanliness support Cleanliness training, instruction, and advising is also provided when necessary at the manufacturing lines of subcontractors.
Cleanliness guidance session
International Sales Operations

AMERICA

EPSON ELECTRONICS AMERICA, INC.
2580 Orchard Parkway, San Jose, CA 95131, USA Phone: +1-800-228-3964

EPSON (CHINA) CO., LTD.

7F, Jinbao Bldg., No.89 Jinbao St., Dongcheng District, Beijing 100005, CHINA Phone: +86-10-6410-6655 FAX: +86-10-6410-7320

FAX: +1-408-922-0238

SHANGHAI BRANCH

EUROPE

EPSON EUROPE ELECTRONICS GmbH
Riesstrasse 15, 80992 Munich, GERMANY Phone: +49-89-14005-0 FAX: +49-89-14005-110
7F, Block B, Hi-Tech Bldg., 900 Yishan Road, Shanghai 200233, CHINA Phone: +86-21-5423-5522 FAX: +86-21-5423-5512

SHENZHEN BRANCH

12F, Dawning Mansion, Keji South 12th Road, Hi-Tech Park, Shenzhen 518057, CHINA
Phone: +86-755-2699-3828 FAX: +86-755-2699-3838

EPSON HONG KONG LTD.

20/F, Harbour Centre, 25 Harbour Road, Wanchai, Hong Kong Phone: +852-2585-4600 FAX: +852-2827-4346 Telex: 65542 EPSCO HX
EPSON TAIWAN TECHNOLOGY & TRADING LTD.
14F, No. 7, Song Ren Road, Taipei 110, TAIWAN Phone: +886-2-8786-6688 FAX: +886-2-8786-6660
EPSON SINGAPORE PTE., LTD.
1 HarbourFront Place, #03-02 HarbourFront Tower One, Singapore 098633 Phone: +65-6586-5500 FAX: +65-6271-3182
SEIKO EPSON CORP. KOREA OFFICE
50F, KLI 63 Bldg., 60 Yoido-dong, Youngdeungpo-Ku, Seoul 150-763, KOREA Phone: +82-2-784-6027 FAX: +82-2-767-3677

SEIKO EPSON CORP. SEMICONDUCTOR OPERATIONS DIVISION IC Sales Dept. IC International Sales Group
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN Phone: +81-42-587-5814 FAX: +81-42-587-5117
H Revised February 2009 in JAPAN