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Sony P1130
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SERVICE MANUAL
US Model Canadian Model
Chassis No. SCC-L33H-A
CR1 CHASSIS
SPECIFICATIONS
Screen dimensions Preset Image Size 4:3 Electrical Video input signals Synchronization input signals analog, 0.7 Vpp, positive at 75 ohm separate horizontal and vertical; and composite TTL level, positive or negative Sync on Green at 0.3 Vp-p 120 to 240 VAC / 50 or 60 Hz 3 Hz / 1.6 A (RMS) at 120 VAC and 0.9 A (RMS) at 220 VAC 50 A 80 A 5:4 Diagonal 19.09 inches (485 mm) Horizontal 15.28 inches (388 mm) Vertical 11.46 inches (291 mm) Diagonal 18.35 inches (466 mm) Horizontal 14.33 inches (364 mm) Vertical 11.46 inches (291 mm) Diagonal 19.86 inches (504 mm) Horizontal 15.90 inches (404 mm) Vertical 11.90 inches (302 mm) 0.24 mm 90 AR Coating AC input voltage / frequency / current Inrush current at 120 V Inrush current at 240 V Physical Characteristics Connector type Signal cable type Dimensions: Height Width Depth Weight (monitor only) Weight (with packaging) Environmental Temperature: Operating Nonoperating Humidity: Operating Nonoperating Altitude: Operating Nonoperating Thermal dissipation
Viewable Image Size (VIS)
Aperture Grille Pitch Deflection angle Faceplate coating Resolution Horizontal scan range Vertical scan range Optimal preset resolution Highest preset resolution Highest addressable resolution*
15-pin D-subminiature Attached to monitor 502 mm (19.8 inches) 497 mm (19.6 inches) 485 mm (19.1 inches) 30.5 kg (67.4 lb) 35.5 kg (78.4 lb)
30 kHz to 130 kHz (automatic) 48 Hz to 170 Hz (automatic) 1280 x 1024 at 85 Hz 1600 x 1200 at 85 Hz 2048 x 1536 at 80 Hz
* Addressable means the monitor will sync up to this mode. However, Dell does not guarantee the image will be sized and centered correctly. Dell guarantees image size and centering for all preset modes listed in the following table.
32 to 104F (0 to 40C) -4 to 140F (-20 to 60C) 10% to 80% (noncondensing) 5% to 90% (noncondensing) 3,048 m (10,000 ft) 10,675 m (35,000 ft) 494 BTU/hour (maximum) 426 BTU/hour (typical)
TORINITRON COLOR GRAPHIC DISPLAY
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety checks before releasing the set to the customer: 1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard wiring to ensure that no wires are pinched or contact high-wattage resistors. 3. Check that all control knobs, shields, covers, ground straps, and mounting hardware have been replaced. Be absolutely certain that you have replaced all the insulators. 4. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommend their replacement. 5. Look for parts which, though functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement. 6. Check the line cords for cracks and abrasion. Recommend the replacement of any such line cord to the customer. 7. Check the B+ and HV to see if they are specified values. Make sure your instruments are accurate; be suspicious of your HV meter if sets always have low HV. 8. Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC Leakage. Check leakage as described below. LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOMs that are suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A)
To Exposed Metal Parts on Set
0.15 F
AC Voltmeter (0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
P1130(E)
WARNING!! NEVER TURN ON THE POWER IN A CONDITION IN WHICH THE DEGAUSS COIL HAS BEEN REMOVED. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY SHADING AND MARK ON THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CIRCUIT ADJUSTMENTS THAT ARE CRITICAL FOR SAFE OPERATION ARE IDENTIFIED IN THIS MANUAL. FOLLOW THESE PROCEDURES WHENEVER CRITICAL COMPONENTS ARE REPLACED OR IMPROPER OPERATION IS SUSPECTED. AVERTISSEMENT!! NE JAMAIS METTRE SOUS TENSION QUAND LA BOBINE DE DEMAGNETISATION EST ENLEVE. ATTENTION AUX COMPOSANTS RELATIFS LA SCURIT!! LES COMPOSANTS IDENTIFIS PAR UNE TRAME ET UNE MARQUE SONT CRITIQUES POUR LA SCURIT. NE LES REMPLACER QUE PAR UNE PICE PORTANT LE NUMRO SPECIFI. LES RGLAGES DE CIRCUIT DONT LIMPORTANCE EST CRITIQUE POUR LA SCURIT DU FONCTIONNEMENT SONT IDENTIFIS DANS LE PRSENT MANUEL. SUIVRE CES PROCDURES LORS DE CHAQUE REMPLACEMENT DE COMPOSANTS CRITIQUES, OU LORSQUUN MAUVAIS FONCTIONNEMENT EST SUSPECT.
P1130(E) 3
POWER SAVING FUNCTION
If you have VESA's DPMS compliance display card or software installed in your PC, the monitor can automatically reduce its power consumption when not in use. If input from keyboard, mouse or other input devices is detected, the monitor will automatically "wake up". The following table shows the power consumption and signaling of this automatic power saving feature: Power Management Definition
VESA's Mode Video H-sync V-sync Power Used minimum 95 W ON Active Yes Yes maximum 135 W typical 120 W Active-OFF OFF* Blanked N/A No N/A No N/A <3W 0W Amber OFF Green LED color
This monitor is ENERGY STAR-compliant and TCO'95 power management compatible. * Zero power consumption in OFF mode can only be achieved by disconnecting the power cable from the monitor.
DIAGNOSIS
Failre +B failure Horizontal / Vertical Deflection failure, Thermal protector ABL protector HV failure Aging / Self Test Out of scan range Self Test (OSD Color Bar) Power LED Amber Off (0.5 sec) (0.5 sec) Amber Off (1.5 sec) (0.5 sec) Amber Off (0.5 sec) (1.5 sec) Amber Off Amber Off (0.25 sec) (0.25 sec) (0.25 sec) (1.25 sec) Amber Off Green Off (0.5 sec) (0.5 sec) (0.5 sec) (0.5 sec) Green (OSD indication)
1 Before removing the bezel assembly, secure
the picture tube by attaching two screws to the picture tube shield at the positions shown with an arrow (diagonal two places) to prevent the picture tube from falling. (Use the screws +BVTT 4 x 8 that fix EMI shield.)
Four tapping screws (5)
Picture tube shield
Screw (+BVTP 4 x 16)
L1 blacket
Magnetic CN1500 MIU-221D sensor
Input button
CN1400 CN1401
Three screws (+BVTP 3 x 10) H4 board
P1130(E) 1-4
1-5. D BOARD REMOVAL
Two screws (+BVTP 3 x 10)
Rear plate assembly
Five screws (+BVTP 3 x 10)
CN1601 CN1600
A1 board (C block)
Connector (4P)
CN1103 CN1003 CN605 CN701 CN501 GND
D board Screw (+BVTP 3X10)
Connector (4P) GND
CN602 CN601
1-6. SERVICE POSITION
Remove the D board. Remove the Video block assembly. Install the Adaptor board (XT MOUNT) (A-1391-123-A). Lay the Video block assembly.
Install the video block assembly.
Put a box which is about 15cm in height under the D board to fix it. (Please disconnect the CN 701 first.)
D board
1-7. PICTURE TUBE REMOVAL
Anode cap
Neck assembly
CN2 CN1
Picture tube
REMOVAL OF ANODE-CAP
NOTE: Short circuit the anode of the picture tube and the anode cap to the metal chassis, CRT shield or carbon painted on the CRT, after removing the anode.
REMOVING PROCEDURES
Anode Button
1 Turn up one side of the rubber cap in the direction indicated by the arrow a.
2 Using a thumb pull up the rubber cap firmly in the direction indicated by the arrow b.
3 When one side of the rubber cap is separated from the anode button, the anode-cap can be removed by turning up the rubber cap and pulling up it in the direction of the arrow c.
HOW TO HANDLE AN ANODE-CAP
1 Dont scratch the surface of anode-caps with sharp shaped material! 2 Dont press the rubber hardly not to damage inside of anodecaps! A material fitting called as shatter-hook terminal is built in the rubber. 3 Dont turn the foot of rubber over hardly! The shatter-hook terminal will stick out or damage the rubber.
P1130(E) 1-8
1-8. HARNESS LOCATION
H4 board
CN1401 CN1400
Magnetic sensor
CN1500
CN2 5P CN1 4P CN3 4P
L2 board
CN1602
CN1600 CN1601 CN501
CN1003
CN1103
N board
CN604 CN601
CN1102
AC inlet (3P)
CN315 CN320
SECTION 2 SAFETY RELATED ADJUSTMENT
When replacing or repairing the shown below table, the following operational checks must be performed as a safety precaution against X-rays emissions from the unit. Part Replaced ([) HV ADJ RV901 Part Replaced (]) HV Regulator Circuit Check D Board C925, IC901, R901, R902, R905, R924, R925, R926, RV901, T901 (FBT) Mounted D Board D Board C920, C923, D911, D912, R903, R917, R918, R919, R920, R923, T901 (FBT) Mounted D Board N Board IC1001, RB1001 Mounted N Board Part Replaced (]) Beam Current Protector Circuit Check D Board C930, D917, R921, R932, R933, R935, T901 (FBT) Mounted D Board N Board IC1001, RB1001 Mounted N Board
* Confirm one minute after turning on the power. a) HV Regulator Circuit Check 1) Turn the RV901 slowly, and adjustment so that high voltage is in the specified range. [Specification]: 27.00 0.05 kV 2) Check that the voltage of D912 cathode on the D board is 17.0 V or more. b) HV Protector Circuit Check 1) Using external DC Power Supply, apply the voltage shown below between cathode of D912 and GND, and check that the RASTER disappers. [Specification]: 19.95 + 0.00/ 0.05 V
P1130(E) 2-1
HV Protector Circuit Check
c) Beam Current Protector Circuit Check 1) Connect constant current source to a section between T901 (FBT) qa pin and GND, and check that the RASTER disappers when the specified current flows to the qa pin. [Specification]: 2.12 + 0.00/ 0.01 mA
SECTION 3 ADJUSTMENTS
Note: Hand degauss must be used on stand-by or power-off condition. This model has an automatic earth magnetism correction function by using an earth magnetism sensor and a LCC coil. When using a hand degauss while monitor (LCC coil) is being operated, it sometimes gets magnetized, and the system may not work properly as a result.
Landing Rough Adjustment
1. 2. 3. 4. Display all white pattern (or black dot pattern). Set contrast to 255. Display green plain pattern. Side back DY and roughly adjust green plain pattern to be centered on the useful screen with Purity Magnet. 5. Adjust DY tilt. Note: Set ROTATION to 128 and LCC_NS to 128 when adjusting DY tilt. 6. LIghtly tighten the DY screw.
Landing Fine Adjustment
Note: (1) After adjust W/B (9300k), measure the average of IK with all white video input, while CONTRAST is maximum and BRIGHTNESS is center. And adjustment shall be made so that the miss-landing become least after aging 2H with the IK 30% of measured value shown above. (2) The magnetic field shall be BH = 0. (3) When adjusting at other than BH = 0, calculate the shifted value from BH = 0.
1. Put the monitor in helmholz coil. 2. Set as follows; LCC_SW = 0 (LCC Correction Current = 0) FUNCTION_SW bit1 = (Auto Degauss = On) CONTRAST = 255 3. Display green plain pattern. 4. Degauss the iron part of chassis with a hand degausser and degauss coil. 5. Degauss CRT face with a hand degausser again. 6. Input AC 230V to AC IN and turn the monitor off and on. Then autodegauss works. 7. Reset FUNCTION_SW bit1 to 0 (auto-degauss = off) 8. Degauss CRT face with a hand degausser again. 9. Attach wobbling coil to the specified place on CRT neck. 10. Put on landing sensor to CRT face. 11. Set LCC_SW to 12. 12. With landing checker, adjust DY position, purity, DY center and landing of the 4 corners. 13. Read VX and VY value which are the read out of magnetic sensor, and write to "LCC_VX_REF" and "LCC_VY_REF".
14. Adjust landing by LCC_NS, LCC_LT, LCC_LB, LCC_RT, and LCC_RB. Adjustment of registers shall be limited within the following range. LCC_NS: LCC_LT, LCC_LB, LCC_RT, and LCC_RB: Set LCC_SW to 13, and Perform Service Save. <Specifications> Adjust so that the green is within the specification given right. 4 corner adjust target : within 1
(m) 0 7.7.7.3
<How to place wedge> Green plain crosshatch pattern a a and b should be equal. c and d should be equal. Plaster RTV to both sides for the upper wedge. Make sure that they settle inside DY.
The red and blue must be within the specification given right with respect to the green.
Plaster RTV to one side for other wedges.
A difference between red and blue must be within the specification given right.
(m) 10
15. Tighten DY screw within specified torque, and auto-degauss. Note: Torque kgcm (2.2 0.2Nm) 16. Adjust the vertical angle of DY to make top and bottom pins equal (a = b). The horizontal angle shall not be changed (straight). Settle DY upright without leaning, and insert wedges firmly so that DY shall not move.
17. Adjust top and bottom pins correction VR. 18. Adjust the horizontal trapezoid distortion by DY horizontal trapezoid correction VR. 19. Check landing at each corner and in case not in specification, adjust landing of 4 corners with "LCC_NS", "LCC_LT", "LCC_LB", "LCC_RT", and "LCC_RB". The limitations of registers are shown below. LCC_NS: LCC_LT, LCC_LB, LCC_RT, and LCC_RB: 20. Remove the sensor and wobbling coil. 21. Switch signals to R, G, and B, and then check that the pure colors have good color purity. 22. Fix purity magnets with white paint.
P1130(E) 3-2
Connect the communication cable of the computer to the connector located on the D board. Run the service software and then follow the instruction.
1 1-690-391-21
2 A-1500-819-A Interface Unit
3 3-702-691-01 Connector Attachment
IBM AT Computer as a Jig
To BUS CONNECTOR
D-sub (9 Pin [female])
mini Din (8Pin)
*The parts above ( 1
3 ) are necessary for DAS adjustment.
Convergence Rough Adjustment
(1) Display white crosshatch pattern. (2) Pile the convex parts of 6-pole magnet for convergence together. (3) Roughly adjust H.CONV and V.CONV with 4-pole magnet.
Purity 4-pole magnet 6-pole magnet 2-pole magnet
TLV R B B R
H.TRAP TB-PIN XCV
Convergence Specification
0.20 mm 0.24 mm
White Balance Adjustment Specification
1. 9300 K x = 0.283 0.005 y = 0.298 0.005 (All White) 2. 6500 K x = 0.313 0.005 y = 0.329 0.005 (All White) 3. 5000 K x = 0.346 0.005 y = 0.359 0.005 (All White)
Focus adjustment
Adjust the focus volume 1 and 2 for the optimum focus.
Focus 1
Focus 2
Vertical and Horizontal Position and Size Specification
b a a b a
MODE B A B
1.8 mm 1.8 mm
SECTION 4 DIAGRAMS
4-1. BLOCK DIAGRAMS
CN309 HD15
INPUT2(HD15)
IC008 INPUT SELECT B1 G1 R1 V1 H1 B OUT SOG B2 G2 R2 V2 H2 SYNC IN
IC001 RGB PRE-AMP
IC002 RGB AMP R OUT G OUT B OUT
CN318 KR KG KB HEATER+ V901 PICTURE TUBE
R OUT G OUT
R IN G IN B IN
R OUT G OUT B OUT
KR KG KB HEATER+
CN307 HD15
SDA SCL VCLK IC009 ROM
INPUT1(HD15)
SDA SCL VCLK
COF R COF G COF B
RIN GIN BIN
ROUT GOUT BOUT
IC004 CUT OFF AMP
G.SYNC
SW Q004 CN311 DDC SCL1 DDC SDA1 DDC GND1 DDC SCL2 DDC SDA2 DDC GNDSW Q001 SW Q002 SW Q005
IC006 INVERTER
IC007 ROM
OSD BLK
TO D BOARD FBT
IC011 HEATER REG Vcc OUT VADJ
TO D BOARD CN1102
H BLK INPUT SW IIC SCL IIC SDA HS OUT VS OUT ECO SW
SCL SDA HS OUT VS OUT ECO SW
SCL SDA
SCL SDA HS OUT VS OUT ECO SW CS IN VS IN HS IN
RCI GCI BCI
HS OUT 12 VS OUT 13 ECO SW 27
BUFFER Q101, Q201, Q301
1 +B +80V +12V 7V 3.3V 8 9
+B +B +80V +12V 7V 3.3V 5V
TO D BOARD CN604
IC003 OSD
XTAL IN
X001 24.5MHz
(VIDEO AMP, RGB OUT)
VSAWN DCC2 H.LINBAL HSAW_SW HSHAPE REFDC HD OUT YDC HFBP XDC D.TILT YSC XSC
PWMOUT MIXOUT
L510 :HOC +B
L509 :HCC
V+ V H H+
ERRIN REFIN HDIN MIX MIX+ VREG9
ERROUT
H-SIZE FILTER SW Q523
H-SIZE FILTER SW Q524 PIN DRIVE Q508-509
PIN OUT Q506
H LIN BAL SW Q510
S501 (RASTER CENTER TAP SWITCH)
B-SS9328<U/C>-BD3-EPS05
4-2. FRAME SCHEMATIC DIAGRAM
CN309 HD15D-SUB
INPUT2 (HD15)
A1 (VIDEO AMP, RGB OUT )
CN307 HD15D-SUB
INPUT1 (HD15)
PICTURE TUBE
RGB G1 G2
DDC GND1 DDC GND2 DDC SDA1 DDC SDA2 DDC SCL1 DDC SCL2 INPUT SW ECO SW
HS OUT
VS OUT
IIC SDA
IIC SCA
CN318 2P
G2 G2(NC)
CN312 9P WHT
CN311 17P WHT
GND 17 IIC SDA 16 IIC SCA 15 GND 14 ECO SW 13 GND 12 DDC SDADDC SCLDDC GND2 INPUT SW DDC GND1 HS OUT VS OUT DDC SDA2 DDC SCL2 H BLK GND 3.3V +12V +80V GND NC 5V 7V +B +B 1
CN1101 40P XSC YSC D.TILT XDC HFBP YDC HD OUT REFDC HSHAPE +12V NC +12V A.GND 3.3V D.GND D.GND HSAW_SW GXSC LCC NS GYSC IIC SDA IIC SCL A.GND A.GND H.LINBAL H BLK NC HS OUT DCC2 VS OUT VSAWN NC A.GND PLL LOCK A.GND POC A.GND A.GND V.DF H.DF XSC YSC D.TILT XDC HFBP YDC HD OUT REFDC HSHAPE +12V NC +12V A.GND 3.3V D.GND D.GND HSAW_SW GXSC LCC NS GYSC IIC SDA IIC SCL A.GND A.GND H.LINBAL H BLK NC HS OUT DCC2 VS OUT VSAWN NC A.GND PLL LOCK A.GND POC A.GND A.GND V.DF H.DF 2 1
CN604 9P BLK CN502 40P
CN1102 17P BLK
CN504 1P
CN701 10P WHT :S-MICRO ROTATION+ ROTATION XSC XSC+ YSC YSC+ XDC XDC+ YDC YDC+ 2 1
DEFLECTION,HDF,VDF, HV, POWER SUPPLY
CN501 6P WHT :VH V+ V NC H NC H+ H DY V DY
CN1101 40P -15V +15V GND GXSC GYSC LCC_NS IIC SDA IIC SCL -15V +15V GND GXSC GYSC LCC_NS IIC SDA IIC SCL 7 8
CN1603 8P WHT
CN1601 4P WHT :S-MICRO CY4+ CY4 CY3+ CY2
KEY SCAN
INPUT SW
CN1104 44P
WAKE UP
R594 G2 4.7k :CHIP DDC GND1 R593 10k :CHIP R592 4.7k R591 4.7k
R504 10k :CHIP R505 22k :CHIP
6.1 R502
C515 0.01 B:CHIP C16V
R524 R525 3.3k 1.8k :RN-CP :RN-CP R523 27k :RN-CP
R735 4.7k :CHIP
C719 0.1 25V F:CHIP +15V C-15V CR2W :RS
SAWR PWMOUT SAWOUT PGND SGND SLOW SW HDIN REFIN NC ERRIN MIX+ NC MIXERROUT MIXOUT
R707 82k
C718 0.1 25V F:CHIP R737 C730 2.7k 1000p :CHIP B:CHIP
C704 0.01 :PT R710 R711 8.2k 9.1k :RN-CP :RN-CP
R712 4.7k C706 0.01 :PT
+B L510 :HOC
L100 H T501 :HDT
R521 100
DUDZS-TE17-5.1B
10.4.7 4.7 3
R709 C713 C714 4.7k 0.01 0.01 C705 :CHIP B:CHIP B:CHIP 0.1 25V B:CHIP
C511 0.1 25V F:CHIP
-15V R701 2.2 C701 330p B:CHIP
C726 R703 0.1 2.2 25V F:CHIP C703 330p
Q501 2SC1623-T1-L5L6 H DRIVE BUFF
Q503 2PB710AR-115 H DRIVE BUFF
R:CHIP C525 0.1 25V F:CHIP B:CHIP
Q521 DTC124EKA-T146 R579 H-SAW SW 1k B:CHIP
IC703 LA6500-FA ROTATION DRIVE
OUT VEE VCC
1.5 1.5 1.5 1.5
1.5 1.5 0.2 0.2
C517 470p CH:CHIP
C727 R700 B:CHIP 0.1 82k 25V :CHIP F:CHIP R2W :RS
R599 R598 100k 3.9k :RN-CP :RN-CP C565 R526 0.1 47k 25V :RN-CP B:CHIP 5.6
Q508 2PD602AR-115 PINDRIVE
IC501 BA9759F-E2 PWM CONT
S6 DDC SDA2 S5 DDC SCL2 S4 DDC GND2 S3
Q506 2SJ569LS-CC11 PIN OUT
XSC YSC
C503 0.1 :PT R506 10
24.7k 1.1H
R515 FB501
Q509 2PB710AR-115 PINDRIVE
C25V R530 3k :RN-CP R531 R532 2.7k 22k :RN-CP :CHIP R512 R534 2.2k 2.2k :CHIP :CHIP
C520 0.015 B:CHIP C522 22
C562 1000p B:CHIP R590 4.7k PWR SW :CHIP
C504 0.0047 :PT
R758 2.2 :FPRD
R759 2.2 :FPRD
+3.3V +15V -15V
+15V -15V
Q504 2SK2231 H DRIVE
C512 R518 470p 220 Q507 C509 B:CHIP :CHIP 2SC2412K 100p 2kV BUFF SL -0.7
Q519 2SA1037AK SIZE DETECT BUFF
R541 47k :CHIP
C519 R573 4700p 2.2k B:CHIP :CHIP
C521 0.01 B:CHIP R578 1k :CHIP
R412 JW(5)
D706 UDZS-TE17-5.1B
D505 R514 C507 FB555 D2L40-TA 22 0.:FPRD 400V :CHIP D503 :MPS HZS182-TE
R511 MA111-TX 22k :RN-CP
IC401 STV9379A V OUT VEE O + - VCC
R756 2.2k
R589 4.7k DGS SW :CHIP
S1 +5V S0
R588 4.7k :CHIP
CN602 3P WHT :VH
C250V F601 SG601 6.3A
IC630 FA13842P REG
3.3V Vcc GND 5V CTL
R617 10k :CHIP
R629 15k :RN-CP C636 2200p B:CHIP
R687 4.9 22k :CHIP
R671 10k :RN-CP L612 4.7 H
C6.3V C6.3V
D643 MA111
R618 1k :CHIP
D644 MA111
VDR602
C635 470p B:CHIP
DGS SW
B-SSS9328<U/C>-D.-P3-EPS05
CN604 9P BLK
P1130(E) 4-12
D BOARD
DEFLECTION, H DF, V DF HV, POWER SUPPLY
D BOARD SEMICONDUCTOR LOCATION
IC DIODE
D401 D405 D406 D501 D502 D503 D504 D505 D506 D509 D510 D512 D516 D517 D518 D519 D520 D521 D610 D613 D631 D632 D633 D634 D635 D641 D643 D644 D650 D651 D652 D680 D690 D692 D694 D697 D701 D702 D703 D705 D706 D901 D906 D907 D909 D910 D911 D912 D914 D917 D918 D919 D920 D921 D922 D923 D-4 C-4 D-4 E-1 E-3 D-3 E-4 D-2 E-2 C-1 E-4 D-2 D-3 E-4 C-1 C-1 E-3 E-3 B-5 A-5 B-4 B-4 B-4 A-3 A-3 A-3 B-5 B-4 B-3 B-2 B-2 B-4 A-5 B-7 A-4 A-2 D-4 D-4 D-4 C-5 D-4 D-5 C-5 C-5 C-6 D-6 E-6 E-7 D-5 D-5 D-7 D-7 D-7 D-5 D-5 D-7
IC401 IC501 IC610 IC620 IC630 IC640 IC652 IC654 IC680 IC701 IC702 IC703 IC901 IC902
D-4 C-1 A-5 A-2 B-3 B-2 B-3 C-2 B-3 B-1 B-1 A-1 D-5 C-6
Q501 Q502 Q503 Q504 Q505 Q506 Q507 Q508 Q509 Q510 Q511 Q512 Q513 Q514 Q515 Q516 Q517 Q519 Q521 Q523 Q524 Q610 Q611 Q630 Q640 Q641 Q652 Q701 Q702 Q703 Q704 Q705 Q706 Q707 Q901 Q902 Q903 Q904 Q905 Q906 Q907 C-1 C-1 C-1 E-1 E-3 D-3 E-2 C-1 C-1 D-3 D-2 D-2 D-1 D-1 E-1 E-1 E-1 D-2 C-1 C-1 D-2 A-2 B-7 B-4 A-3 A-3 A-2 D-4 D-4 D-5 D-5 D-5 E-6 E-6 C-5 C-6 D-5 D-5 D-6 D-6 D-1 1
VARIABLE RESISTOR
RV901 E-7
P1130(E) 4-13
(3) Schematic Diagram of DA Board
VS OUT HS OUT PLL LOCK SDA SCL C1103 C1104 0.1 0.1 25V 25V B:CHIP B:CHIP 3.3V C1102 0.1 25V B:CHIP C1101 0.1 25V B:CHIP RB1102 1k :CHIP C1139 0.1 25V B:CHIP
DA(DPU)
R1139 47k :CHIP RB:CHIP C1105 0.01 B:CHIP
LCC_NS HSAW_SW HLINBAL HCENT
CN1101 40P
C1108 0.01 B:CHIP
XSC YSC D.TILT XDC HFBP YDC HD OUT REFDC HSHAPE +12V NC +12V A.GND 3.3V D.GND D.GND HSAW_SW GXSC LCC_NS GYSC IIC SDA IIC SCL A.GND A.GND H.LINBAL H BLK NC HS OUT DCC2 VS OUT VSAWN NC A.GND PLL LOCK A.GND POC A.GND A.GND V.DF H.DF TO D-a BOARD CN502
C1109 0.01 B:CHIP C1110 0.01 B:CHIP C1111 0.01 B:CHIP C1112 0.1 25V B:CHIP C1113 0.01 B:CHIP C1115 0.01 B:CHIP
0 1-251-382-31 INLET, AC (WITH NOISE FILTER) 0 1-453-359-11 TRANSFORMER ASSY, FLYBACK (NX-4702/KM7E) * 8-933-476-00 DA BOARD, COMPLETE * 8-933-517-00 N BOARD, COMPLETE * 8-933-481-00 L2 BOARD, COMPLETE * 8-933-516-00 D BOARD, COMPLETE 4-083-206-01 BAR, EXTENSION
5-2. PICTURE TUBE
z x a f 7-685-881-09 7-685-647-79 7-685-663-71 7-685-872-09 +BVTT 4X8 +BVTP 3X10 +BVTP 4X16 +BVTT 3X8
REF.NO. PART NO. 56
DESCRIPTION BEZEL ASSY SPRING COMPRESSION BUTTON, INPUT H4 BOARD, COMPLETE ITC ASSY (21TKD-R2)
REMARK 52
X-4038-991-1 4-036-405-01 4-083-208-01 * 8-933-506-00 8-734-046-06 3-704-372-01 2-162-100-8-451-519-1-452-923-51 * 4-047-316-1-419-130-1-419-129-21 4-365-808-01 4-041-021-02 4-071-175-01 4-062-670-1-419-838-11 X-4038-990-1 * 4-061-996-8-610-158-8-738-848-05 4-308-870-00 1-452-032-00 1-452-094-00 4-051-736-21
59, 60, 73
HOLDER, HV CABLE SPACER, DY DEFLECTION YOKE Y21TKN NECK ASSEMBLY SPRING, EXTENSION COIL, LANDING CORRECTION COIL, LANDING CORRECTION SCREW (5), TAPPING HOLDER, DEGAUSE COIL HOLDER, DGC SPACER, PICTURE TUBE COIL, DEGAUSSING BASE ASSY, STAND CUSHION SENSOR, MAGNETIC MIU-221D
PICTURE TUBE 21TKD (B COAT) CLIP, LEAD WIRE MAGNET, DISK; 10mm MAGNET, ROTATABLE DISK; 15mm PIECE A (90), CORRECT
5-3. PACKING MATERIALS
104 109
REF.NO. PART NO. 107
0 1-790-568-11 CORD SET, POWER 0 1-757-496-31 CABLE ASSY (15P SUB X2 CONNECTOR) * 4-082-704-01 CUSHION (UPPER) * 4-059-174-11 BAG, PROTECTION * 4-082-705-01 CUSHION (LOWER) * 4-082-703-01 INDIVIDUAL CARTON 1-796-185-11 MANUAL, INSTRUCTION (CD-ROM)
108 109
SECTION 6 ELECTRICAL PARTS LIST
The components identified ! marked are critical for safety. Replace only with the part number specified.
Les composants identifis par la marque ! sont critiques pour la scurit. Ne les remplacer que par une pice portant le numro spcifi.
Items marked " * " are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. RESISTORS All resistors are in ohms F : nonflammable CAPACITOR MF : F COIL UH : H
When indicating parts by reference number, please include the board name. All variable and adjustable resistors have characteristic curve B, unless otherwise noted.
No. 33 34
Board A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1
Type CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR CAPACITOR
Description
No. 169 170
Type FERRITE BEAD FERRITE BEAD IC IC IC IC IC IC IC IC IC IC IC JACK CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR
! / * Ref. No. FB303 FB310 IC001 IC002 IC002 IC003 IC004 IC005 IC006 IC007 IC008 IC009 IC011 J001 JR001 JR002 JR005 JR007 JR008 JR009 JR010 JR011 JR012 JR013 JR014 JR015 JR016 JR017 JR019 JR020 JR021 JR022 JR023 JR024
Part No. 1-469-965-21 1-412-911-11 6-700-496-01 8-759-824-97 4-382-854-11 8-759-681-38 8-749-018-09 8-759-058-60 8-759-584-98 8-759-697-54 8-759-680-71 8-759-697-54 8-759-592-79 1-451-524-11 1-216-296-11 1-216-296-11 1-216-296-11 1-216-295-91 1-216-296-11 1-216-296-11 1-216-296-11 1-216-296-11 1-216-296-11 1-216-296-11 1-216-296-11 1-216-295-91 1-216-296-11 1-216-296-11 1-216-296-11 1-216-296-11 1-216-296-11 1-216-295-91 1-216-295-91 1-216-296-11
Description INDUCTOR FERRITE 1.1UH IC M61314SP IC LM2412AT SCREW (3X10), P, SW (+) IC CXD9548M IC H8D3060 IC TC7SU04FU(TE85R) IC SN74AHCT04NSR IC BR24C21F-E2 IC MM1470AD IC BR24C21F-E2 IC BA00AST-V5 SOCKET, PICTURE TUBE SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0
No. 203 204
Type CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR COIL COIL COIL COIL COIL COIL COIL TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR RESISTOR
! / * Ref. No. JR025 JR026 JR027 JR028 JR029 JR030 L001 L002 L003 L004 L005 L006 L007 Q001 Q002 Q004 Q005 Q101 Q201 Q301 R001 R002 R003 R006 R007 R008 R010 R011 R012 R013 R014 R015 R016 R017
Part No. 1-216-296-11 1-216-295-91 1-216-296-11 1-216-296-11 1-216-295-91 1-216-296-11 1-412-537-31 1-412-549-11 1-412-537-31 1-412-529-11 1-412-537-31 1-412-537-31 1-412-537-31 8-729-025-28 8-729-025-28 8-729-025-28 8-729-025-28 8-729-120-28 8-729-120-28 8-729-120-28 1-216-077-91 1-216-077-91 1-216-025-11 1-260-316-51 1-216-025-11 1-216-025-11 1-216-025-11 1-216-057-00 1-216-057-00 1-216-025-11 1-260-316-51 1-216-057-00 1-216-057-00 1-216-025-11
Description SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 INDUCTOR 100UH INDUCTOR 1mH INDUCTOR 100UH INDUCTOR 22UH INDUCTOR 100UH INDUCTOR 100UH INDUCTOR 100UH TRANSISTOR 2SK1828 TRANSISTOR 2SK1828 TRANSISTOR 2SK1828 TRANSISTOR 2SK1828 TRANSISTOR 2SC1623-L5L6 TRANSISTOR 2SC1623-L5L6 TRANSISTOR 2SC1623-L5L6 RES-CHIP 15K 5% 1/10W RES-CHIP 15K 5% 1/10W RES-CHIP 100 5% 1/10W CARBON 100 5% 1/2W RES-CHIP 100 5% 1/10W RES-CHIP 100 5% 1/10W RES-CHIP 100 5% 1/10W RES-CHIP 2.2K 5% 1/10W RES-CHIP 2.2K 5% 1/10W RES-CHIP 100 5% 1/10W CARBON 100 5% 1/2W RES-CHIP 2.2K 5% 1/10W RES-CHIP 2.2K 5% 1/10W RES-CHIP 100 5% 1/10W
No. 577 578
Type DIODE DIODE DIODE DIODE DIODE DIODE FUSE FERRITE BEAD FERRITE BEAD FERRITE BEAD FERRITE BEAD FERRITE BEAD FERRITE BEAD FERRITE BEAD FERRITE BEAD FUSE HOLDER FUSE HOLDER IC IC IC IC IC IC IC IC IC IC IC IC IC IC IC IC IC
! / * Ref. No. D918 D919 D920 D921 D922 D923 F601 FB501 FB555 FB901 FB902 FB1000 FB1002 FB1005 FB1007 FH601 FH602 IC401 IC401 IC501 IC610 IC610 IC620 IC630 IC640 IC652 IC654 IC654 IC680 IC701 IC702 IC703 IC703 IC901
Part No. 8-719-404-50 8-719-069-54 8-719-977-28 8-719-911-19 8-719-404-50 8-719-404-50 1-576-233-11 1-410-397-21 1-216-295-91 1-412-911-11 1-414-231-22 1-414-231-22 1-216-295-91 1-216-295-91 1-216-295-91 1-533-223-11 1-533-223-11 8-759-192-71 4-382-854-11 8-759-585-82 8-749-018-08 7-682-950-01 8-759-670-30 8-759-535-32 8-749-018-07 8-759-669-10 8-759-701-79 4-382-854-01 8-759-682-42 8-759-822-38 8-749-017-48 8-759-803-42 4-382-854-11 8-759-585-81
Description DIODE MA111-(K8).S0 ZENER DIODE UDZS-TE17-5.1B ZENER DIODE DTZ10B DIODE 1SS119-25 DIODE MA111-(K8).S0 DIODE MA111-(K8).S0 FUSE (H.B.C) (6.3A/250V) FERRITE 1.1UH SHORT 0 FERRITE 1.1UH SHORT 0 FERRITE 1.1UH SHORT 0 SHORT 0 SHORT 0 HOLDER, FUSE HOLDER, FUSE IC STV9379 SCREW (3X10), P, SW (+) IC BA9759F-E2 IC MZ1532 +PSW 3X12 IC MCZ3001D IC FA13842P IC SEB3-LF4 IC BA3953T-V5 IC NJM7812FA SCREW (3X8), P, SW (+) IC MM1431ATT IC LA6510 IC STK391-220 IC LA6500-FA SCREW (3X10), P, SW (+) IC BA9758FS-E2
No. 611 612
Type IC CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR CHIP CONDUCTOR COIL COIL COIL COIL COIL COIL COIL COIL COIL COIL COIL COIL COIL COIL COIL COIL
! / * Ref. No. IC902 JR001 JR002 JR003 JR004 JR006 JR007 JR008 JR009 JR012 JR013 JR014 JR015 JR016 JR017 JR018 JR019 JR022 L501 L502 L504 L505 L506 L508 L509 L510 L610 L611 L612 L652 L653 L680 L902 L1001
Part No. 8-759-701-01 1-216-295-91 1-216-296-11 1-216-296-11 1-216-296-11 1-216-296-11 1-216-295-91 1-216-296-11 1-216-295-91 1-216-296-11 1-216-295-91 1-216-296-11 1-216-295-91 1-216-296-11 1-216-295-91 1-216-295-91 1-216-296-11 1-216-296-11 1-412-537-31 1-419-871-11 1-406-673-11 1-406-675-11 1-406-673-11 1-412-525-31 1-419-869-11 1-411-594-41 1-419-837-11 1-419-397-11 1-412-521-31 1-406-665-11 1-406-665-11 1-408-615-31 1-406-661-21 1-412-911-11
Description IC NJM2904M SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 SHORT 0 INDUCTOR 100UH COIL, HORIZONTAL LINEARITY INDUCTOR 2.2mH INDUCTOR 4.7mH INDUCTOR 2.2mH INDUCTOR 10UH COIL, HORIZONTAL CENTER INDUCTOR 5mH INDUCTOR 340UH INDUCTOR 68UH INDUCTOR 4.7UH INDUCTOR 100UH INDUCTOR 100UH INDUCTOR 100UH INDUCTOR 22UH FERRITE 1.1UH
No. 645 646

United States General Accounting Office Washington, DC 20548
Comptroller General of the United States DOCUMENT FOR PUBLIC RELEASE
The decision issued on the date below was subject to a GAO Protective Order. This redacted version has been approved for public release.
Decision
Matter of: File: Date: GTSI Corp. B-292298; B-292298.2; B-292298.3 August 14, 2003
John J. Fausti, Esq., Monica C. Parchment, Esq., and Jennifer M. Morrison, Esq., John J. Fausti & Associates, for the protester. Kelley P. Doran, Esq., William A. Shook, Esq., and Michael D. Garson, Esq., Preston Gates Ellis & Rouvelas Meeds, for Dell Marketing, L.P., an intervenor. James H. Haag, Esq., Space & Naval Warfare Systems Command, for the agency. David A. Ashen, Esq., and Jerold D. Cohen, Esq., Office of the General Counsel, GAO, participated in the preparation of the decision. DIGEST Protest that agency improperly accepted quotation that did not unambiguously indicate compliance with mandatory computer monitor viewing area requirement, but instead could reasonably be interpreted as indicating noncompliance, and then improperly modified the blanket purchasing agreement shortly after award to correct ambiguity, is denied where there is no basis for concluding that the agencys actions prejudiced protester; protester has not alleged, nor is there any basis for concluding, that it would have lowered its price sufficiently to displace awardee as the low-priced vendor. DECISION GTSI Corp. protests the Department of the Navy, Space & Naval Warfare Systems Commands (SPAWAR), award of a blanket purchasing agreement (BPA) to Dell Marketing, L.P., under request for quotations (RFQ) No. N00039-02-Q-0016, for computers, laptops and peripherals. GTSI asserts that Dells quotation failed to comply with the specifications in the RFQ. We deny the protest. The RFQ contemplated award of a BPA for the procurement of commercial off-the-shelf computers, laptops and peripherals in support of shipboard command, control, communications, computers and intelligence networks. All items offered by a vendor were required to be on that vendors General Services Administrations (GSA) Federal Supply Schedule (FSS) contract. The required equipment
characteristics, configurations and options were set forth in the RFQs Section B Schedule (including attachment No. 1) and Statement of Objectives (SOO). The RFQ provided that award would be made to the responsible contractor whose proposal represented the best value to the government. Best value was to be determined based on price and four non-price evaluation factors, including (in descending order of importance): (1) satisfaction of technical requirements; (2) past performance; (3) logistics and support plan; and (4) small and disadvantaged business (SDB) participation. While the SOO provided that [t]he identified specifications are to be met at a minimum, but may be exceeded, SOO 2.1, the statement of evaluation factors in Section M provided, with respect to the factor for satisfaction of technical requirements, that [t]he government will evaluate the extent to which the equipment proposed by the contractor meets or exceeds the requirements of Section B of the RFQ and in the SOO. RFQ M.3. The non-price evaluation factors when combined were approximately equal in importance to price. Four vendors submitted six quotations. Dells and GTSIs quotations were included in the competitive range. SPAWAR conducted discussions with Dell and GTSI in which the agency advised the vendors of a number of weaknesses, including instances in which their proposed equipment did not appear to meet the requirements set forth in the Section B Schedule and the SOO. SPAWAR then requested revised quotations. Based on its evaluation of final quotation revisions, SPAWAR determined that Dells basic quotation offered the best value. (Dell submitted basic and alternate quotations.) Specifically, while Dells and GTSIs revised quotations both received very good ratings under the evaluation factors for satisfaction of technical requirements and logistics and support plan, and both received acceptable ratings for SDB participation, Dells past performance was rated excellent while GTSIs was only rated very good. SPAWAR concluded that Dell had a slight edge under the non-price technical factors. Source Selection Advisory Council Report at 11. In addition, Dells evaluated price ($60,733,475) was significantly ($[DELETED]) lower than GTSIs ($[DELETED]). Upon learning of the resulting award of the BPA to Dell, GTSI filed this protest with our Office. MONITORS In its comments on the agency reports responding to its protest, GTSI primarily argues that it was improper for SPAWAR to make award on the basis of Dells quotation because Dell offered computer monitors that did not comply with the specifications. In this regard, the RFQs Section B Schedule required vendors to offer a quantity of 17 [inch] Viewable Monitor[s] and a smaller quantity of 21 [inch] Viewable Monitor[s]. RFQ B, High End PC & Associated Items, and Standard PC & Associated Items. When asked prior to receipt of initial quotations to confirm that the monitor descriptions required monitors with actual viewable areas (measured
Page 2
B-292298 et al.
diagonally per industry standards) of 17. and 21 inches as opposed to CRT tube sizes, the agency responded in writing that its requirement was based on viewable areas as opposed to CRT tube size. Industry Questions/Comments and Government Response, Nov. 7, 2002. In its initial quotation, however, Dell nevertheless offered the Dell M782, 17 in[ch] (16.00 inch VIS) monitor to satisfy the RFQ requirement for 17-inch viewable monitors and the Dell P1130, Trinitron, 21 in[ch] (19.8 VIS) monitor to satisfy the RFQ requirement for 21-inch viewable monitors. Since these monitors offered viewable areas of only 16 and 19.8 inches respectively, neither of these monitors met the applicable viewable area requirement. When SPAWAR challenged Dell during discussions to explain how its monitors would meet the viewable area requirements, SPAWAR Discussion Letter, Feb. 10, 2003 (dated 2002), at 2, Dell responded, in a submission dated February 17, 2003 (as well as February 18, 2003), that Dell misinterpreted the RFQ specification. We would like to propose the following items as replacements which meet the RFQ specification. Dell Response, Feb. 17, 2003, at 5. Dells submission then listed and included a price for the Dell 19-inch M992 monitor, with an 18-inch viewable area, to meet the 17-inch viewable area requirement, and the Sony GDM-FW900 24-inch monitor, with an 22.5-inch viewable area, to meet the 21-inch viewable area requirement. Dells final revised quotation dated March 20, included an Updated CLIN Structure (Section B), as well several other documents, and described these documents in addition to the Dell response to SPAWAR Questions submitted on 18 February 2003 [--apparently referring the above response dated February 17--] and e-mail submittals of 24 February, 3 March and 6 March as our Final Proposal Revision. Dell Final 1 Revised Quotation, March 20, 2003, at 1. However, while Dells February 17 response had substituted the Dell M992 19-inch monitor and the Sony GDM-FW900 24-inch monitor for its initially offered Dell M782 17-inch and Dell P1130 21-inch monitors, the Section B Schedule included in the March 20 final revised quotation again indicated that the Dell M782 17-inch and Dell P1130 21-inch monitors were being offered to satisfy the requirements for 17-inch and 21-inch monitors. Likewise, in new and corrected Section B Schedules submitted on March 27 and March 28, Dell continued to list the non-compliant Dell M782 17-inch and Dell P1130 21-inch monitors as being offered to satisfy the requirements for 17-inch and 21-inch monitors. Dell March 27, 2003 Submission at 2; Dell March 28, 2003 Submission at 2.
Dells March 6 clarification included Dells GSA schedule price list, which included not only the compliant Dell 19-inch M992 and Sony GDM-FW900 24-inch monitors, but also the non-compliant Dell M782 17-inch and Dell P1130 21-inch monitors. (The prices offered by Dell for this procurement were less than those listed on its GSA schedule.)
Page 3
The record indicates that since Dells final revised quotation had incorporated by reference its February 17 response, which substituted the compliant Dell M992 19-inch and the Sony GDM-FW900 24-inch monitors for the previously offered monitors, SPAWAR, in its final evaluation, determined that Dells quotation satisfied the viewable area requirement for monitors. Addendum to the Report of the Technical Evaluation Board (TEB) at 8-9; Agency Memorandum to File, May 6, 2003, at 2; Agency Report, June 9, 2003, at 31. However, Dells final evaluated price was based on the lower price for the noncompliant Dell M782 17-inch and Dell P1130 21-inch monitors as listed in Dells Section B Schedule. Only after the April 28 award to Dell (and as a result of concerns raised by GTSI) did the agency become aware of the discrepancy between Dells February 17 response offering the Dell M992 19-inch and Sony GDM-FW900 24-inch monitors and Dells Section B Schedule listing the Dell M782 17-inch and Dell P1130 21-inch monitors. Agency Memorandum to File, May 6, 2003, at 2; Agency Report, June 9, 2003, at 31. Upon learning of the discrepancy, SPAWAR determined that a mistake had been made in Dells proposal which was correctable under the Federal Acquisition Regulation. Noting (among other considerations) that Dell has confirmed that the discrepancy was a mistake on its part, and that Dell had agreed to furnish the upgraded monitors at no additional cost to the government, SPAWAR concluded that it was appropriate to modify the BPA on a bilateral basis to resolve the discrepancy by replacing the noncompliant monitors on Dells Section B Schedule with the compliant Dell M992 19-inch and Sony GDM-FW900 24-inch monitors. Agency Memorandum to File, May 6, 2003, at 4. GTSI asserts that Dells final revised quotation was based on the offer of the monitors that were noncompliant with the viewable area requirement and that the agencys correction of this deficiency after award was improper. SPAWAR, on the other hand, maintains that Dells final revised quotation in fact offered the compliant Dell M992 19-inch and Sony GDM-FW900 24-inch monitors. In reviewing an agencys technical evaluation of vendor submissions under an RFQ, we will not reevaluate the quotations; we will only consider whether the agencys evaluation was reasonable and in accord with the evaluation criteria listed in the solicitation and all applicable procurement statutes and regulations. Datastream Sys., Inc., B-291653, Jan. 24, 2003, 2003 CPD 30 at 4-5; Applied Mgmt. Solutions, Inc., B-291191, Nov. 15, 2002, 2002 CPD 202 at 2. Our review of the record here shows that SPAWAR did relax the solicitations viewable area requirement for monitors when making award to Dell but that GTSI was not prejudiced by the agencys actions. Again, in determining that Dells monitors satisfied the viewable area requirement, the record indicates that SPAWAR relied upon the fact that Dells March 20 final revised quotation generally incorporated by reference Dells 127-page February 17 response, which substituted the compliant Dell M992 19-inch and the Sony GDM-FW900 24-inch monitors for the non-compliant Dell M782 17-inch and Dell
Page 4
P1130 21-inch monitors. Dells March 20 final revised quotation, however, also included and specifically made part of its final proposal revision an Updated CLIN Structure (Section B) which expressly provided that the (noncompliant) Dell M782 17-inch and Dell P1130 21-inch monitors were being offered to satisfy the requirements for 17-inch and 21-inch monitors. Likewise, Dells subsequently submitted new and corrected March 27 and March 28 Section B Schedules also listed the Dell M782 17-inch and Dell P1130 21-inch monitors as being offered to satisfy the requirements for 17-inch and 21-inch monitors. It is a vendors burden to submit an adequately written quotation in response to an RFQ. Godwin Corp., B-290291, June 17, 2002, 2002 CPD 103 at 4. Here, given Dells repeated express statements in the updated, new and corrected Section B Schedules in its final submissions that it was offering the noncompliant Dell M782 17-inch and Dell P1130 21-inch monitors to satisfy the requirements for 17-inch and 21-inch monitors, the mere fact that Dells March 20 final revised quotation also generally incorporated the earlier 127-page February 17 response did not furnish a reasonable basis for concluding that Dell was instead proposing the compliant Dell M992 19-inch and the Sony GDM-FW900 24-inch monitors. At best, Dells commitment to furnish monitors that complied with the viewable area requirement was ambiguous, with the ambiguity not resolvable from the face of Dells final, revised quotation. Nevertheless, even if SPAWAR should not have accepted Dells quotation as submitted and later permitted the firm to correct it via modification of the BPA, there is no basis for concluding that the agencys actions prejudiced GTSI. In this regard, our Office will not sustain a protest unless the protester demonstrates a reasonable possibility of prejudice, that is, unless the protester demonstrates that, but for the agencys actions, it would have had a substantial chance of receiving the award. Parmatic Filter Corp., B-285288.3, B-285288.4, Mar. 30, 2001, 2001 CPD 71 at 11; see Statistica, Inc. v. Christopher, 102 F.3d 1577, 1581 (Fed. Cir. 1996). GTSI has not shown, nor does the record otherwise indicate, that it was prejudiced with respect to the monitor issue. The evaluated price of GTSIs quotation ($[DELETED]) already included the price for the compliant monitors. Adjusting Dells price upward (to $[DELETED]) to reflect the higher price (an additional $[DELETED]) for the compliant Dell M992 19-inch and the Sony GDM-FW900 24-inch monitors as indicated in Dells February 17 response, still leaves the award price lowest by a substantial margin ($[DELETED]). Agency Memorandum to File, May 6, 2003, at 3. Further, even if SPAWAR had noted the ambiguity in Dells quotation before award and had reopened discussions to resolve it--which necessarily would have given GTSI the opportunity to revise its price--there is no basis for concluding that it
Page 5
would have lowered its price sufficiently to displace Dell as the low-priced vendor.2 Given Dells advantage under the non-price factors, we are unable to find that GTSI was prejudiced. SPARE PARTS KIT GTSI also challenges the evaluation of Dells quotation with regard to spare parts kits. The RFQs SOO required that vendors provide as an optional item a spare parts kit. According to the RFQ: The contents of the Kits will be based on the Contractors analysis of past failures of the equipment provided and a desired 97 % availability level of the equipment supported. The contents of the kits shall be based on supporting a quantity of 50 fielded end items. RFQ, SOO 2.10.3. Further, vendors were required to provide a list of the contents of the proposed Spare Parts Kits, with the contents based on an analysis of past failures of the proposed equipment. RFQ L-2.1(c)(2). Although Dell did not provide details in its initial quotation as to what was in its spare parts kit, it subsequently furnished a detailed listing of which spare parts were in each kit, tailored to the computer the kit was supporting. Dell, however, did not specify the number of each spare part that was included in the kits. GTSI notes that its prices for the spare parts kits were higher than Dells prices. For example, with respect to the first year prices for the desktop computer spare parts kit, the kit which the agency indicated would account for 170 of the 231 first year spare parts kits, Dells price was $[DELETED] while GTSIs price was $[DELETED]. For the remaining kits, GTSIs price also was higher than Dells. For example, GTSIs price was more than [DELETED] times higher for a kit with an expected first year demand of two units. GTSI asserts that SPAWAR lacked a reasonable basis for finding Dells spare parts kits to be acceptable. Again, the statement of evaluation factors in Section M provided, with respect to the factor for satisfaction of technical requirements, that [t]he government will evaluate the extent to which the equipment proposed by the contractor meets or exceeds the requirements of Section B of the RFQ and in the SOO. RFQ M.3. Likewise, the statement of evaluation factors in Section M provided, with respect to the factor for logistics support plan, that [t]he Government will evaluate the extent to which the contractor demonstrates their ability to provide Logistics Support. RFQ M.5. We find that SPAWAR could reasonably determine that Dell had substantially complied GTSI now generally alleges that if it had been afforded the opportunity to revise its price it would have certainly taken the opportunity. to make its proposal more competitive from a price standpoint. GTSI Comments, June 27, 2003, at 5.
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with the spare parts kit requirement. In addition to listing in its revised quotation each spare part (but not the number thereof) that was included in its kits, Dell also explained the basis for determining the contents of its spare parts kits. Specifically, Dell stated that its recommended spare parts kits took into account such factors as the quantity of units and failure rate; lead times; and that the kits were designed to support 100 percent availability for parts deemed critical. Dell Response, Feb. 17, 2003, at 8-12; Agency Supplemental Report, June 20, 2003, at 53. Further, although Dells price for the kits was significantly lower than GTSIs, the record indicates that the difference may reflect the fact that GTSIs approach to stocking the kits was different than Dells. When advised during discussions that its kits appeared to include sufficient spare parts to build three computers from scratch, Agency Discussions Letter to GTSI, Feb. 10, 2003, at 2, GTSI responded that its intent was to provide the agency with the option of replacing an entire computer while repairs were being made to the failed computer by the original equipment manufacturer. GTSI Response, Feb. 19, 2003, at 37. GTSI, however, has pointed to nothing in the RFQ that required furnishing replacement computers rather than simply replacement spare parts. Further, to the extent that Dells quotation lacked detail as to the number of each spare part, there is no basis in the record for concluding that any weakness in this respect was so significant that it was unreasonable for the agency to find that Dells quotation represented the best value. In this regard, we note that even if the vendors prices for the spare parts kits were excluded from the evaluation, the evaluated price of Dells quotation would remain nearly approximately $[DELETED] lower than GTSIs. See Price Evaluation Board Summary Report, Apr. 14, 2003, at 5; Agency Memorandum to File, May 6, 2003, at 3.3 The protest is denied. Anthony H. Gamboa General Counsel
GTSI also challenged several other aspects of the evaluation in its several protests. SPAWAR addressed these allegations in its reports, and the protester failed to respond in its comments; thus, we consider GTSI to have abandoned its other arguments and will not consider them further. MFVega & Assocs., LLC, B-291605.3, Mar. 25, 2003, 2003 CPD 65 at 4.
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