Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] HP Compaq nx8420 Notebook PC HP Compaq nc8430 Notebook PC HP Compaq nw8440 Notebook PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances Include the cartridges, print heads, tubes, vent chambers, and service stations. With a surface greater than 10 sq cm All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps 0 0
EL-MF877-00 Template Revision A

Page 1

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Phillips Screwdriver Description #2 TORX Screwdriver Description #3 Socket Screwdriver Description #4 Slotted Screwdriver Description #5 Vacuum Chuck 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. Remove primary battery module Remove HDD module (contains PCA) Remove Bluetooth module (contains PCA) Remove expansion memory module (PCA) Remove ODD assembly (contains PCA) Remove touch pad assy Remove keyboard Remove switch cover Remove LCD cable and antenna Divide LCD assembly from base assembly Dismantle LCD panel and remove mercury lamp for selective treatment Remove wireless module Remove FAN assembly from base assembly Remove thermal assembly from base assembly Remove motherboard PCA and separate coin cell battery for selective treatment
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).