Hardware Reference Guide

HP Compaq dx2200 Microtower Business PC
Document Part Number: 413758-001

January 2006

This guide provides basic information about upgrading this computer model.
Copyright 2006 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Microsoft and Windows are trademarks of Microsoft Corporation in the U.S. and other countries. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. This document contains proprietary information that is protected by copyright. No part of this document may be photocopied, reproduced, or translated to another language without the prior written consent of Hewlett-Packard Company.
WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily harm or loss of life.
CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to equipment or loss of information.
Hardware Reference Guide HP Compaq dx2200 Microtower Business PC First Edition (January 2006) Document Part Number: 413758-001

Contents

1 Hardware Upgrades
Serviceability Features. 12 Warnings and Cautions. 12 Removing the Access Panel and Front Bezel. 13 Removing a 5.25" Drive Bezel Blank. 15 Removing a 3.5" Drive Bezel Blank. 16 Installing Additional Memory. 17 DIMMs. 17 DDR2-SDRAM DIMMs. 17 Installing DIMMs. 18 Installing an Expansion Card. 110 Replacing or Upgrading a Drive. 112 Locating Drive Positions. 113 Removing a 5.25" Optical Drive. 114 Removing a 3.5" Media Card Reader or Diskette Drive. 116 Removing a 3.5" Hard Drive. 118

2 Battery Replacement

Replacing the Battery. 21
3 Computer Operating Guidelines, Routine Care and Shipping Preparation
Computer Operating Guidelines and Routine Care. Optical Drive Precautions. Operation. Cleaning. Safety. Shipping Preparation. 32 33

www.hp.com

4 Electrostatic Discharge
Preventing Electrostatic Damage. 41 Grounding Methods. 41

Hardware Upgrades

HP Compaq dx2200 Microtower
configuration The drive model. shown above may be different than your computer

Serviceability Features

The Microtower computer includes features that make it easy to upgrade and service. A Torx T-15 screwdriver is needed for many of the installation procedures described in this chapter.

Warnings and Cautions

Before performing upgrades be sure to carefully read all of the applicable instructions, cautions, and warnings in this guide.
WARNING: To reduce the risk of personal injury from electrical shock and/or hot surfaces, be sure to disconnect the power cord from the wall outlet and allow the internal system components to cool before touching.
WARNING: To reduce the risk of electrical shock, fire, or damage to the equipment, do not plug telecommunications/telephone connectors into the network interface controller (NIC) receptacles.
CAUTION: Static electricity can damage the electrical components of the computer or optional equipment. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. See Chapter 4, Electrostatic Discharge for more information.
CAUTION: When the computer is plugged into an AC power source, voltage is always applied to the system board. You must disconnect the power cord from the power source before opening the computer to prevent system board damage.
Removing the Access Panel and Front Bezel
CAUTION: Before removing the computer access panel, ensure that the computer is turned off and that the power cord is disconnected from the electrical outlet.

1. Turn off the computer properly through the operating system and turn off any external devices. 2. Disconnect the power cord from the power outlet and the computer 1, and disconnect any external devices. 3. Remove the two screws that secure the access panel to the computer chassis 2. 4. Slide the access panel back about 1.25 cm (1/2 inch), then lift it away from and off the unit 3.
Removing the Power Cord and Access Panel
To replace the access panel, reverse the removal steps.
5. To remove the front bezel, pull outward on all three tabs on the left side of the bezel 1 then rotate the bezel off the chassis 2, beginning with the left side then the right side.

Removing the Front Bezel

the front bezel, insert the hooks right side of To replaceinto the rectangular holes onthreechassison therotate the bezel the bezel the then into place so that the catches on the three tabs on the left side of the bezel snap into place on the chassis.
Removing a 5.25" Drive Bezel Blank
If the computer was not shipped with a drive in the 5.25" option bay, the bay will be covered by a bezel blank. If you add a drive to the option bay, you must first remove the bezel blank. 1. Turn off the computer properly through the operating system and turn off any external devices. 2. Disconnect the power cord from the power outlet and the computer, and disconnect any external devices. 3. Remove the access panel and front bezel. Refer to Removing the Access Panel and Front Bezel. 4. While facing the inside of the front bezel, press the two retaining tabs on the right towards the outer edge of the bezel 1 and pull the bezel blank inwards to remove it 2.
Removing a 5.25" Bezel Blank
the left the the To install a 5.25" bezel blank, slide the frontside of thenblank intoright two retainer slots on the left side of bezel snap the side of the blank into place.
Removing a 3.5" Drive Bezel Blank
If the computer was not shipped with a device in the 3.5" bay, the bay will be covered by a bezel blank. If you install a device in the 3.5" bay, you must first remove the bezel blank. 1. Turn off the computer properly through the operating system and turn off any external devices. 2. Disconnect the power cord from the power outlet and the computer, and disconnect any external devices. 3. Remove the access panel and front bezel. Refer to Removing the Access Panel and Front Bezel. 4. While facing the inside of the front bezel, press outward on the two retaining tabs on each side of the bezel blank 1 and pull the bezel blank inwards to remove it 2.

Removing a 3.5" Bezel Blank
3.5" bezel blank, press the To install a so that it snaps into place. blank inward from inside the front bezel
Installing Additional Memory
The computer comes with double data rate 2 synchronous dynamic random access memory (DDR2-SDRAM) dual inline memory modules (DIMMs).
The memory sockets on the system board can be populated with up to two industry-standard DIMMs. These memory sockets are populated with at least one preinstalled DIMM. The sockets are labeled DIMM1 and DIMM2. To achieve the maximum memory support, you can populate the system board with up to 2GB (2 x 1GB) of memory.

DDR2-SDRAM DIMMs

For proper system operation, the DDR2-SDRAM DIMMs must be:
industry-standard 240-pin unbuffered PC2-MHz-compliant 1.9 volt DDR2-SDRAM DIMMs support CAS latency 4 (CL = 4) for PC2-MHz contain the mandatory JEDEC SPD information 256Mbit, 512Mbit, and 1Gbit non-ECC memory technologies single-sided and double-sided DIMMS DIMMs constructed with x8 and x16 DDR devices; DIMMs constructed with x4 SDRAM are not supported
The DDR2-SDRAM DIMMs must also:
In addition, the computer supports:
The system will not start if you install unsupported DIMMs.

Installing DIMMs

CAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation resulting from having incompatible metals in contact with each other.
CAUTION: Static electricity can damage the electronic components of the computer or optional cards. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. For more information, refer to Chapter 4, Electrostatic Discharge.
CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module.
1. Turn off the computer properly through the operating system and turn off any external devices. 2. Disconnect the power cord from the power outlet and the computer, and disconnect any external devices. 3. Remove the computer access panel. 4. Locate the memory module sockets on the system board.

WARNING: To reduce risk of personal injury from hot surfaces, allow the internal system components to cool before touching.
5. Open both latches of the memory module socket 1, and insert the memory module into the socket 2.

Installing a DIMM

in only one way. A memory module can be installedmemory socket. Match the notch on the module with the tab on the 6. Push the module down into the socket, ensuring that the module is fully inserted and properly seated. Make sure the latches are in the closed position 3. 7. Replace the computer access panel and reconnect the power cable. The computer should automatically recognize the additional memory the next time you turn on the computer.
Installing an Expansion Card
The computer has two PCI expansion slots that can accommodate expansion cards up to 17.46 cm (6.875 inches) in length, one PCI Express x1 expansion slot, and one PCI Express x16 expansion slot. 1. Turn off the computer properly through the operating system and turn off any external devices. 2. Disconnect the power cord from the power outlet and the computer, and disconnect any external devices. 3. Remove the access panel and lay the computer on its side with the opening to internal parts facing up. 4. On the rear panel of the computer, remove the screw that secures the slot cover lock in place 1 and slide the slot cover lock up and away from the slots to remove it from the computer 2.
Releasing the Slot Cover Lock
5. If you are installing an expansion card for the first time, you must use a flatblade screwdriver to pry out the metal shield on the rear panel that covers the expansion slot. Be sure to remove the appropriate shield for the expansion card you are installing.
Removable Shield Top shield Second shield Third shield Bottom shield Expansion Card Type PCI Express x16 PCI Express x1 PCI PCI
6. Hold the expansion card just above the expansion slot on the system board then move the card toward the rear of the chassis so that the bottom of the bracket on the card slides into the small slot on the chassis. Gently press the card straight down into the expansion slot on the system board.

Adding an Expansion Card

press When installing an expansion card, in the firmly on the card so that the whole connector seats properly expansion card slot. 7. While holding the expansion card bracket against the chassis, slide the slot cover lock down toward the expansion card bracket to secure it in place and replace the screw that secures the slot cover lock. 8. Connect external cables to the installed card, if needed. Connect internal cables to the system board, if needed. 9. Replace the computer access panel and reconnect the power cable.
To remove an expansion card, reverse the installation procedure.
CAUTION: After removing an expansion card, you must replace it with a new card or expansion slot cover for proper cooling of internal components during operation.

Replacing or Upgrading a Drive
The computer supports up to five drives that may be installed in various configurations. This section describes the procedure for replacing or upgrading the storage drives. A Torx T-15 screwdriver is needed to remove and install the guide screws and retainer screws on a drive.
CAUTION: Make sure you back up your personal files on the hard drive to an external storage device, such as a CD, before removing the hard drive. Failure to do so will result in data loss. After replacing the primary hard drive, you will need to run the Restore Plus! CD to load the HP factory-installed files.

Locating Drive Positions

configuration The drive model. shown below may be different than your computer
Drive Positions 5 External 5.25" full-height optical drive bay External 5.25" full-height option drive bay External 3.5" option drive bay (media card reader shown)* Internal 3.5" one-third height bay for optional secondary hard drive Internal 3.5" one-third height bay for primary hard drive
*The external 3.5" option drive bay accommodates a diskette drive or a media card reader.
Removing a 5.25" Optical Drive
1. Turn off the computer properly through the operating system and turn off any external devices. 2. Disconnect the power cord from the power outlet and the computer, and disconnect any external devices. 3. Remove the access panel and front bezel. Refer to Removing the Access Panel and Front Bezel. 4. Disconnect the power and data cables from the back of the drive. 5. Remove the two retainer screws that secure the drive to the bay 1 then slide the drive forward and out of the bay 2.
Removing a 5.25 External Drive
To install a drive, reverse the removal procedure. Be sure to install a guide screw on the front right side of a new drive. The guide screw helps secure the drive in place.
are installing a drive the If youshield that covers the in the bottom 5.25" driveonbay, removetab metal bay by pressing inward the silver
on the left side of the chassis then pulling the shield out from the front of the chassis.
total eight extra guide/retainer screws of There are abehindofthe bezel. Four have 6-32 standard on the front four the chassis threads and have M3 metric threads. Standard screws are used for hard drives and have a silver finish. Metric screws are used for all other drives and have a black finish. Be sure to install the appropriate guide screws into the drive.

Removing a 3.5" Media Card Reader or Diskette Drive
The 3.5" external drive bay may be populated with a diskette drive or a media card reader. The removal procedure is the same for both devices. 1. Turn off the computer properly through the operating system and turn off any external devices. 2. Disconnect the power cord from the power outlet and the computer, and disconnect any external devices. 3. Remove the access panel and front bezel. Refer to Removing the Access Panel and Front Bezel. 4. If the device is a media card reader, disconnect the internal USB cable from the system board. If the device is a diskette drive, disconnect the power and data cables from the back of the drive. 5. Remove the retainer screws that secure the drive to the bay 1 then slide the drive forward and out of the bay 2.
Removing a 3.5 Device (Media Card Reader Shown)
To install a drive, reverse the removal procedure. Refer to the following table for proper retainer and guide screw locations.
Device Diskette Drive Media Card Reader Retainer Screws 2 (labeled FDD on chassis) 2 (labeled CR on chassis) Guide Screws 1 (front left side of drive) none
are drive in the drive the first If youuse ainstalling ascrewdriver toexternal 3.5" metal bay forcovering time, flatblade pry out the shield the bay. total eight extra guide/retainer screws of There are abehindofthe bezel. Four have 6-32 standard on the front four the chassis threads and have M3 metric threads. Standard screws are used for hard drives and have a silver finish. Metric screws are used for all other drives and have a black finish. Be sure to install the appropriate guide screws into the drive.
Removing a 3.5" Hard Drive
1. Turn off the computer properly through the operating system and turn off any external devices. 2. Disconnect the power cord from the power outlet and the computer, and disconnect any external devices. 3. Remove the access panel and front bezel. Refer to Removing the Access Panel and Front Bezel. 4. Disconnect the power and data cables from the back of the hard drive. 5. Remove the four retainer screws that secure the drive to the bay 1 then slide the drive back and out of the bay 2.
Removing a 3.5 Hard Drive
hard drive, the removal No To install arequired forreverseinstalled in a procedure.driveguide screws are drives 3.5" hard bay.

Battery Replacement

Replacing the Battery
The battery that comes with the computer provides power to the real-time clock. When replacing the battery, use a battery equivalent to the battery originally installed in the computer. The computer comes with a 3-volt lithium coin cell battery. be extended by plugging The lifetime ofathe lithium battery canThe lithium battery is only the computer into live AC wall socket. used when the computer is NOT connected to AC power.
WARNING: The computer contains an internal lithium manganese dioxide battery. There is a risk of fire and burns if the battery is not handled properly. To reduce the risk of personal injury:
Do not attempt to recharge the battery. Do not expose to temperatures higher than 60 C (140 F). Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water. Replace the battery only with the HP spare designated for this product.
CAUTION: Before replacing the battery, it is important to back up the computer CMOS settings. When the battery is removed or replaced, the CMOS settings will be cleared. Refer to the Computer Setup (F10) Utility Guide on the Documentation CD for information on backing up the CMOS settings.
Batteries, battery packs, and accumulators should not be disposed of together with the general household waste. In order to forward them to recycling or proper disposal, please use the public collection system or return them to HP, their authorized partners, or their agents.
CAUTION: Static electricity can damage the electronic components of the computer or optional equipment. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object.
1. Turn off the computer properly through the operating system, then turn off any external devices. Disconnect the power cord from the power outlet and disconnect any external devices. Then remove the computer access panel.
It may be necessary to remove an expansion card to gain access to the battery.
2. Locate the battery and battery holder on the system board. 3. Depending on the type of battery holder on your system board, complete the following instructions to replace the battery.

Type 1

a. Lift the battery out of its holder.
Removing a Coin Cell Battery (Type 1)
b. Slide the replacement battery into position, positive side up. The battery holder automatically secures the battery in the proper position.

Type 2

a. To release the battery from its holder, squeeze the metal clamp that extends above one edge of the battery. When the battery pops up, lift it out 1. b. To insert the new battery, slide one edge of the replacement battery under the holders lip with the positive side up. Push the other edge down until the clamp snaps over the other edge of the battery 2.
Removing and Replacing a Coin Cell Battery (Type 2)

Type 3

a. Pull back on the clip 1 that is holding the battery in place and remove the battery 2. b. Insert the new battery and position the clip back into place.
Removing a Coin Cell Battery (Type 3)
After the battery has been replaced, use the following steps to complete this procedure.
4. Replace the computer cover or access panel. 5. Plug in the computer and turn on power to the computer. 6. Reset the date and time, your passwords, and any special system setups using Computer Setup. Refer to the Computer Setup (F10) Utility Guide on the Documentation CD.
Computer Operating Guidelines, Routine Care and Shipping Preparation
Computer Operating Guidelines and Routine Care
Follow these guidelines to properly set up and care for the computer and monitor:
Keep the computer away from excessive moisture, direct sunlight, and extremes of heat and cold. Operate the computer on a sturdy, level surface. Leave a 10.2-cm (4-inch) clearance on all vented sides of the computer and monitor to permit the required airflow. Never restrict the airflow into the computer by blocking any vents or air intakes. Do not place the keyboard, with the keyboard feet down, directly against the front of the desktop unit as this also restricts airflow. Never operate the computer with the cover or side panel removed. Do not stack computers on top of each other or place computers so near each other that they are subject to each others re-circulated or preheated air. If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply. Keep liquids away from the computer and keyboard. Never cover the ventilation slots on the monitor with any type of material. Install or enable power management functions of the operating system or other software, including sleep states.
Turn off the computer before you do either of the following:
Wipe the exterior of the computer with a soft, damp cloth as needed. Using cleaning products may discolor or damage the finish. Occasionally clean the air vents on all vented sides of the computer. Lint, dust, and other foreign matter can block the vents and limit the airflow.
Optical Drive Precautions
Be sure to observe the following guidelines while operating or cleaning the optical drive.

Operation

Do not move the drive during operation. This may cause it to malfunction during reading. Avoid exposing the drive to sudden changes in temperature, as condensation may form inside the unit. If the temperature suddenly changes while the drive is on, wait at least one hour before you turn off the power. If you operate the unit immediately, it may malfunction while reading. Avoid placing the drive in a location that is subject to high humidity, extreme temperatures, mechanical vibration, or direct sunlight.

Cleaning

Clean the panel and controls with a soft, dry cloth or a soft cloth lightly moistened with a mild detergent solution. Never spray cleaning fluids directly on the unit. Avoid using any type of solvent, such as alcohol or benzene, which may damage the finish.

Safety

If any object or liquid falls into the drive, immediately unplug the computer and have it checked by an authorized HP service provider.

Shipping Preparation

Follow these suggestions when preparing to ship the computer: 1. Back up the hard drive files on PD discs, tape cartridges, CDs, or diskettes. Be sure that the backup media is not exposed to electrical or magnetic impulses while stored or in transit.
The hard drive locks automatically when the system power is turned off.
2. Remove and store any program diskettes from the diskette drives. 3. Insert a blank diskette into the diskette drive to protect the drive while in transit. Do not use a diskette on which you have stored or plan to store data. 4. Turn off the computer and external devices. 5. Disconnect the power cord from the electrical outlet, then from the computer. 6. Disconnect the system components and external devices from their power sources, then from the computer. are seated properly Ensure that all boardsthe computer. and secured in the board slots before shipping 7. Pack the system components and external devices in their original packing boxes or similar packaging with sufficient packing material to protect them.

Electrostatic Discharge

A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
Preventing Electrostatic Damage
To prevent electrostatic damage, observe the following precautions:
Avoid hand contact by transporting and storing products in static-safe containers. Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations. Place parts on a grounded surface before removing them from their containers. Avoid touching pins, leads, or circuitry. Always be properly grounded when touching a static-sensitive component or assembly.

Grounding Methods

There are several methods for grounding. Use one or more of the following methods when handling or installing electrostatic-sensitive parts:
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist straps are flexible straps with a minimum of 1 megohm +/- 10 percent resistance in the ground cords. To provide proper ground, wear the strap snug against the skin.
Use heelstraps, toestraps, or bootstraps at standing workstations. Wear the straps on both feet when standing on conductive floors or dissipating floor mats. Use conductive field service tools. Use a portable field service kit with a folding static-dissipating work mat.
If you do not have any of the suggested equipment for proper grounding, contact an HP authorized dealer, reseller, or service provider.
For more information on static electricity, contact an HP authorized dealer, reseller, or service provider.

Product environmental attributes - IT Eco Declaration 2004
Brand Manufacturer Manufacturers representative Contact person Postal address Postal code /City/ Country Telephone (incl. country code) Mobile phone (incl. country code) Fax (incl. country code) Internet site Additional information Hewlett-Packard Hewlett-Packard Name: e-mail: Name: e-mail: itecodeclaration.ww@hp.com Hans Wendschlag , HP Sweden Logo
+ + + http://www.hp.se/environment Latest version of this document can be found at: http://www.hp.se/itecodeclarations. The company environmental profile, which is issued for the company and isn't product related, can also be found at the same website. Check Item 14 for explanatory information regarding specific item responses.
This declaration covers the below listed Information Technology product categories* with specified product identity (ID) such as type/model number.
Computer system unit CPU Display/ monitor Printer Black/white Product identity Copier Colour Fax Mobile/portable computer Keyboard Multifunction product Scanner Server Digital Projector Camera
Other IT product, specify:

Pages per minute:

HP Compaq dx2200 Microtower PC

June 2004

Issue date 09/22/2006 Guideline document (Version of Guideline document used for completion of this declaration (month, year)) This IT Eco Declaration consists of three documents: Company environmental profile: Divided into two sections, legal and market requirements
Product environmental attributes: Divided into two sections, legal and market requirements Guideline document with extensive clarifications, comments and references. The latest version of all these documents can be downloaded from: www.itecodeclaration.org Notes: Voluntary vs compulsory requirements: Items marked V are voluntary to answer, all other items must be answered. The latest version of the Guideline document must be used. Specify in table above according to which version of the guideline document this declaration has been completed. This version of the IT Eco Declaration is adjusted to the document Product-related Environmental Attributes, issued by the European Association for Standardizing Information and Communication Systems (ECMA), TR/70, version 1999. This version of the IT Eco Declaration meets the basic principles of ISO14021:1999, Environmental labels and declarations Self-declared environmental claims (Type II environmental labelling). When references are given to standards like ISO, IEC and EN, the latest version should always be referred to. For telecommunication products, use eco declaration for telecommunication products. This IT Eco Declaration version can be used from October and shall be used for products announced after December 1 2003. The IT Eco Declaration is a system for declaration of environmental aspects of IT and telecom products, developed by the Nordic IT organisations, IT-Fretagen in Sweden, ITB in Denmark, IKT-Norge in Norway and TTK ry in Finland. This IT Eco Declaration may only be used after having signed a contract with at least one of these organisations.

Association of the Swedish IT and Telecom Industry www.itforetagen.se
Norwegian IT-companies Organisation www.ikt-norge.no
IT-Brancheforeningen Kontor & Data www.itb.dk
Finnish Association of Office Technology Traders www.ttkry.com

Version June 2004

Page 1 (5)
Copyright Association of the Swedish IT and Telecom Industry 2000. Reproduction of this form without permission is prohibited by the copyright law 1960:729. The prohibition includes any kind of reproduction, by electronic or any other means.
Product identity Issue date

09/22/2006 Logo

Product environmental attributes - Legal requirements
Item P1 P1.1 P1.2 P1.3 P1.4 P1.5 Additional information regarding each item may be found under P14. Environmental conscious design Product parts are free from, i.e. less than 0.1% by weight (b.w.), CFCs & HCFCs, asbestos, PCB & PCT (3093/94/EEC, 76/769/EEC, 6th amendment, 99/77/EEC, 82/828/EEC) Components are free from, i.e. less than 0.1% b.w., mercury (Hg), except for small amounts of mercury which are allowed in light sources. (SE SFS 1998:944) Cadmium (Cd) content of colorants, stabilizers, and surface treatments does not exceed, 0.01% b.w., as specified in 76/769/EEC, 10th amendment, 1991/338/EEC. Paints are free from lead (Pb), i.e. less than 0.1% b.w., (76/769/EEC, 8th amendment, 89/677/EEC) Paints, coatings, plastics, rubbers and seals are free from flame retardants and/or plasticizers containing Short Chain Chlorinated Paraffines (SCCPs) with more than 0,1% by weight, 10-13 carbon atoms, minimum 48% chlorine by weight, CAS number 63449-39-8 (NO MVD regulation 1544, 2000.12.13 and FI 416/2003). If the product is intended for direct and prolonged skin contact, the surfaces do not release nickel (Ni) above levels specified in (76/769/EEC, 8th amendment, 94/27/EEC) Batteries If hazardous batteries are used in the product, they are labelled. (93/86/EEC). If batteries are used in the product they are free (<0.0005% by weight) from mercury (Hg) (98/101/EC) Electrical safety, EMC and connection to the telephone network The product meets the Low Voltage Directive (LVD) regarding electrical safety (73/23/EEC & 93/68/EEC) The product meets the EMC Directive regarding electromagnetic compatibility (89/336/EEC) If product is intended for connection to a public telecom network or contains a radio transmitter, it meets the EU R&TTE Directive (1999/5/EC) The product is CE-marked (93/68/EEC) Consumable materials If a photo conductor (drum, belt etc.) is used in the product, it is free (<0.01% by mass) from cadmium (Cd) (76/769/EEC and 91/338/EEC) If an ink is used in the product, it is free (<0.01% by mass) from cadmium (Cd) (91/338/EEC) If toner/ink (or corresponding) are used in the product, they are classified and if required labelled in accordance with EU directives Packaging materials The sum of the concentration levels of lead, cadmium, mercury, and hexavalent chromium present in packaging or packaging components does not exceed 0.01% by weight (100 ppm). (94/62/EC). The product packaging material is free from CFC/HCFC.

Requirement met Yes No n.a.
P1.6 P2 P2.1 P2.2 P3 P3.1 P3.2 P3.3 P3.4 P4 P4.1 P4.2 P4.3 P5 P5.1 P5.2
This product meets above listed legal requirements

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Product Identity Issue date
Product environmental attributes - Market requirements
Item P6 P6.1 P6.2 P6.3 P6.4 P6.5 V P6.6 P6.7 P6.8 P6.9 P6.10 V P6.11 P6.12 V P6.13 V = Voluntary to answer. Additional information regarding each item may be found under P14. Environmental conscious design Disassembly, recycling Gluing/welding of different material has been avoided. Plastic materials in covers/housing are free from surface coating. Mechanical plastic parts >100g, consist of one material or of easily separable materials. Plastic parts >25g, have material codes according to ISO 11469. Plastic parts are free from metal inlays or have inlays that can be removed with commonly available tools. If labels are required they should be separable. (This requirement does not apply to safety labels). Product lifetime Upgrading of the product can be done with commonly available tools Processor, memory and cards of various types can be changed/upgraded. Hard disk, CD/DVD drives and / or floppy drive can be changed/upgraded. Spare parts are available after end of production for: Material requirements Plastic parts >25g are free from PBB/PBDE, i.e less than 0.1% b.w. Plastic parts >25g are free from flame retardant substances/preparations above 0.1% classified as R45/46, R50/51/52/53 and R60/61 (67/548/EEC) Chemical specification of flame retardants in plastic parts >25g according to ISO 1043-4 declared below: Product cover/ housing: Printed circuit boards: V P6.14 P6.15 P6.16 V P6.17 V P6.18 V P7 P7.1 P7.2 V P8 P8.1 Other plastic parts: Product cover/housing material type, specified according to ISO 1043-1 Material type ABS Material type Electrical cable insulation material specification Light sources are free from mercury, i.e less than 0.1% b.w. If mercury is used specify: Number of lamps 1 & max. mercury per lamp >3 mg Mechanical plastic parts > 25g are free from lead (Pb), i.e. less than 0.1% b.w. Batteries Product is free from batteries defined as hazardous (91/157/EEC) Batteries are used that meet the European eco-label (EU Flower) criteria (2001/687/EC & 2001/686/EC) Energy consumption Material type PVC Other years
Product parts are free from beryllium (Be) and beryllium oxide (BeO), i.e. less than 0.1% b.w.
Note: For Monitors, PCs and Handheld PCs, energy consumption data are reported on Page 5 under Item P14, Additional Information.
n.a. V Maximum power Low power mode W W V Operation Off mode Deep sleep mode Sleep mode in 20 min min W W W n.a.
W Sleep mode If the product is in Stand by mode, it reverts to: Low power mode in V P8.2 P8.min

min V Off mode in Deep sleep mode in 2-sided printing/copying (duplex) from 1-sided originals is an integrated product function.

P8.4 P8.5 V P8.6 V V

Information about the energy save function is given in the user documentation. (Not applicable when no instruction is needed to operate the energy save function, i.e. the energy save function cannot be adjusted or inhibited by the user.) The product meets the requirements of ENERGY STAR. The product meets the requirements of GEEA. Display meets the energy save requirements of the European eco-label (EU Flower) (2001/686/EC & 2001/687/EC). Desktop or portable computer meets the energy save requirements of the European eco-label (EU Flower) (2001/686/EC & 2001/687/EC)

Page 3 (5)

Product environmental attributes - Market requirements (continued)
Item P9 P9.1 P9.2 V V = Voluntary to answer. Additional information regarding each item may be found under P14. Noise characteristics (Measured and declared according to ISO 7779 and ISO 9296) Declared A-Weighted Sound Power Level, LWAd (1B = 10 dB) Idling mode: LWAd : 4.0 B Operating mode: LWAd : 4.1 B The product meets the acoustic noise requirement of:
TCO Blue Angel European eco-label (EU Flower) Nordic Swan

P9.3 V

Declared A-Weighted Sound Pressure Level, LpAm (measured at the operator position if applicable; otherwise measured at the 1m bystander positions). Idling mode: LpAm: 29 dB Operating mode: LpAm: 31 dB Test position: LpAm: LpAm: Operator position Table top , other standard TVOC Bystander positions Floor standing , specify: Benzene TCO Blue Angel Nordic Swan

P10 P10.1

Test position for PC tower Emissions
Chemical emission test performed according to RAL-UZ

P10.2 V

Ozone Styrene The test covers: Dust The product meets the requirement for chemical emission in:
Display/monitor/portable computer meets the requirement for low frequency electromagnetic fields in: MPR-II TCO prEN50279- A , -B , -C
P11 P11.1 P11.2 P11.3 V P11.4 V P12 P12.1 P12.2 P12.3 P13 P13.1
Consumable materials The photo conductor is free from selenium. If the photo conductor contains selenium there is a system for waste recovery. Safety Data Sheet/Material Safety Data Sheet (SDS/MSDS) is available for toner/ink (99/45/EC & 2001/58/EC) Paper containing recycled fibres and meeting requirements of ENV12281 can be used in the product. Ergonomics The computer system meets the ergonomic requirements of EN 29241-3, -7, -8 for CRT displays and EN-ISO 13406-2 for flat panel displays. The product keyboard meets the requirements of ISO 9995 and EN 29241-4. The computer input device meets the requirements of ISO 9241-9. Packaging and documentation Product packaging: material type(s): Corrugated carton weight (kg): Paper insert Expanded PE Foam LDPE Bag Plastic packaging material is marked according to DIN 6120, ISO 11469 or ISO 1043, 1-4. Product plastic packaging is free from chlorine User and product documentation are free from chlorine bleached paper Additional information "The IT Eco Declaration covers the product base model only. If optional items with moving parts are added, like extra hard disks or graphic cards with fans etc, these can change energy and acoustics values for which HP can take no responsibility." 1.400 0.200 0.240 0.010

P13.2 V P13.3 V P13.4 V P14

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Additional information 1. "The IT Eco Declaration covers a typically configured product base model only. If optional items with moving parts are added, like extra hard disks or graphic cards with fans etc, these can change energy and acoustics values for which HP can take no responsibility." 2. For PCs, HP will not declare "Maximum Power Consumption" as a standard for measurement and declaration has not been established. 3. For Commercial Desktop and Mobile PCs, power consumption in the Off / Apparent Off mode is measured and reported with the network interface controller (NIC) WOL disabled. Supplemental Energy Efficiency Data for Monitors, PCs and Handheld PCs Power Consumption Parameters AC Input Voltage at 100 AC Input Voltage at 115 AC Input Voltage at 230 VAC VAC +/- 5 VAC, 50 Hz VAC +/- 5 VAC, 60 Hz +/- 5 VAC, 50 Hz +/- 3 Hz +/- 3 Hz +/- 3 Hz Power Consumption for Displays: Enter power consumption in On / Active Power Operation Mode (W) Enter power consumption in First Low Power / Sleep Mode (W) Enter power consumption in Second Low Power / Deep Sleep Mode [If applicable] (W) Enter power consumption in Off or Apparent Off Mode (W) Power Consumption for Desktop and Mobile PCs: Enter power consumption in NA NA NA Maximum Power Mode (W) Enter power consumption in On / 84.5 83.7 83.0 Operation Mode (W) Enter the power consumption in the 2.53 2.81 3.33 ENERGY STAR Low Energy (Sleep) Mode (W) Enter power consumption in Off or 1.25 1.44 1.96 Apparent Off Mode (W) Power Consumption for Handheld PCs: Enter power consumption in On / Operation Mode (W) Enter power consumption in Off or Apparent Off Mode (W)

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