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Texas Instruments E-2006

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Comments to date: 6. Page 1 of 1. Average Rating:
shabri 12:24pm on Sunday, October 24th, 2010 
BUYER BEWARE - This phone is not compatible with North American 3G bands. All in all I love this phone, only one I can think that is better is the Samsung I9000 Galaxy S.
XRumer112 5:28pm on Friday, September 24th, 2010 
Great cover,durable,bright color,fast shipment,very pleased with purchase. love the pink sparkle cover. Thanks! Fits the phone perfectly really like it, have had it for over a month and it holds up well and is very pretty. great buy!
tawtao 1:50am on Tuesday, July 20th, 2010 
i got this flew in from the US and i must say it looked good as i brought it out, i was even impressed by the apps it had on the phone.
sakulagi 6:46am on Thursday, June 10th, 2010 
I would like to see more service in my town, granted I bought them for use while I was at work.
ronan 3:11am on Sunday, May 9th, 2010 
First to all the people who say that this is different than the verizon model; do some reasearch before you post. Second.
johnj46 10:15pm on Friday, March 19th, 2010 
Overall, I would take this phone over the Droid. I think that the form factor, and Sense UI really help for the consumer. I think that the Droid.

Comments posted on www.ps2netdrivers.net are solely the views and opinions of the people posting them and do not necessarily reflect the views or opinions of us.

 

Documents

doc0

ULN2803A DARLINGTON TRANSISTOR ARRAY
SLRS049E FEBRUARY1997 REVISED JULY 2006
D 500-mA Rated Collector Current (Single D D D D D
Output) High-Voltage Outputs. 50 V Output Clamp Diodes Inputs Compatible With Various Types of Logic Relay Driver Applications Compatible with ULN2800A Series
DW OR N PACKAGE (TOP VIEW)
description/ordering information
The ULN2803A is a high-voltage, high-current Darlington transistor array. The device consists of eight npn Darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads. The collector-current rating of each Darlington pair is 500 mA. The Darlington pairs may be connected in parallel for higher current capability.
1B 2B 3B 4B 5B 6B 7B 8B GND
1C 2C 3C 4C 5C 6C 7C 8C COM
Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers. The ULN2803A has a 2.7-k series base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. ORDERING INFORMATION
TA PDIP (N) 40 C 85C 40C to 85 C SOIC (DW) PACKAGE Tube of 20 Tube of 40 Reel of 2000 ORDERABLE PART NUMBER ULN2803AN ULN2803ADW ULN2803ADWR TOP-SIDE MARKING ULN2803AN ULN2803A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 2006, Texas Instruments Incorporated

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

logic diagram

8C COM
schematic (each Darlington pair)
COM 2.7 k Input B Output C
absolute maximum ratings at 25C free-air temperature (unless otherwise noted)
Collector-emitter voltage. 50 V Input voltage (see Note 1). 30 V Continuous collector current. 500 mA Output clamp diode current. 500 mA Total substrate-terminal current. 2.5 A Package thermal impedance, JA (see Notes 2 and 3): DW package. 73.14C/W N package. 62.66C/W Operating virtual junction temperature, TJ. 150C Storage temperature range, Tstg. 65C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, unless otherwise noted, are with respect to the emitter/substrate terminal GND. 2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7.
electrical characteristics at 25C free-air temperature (unless otherwise noted)

PARAMETER ICEX II(off) II(on) VI(on) Collector cutoff current Off-state input current Input current TEST CONDITIONS VCE = 50 V, See Figure 1 VCE = 50 V, TA = 70C, VI = 3.85 V, VCE = 2 V, See Figure 4 II = 250 A, See Figure 5 VCE(sat) Collector-emitter saturation voltage II = 350 A, See Figure 5 II = 500 A, See Figure 5 IR VF Ci Clamp diode reverse current Clamp diode forward voltage Input capacitance VR = 50 V, IF = 350 mA, VI = 0 V, II = 0, IC = 500 A, See Figure 2 See Figure 3 IC = 200 mA IC = 250 mA IC = 300 mA IC = 100 mA, IC = 200 mA, IC = 350 mA, See Figure 6 See Figure 7 f = 1 MHz 1.0.93 1.35 2.4 2.0.1.3 1.1 1.3 1.A V pF V V MIN TYP MAX 50 UNIT A A mA

On-state input voltage

switching characteristics at 25C free-air temperature
PARAMETER tPLH tPHL VOH Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output High-level output voltage after switching TEST CONDITIONS VS = 50 V, CL = 15 pF, VS = 50 V, See Figure 9 RL = 163 , See Figure 8 IO 300 mA, VS 20 MIN TYP ns mV MAX UNIT
PARAMETER MEASUREMENT INFORMATION
Open VCE II(off) Open VCE IC ICEX Open
Figure 1. ICEX Test Circuit
Figure 2. II(off) Test Circuit

II VI Open VI VCE

Figure 3. II(on) Test Circuit

Open IC hFE = II IC

Figure 4. VI(on) Test Circuit

Open VCE

Figure 5. hFE, VCE(sat) Test Circuit
Figure 6. IR Test Circuit

IF VF Open

Figure 7. VF Test Circuit
Input Open VS = 50 V RL = 163 Pulse Generator (see Note A) Output CL = 15 pF (see Note B)

Test Circuit

<5 ns Input 10% 90% 50% 0.5 s tPHL 50% 90% 50%
<10 ns VIH (see Note C) 10% tPLH VOH 50% 0

Output

Voltage Waveforms NOTES: A. The pulse generator has the following characteristics: PRR = 1 MHz, ZO = 50. B. CL includes probe and jig capacitance. C. VIH = 3 V
Figure 8. Propagation Delay Times

VS Input

2 mH 163
Pulse Generator (see Note A)
Output CL = 15 pF (see Note B)
<5 ns Input 10% 90% 1.5 V 40 s 90% 1.5 V
<10 ns VIH (see Note C) 10% 0

VOH Output

Voltage Waveforms NOTES: A. The pulse generator has the following characteristics: PRR = 12.5 KHz, ZO = 50. B. CL includes probe and jig capacitance. C. VIH = 3 V

Figure 9. Latch-Up Test

PACKAGE OPTION ADDENDUM

www.ti.com

21-May-2007

PACKAGING INFORMATION

Orderable Device ULN2803ADW ULN2803ADWG4 ULN2803ADWR ULN2803ADWRG4 ULN2803AN ULN2803ANE4

Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOIC SOIC SOIC SOIC PDIP PDIP
Package Drawing DW DW DW DW N N
Pins Package Eco Plan (2) Qty Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR N / A for Pkg Type N / A for Pkg Type
2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 26-Mar-2009

TAPE AND REEL INFORMATION
*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC DW 18
Reel Reel Diameter Width (mm) W1 (mm) 330.0 24.4

A0 (mm)

B0 (mm)

K0 (mm)

P1 (mm) 12.0
W Pin1 (mm) Quadrant 24.0 Q1

ULN2803ADWR

Pack Materials-Page 1

Device ULN2803ADWR

Package Type SOIC

Package Drawing DW

Pins 18

SPQ 2000

Length (mm) 370.0

Width (mm) 355.0

Height (mm) 55.0

Pack Materials-Page 2

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee Solutions www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Applications Communications and Telecom www.ti.com/communications Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Transportation and Automotive Video and Imaging Wireless www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/automotive www.ti.com/video www.ti.com/wireless-apps

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2011, Texas Instruments Incorporated

doc1

TI-Navigator Software Tour
Contributing Lists in Activity Center
Overview This tour details the use of Lists in Activity Center, including: 1. Selecting Contributing Lists for Student Input 2. Configuration Options for Contributing Lists 3. Starting List Activity 4. Viewing List data 5. Saving List data
1. Launch the TI-Navigator Software
Click Start > Programs > TI Tools > TI-Navigator > TI-Navigator. The TI-Navigator computer home screen opens.

2. Start a Class

Assure that your TI-Navigator network hardware is connected and powered and calculators containing the necessary apps are connected. Choose a Class to begin in the Current Class selector and click Begin Class.
2006 Texas Instruments Incorporated
3. Open the Tools Tab and launch the Activity Center
A. Click the Tools tab near the upper middle of the home screen.
B. Click the Activity Center icon.
The Activity Center opens.
C. Click the List Tab. The List view will open.
4. Configure and start the Contribute Lists Activity.
A. Click Lists from the Contribute selector and click the Configure button.
The Configure Calculators for Activity and Create New Lists dialog boxes will open.
C. Enter arml and hght (for arm length and height) as the list names for this activity. Click OK. The Create New Lists dialog box will close.
D. Click the Configure Plots button. The Plot Options dialog box will open.
E. Select ARML for the X-List of Plot 1 and HGHT for the Y-List. This will plot the students entered values for Arm Length against their values for Height. Click Enable Plot on device to allow students to view their entered data in a plotted form on their calculators. Click OK. The List view will be updated with the new blank lists, ARML and HGHT.
F. Click Start Activity to allow students to enter the Activity Center and begin contributing their data.
5. Have students login, enter the Activity Center and contribute data.
A. Students login and chose ACTIVITY CENTER from the TI-NAVIGATOR HOME screen.
Note: If you have not started the Activity, students will see the following screen.
The Activity Center will open. B. Students enter their arm length and height.
C. Because Plot on device was enabled, students may choose to view their data in plotted form (however, it has little value in this example).
D. Students chose Send to send their data to the Activity Center on the teacher computer. The data appear in the List view.
Click the Show Student Names option to display student names beside the data they have contributed.
E. Click the List-Graph tab to view the list data on a graph. The List-Graph view opens.
Click the ZoomStat option to zoom the graph to fit all the data. Click the Grid option to display gridlines on the graph.

6. Save List data.

A. Place the cursor over the ARML list heading, positioning it in the middle of the cell (so that the cursor changes to a hand).
Click the ARML list heading to select the entire column of data.
Hold the Shift key while placing the cursor over the HGHT list heading, positioning it in the middle of the cell (so that the cursor changes to a hand) and click to select the entire column of data.
B. Click File > Save > Save Selected Lists.
The Select Save Data (step 1) dialog box will open.
Click Next. The Select Save Folder (step 2) dialog box will open.
Browse to the location where you want to save the lists and click Save.

 

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