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Toshiba D-KR4, size: 3.3 MB
Toshiba D-KR4 Installation Guide
User reviews and opinions
|hopshead||5:30am on Wednesday, May 5th, 2010|
|I got this drive to replace a slow 5400 rpm Seagate drive and is amazed at the screaming performance and its quietness.|
|msavigear||2:55am on Friday, April 16th, 2010|
|I cloned a 250 GB drive to this one using Seagate Discwizard. Worked perfectly. No problems Quiet, fast, reasonably priced. Incredible difficult to configure. The MioNet web interface is terrible.|
|newtonventures||12:49pm on Friday, April 9th, 2010|
|Bought this drive to replace smaller drive in new Toshiba laptop. It is quick, quiet and no problems. I was so impressed. It seems to work pretty well. When I test it under Linux using the smartctl program.|
|Danesh_D||9:08am on Monday, April 5th, 2010|
|Not as fast as other units that I have built but perfectly usable. Nice smaller size (compared to previous MyBooks). Attractive Design".|
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Highlights Proven high-yield, highvolume manufacturing Flexible hand-off model starting from system block diagram to a traditional ASIC netlist Broad support for the ARM series of microprocessor cores and peripherals including ARM7TDMI, ARM926EJ, ARM946ES, ARM1026EJ, ARM1176EJ, Cortex R4, R4F, A9, MP, UPCORE and CoreSight support included DK11, DKA9, DKR4 and primecells
Complete Custom System-on-Chip (SoC) Business Solution
Description Toshiba, a world leader in semiconductors, works closely with top companies to deliver a complete business solution that mitigates design risk and ensures highyield manufacturing of Custom SoCs. Featured Custom SoC Capabilities 130, 90, 65 and 40 nanometer (nm) process, up to 11-layer copper CMOS technology Low-k dielectric and logic densities up to 1,500,000 gates/mm2 Cost-effective, 4 Mb to 182 Mb embedded DRAM cores in 90/65 nm Input/output cells support highperformance SerDes chip-to-chip interfaces for 622 Mbps to 10-Gbit/s Ethernet and FCoE applications; also included are support for 1/2/4/8.5-Gbit/s Fibre Channel, 6.5Gbps Backplane, 1.5/3.0 Gbps SATA PCI Express Gen-1 and Gen-2 and 3/6 G SAS High-performance and low leakage ASIC libraries with multi-VDD, multithreshold and special multi-threshold CMOS low-leakage library elements High-performance and high pin-count packages include thermally-enhanced PBGA, FPBGA, FCBGA and System in Package (SiP) Commercial EDA design flow with signal integrity support and power analysis Three local design support centers Custom SoC Technology Lead Toshiba holds a significant technological lead in delivering production-volume, highyield 40, 65, 90 and 130 nm Custom SoCs. Development of 32 nm process technologies is underway. With a strict design for manufacturing culture, the use of the latest yield prediction software, tools and manufacturing expertise, problems are solved early on. This enables quick ramp up to high-yield production volumes and low defect densities. Toshiba has consistently proven its ability to deliver high-yield 90 and 65 nm volume production. Proven IP Toshiba SoCs incorporate pre- and posttested IP including MIPS and ARM processor (500+MHz) cores, memory, mixed-signal functions, high-speed serial interfaces, MPEG and more. Toshiba also holds a fullvolume manufacturing lead in embedded DRAM technology for performance applications, or applications where availability of discrete DRAMs is uncertain. Platform SoCs To solve the challenge of engineering productivity, Toshiba's customers have cut their design cycles by months using the Toshiba custom chip Soft IP platform approach. Toshiba platform technology uses mix and match IP that is pre-verified, pretested and configurable to accelerate time-torevenue. Comprehensive Support Toshibas comprehensive engineering support helps customers meet their Custom SoC design specifications and development schedules at the lowest possible cost. Expert support is available from three U.S. Design Centers. However, in the case of extremely complex Custom SoC designs, customers can call upon expertise from Toshibas worldwide engineering network and facilities, including Research and Development Centers.
For each Custom SoC design program, a Toshiba engineering team is assembled to help customers create the best design based on system-chip architecture tradeoffs, silicon technology, cell libraries, IP, EDA tools, design flows, test, packaging, quality assurance and other criteria. Depending on each customers own resources and skills, Toshiba engineers can work as expert consultants or provide access to Toshibas sophisticated design tools. Toshiba can also deliver turnkey engineering services to facilitate a new or derivative design.
TAEC Regional Sales Offices
NORTHWEST San Jose, CA TEL: (408) 526-2400 FAX: (408) 526-2410 Portland, OR TEL: (503) 784-8879 FAX: (503) 466-9729 SOUTHWEST Irvine, CA TEL: (949) 623-2900 FAX: (949) 474-1330 Richardson, TX TEL: (972) 480-0470 FAX: (972) 235-4114 CENTRAL Buffalo Grove, IL TEL: (847) 484-2400 FAX: (847) 541-7287 NORTHEAST Marlboro, MA TEL: (508) 481-0034 FAX: (508) 481-8828 Parsippany, NJ TEL: (973) 541-4715 FAX: (973) 541-4716 SOUTHEAST Duluth, GA TEL: (770) 931-3363 FAX: (770) 931-7602
* The information contained herein is subject to change without notice. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situation in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the Handling Guide for Semiconductor Devices, or TOSHIBA Semiconductor Reliability Handbook etc. * The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (Unintended Usage). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of Toshiba products listed in this document shall be made at the customers own risk. * The products described in this document may include products subject to foreign exchange and foreign trade laws. * The products contained herein may also be controlled under the U.S. Export Administration Regulations and/or subject to the approval of the U.S. Department of Commerce or U.S. Department of State prior to export. Any export or re-export, directly or indirectly in contravention of any of the applicable export laws and regulations, is hereby prohibited.
All trademarks are of their respective manufacturer and may be registered in certain jurisdictions. Copyright 5/2008 TAEC
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