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HP Pavilion T3000

Manual

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HP Pavilion T3000 - Getting Started Guide, size: 1.4 MB
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HP Pavilion T3000About HP Pavilion T3000
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Documents

doc0

HP-00007-01, Appendix 3

13-Oct-2004
Appendix 3 Product End-of-Life Disassembly instructions Product Identification: Model Name Description HP Pavilion t3000 Series PC Desktop PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Item Description Notes Quantity of items included in product. Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries With a surface greater than 10 square cm All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps 3 1
Mercury containing components
Liquid Crystal Displays (LCD) with a surface greater than 100 square cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB / PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos
Declaration limited to case plastics only. Include the cartridges, print heads, tubes, vent chambers, and service stations. 0 0

HP Restricted Page 1

Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances
Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Clipper Screw Driver Tool Size (if applicable)
Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1 Panel Access Disassemble: loosing one thumb screw, removing panel-Access access 16 Front Bezel Disassemble: press and hold down, press tab(*4), take out front bezel M/B Disassemble: turn the screws(*8) to loosen it , take M/B out of Chassis. Remove RTC coin cell battery for selective treatment. EMI Shield Disassemble: pull snap up , take out of I/O shield System Fan Disassemble: turn the screws(*4) to loosen it , take system fan out of Chassis Power LED holder Disassemble: press Power LED holder hooks to take it out Front I/O cover Disassemble: pull snap up(*4), pull the front I/O cover backward, take Front I/O bezel out of Front I/O bracket Front I/O bracket Disassemble: turn the screw to loosen it, pull the front I/O bezel toward right, take Front I/O bracket out of chassis Main Bezel Sub-Disassemble Optional parts: Press two hooks to take out of FDD bezel trim ODD Disassemble : pull snap up ,take out ODD HDD Disassemble : pull snap up ,take out HDD Cardreader Disassemble : pull snap up ,take out Cardreader Floppy Disassemble : pull snap up ,take out Floppy Latch Disassemble: pull snap up , take out Latch Power Supply Disassemble: turn the screws(*4) to loosen it , take Power Supply out of Chassis Nameplate Disassemble: Ejecting two hooks

HP Restricted Page 2

Power button Disassemble: press two hooks and take out the Power button HDD lence Disassemble: press two hooks ,take out HDD lence Cardreader bezel trim Disassemble: pull snap up , take out Cardreader bezel trim Backup bezel Disassemble: pull hooks(*8) up, take out Backup bezel Eject ODD button*2 Disassemble: pull snap up, pull out Eject ODD button Spring of Eject ODD button*2 Disassemble: pull the spring out of the hooks CD shutter door*2 Disassemble: take off hinge(*2), takel out CD shutter door Basepan-CPU Disassemble: take out the nail with driller ,and take out Basepan-CPU Bezel latch Disassemble: take out Bezel latch

OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within the product which require selective treatment (with descriptions and arrows identifying locations) can be inserted below:

HP Restricted Page 3

doc1

Product End-of-Life Disassembly Instructions
Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP dx2000 Series HP Pavilion PC m8000 Series HP Compaq Presario PC SR1000 Series HP Pavilion PC m7000 Series HP Pavilion PC g1000 Series HP Compaq Presario PC SG1000 Series HP Compaq Presario PC SR5000 Series HP Pavilion PC g3000 Series HP Compaq Presario PC SG3000 Series HP Pavilion PC a1000 Series HP Pavilion PC t3000 Series HP Pavilion PC m9000 Series HP Pavilion PC a6000 Series Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords EL-MF877-00 Template Revision B PSG instructions for this template are available at EL-MF877-01 The QTY may vary from different PSU Models With a surface greater than 10 sq cm All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps Page 1
Gas Discharge Lamps Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances M/B ; Power Supply PCA
Include the cartridges, print heads, tubes, vent chambers, and service stations.
2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Phillips screw driver Description #2 Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. Remove cover from the unit Remove all the cables from PCA remove PCI & PCI-E card from the PCA Remove HDD from the system Remove ODD from PCA take off Front Panel Take off ODD Take off Cooler Take off CMOS battery Take off PS from the Unit cut off wire tie open PS NO 2
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Template Revision B PSG instructions for this template are available at EL-MF877-01

Page 2

1 Remove cover from the unit Rotate screw to open the cover
2 Remove all the cables from PCA Press the button to pull power cords off Pull the other cords off PCA
3 remove PCI & PCI-E card from the PCA Use screw driver to take off the screw as shown in the photo

Page 3

3 Take PCI & PCI-E cards off the PCA Use one hand to push the white plastic use the other hand to pull off the card
4 Remove HDD from the system Rotate the screw driver to take off the HDD holder
5 take off Front Panel Pull the button up and then take off the front panel

Page 4

6 Take off ODD Use one hand to pull the steel up , and the same time take off ODD use the other hand
7 Take off Cooler Press the steel button to loose Cooler fan
7 Take off Cooler Rotate screw driver to loose screw and then take the cooler off PCA

Page 5

8 Take off CMOS battery Pull the battery holder as shown in the photo, and then the battery will off the PCA
9 Take off PS from the Unit Use screw driver to loose screws and then take the PS off the Unit

10 cut off wire tie

Page 6

11 open PS

12 use screw driver to separate the small PCA from the main board
13 Screw driver Phillips screw driver NO 2

Page 7

 

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