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Samsung TS-H653G

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Comments to date: 4. Page 1 of 1. Average Rating:
joma 6:57pm on Friday, September 3rd, 2010 
Best price ! Easy To Use,Great Value,Large Capacity,Reliable Performance,Writes/Reads fast None I bought this for my Canon T1I. It can take HiDef videos, and the combination works well together. Easy To Use,Great Value,Large Capacity.
_ds 6:40pm on Friday, August 27th, 2010 
NINTENDO 8GB SD card The SD card is an easy piece of hardware to insert into the DS system. There is no science to it just plug and play. Great speed and performance This is the only card that I keep in my Nikon D700. Lexar used to be first choice. Performed flawlessly I bought this memory card to shoot a wedding (my first).
masodano 9:47am on Sunday, July 4th, 2010 
Thanks for offering this outstanding card at such a competitive price. Easy To Use,Great Value,Large Capacity,Reliable Performance. Fast card; works great with my Canon Rebel XTi. Easy To Use,Great Value,Large Capacity,Reliable Performance,Writes/Reads fast
pity 6:02pm on Saturday, June 12th, 2010 
good and reliable. Easy To Use,Reliable Performance Works as expected. Use in a Sony H20 camera Great Value I got this for a great price.It hold a lot. Easy To Use,Great Value,Large Capacity,Writes/Reads fast

Comments posted on www.ps2netdrivers.net are solely the views and opinions of the people posting them and do not necessarily reflect the views or opinions of us.

 

Documents

doc0

M393B1K70CH0-C(F8/H9/K0*)(04/05) 2Gb (512M x4) * 36

512Mx72

8GB 16GB 32GB

Notes:

1.35V 1.35V 1.35V

1Gx72 2Gx72 4Gx72

F7 = DDR3-800 (6-6-6) F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11)

DDR3 SDRAM

www.samsung.com/semi/dram
DDR3 SDRAM VLP REGISTERED MODULES
1GB 2GB 1.5V 1.5V 128Mx72 256Mx72 M392B2873FH0-C(F8/H9)(04/05) M392B5673FH0-C(F8/H9)(04/05) M392B5670FH0-C(F8/H9)(04/05) M392B5170FM0-C(F8/H9)(04/05) 4GB 1.5V 512Mx72 M392B5273CH0-C(F8/H9)(04/05) M392B5270CH0-C(F8/H9)(04/05) 8GB 16GB 1GB 2GB 1.5V 1.5V 1.35V 1.35V 1Gx72 2Gx72 128Mx72 256Mx72 M392B1K73CM0-CF8(04/05) M392B1K70CM0-C(F8/H9)(04/05) M392B2G70AM0-C(F8/H9)(04/05) M392B2873FH0-Y(F8/H9)(04/05) M392B5673FH0-Y(F8/H9)(04/05) M392B5670FH0-Y(F8/H9)(04/05) M392B5170FM0-Y(F8/H9)(04/05) 4GB 1.35V 512Mx72 M392B5273CH0-Y(F8/H9)(04/05) M392B5270CH0-Y(F8/H9)(04/05) 8GB 16GB
1Gb (128M x8) * 9 1Gb (128M x8) * 18 1Gb (256M x8) * 18 2Gb DDP (512M x4) * 18 2Gb (256M x8) * 18 2Gb (512M x4) * 18 4Gb DDP (512M x8) * 18 4Gb DDP (1024M x4) * 18 8Gb DDP (2048M x4) * 18 1Gb (128M x8) * 9 1Gb (128M x8) * 18 1Gb (256M x8) * 18 2Gb DDP (512M x4) * 18 2Gb (256M x8) * 18 2Gb (512M x4) * 18 4Gb DDP (512M x8) * 18 4Gb DDP (1024M x4) * 18 8Gb DDP (2048M x4) * 18
Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free
1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333 1066/1333
Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now

1.35V 1.35V

1Gx72 2Gx72
M392B1K73CM0-YF8(04/05) M392B1K70CM0-Y(F8/H9)(04/05) M392B2G70AM0-Y(F8/H9)(04/05)

Density

Voltage

Organization

Part Number

Composition

Compliance

Speed (Mbps)

Ranks Production
DDR3 SDRAM SODIMM MODULES
Organization 128Mx64 256Mx64 512Mx64 1024Mx64 128Mx64 256Mx64 512Mx64 1024Mx64
Part Number M471B2873FHS-C(F8/H9/K0*) M471B5673FH0-C(F8/H9/K0*) M471B5773FHS-C(F8/H9/K0*) M471B5273CH0-C(F8/H9/K0*) M471B1G73AH0-C(F8/H9/K0*) M471B2873FHS-Y(F8/H9/K0*) M471B5673FH0-Y(F8/H9/K0*) M471B5773FHS-Y(F8/H9/K0*) M471B5273CH0-Y(F8/H9/K0*) M471B1G73AH0-Y(F8/H9/K0*)
Composition 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 16 4Gb (512M x8) * 16 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 16 4Gb (512M x8) * 16

DDR3 SDRAM COMPONENTS

Density 1Gb Voltage 1.5V Organization 256M x4 128M x8 512M x4 2Gb 1.5V 256M x8 128M x16 1Gb 2Gb
Part Number K4B1G0446F-HC(F8/H9) K4B1G0846F-HC(F8/H9/K0*) K4B2G0446C-HC(F8/H9) K4B2G0846C-HC(F8/H9/K0*) K4B1G0446F-HC(F8/H9) K4B1G0846F-HC(F8/H9/K0*) K4B2G0446C-HC(F8/H9) K4B2G0846C-HC(F8/H9/K0*)
# Pins-Package 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA 78 Ball -FBGA
Compliance Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free
Speed (Mbps) 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600
Dimensions Production 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm 7.5x11mm Now Now Now Now Now Now Now Now
K4B2G1646C-HC(F8/H9/K0*/MA*/NB*) 96 Ball -FBGA

7.5x13.3mm Now

256M x4 128M x8 512M x4 256M x8
F7 = DDR3-800 (6-6-6) MA = DDR3-1866 (13-13-13) F8 = DDR3-1066 (7-7-7) NB = DDR3-2133 (14-14-14) H9 = DDR3-1333 (9-9-9) * K0, MA, and NB are available in ES only K0 = DDR3-1600 (11-11-11)
DDR2 SDRAM REGISTERED MODULES

Density 1GB 2GB 4GB

Organization 128Mx72 256Mx72 512Mx72
Part Number M393T2863FBA-C(E6/F7) M393T5660FBA-C(E6/F7) M393T5663FBA-C(E6/E7) M393T5160FBA-C(E6/F7)

# Pins-Package 84-FBGA 60-FBGA 60-FBGA 84-FBGA 60-FBGA 60-FBGA 84-FBGA 68-FBGA 68-FBGA 84-FBGA
Dimensions 7.5x12.5mm 7.5x9.5mm 7.5x9.5mm 7.5x12.5mm 7.5x9.5mm 7.5x9.5mm 7.5x12.5mm 7.5x9.5mm 7.5x9.5mm 7.5x12.5mm
Package Lead free & Halogen free Lead free & Halogen free Lead free & Halogen free Lead free & Halogen free Lead free & Halogen free Lead free & Halogen free Lead free & Halogen free Lead free & Halogen free Lead free & Halogen free Lead free & Halogen free
Speed (Mbps) 667/800/1066 667/800 667/800/1066 667/800/1066 667/800 667/800/1066 667/800/1066 667/800 667/800/1066 667/800/1066
Production Now Now Now Now Q3 Q3 Q3 Now Now Now

128M x8 64M x16

E6=DDR2-667 (5-5-5) F7=DDR2-800 (6-6-6) E7=DDR2-800 (5-5-5) F8=DDR2-1066 (7-7-7) Voltage = 1.8V

DDR2 SDRAM

Production
DDR SDRAM 1U REGISTERED MODULES
Organization 128Mx72 256Mx72
B0 = DDR266 (133MHz @ CL=2.5) A2 = DDR266 (133MHz @ Cl=2) B3 = DDR333 (166MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3) Type: 184-pin
Part Number M312L2920GH3-CB3 M312L5720GH3-CB3
Composition (128Mx4)*18 (128Mx4)*36
Speed (Mbps) 333/400 333/400

DDR DRAM SODIMM MODULES

Density 512MB

Organization 64Mx64

B0 = DDR266 (133MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3) B3 = DDR333 (166MHz @ CL=2.5) A2 = DDR266 (133MHz @ Cl=2)
Part Number M470L6524GL0-CB300

Composition (32M x 16)*8

Speed (Mbps) 333

DDR SDRAM COMPONENTS

Density 256Mb Organization 64Mx4 32Mx8 16Mx16 128Mx4 512Mb 64Mx8 32Mx16 128Mb
Part Number K4H560438N-LCB3/B0 K4H560838N-LCCC/B3 K4H561638N-LCCC/B3 K4H510438G-LCB3/B0 K4H510438G-HCCC/B3 K4H510838G-LCCC/B3 K4H510838G-HCCC/B3 K4H511638G-LCCC/B3 K4H281638O-LCCC
# Pins - Package 66-TSOP 66-TSOP 66-TSOP 66-TSOP 60-FBGA 66-TSOP 60-FBGA 66-TSOP 66-TSOP
Speed (Mbps) 266/333 333/400 333/400 266/333 333/400 333/400 333/400 333/400 400
B0 = DDR266 (133MHz @ CL=2.5) A2 = DDR266 (133MHz @ Cl=2) B3 = DDR333 (166MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3)

SDRAM COMPONENTS

64Mb 128Mb 8Mx8 4Mx16 16Mx8 8Mx16 64Mx4 256Mb 32Mx8 16Mx16 128Mx4 512Mb
K4S640832N-LC75000 K4S641632N-LC(L)(75/60)000 K4S280832O-LC(L)75000 K4S281632O-LC(L)(75/60)000 K4S560432N-LC(L)75000 K4S560832N-LC(L)75000 K4S561632N-LC(L)(75/60)000 K4S510432D-UC(L)(75)000 K4S510832D-UC(L)(75)000 K4S511632D-UC(L)(75)000
54-TSOP 54-TSOP 54-TSOP 54-TSOP 54-TSOP 54-TSOP 54-TSOP 54-TSOP 54-TSOP 54-TSOP
133 133/133/133 133/133 133
4K 4K 4K 4K 8K 8K 8K 8K 8K 8K
EOL with no replacement EOL with no replacement

EOL with no replacement EOL with no replacement EOL with no replacement

64Mx8 32Mx16

L = Commercial Temp., Low Power For Industrial Temperature, check with SSI Marketing Banks: 4
All products are Lead Free Voltage: 3.3V Speed: PC133 (133MHz CL=3/PC100 CL2)

RDRAM COMPONENTS

Density 288M

Organization x18

Part Number K4R881869I-DCT9000

Speed (Mbps) 1066

# Pins-Package 92-FBGA

Refresh 16K/32ms

Note EOL in Aug'10
All products are lead free

GRAPHICS DRAM COMPONENTS

Type GDDR5 Density 1Gb 1Gb GDDR3 512Mb 1Gb 512Mb 128Mb
Package: Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 FBGA (Lead Free) Z: 84 FBGA (Lead Free) T: TSOP L: TSOP (Lead Free) A: 136 FBGA B: 136 FBGA (Lead Free) H: FBGA (Halogen Free & Lead Free) E: 100 FBGA (Halogen Free & Lead Free)
Organization 32Mx32 32Mx32 16Mx32 64Mx16 32Mx16 4Mx32 8Mx16
Part Number K4G10325FE-HC(1) K4J10324KE-HC(1) K4J52324QH-HC(1) K4J52324QH-HJ(1) K4J52324QH-HJ(1) K4N1G164QE-HC(1) K4N51163QG-HC(1) K4D263238K-VC(1) K4D263238K-UC(1) K4D261638K-LC(1)
Package 170-FBGA 136-FBGA 136-FBGA 136-FBGA 136-FBGA 84-FBGA 84-FBGA 144-FBGA 100-TQFP 66-TSOPII
04: 0.4ns (2500MHz) 05: 0.5ns (2000MHz) 5C: 0.555 (1800MHz) 07: 0.71ns (1400MHz) 08: 0.83ns (1200MHz) 09: 0.90ns (1100MHz)
VDD/VDDQ 1.5/1.5V 1.8V/1.8V 1.8/1.8V 1.9/1.9V 2.05/2.05V 1.8/1.8V 1.8/1.8V 2.5/2.5V 2.5/2.5V 2.5/2.5V
1A: 1ns (1000MHz) 11: 1.1ns (900MHz) 12: 1.25ns (800MHz) 14: 1.429ns (700MHz) 16: 1.667ns (600MHz) 20: 2.0ns (500MHz)
Speed Bin (MHz) 1800/2000/2500 700/800/1000/1200 700/1200 400/500 400/500 200/250 200/250 200/250
22: 2.2ns (450MHz) 25: 2.5ns (400MHz) 2A: 2.86ns (350MHz) 33: 3.3ns (300MHz) 40: 4.0ns (240MHz) 50: 5.0ns (200MHz)

Status

EOL Mar '10 EOL Mar '10 EOL Mar '10 EOL Mar '10 EOL Mar '10 CuSmpl Oct '09 EOL Sep '10
(1) Speeds (clock cycle - speed bin):
SDRAM, RDRAM & Graphics DRAM Components

# Pins - Package

Refresh

Remarks

Mobile-SDR/DDR
Density Type MSDR 256Mb MDDR MSDR 512Mb MDDR Organization 16Mx16 8Mx32 16Mx16 8Mx32 32Mx16 16Mx32 32Mx16 16Mx32 64Mx16 1Gb MDDR 32Mx32 64Mx16 32Mx32 2Gb MDDR 128Mx16 64Mx32 x32 (2CS, 2CKE) 4Gb MDDR x32 (2CS, 2CKE) x32 (2CS, 2CKE) Part Number K4M56163PN-BG(1) K4M56323PN-HG(1) K4X56163PN-FG(1) K4X56323PN-8G(1) K4M51163PI-BG(1) K4M51323PI-HG(1) K4X51163PI-FG(1) K4X51323PI-8G(1) K4X1G163PE-FG(1) K4X1G323PE-8G(1) K4X1G163PF-FG(1) K4X1G323PF-8G(1) K4X2G163PC-FG(1) K4X2G323PC-8G(1) K4X4G303PB-AG(1) K4X4G303PB-AG(1) K4X4G303PB-7G(1) Package 54-FBGA 90-FBGA 60-FBGA 90-FBGA 54-FBGA 90-FBGA 60-FBGA 90-FBGA 60-FBGA 90-FBGA 60-FBGA 90-FBGA 60-FBGA 90-FBGA 168-FBGA, 12x12 PoP, DDP 168-FBGA, 12x12 PoP, DDP 240-FBGA, 14x14 PoP, DDP Power 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V Production Now Now Now Now Now Now Now Now Now Now MP Q1'11 MP Q1'11 Now Now Now Now Now

4. Density

10: 1G, 8K/32ms 16: 16M, 4K/64ms 26: 128M, 4K/32ms 28: 128M, 4K/64ms 32: 32M, 2K/32ms 50: 512M, 32K/16ms 51: 512M, 8K/64ms 52: 512M, 8K/32ms 54: 256M, 16K/16ms 55: 256M, 4K/32ms 56: 256M, 8K/64ms 62: 64M, 2K/16ms 64: 64M, 4K/64ms 68: 768M, 8K/64ms 1G: 1G, 8K/64ms 2G: 2G, 8K/64ms 4G: 4G, 8K/64ms

8. Revision

A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation E: 6th Generation F: 7th Generation G: 8th Generation H: 9th Generation I: 10th Generation J: 11th Generation K: 12th Generation M: 1st Generation N: 14th Generation Q: 17th Generation

5. Bit Organization

02: x2 04: x4 06: x4 Stack (Flexframe) 07: x8 Stack (Flexframe)
DRAM Ordering Information
XDR DRAM J: BOC(LF) P: BOC Mobile DRAM Leaded / Lead Free G/A: 52balls FBGA Mono R/B: 54balls FBGA Mono X /Z: 54balls BOC Mono J /V: 60(72)balls FBGA Mono 0.5pitch L /F: 60balls FBGA Mono 0.8pitch S/D: 90balls FBGA Monolithic (11mm x 13mm) F/H: Smaller 90balls FBGA Mono Y/P: 54balls CSP DDP M/E: 90balls FBGA DDP
DDR2 SDRAM CC: DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) D5: DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) E6: DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) F7: DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) E7: DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) DDR3 SDRAM F7: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6) F8: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7) G8: DDR3-1066 (533MHz @ CL=8, tRCD=8, tRP=8) H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9) K0: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11) Graphics Memory 18: 1.8ns (550MHz) 04: 0.4ns (2500MHz) 20: 2.0ns (500MHz) 05: 0.5ns (2000MHz) 22: 2.2ns (450MHz) 5C: 0.56ns (1800MHz) 25: 2.5ns (400MHz) 06: 0.62ns (1600MHz) 2C: 2.66ns (375MHz) 6A: 0.66ns (1500MHz) 2A: 2.86ns (350MHz) 07: 0.71ns (1400MHz) 33: 3.3ns (300MHz) 7A: 0.77ns (1300MHz) 36: 3.6ns (275MHz) 08: 0.8ns (1200MHz) 40: 4.0ns (250MHz) 09: 0.9ns (1100MHz) 45: 4.5ns (222MHz) 1 : 1.0ns (1000MHz) 50/5A: 5.0ns (200MHz)
1 : 1.1ns (900MHz) 55: 5.5ns (183MHz) 12: 1.25ns (800MHz) 60: 6.0ns (166MHz) 14: 1.4ns (700MHz) 16: 1.6ns (600MHz) SDRAM (Default CL=3) 50: 5.0ns (200MHz CL=3) 60: 6.0ns (166MHz CL=3) 67: 6.7ns 75: 7.5ns PC133 (133MHz CL=3) XDR DRAM A2: 2.4Gbps, 36ns, 16Cycles B3: 3.2Gbps, 35ns, 20Cycles C3: 3.2Gbps, 35ns, 24Cycles C4: 4.0Gbps, 28ns, 24Cycles DS: Daisychain Sample Mobile-SDRAM 60: 166MHz, CL 3 75: 133MHz, CL 3 80: 125MHz, CL 3 1H: 105MHz, CL 2 1L: 105MHz, CL 3 15: 66MHz, CL 2 & 3 Mobile-DDR C3: 133MHz, CL 3 C2: 100MHz, CL 3 C0: 66MHz, CL 3

Note: All of Lead-free or Halogen-free product are in compliance with RoHS
10. Temp & Power - COMMON (Temp, Power)
C: Commercial, Normal (0C 95C) & Normal Power C: (Mobile Only) Commercial (-25 ~ 70C), Normal Power J: Commercial, Medium L: Commercial, Low (0C 95C) & Low Power L: (Mobile Only) Commercial, Low, i-TCSR F: Commercial, Low, i-TCSR & PASR & DS E: Extended (-25~85C), Normal N: Extended, Low, i-TCSR G: Extended, Low, i-TCSR & PASR & DS I: Industrial, Normal (-40C 85C) & Normal Power P: Industrial, Low (-40C 85C) & Low Power H: Industrial, Low, i-TCSR & PASR & DS
11. Speed (Wafer/Chip Biz/BGD: 00)
DDR SDRAM CC: DDR400 (200MHz @ CL=3, tRCD=3, tRP=3) B3: DDR333 (166MHz @ CL=2.5, tRCD=3, tRP=3) *1 A2: DDR266 (133MHz @ CL=2 , tRCD=3, tRP=3) B0: DDR266 (133MHz @ CL=2.5, tRCD=3, tRP=3)
Note 1: "B3" has compatibility with "A2" and "B0"
Module DRAM Ordering Information
SAMSUNG Memory DIMM Data bits DRAM Component Type Depth Number of Banks Bit Organization
AMB Vendor Speed Temp & Power PCB Revision Package Component Revision
1. Memory Module: M 2. DIMM Type

3: DIMM 4: SODIMM

5. Depth
09: 8M (for 128Mb/512Mb) 17: 16M (for 128Mb/512Mb) 16: 16M 28: 128M 29: 128M (for 128Mb/512Mb) 32: 32M 33: 32M (for 128Mb/512Mb) 51: 512M 52: 512M (for 512Mb/2Gb) 56: 256M 57: 256M (for 512Mb/2Gb) 59: 256M (for 128Mb/512Mb) 64: 64M 65: 64M (for 128Mb/512Mb) 1G: 1G 1K: 1G (for 2Gb)

9. Package

E: FBGA QDP (Lead-free & Halogen-free) G: FBGA H: FBGA (Lead-free & Halogen-free) J: FBGA DDP (Lead-free) M: FBGA DDP (Lead-free & Halogen-free) N: sTSOP Q: FBGA QDP (Lead-free) T: TSOP II (400mil) U: TSOP II (Lead-Free) V: sTSOP II (Lead-Free) Z: FBGA(Lead-free)

3. Data bits

12: x72 184pin Low Profile Registered DIMM 63: x63 PC100 / PC133 SODIMM with SPD for 144pin 64: x64 PC100 / PC133 SODIMM with SPD for 144pin (Intel/JEDEC) 66: x64 Unbuffered DIMM with SPD for 144pin/168pin (Intel/JEDEC) 68: x64 184pin Unbuffered DIMM 70: x64 200pin Unbuffered SODIMM 71: x64 204pin Unbuffered SODIMM 74: x72 /ECC Unbuffered DIMM with SPD for 168pin (Intel/JEDEC) 77: x72 /ECC PLL + Register DIMM with SPD for 168pin (Intel PC100) 78: x64 240pin Unbuffered DIMM 81: x72 184pin ECC unbuffered DIMM 83: x72 184pin Registered DIMM 90: x72 /ECC PLL + Register DIMM 91: x72 240pin ECC unbuffered DIMM 92: x72 240pin VLP Registered DIMM 93: x72 240pin Registered DIMM 95: x72 240pin Fully Buffered DIMM with SPD for 168pin (JEDEC PC133)

Please contact your local Samsung sales representative for latest product offerings.
Note: All parts are lead free
www.samsung.com/semi/flash

MLC Flash

Type Family Density 32Gb Mono 32Gb Based 2bit 16Gb Based 8Gb Based 64Gb DDP 128Gb QDP 16Gb Mono 32Gb DDP 64Gb QDP 8Gb Mono 32Gb mono 3bit 32Gb Based 64Gb DDP 128Gb QDP Technology 27nm 27nm 27nm 32nm 32nm 32nm 32nm 32nm 32nm 32nm Part Number K9HDG08U1A-SCB0 K9LCG08U0A-SCB0 K9GBG08U0A-SCB0 K9GAG08U0E-SCB0 K9LBG08U0E-SCB0 K9HCG08U1E-SCB0 K9G8G08U0C-SCB0 K9CDG08U5A-MCB0001 K9BCG08U1A-MCB0001 K9ABG08U0A-MCB0001 Package Type TSOP - Lead free & Halogen free TSOP - Lead free & Halogen free TSOP - Lead free & Halogen free TSOP - Lead free & Halogen free TSOP - Lead free & Halogen free TSOP - Lead free & Halogen free TSOP - Lead free & Halogen free LGA - Lead free & Halogen free LGA - Lead free & Halogen free LGA - Lead free & Halogen free MOQ Org. x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 Vol(V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 Tray -xxxx0xx T/R -xxx0Txx Moving to 2xnm Q3'10 Moving to 2xnm Q3'10 Moving to 2xnm Q3'Comments
Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead free
SD and MicroSD FLASH CARDS
Application Density 2GB SD Card 4GB 8GB 16GB 2GB 4GB MicroSD Card 8GB 16GB 32GB

Controller

Contact your local Samsung rep for availability and ordering information

Solid State Drives (SSD)

Interface Size Connector Controller Comp. Capacity 64GB SATA II (Native) 2.5" Thin SATA MAX 16Gb 128GB 256GB TMDDR Controller 32Gb Toggle-Mode DDR NAND 512GB 32GB SATA II (Native) mSATA mSATA MAX 16Gb 64GB 128GB
Part Number MZ5PA064HMCD-0A000 MZ5PA128HMCD-0A000 MZ5PA256HMDR-0A000 Contact Sales MZMPA032HMCD-00000 MZMPA064HMDR-00000 MZMPA128HMFU-00000
MLC Flash, SD/MicroSD Flash Cards & SSD
FLASH Product Ordering Information
SAMSUNG Memory NAND Flash Small Classification Density Density Organization Organization Vcc
Pre-Program Version Customer Bad Block Temp Package --Generation Mode
1. Memory (K) 2. NAND Flash : 9 3. Small Classification
(SLC : Single Level Cell, MLC : Multi Level Cell)

Package 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP 100-TQFP 100-TQFP, 165FBGA 100-TQFP, 165FBGA 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP 100-TQFP
Operating Mode SPB SPB SPB SPB FT FT SPB SPB FT (SB) FT (SB) SPB SPB SPB SPB SPB SPB SPB SPB FT FT SPB SPB SB
Vdd (V) 2.5 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3 3.3 3.3 3.3 3.3 3.3 2.5 2.5 2.5 2.5 3.3 3.3 3.3 3.3 3.3
Access Time tCD (ns) 2.6, 3.5 2.6, 3.5 2.6, 3.5 2.6, 3.5 7.5 7.5 2.6, 3.5 2.6, 3.5 6.5 6.5 3.5 3.5 2.6 2.6 3.5 3.5 2.6 2.6 6.5 6.3 6.5
Speed tCYC (MHz) 250, 167 250, 167 250, 167 250, 118 250, 167 250, 200 133
I/O Voltage (V) 2.5 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3, 2.5 3.3,2.5 3.3,2.5 3.3,2.5 3.3,2.5 2.5 2.5 2.5 2.5 3.3, 2.5 3.3, 2.5 3.3,2.5 3.3,2.5 3.3, 2.5
Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs Not for new designs

128Kx36 256Kx18 256Kx18

All TQFP products are lead free NtRAM speed recommendations: For 200MHz use 250MHz; For 133MHz use 167MHz NtRAM speed recommendation: Use 7.5ns Access Time use 6.5ns Access Time Recommended SPB speeds are 250MHz and 167MHz Recommended SB Acess Speed is 7.5ns

Late-Write RR SRAM

Density Organization 1Mx36 2Mx18 256Kx36 8Mb 512Kx18 256Kx36 512Kx18 Part Number K7P323674C K7P321874C K7P803611B K7P801811B K7P803666B K7P801866B Package 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA 119-BGA Operating Mode SP SP SP SP SP SP Vdd (V) 1.8 / 2.5V 1.8 / 2.5V 3.3 3.3 2.5 2.5 Access Time tCD (ns) 1.6, 2.0 1.6, 2.0 1.6 1.2 Speed tCYC (MHz) 300,250 300,250 I/O Voltage (V) 1.5 (Max 1.8) 1.5 (Max 1.8) 1.5 (Max.2.0) 1.5 (Max.2.0) 1.5 (Max.2.0) 1.5 (Max.2.0) Production Status Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
NtRAM & Late Write RR SRAM

DDR SYNCHRONOUS SRAM

Type Density Organization 512Kx36 1Mx18 256Kx36 512Kx18 Part Number K7D163674B K7D161874B K7D803671B K7D801871B K7I641882M 4Mx18 72Mb 2Mx36 K7I641884M K7J641882M K7I643682M K7I643684M K7J643682M K7I321882C 2Mx18 DDR II CIO/ SIO 36Mb 1Mx36 K7I321884C K7J321882C K7I323682C K7I323684C K7J323682C K7I161882B 1Mx18 18Mb 512Kx36 K7I161884B K7J161882B K7J163682B K7I163682B K7I163684B K7K3218T2C 2Mx18 K7K3218U2C 36Mb K7K3236T2C 1Mx36 DDR II+ CIO 1Mx18 K7K1618U2C 18Mb K7K1636T2C 512Kx36 K7K1636U2C

NOTES: 2B = Burst of 2 4B = Burst of 4 SIO = Separate I/O CIO = Common I/O For DDR II CIO/SIO: C-die use 330, 300, or 250MHz instad of 200MHz or 167MHz using a stable DLL circuit For DDR II+ CIO: 2-clock latency is available. A 2.5-clock latency can be supported on 18Mb at 500Mhz and 36Mb at 450MHz
Package 153-BGA 153-BGA 153-BGA 153-BGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA 165-FBGA
Vdd (V) 1.8~2.5 1.8~2.5 2.5 2.5 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8
Access Time tCD (ns) 2.3 2.3 1.7/1.9/2.1 1.7/1.9/2.1 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45 0.45 0.45 0.45 0.45 0.45 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45,0.45,0.45,0.50 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45
Cycle Time (MHz) 330, 300 330, 300 333, 330, 250 333, 330, 250 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250 300,250 300,250 300,250 300,250 300,250 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 300,250,200,167 400, 333 400, 334 400, 333 400, 334 400, 333 400, 334 400, 333 400, 334
I/O Voltage (V) 1.5~1.9 1.5~1.9 1.5 (Max 2.0) 1.5 (Max 2.0) 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5,1.8 1.5 2.5 1.5 2.5 1.5 2.5 1.5 2.5
Production Status Mass Production Mass Production Not for new designs Not for new designs Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production

Comments

16Mb DDR 8Mb
CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B CIO-2B CIO-4B SIO-2B SIO-2B CIO-2B CIO-4B DDRII + CIO-2B, 2 clocks latancy DDRII + CIO-2B, 2.5 clocks latancy DDRII + CIO-2B, 2 clocks latancy DDRII + CIO-2B, 2.5 clocks latancy DDRII + CIO-2B, 2 clocks latancy DDRII + CIO-2B, 2.5 clocks latancy DDRII + CIO-2B, 2 clocks latancy DDRII + CIO-2B, 2.5 clocks latancy

8~9. Vcc, Interface, Mode
00: 3.3V,LVTTL,2E1D WIDE 01: 3.3V,LVTTL,2E2D WIDE 08: 3.3V,LVTTL,2E2D Hi SPEED 09: 3.3V,LVTTL,Hi SPEED 11: 3.3V,HSTL,R-R 12: 3.3V,HSTL,R-L 14: 3.3V,HSTL,R-R Fixed ZQ 22: 3.3V,LVTTL,R-R 23: 3.3V,LVTTL,R-L 25: 3.3V,LVTTL,SB-FT WIDE 30: 1.8/2.5/3.3V,LVTTL,2E1D 31: 1.8/2.5/3.3V,LVTTL,2E2D 35: 1.8/2.5/3.3V,LVTTL,SB-FT 44: 2.5V,LVTTL,2E1D 45: 2.5V,LVTTL,2E2D
20 SRAM Ordering Information

13. Temp, Power

COMMON (Temp,Power) 0: NONE,NONE (Containing of error handling code) C: Commercial,Normal E: Extended,Normal I: Industrial,Normal

MCP: NAND/DRAM

Memory NAND Density DRAM Density (Org.) 256Mb (x16,x32) 1Gb NAND & DRAM 2Gb 4Gb 512Mb (x16,x32) 1Gb (x32) 512Mb (x16,x32) 1Gb (x16,x32) 1Gb (x32) Voltages (NAND-DRAM) 3.0V/1.8V - 1.8V 2.7V/1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 2.7V - 1.8V MCP Package 107/137FBGA 107/137FBGA 137FBGA 107/137FBGA 107/137FBGA 137FBGA PoP Package 152FBGA 119/152FBGA 119/152FBGA 152/160/168FBGA -

MCP: OneNAND/DRAM

Memory OneNAND Density 512Mb DRAM Density (Org.) 256Mb (x32) 512Mb (x16,x32) 512Mb (x16,x32) 1Gb (x32) 512Mb (x16,x32) 2Gb 1Gb (x16,x32) 2Gb (x32) 4Gb 1Gb (x16) Voltages (NAND-DRAM) 3.3V/1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V MCP Package 188FBGA 167/202FBGA 167/202FBGA 167/202FBGA 202FBGA PoP Package 152FBGA 152FBGA 168FBGA 168FBGA 152/160/168FBGA 152/160/168FBGA 152/168FBGA -

1Gb OneNAND & DRAM

MCP: Flex-OneNAND/DRAM
Memory Flex-OneNAND & DRAM Flex-OneNAND Density 8Gb DRAM Density (Org.) 2Gb (x32) Voltages (NAND-DRAM) 1.8V - 1.8V MCP Package 202FBGA PoP Package -
Memory OneNAND & DRAM & OneDRAM

Flex-OneNAND Density 2Gb

DRAM Density (Org.) 1Gb (x16)
Voltages (NAND-DRAM) 1.8V - 1.8V

MCP Package

PoP Package 216FBGA

www.samsung.com/semi/mcp

MCP: OneNAND/DRAM/OneNAND

MCP: moviNAND/NAND/DRAM

Memory movi & NAND Density 512Mb DRAM Density (Org.) 256Mb(x16,x32) 512Mb (x16,x32) 256Mb (x16,x32) moviNAND & NAND & DRAM 1Gb 512Mb (x16,x32) 1Gb (x32) 2Gb 4Gb 512Mb (x16,x32) 1Gb (x16,x32) 1Gb (x32) Voltages (NAND-DRAM) 2.7V/1.8V - 1.8V 2.7V/1.8V - 1.8V 3.0V/1.8V - 1.8V 2.7V/1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 2.7V - 1.8V MCP Package 107/137FBGA 107/137FBGA 107/137FBGA 107/137FBGA 137FBGA 107/137FBGA 107/137FBGA 137FBGA Remark

MCP: NOR/UtRAM

Memory NOR Density 512Mb 256Mb UtRAM Density (Org.) 128Mb 128Mb Voltages (NOR-UtRAM) 1.8V - 1.8V 1.8V - 1.8V 1.8V - 1.8V 64Mb 32Mb 1.8V - 1.8V 1.8V - 1.8V MCP Package 107FBGA 107FBGA 56FBGA 84/88FBGA 84/88FBGA Remark

NOR & UtRAM

MCP: NOR/DRAM
Memory NOR & DRAM NOR Density 512Mb DRAM Density (Org.) 128Mb (x16) 256Mb (x16) Voltages (NOR-DRAM) 1.8V - 1.8V 1.8V - 1.8V Package 103FBGA 103FBGA Remark

moviNAND

moviNAND combines high-density MLC NAND Flash with an MMC controller in a single chip that has an MMC interface. moviNAND delivers dense, cost-effectice storage for embedded applications.
Density 2GB 4GB 8GB 16GB 32GB 64GB
Package Type FBGA FBGA FBGA FBGA FBGA FBGA

Org. x8 x8 x8 x8 x8 x8

Vol (V) 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3
Remarks MMC 4.3 & MMC 4.4
Contact your local Samsung rep for availability and ordering information.
Please contact your local Samsung sales representative for the latest product offerings. Note: All parts are lead free

OneDRAM

OneDRAM is a dual-port, low-power DRAM with an SRAM buffer interface and is optimal for high-performance, high-density mobile applications.
Part Number KJA51Z23PC-AAO
Package Type 216FBGA (14x14)
Org. A-port: x16 (SDR/DDR) B-port: x16 (SDR/DDR) A-port: x16 (SDR/DDR) B-port: x16 (SDR/DDR) A-port: x32SDR B-port: x32DDR" A-port: x16DDR

Vol (V)

512Mb KJA51Y23PC-AAO 152FBGA (14x14)

extended

133MHz

KJA1GW25PD-EAO

KJA1GZ45PD-EAO 1Gb KJA1GZ45PD-EAO 240FBGA (14x14)
B-port: x32DDR" A-port: x16DDR B-port: x16DDR" A-port: x16SDR B-port: x32DDR"

166MHz

KJA1GY25PD-EAO
www.samsung.com/semi/fusion
3.5" Hard Disk Drives
Family Capacity (GB) 320 F1DT 1 TB 1 TB 500 F2EG 1 TB 1.5 TB F750 1TB 500 F3EG 750 1TB 1.5 TB 2 TB FRPM Interface SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA-2 SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps Buffer 16 Sector 512 Model HD083GJ HD084GJ HD161GJ HD162GJ HD251HJ HD252HJ HD321HJ HD322HJ HD501IJ HD502IJ HD642JJ HD752LJ HD753LJ HD102UJ HD103UJ HD502HI HD103SI HD154UI HD164GJ HD254GJ HD324HJ HD163GJ HD253GJ HD323HJ HD502HJ HD754JJ HD103SJ HD253GI HD324HI HD503HI HD754JI HD105SI HD153WI HD203WI HD165GJ HD166GJ HD255GJ HD255GJ HD323HJ

Hard Disk Drives

www.samsung.com/semi/hdd
3.5" Enterprise RAID Drives
Family Capacity (GB) F1R TB 250 F3R 1 TB RPM Interface SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps Buffer Sector Model HE252HJ HE322HJ HE502IJ HE642JJ HE753LJ HE103UJ HE253GJ HE502HJ HE754JJ HE103SJ
2.5" Hard Disk Drives

Family Capacity (GB) M7E 160 MMPMT1 TB RPM 5400 Interface SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps SATA 3.0 Gbps Buffer 8 Sector 512 Model HM161GI HM251HI HM321HI HM501JI HM641JI HM120JI HM161JI HM250II HM320HI HM400HI HM500GI HM250HJ HM320HJ HM500JJ HM640JJ HM750LI HM100UI

www.samsung.com/hdd

BD-COMBO
Interface Speed BD ROM READ 8X BD ROM READ 12X SATA BD-ROM READ 4X Slim Tray O Slot O Type H/H H/H Loading Tray Tray Lightscribe X O X O X Medel TS-HB33A / SH-B083A TS-HB33L / SH-B083L TS-HB43A / SH-B123A TS-HB43L / SH-B123L TS-LB23A / SN-B043A TS-LB23B TS-LB23D TS-LB23L / SN-B043L TS-LB23P TS-TB23L
Interface SATA PATA Speed DVD Write 22X DVD Write 20X DVD Write 20X DVD Write 22X DVD Write 22X SATA DVD Write 24X DVD Write 22X DVD Write 16X PATA SATA DVD Write 22X DVD Write 22X DVD Write 24X Type H/H H/H H/H H/H H/H H/H H/H H/H H/H H/H H/H Loading Tray Tray Tray Tray Tray Tray Tray Tray Tray Tray Tray Lightscribe X X X X X X O O O O O Medel TS-H653G TS-H653H TS-H653J TS-H662A / SH-S222A TS-H663C / SH-S223C TS-H663D / SH-S243D TS-H653R TS-H653T TS-H662L / SH-S222L TS-H663L / SH-S223L TS-H663N / SH-S243N TS-L633B / SN-S083B X Tray Slim O SATA DVD Write 8X Slot Tray Ultra Slim Slot X X O X TS-L633C / SH-S083C TS-L633F / SN-S083F TS-L633J TS-L633N / SN-S083N TS-L633R / SN-S083R TS-L633Y TS-T633C / SN-T083C TS-T633P TS-U633F TS-U633J / SU-S083J TS-D633A TS-D633C

Optical Disk Drives

DVD-W Slim External
Interface Speed Type Slim USB 2.0 DVD Write 8X Ultra Slim Slim Loading Tray Tray Tray Slot Lightscribe X X X O Medel SE-S084C SE-S084D SE-S084F SE-T084P

DVD-ROM

Interface Speed DVD 16X SATA DVD 8X DVD 8X Type H/H Slim Utra Slim Loading Tray Tray Tray Lightscribe X X X Medel TS-H353C / SH-D163J TS-L333B TS-L333D TS-U333A

DVD-W Loader

Interface PATA Speed DVD 8X Type H/H Loading Tray Lightscribe X Medel TS-P632F

Memory

DRAM Flash SRAM MCP Fusion

System LSI

ASICs APs Display Drivers Imaging ICs Foundry

Storage

Solid State Drives Hard Drives Optical Disc Drives

LCD Panels

TV Monitors Notebook PC Mobile
Samsung Semiconductor, Inc. 3655 North First Street San Jose, CA 95134-1713
Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products or product specifications with the intent to improve function or design at any time and without notice and is not required to update this documentation to reflect such changes. This publication does not convey to a purchaser of semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages. Copyright 2010. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co., Ltd. All other names and brands may be claimed as the property of others. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. BR-10-ALL-001 Printed 07/10

doc1

CERTIFICATE OF CONFORMITY
For the following information

Ref. File No.: EM982266B

Product Product Series Model Number
Personal Computer ThinkCenter M90/M90p
(1)3029-XXXX (2)3054-XXXX (3)3139-XXXX (4)3219-XXXX (5)3246-XXXX (6)3282-XXXX (7)3349-XXXX (8)3421-XXXX (9)3544-XXXX (10)3652-XXXX (11)3769-XXXX (12)3934-XXXX (13)4992-XXXX (14)5206-XXXX (15)5267-XXXX (16)5325-XXXX (17)5384-XXXX (18)5450-XXXX (19)5474-XXXX (20)5498-XXXX (21)5554-XXXX (22)5852-XXXX (23)6232-XXXX (24)6590-XXXX
Brand Name Applicant Manufacturer Test Report Number Standards
Lenovo Lenovo (Beijing) Limited Lenovo (Beijing) Limited EM-F980888 FCC 47 CFR Part 15 Subpart B/July 2008 and CISPR 22/1997 and ICES-003 Issue 4 Feb. 2004
We hereby certify that the above product has been tested by us and complied with the FCC official limits. These products might be marketed at the US accordance to FCC Rule based on the standard 47 CFR Part 2 and Part 15 Class B Equipment Regulations. The test was performed accordance to the procedures from ANSI C63.4-2003. The test data & results are issued on the test report no. EM-F980888. Signature
Leon Liu/Deputy General Manager Date: Dec.16, 2009 Test Laboratory: AUDIX Technology Corporation, EMC Department
NVLAP Lab. Code: 200077-0 FCC OET Designation: TW1004 Web Site: www.audixtech.com
The statement is based on a single evaluation of one sample of the above-mentioned products. It does not imply an assessment of the whole production and does not permit the use of the test lab logo.

Lab. Code: 200077-0

Page 1 of 32
TEST REPORT FOR FCC DoC for Lenovo (Beijing) Limited Personal Computer Product Series ThinkCenter M90/M90p Model Number: (1)3029-XXXX (2)3054-XXXX (3)3139-XXXX
(4)3219-XXXX (5)3246-XXXX (6)3282-XXXX (7)3349-XXXX (8)3421-XXXX (9)3544-XXXX (10)3652-XXXX (11)3769-XXXX (12)3934-XXXX (13)4992-XXXX (14)5206-XXXX (15)5267-XXXX (16)5325-XXXX (17)5384-XXXX (18)5450-XXXX (19)5474-XXXX (20)5498-XXXX (21)5554-XXXX (22)5852-XXXX (23)6232-XXXX (24)6590-XXXX

Brand Name: Lenovo

Prepared for : Lenovo (Beijing) Limited Number 6, Shangdi West Road, Shangdi information industry Base, Haidian district, Beijing, China Prepared by : AUDIX Technology Corporation EMC Department No. 53-11, Tin-Fu Tsun, Lin-Kou Hsiang, Taipei Hsien, Taiwan Tel: (02) 2609-9301, 2609-2133 Fax: (02) 2609-9303
File Number Report Number Date of Test Date of Report

Version:1.0

EM982266B (ACS Ref. No.: ACS9Q1740) EM-F980888 Dec. 03. ~ 04, 2009 Dec.16, 2009
AUDIX Technology Corporation Report No.: EM-F980888

Page 2 of 32

TABLE OF CONTENTS

Description Page

Test Report for FCC Compliance Declaration... 3 1. SUMMARY OF STANDARDS AND RESULTS.. 4
1.1. Description of Standards and Results.... 4
2. GENERAL INFORMATION... 5
2.1. 2.2. 2.3. 2.4. 3.1. 3.2. 3.3. 3.4. 3.5. 3.6. 4.1. 4.2. 4.3. 4.4. 4.5. 4.6. Description of EUT.... 5 Description of Tested Supporting Unit and Cable... 9 Description of Test Facility... 11 Measurement Uncertainty.... 11 Test Equipment.... 12 Block Diagram of Test Setup.... 12 Powerline Conducted Emission Limit (15.107(a), Class B)... 13 Operating Condition of EUT.... 13 Test Procedure..... 14 Powerline Conducted Emission Measurement Results... 14 Test Equipment.... 17 Block Diagram of Test Setup.... 17 Radiation Emission Limit ( 15.109(a)(g)/CISPR 22, Class B)... 19 Operating Condition of EUT.... 19 Test Procedure..... 19 Radiated Emission Measurement Results... 20
3. POWERLINE CONDUCTED EMISSION MEASUREMENT... 12
4. RADIATED EMISSION MEASUREMENT.. 17

5. PHOTOGRAPHS.... 28

5.1. Photos of Powerline Conducted Emission Measurement.. 28 5.2. Photos of Radiated Emission Measurement at Open Area Test Site (30-1000MHz). 29 5.3. Photos of Radiated Emission Measurement at Open Area Test Site (Above 1GHz). 31
APPENDIX I (Photos of EUT)
AUDIX Technology Corporation

Report No.: EM-F980888

Page 3 of 32
TEST REPORT FOR FCC COMPLIANCE DECLARATION

Applicant Manufacturer EUT Description (A)Product Series (B) Model Number Lenovo (Beijing) Limited Lenovo (Beijing) Limited Personal Computer ThinkCenter M90/M90p (1)3029-XXXX (2)3054-XXXX (3)3139-XXXX (4)3219-XXXX (5)3246-XXXX (6)3282-XXXX (7)3349-XXXX (8)3421-XXXX (9)3544-XXXX (10)3652-XXXX (11)3769-XXXX (12)3934-XXXX (13)4992-XXXX (14)5206-XXXX (15)5267-XXXX (16)5325-XXXX (17)5384-XXXX (18)5450-XXXX (19)5474-XXXX (20)5498-XXXX (21)5554-XXXX (22)5852-XXXX (23)6232-XXXX (24)6590-XXXX N/A Lenovo 100-127/200V-240Vac, 60/50Hz AC 120V, 60Hz
(C) Serial Number (D) Brand Name (E) Power Supply (F) Test Voltage Measurement Standard Used: FCC 47 CFR Part 15 Subpart B/July 2008 and CISPR 22/1997 ANSI C63.4-2003 ICES-003 Issue 4 Feb. 2004 (NOTE These results are deemed satisfactory evidence of compliance with ICES-003 of the Canadian Interference-Causing Equipment Regulations.) The device described above was tested by AUDIX Technology Corporation, to determine the maximum emission levels emanating from the device. The maximum emission levels were compared to the FCC Part 15 subpart B with the provisions of sections 15.107(a) and 15.109(a)(g) Class B limits both conducted and radiated emissions. The measurement results are contained in this test report and AUDIX Technology Corporation is assumed full responsibility for the accuracy and completeness of these measurements. Also, this report shows that the EUT to be technically compliant with the FCC official limits. This report applies to above tested sample only and which shall not be reproduced in part without written approval of AUDIX Technology Corporation. This report must not be used by the applicant to claim product endorsement by NVLAP or any agency of the U.S. Government. Date of Test : Dec. 03~ 04, 2009 Date of Report : Dec. 16, 2009
Producer: (Julie Hsu/Assistant Administrator) Reviewer: (Ben Cheng/Manager) Signatory: (Leon Liu/Deputy General Manager) Name of the Representative of the Responsible Party : Signature :
Version:1.0 AUDIX Technology Corporation Report No.: EM-F980888

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1. SUMMARY OF STANDARDS AND RESULTS
1.1. Description of Standards and Results
The EUT has been tested according to the applicable standards as referenced below. EMISSION Description of Test Item
Powerline Conducted Emission Measurement

Standard

FCC CFR 47 Part 15 Subpart B: 2008 and ICES-003: 2004

Limits

Class B

Results

Minimum passing margin is 8.66dB at 21.123MHz Class B PASS
Radiated Emission Measurement
FCC CFR 47 Part 15 Subpart B: 2008 and CISPR 22 and ICES-003: 2004
Minimum passing margin is 4.37dB at 134.986MHz

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2. GENERAL INFORMATION

2.1. Description of EUT

Product Product Series Personal Computer ThinkCenter M90/M90p (1)3029-XXXX (2)3054-XXXX (3)3139-XXXX (4)3219-XXXX (5)3246-XXXX (6)3282-XXXX (7)3349-XXXX (8)3421-XXXX (9)3544-XXXX (10)3652-XXXX (11)3769-XXXX (12)3934-XXXX (13)4992-XXXX (14)5206-XXXX (15)5267-XXXX (16)5325-XXXX (17)5384-XXXX (18)5450-XXXX (19)5474-XXXX (20)5498-XXXX (21)5554-XXXX (22)5852-XXXX (23)6232-XXXX (24)6590-XXXX (The model number is postfixed by XXXX. The XXXX can be alphanumeric characters or x can be blank that represent specific models as defined in Model Matrix. The first XXX indicate various combinations of processor speeds, memory, hard drive and other components that have been evaluated to support the model matrix. The last X character is used to indicate which country the model is to be sold to. The model 3029 is representative tested in this report) N/A Lenovo Lenovo (Beijing) Limited Applicant Number 6, Shangdi West Road, Shangdi information industry Base, Haidian district, Beijing, China Lenovo (Beijing) Limited Manufacturer Number 6, Shangdi West Road, Shangdi information industry Base, Haidian district, Beijing, China Back View: Front View: AC In*1 MIC Port*1 VGA Port*1 (On Board) USB Ports*2 Display Port*1(On Board) Earphone Port*1 COM Ports*2 USB Ports*6 LAN Port*1 MIC Port*1 Audio In Port*1 Audio Out Port*1 DVI Port*1 (On Card) Display Port*1 (On Card) 1394 Ports*2 RJ11 Ports*2

Model Number

Serial Number Brand Name

Interface Ports of EUT

Date of Receipt of Sample Date of Test
Dec. 03, 2009 Dec. 03 ~ 04, 2009

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2.1.1. PC Configuration
Item Brand Model/Spec 3.46GHz 3.33GHz 3.20GHz 3.06GHz 2.93GHz 2.80GHz 2.66GHz Melbourne_mATX Tamdhu IV PS-5321-1VA-ROHS PS-5281-02VA-ROHS PS-5281-7VR PC6001 PC9008 PC8041 FSP280-50EPA MT8JTF12864AZ-1G4F1 MT16JTF25664AZ-1G4F1 MICRON MT8JTF12864AZ-1G1F1 MT16JTF25664AZ-1G1F1 HMT112U6BFR8C-H9N0 HMT125U6BFR8C-H9N0 HYNIX HMT112U6BFR8C-G7N0 HMT125U6BFR8C-G7N0 Memory M378B2873EH1-CH9 M378B5673EH1-CH9 SAMSUNG M378B2873EH1-CF8 M378B5673EH1-CF8 M378B5273BH1-CH9 EBJ10UE8BDF0-DJ-F EBJ21UE8BDF0-DJ-F Elpida EBJ10UE8BDF0-AE-F EBJ21UE8BDF0-AE-F Unifosa

Motherboard Chassis

Lenovo Lenovo LITEON

Power Supply AcBel FSP

GU502203EP0201 GU512303EP0202
--------------ATX (10/100/1000M Ethernet) Tamdhu IV - Tower ATX 320W ATX 280W ATX 250W ATX 280W ATX 280W ATX 320W ATX 280W 1GB PC3-10600 1333MHz DDR3 UDIMM 2GB PC3-10600 1333MHz DDR3 UDIMM 1GB PC3-8500 1066MHz DDR3 UDIMM 2GB PC3-8500 1066MHz DDR3 UDIMM 1GB PC3-10600 1333MHz DDR3 UDIMM 2GB PC3-10600 1333MHz DDR3 UDIMM 1GB PC3-8500 1066MHz DDR3 UDIMM 2GB PC3-8500 1066MHz DDR3 UDIMM 1GB PC3-10600 1333MHz DDR3 UDIMM 2GB PC3-10600 1333MHz DDR3 UDIMM 1GB PC3-8500 1066MHz DDR3 UDIMM 2GB PC3-8500 1066MHz DDR3 UDIMM 4GB DDRIII1333 1GB PC3-10600 1333MHz DDR3 UDIMM 2GB PC3-10600 1333MHz DDR3 UDIMM 1GB PC3-8500 1066MHz DDR3 UDIMM 2GB PC3-8500 1066MHz DDR3 UDIMM 1GB DDRIII1333 2GB DDRIII1333

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Model/Spec HDT721016SLA380 HDT721025SLA380 SATA 160GB 7200RPM/3Gb/9M SATA 250GB 7200RPM/3Gb/8M SATA 320GB 7200 RPM/3Gb/8M SATA 500GB 7200RPM/3Gb/16M SATA 1TB 7200RPM/3Gb/32M SATA 160GB 7200RPM/3Gb/11M SATA 250GB 7200RPM/3Gb/11M SATA 320GB 7200 RPM/3Gb/11M SATA 500GB 7200RPM/3Gb/18M SATA 1TB 7200RPM/3Gb/33M SATA 750GB SATA 1500GB SATA 160GB 7200RPM/3Gb/10M SATA 250GB 7200RPM/3Gb/9M SATA 320GB 7200 RPM/3Gb/9M SATA 500GB 7200RPM/3Gb/17M 1.8 inch 128G SSD MLC HDD SATA 160GB 7200RPM/3Gb/8M SATA 250GB 7200RPM/3Gb/10M SATA 320GB 7200 RPM/3Gb/10M SATA 500GB 7200RPM/3Gb/20M SATA750GB 1.8 inch 128G SSD MLC HDD 2.5 inch 150G 10K RPM HDD IEEE 1394 Firewire Adapter (ATX) --USB2.0 MEDIA CARDREADER,25 in 1 ROHS NVDIA GeForce 310 512MB DDR3 (VGA+DP) HP NVIDIA Quadro FX380 (DVI+DP) ATX

Hitachi

HDT721032SLA380 HDT721050SLA360 HDE721010SLA330 ST3160318AS ST3250318AS ST3320418AS
Seagate ST3500418AS ST31000528AS Hard Drive ST3750528AS ST31500341AS HD161GJ HD251HJ Samsung HD321HJ HD502IJ PM800 WD1600AAJS-08L7A0 WD2500AAJS-08L7A0 WD WD3200AAJS-08L7A0 WD5000AAKS-08A7B2 Toshiba WD-Viking 1394 Card (Optional) Modem Card (Optinoal) Card Reader (Optional) Graphic Card USI Conexant Bitland MSI Bitland NVIDIA WD7502AALS-22E3A0 Daikoku WD1500 BLFS-08 HI-1582TN RD01-D850 46R1528 Geforce 310 Geforce 310 FX380

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Dongle
Brand Foxconn Luxshare Luxshare Foxconn Foxconn Longwell HLDS HLDS TSST TSST PLDS PLDS SONY Optiarc SONY Optiarc
Model/Spec CQJ20D02CR4-K13-DF LX500173 LX500190 CQJ20D02D15-K23-DF CD17A00D15-C10-1F CH2010020013610 DH10N GH40N TS-H653G TS-H353B DH-16D5S DH-16AAS AD-7230S DDU1681S

DP to DVI dongle 200mm Display port to VGA dongle DVI_I(M)-VGA(F) adpater DVD-ROM Drive 16x/48x - SATA Super Multi DVD Rewriter 8 - SATA DVD Writer 8 - SATA DVD-ROM Drive 16x/48x - SATA DVD-ROM Drive 16x/48x - SATA DVD/CD Rewritable Drive 8 - SATA DVD/CD Rewritable Drive 8 - SATA DVD-ROM Drive 16x/48x - SATA

Optical Driver

2.1.2. Test Mode of PC Configuration EUT Configuration Main Board Chassis Power Supply CPU Memory Hard Disk Optical Drive Card Reader Video Card 1394 Card Modem Card Dongle Mode1 Q57-ATX (10/100/1000M Ethernet) Tamdhu IV Tower(25L) Acbel PCW (88plus) - Robust, JP Clarkdale Core i5-670 3.46G 1333MHz Elpida EBJ21UE8BDF0-DJ-F 2GB PC3-10600 1333MHz DDR3 UDIMM Samsung HD502IJ 500 GB 7200rpm SATA HLDS GH40N, Super Multi DVD Rewriter N/A NVIDIA FX380 ATX (DVI+DP) USI, HI-1582TN Conexant, RD01-D850 Luxshare LX500190 Display port to VGA dongle

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Description of Tested Supporting Unit and Cable
2.2.1. Support Peripheral Unit
No. 1. 2. 3. 4. 5. 6. 7. 8. 9.
Product LCD Monitor LCD Monitor USB Keyboard USB Mouse Laser Printer
Brand Lenovo Lenovo Lenovo Lenovo SAMUSNG
Model No. L2361pwA L2240pwD KU-0225 MO28UOL ML-1630 55Y9263 55Y9263 A1204 N/A 41A5330 HD-303 MC-001 RQ-P35LT-K 328 S-U2eS NST-200SU-BK K-2500TRP DM-1414 RTW030 KX-TA308BX 8806-A26 L2361pwA 3392 MO28UOL DM-1414 N/A N/A 3392

Serial No.

FCC ID FCC DoC Approved FCC DoC Approved FCC DoC Approved FCC DoC Approved FCC DoC Approved FCC DoC Approved N/A N/A N/A N/A N/A N/A FCC DoC Approved FCC DoC Approved N/A IFAXDM1414 H8NRTW030 N/A FCC DoC Approved FCC DoC Approved FCC DoC Approved FCC DoC Approved IFAXDM1414

4408467

4561B1CP600023X A3LML1630 P/N: 55Y9262 P/N: 55Y9262 4H722TFVVTE N/A 60109 N/A N/A HA08715 N/A N/A 122B1077087 0FBSK003863 L3A0356 N/A KU-980034387
Lenovo USB Lenovo Portable Hard Drive Lenovo USB Lenovo Portable Hard Drive

I-POD Player Earphone

APPLE APPLE Lenovo Multimedia Microphone System heng Jia Panasonic Linger VANTEC Kuo Yang Accex HwaCom Panasonic Lenovo Lenovo Lenovo Lenovo Accex
10. Speaker 11. Microphone 12. Microphone 13. Walkman 14. e-SATA HDD 15. e-SATA HDD 16. TELEPHONE 17. Modem 18. Wireless LAN AP 19. Advance Hybrid System
20. PC System 21. 15 LCD Monitor 22. USB Keyboard 23. USB Mouse 24. Modem

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2.2.2. Cable Lists
No. 1. Signal Cable Description Of The Above Support Units D-Sub Cable: Shielded, Detachable, 1.8m, Bonded two ferrite cores DP to D-Sub Dongle 2. DVI Cable: Shielded, Detachable, 1.8m, Bonded two ferrite cores 3. USB Cable: Shielded, Undetachable, 1.8m 4. USB Cable: Shielded, Undetachable, 1.8m 5. USB Cable: Shielded, Detachable, 1.8m 6. USB Cable: Shielded, Detachable, 0.6m 7. USB Cable: Shielded, Detachable, 0.6m 8. USB Cable: Shielded, Detachable, 1.0m 9. EAR Cable: Non-Shielded, Undetachable, 0.9m 10. Audio Cable: Non-Shielded, Detachable, 1.8m 11. Cable: Non-Shielded, Undetachable, 2.2m 12. Cable: Non-Shielded, Undetachable, 2.1m 13. Cable: Non-Shielded, Detachable, 1.8m e-SATA Cable: Shield, Detachable, 1.0m USB Cable: Shield, Detachable, 1.5m e-SATA Cable: Shield, Detachable, 0.6m 15. USB Cable: Shield, Detachable, 1.5m 14. 16. Telephone Line: Non-Shielded, Detachable, 1.8m 17. RS-232 Cable: Shielded, Detachable, 1.2m 18. LAN Cable: Non-Shielded, Detachable, 20m (To EUT) Telephone Cable: Non-Shielded, Detachable, 20m (To EUT) 19. Telephone Line: Non-Shielded, Detachable, 1.8m (To Modem) 20. LAN Cable: Non-Shielded, Detachable, 1.8m 21. 22. 23. 24. 25. 26. 27. Note D-Sub Cable: Shielded, Detachable, 1.8m, Bonded two ferrite cores USB Cable: Shielded, Undetachable, 1.8m USB Cable: Shielded, Undetachable, 1.8m RS-232 Cable: Shielded, Detachable, 1.2m Display Cable: Shielded, Detachable, 1.8m D-Sub Cable: Shielded, Detachable, 1.8m, Bonded two ferrite cores RS232 Cable: Shielded, Detachable, 1.8m 1. 2. 3. 4. 5. 6. 7. Support Unit 1, 2, 5, 20, 21: Power Cord: Non-Shielded, Detachable, 1.8m Support Unit 10 AC Adapter: M/N: A48-2100A; Cord: Non-Shielded, Undetachable, 1.8m Support Unit 17 AC Adapter: M/N AM-91000A; Cord: Non-Shielded, Undetachable, 1.8m. Support Unit 18: AC Adapter: M/N AD-121ANDT; Cord: Non-Shielded, Undetachable, 3m Support Unit 19: AC Adapter: M/N AF1805-A; Cord: Non-Shielded, Undetachable, 1.8m Support Unit 24: AC Adapter: M/N AM-91000A; Cord: Non-Shielded, Undetachable, 1.8m. The support units (18-24) are communicated partner system.

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2.3. Description of Test Facility
Name of Firm AUDIX Technology Corporation EMC Department No. 53-11, Tin-Fu Tsun, Lin-Kou Hsiang, Taipei Hsien, Taiwan No. 5 Shielded Room No. 67-4, Tin-Fu Tsun, Lin-Kou Hsiang, Taipei Hsien, Taiwan No.8 Open Area Test Site No. 67-4, Tin-Fu Tsun, Lin-Kou Hsiang, Taipei Hsien, Taiwan Federal Communication Commission Registration Number: 220521 Renewal on September 25, 2007 NVLAP Lab. Code TAF Accreditation No 200077-0 1724

Test Site (C5/R8)

2.4. Measurement Uncertainty
Test Item Conduction Test Radiation Test (Distance: 10m) Radiation Test (Distance: 3m) Frequency Range 150kHz~30MHz 30MHz~300MHz 300MHz~1000MHz 30MHz~300MHz 300MHz~1000MHz 1GHz-18GHz Remark : Uncertainty = kuc(y) Uncertainty (dB) 1.73dB 2.99dB 2.73dB 2.91dB 2.94dB 3.527dB

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3. POWERLINE CONDUCTED EMISSION MEASUREMENT

3.1. Test Equipment

The following test equipment was used during the powerline conducted emission measurement (No. 5 Shielded Room)
Type Item 1. Test Receiver 2. A.M.N. 3. L.I.S.N. Manufacturer R&S R&S Kyoritsu Model No. ESCS30 ENV4200 KNW-407 Serial No. 8-1539-3 Last Cal. Jun. 18, 09 Jun. 08, 09 Nov. 03, 09 Next Cal. Jun. 17, 10 Jun. 07, 10 Nov. 02, 10
3.2. Block Diagram of Test Setup
3.2.1. Block Diagram of Connection between EUT and Peripherals

AC POWER SOURCE

TRANSFORMER

A.M.N.

KEYBOARD

TELEPHONE

TEST RECEIVER IPOD PERSONAL COMPUTER PRINTER

USB PORTABLE HDD #1, #2

e-SATA HDD #1, #2

PERSONAL COMPUTER (EUT)

WAKMAN MODEM

PRINTER

MICROPHONE #1, #2

SPEAKER

MONITOR #1, #2 EARPHONE L.I.S.N.

WIRELESS LAN AP

: POWER LINE : SIGNAL LINE : 50 OHM TERMINATOR
ADVANCE HYBRID SYSTEM MODEM

PC SYSTEM PARTNER SYSTEM

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3.2.2.

Shielded Room Setup Diagram
Peripherals Test Receiver Table

Ground Plane

3.3. Powerline Conducted Emission Limit (15.107(a), Class B)
Frequency 150kHz ~ 500kHz 500kHz ~ 5MHz 5MHz ~ 30MHz Maximum RF Line Voltage Quasi-Peak Level Average Level 66 ~ 56 dBV 56 ~ 46 dBV 56 dBV 46 dBV 60 dBV 50 dBV
Remark: 1. If the average limit is met when using a Quasi-Peak detector, the EUT shall be deemed to meet both limits and measurement with the average detector is unnecessary. 2. The lower limit applies at the band edges.
3.4. Operating Condition of EUT
EUT Exercise Program and Condition Operating System Test Program Graphic Controller Disk Controller Audio Controller LAN & RJ11 Controller Serial Ports e-SATA Port Windows 7 Rtpx V4.0.exe Display scrolling H pattern with r with 1920 x 1200/60Hz resolution Read/Write operation to hard disk Play 1kHz audio signal Data transfer to client Read/Write operation to USB I-Pod Player and portable hard drive Sent H (Arial 10) to printer Read/Write operation to e-SATA hard disk.

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3.5. Test Procedure
The EUT was put on table which was above the ground by 80cm and its power cord was connected to the AC mains through an Artificial Mains Network (A.M.N.). The other peripheral devices power cord connected to the power mains through a line impedance stabilization network (L.I.S.N.). This provided a 50 coupling impedance for the tested equipments. Both sides of A.C. line were checked for maximum conducted interference. In order to find the maximum emission, the relative positions of equipment and all of the interface cables were changed according to FCC ANSI C63.4-2003 during conducted measurement. The bandwidth of the R&S Test Receiver ESCS30 was set at 9kHz. The frequency range from 150kHz to 30MHz was pre-scanned with a peak detector. The all final readings from Test Receiver were measured with the Quasi-Peak detector and Average detector. (Remark: If the Average limit is met when using a Quasi-Peak detector, the Average detector is unnecessary)
3.6. Powerline Conducted Emission Measurement Results
PASSED. (All emissions not reported below are too low against the prescribed limits.) The EUT with the following test mode was performed during this section testing and all the test results are listed in next pages. EUT Personal Computer Test Date Dec. 02, 2009 The details are as follows
Reference Test Data No. Mode CPU Power Supply Operation, Resolution Neutral 1. Intel, 3.46G AcBel, PC8041 VGA+DVI 1920*1200/60Hz #2 Line #1
M/N 3029 Temperature 22 Humidity 63

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4. RADIATED EMISSION MEASUREMENT

4.1. Test Equipment

The following test equipment was used during the radiated emission measurement 4.1.1. For 30MHz~1000MHz Frequency (At No.8 Open Area Test Site)
Item 1. 2. 3. 4. Type Spectrum Analyzer Test Receiver Amplifier Bilog Antenna Manufacturer Model No. Serial No. Last Cal. Agilent E7405A MY42000133 Jul. 08, 09 R&S ESCI 100558 Oct. 23, 09 HP 8447D 2944A06891 N/A Schaffner CBL6112B 2735 Mar.20, 09 Next Cal. Jul. 07, 10 Oct. 22, 10 N/A Mar.19, 10

4.1.2. For 1GHz-18GHz Frequency (At No.8 Open Area Test Site) Item Type Manufacturer Model No.
Agilent HP EMCO E7405A 8449B 3115

Last Cal.

Next Cal.
Jul. 07, 10 Jun. 18, 10 Jul. 08, 10
1. Spectrum Analyzer 2. Amplifier 3. Horn Antenna
MY42000133 Jul. 08, 09 3008A01284 Jun. 17, 09 9609-4927 Jul. 09, 09
4.2. Block Diagram of Test Setup
4.2.1. Block Diagram of connection between EUT and simulators

KEYBOARD TELEPHONE MOUSE

IPOD AC POWER SOURCE

MONITOR #1, #2 EARPHONE

: POWER LINE : SIGNAL LINE

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4.2.2. Open Area Test Site Setup Diagram (10m) for 30-1000MHz Antenna Tower
Antenna Elevation Varies From 1 To 4 Meters

Peripherals

Turn Table Ground Plane
Test Receiver 4.2.3. Open Area Test Site Setup Diagram (3m) for 1GHz-18GHz Antenna Tower

Test Receiver

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4.3. Radiation Emission Limit ( 15.109(a)(g)/CISPR 22, Class B)
FREQUENCY (MHz) 30 ~ ~ 1000 Above 1000 Above 1000

DISTANCE (Meters) 3 3

FIELD STRENGTHS LIMITS (dBV/m) 54.0 (Average) 74.0 (Peak)
(1) The tighter limit applies at the edge between two frequency bands. (2) Distance refers to the distance in meters between the measuring instrument antenna and the closed point of any part of the E.U.T. (3) There is no over 1GHz limits in CISPR 22 standard. Therefore, a FCC limit is used based on CFR 47 Part 15.35 (b) and Part 15.109 (g).
4.4. Operating Condition of EUT
Same as conducted measurement which is listed in 3.4. except the test set up replaced by section 4.2.

4.5. Test Procedure

4.5.1. For Frequency Range was 30MHz-1000MHz which measurement distance was 10m at Open Area Test Site: The EUT and its simulators were placed on a turn table which was 0.8 meter above the ground. The turn table rotated 360 degrees to determine the position of the maximum emission level. EUT was set 3 meters at open area test site away from the receiving antenna which was mounted on an antenna tower. The antenna could be moved up and down between 1 to 4 meters to find out the maximum emission level. Broadband antenna (calibrated Bilog antenna) was used as a receiving antenna. Both horizontal and vertical polarization of the antenna were set on measurement. In order to find the maximum emission, all of the interface cables were manipulated according to ANSI C63.4-2003 on radiated measurement The bandwidth of the R&S Test Receiver ESCI was set at 120kHz. The frequency range from 30MHz to 1000MHz was pre-scanned with a peak detector and all final readings from test receiver were measured with Quasi-Peak detector.

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4.5.2. For Frequency Range was1GHz-18GHz which measurement distance was 3m at Open Area Test Site: The EUT and its simulators were placed on a turn table which was 0.8 meter above ground. The turn table rotated 360 degrees to determine the position of the maximum emission level, EUT was set to 3 meters away from the receiving antenna which was mounted on a antenna tower. The antenna could be moved up and down between 1 meter and 4 meters (maximum emission level receiving position) above the ground. A calibrated Horn Antenna was used as a receiving antenna. Both horizontal and vertical polarization of the antenna were set on measurement, and both average and peak emission level were recorded form spectrum analyzer. In order to find the maximum emission level, all the interface cables were manipulated according to ANSI C63.4-2003 on radiated measurements. The resolution bandwidth of the HP Spectrum Analyzer 8593EM was set at 1MHz. The frequency range from 1GHz to 18GHz was pre-scanned and all final readings of measurement were with Peak detector and Average value.

4.6. Radiated Emission Measurement Results
PASSED. (All emissions not reported below are too low against the prescribed limits.) For 30MHz~1000MHz frequency range: The EUT with the following test mode was performed during this section testing and all the test results and all the test results are listed in section 4.6.1. EUT Personal Computer Test Date Dec. 03, 2009 The details are as follows
Reference Test Data No. Mode CPU Power Supply Operation, Resolution Horizontal 1. Intel, 3.46G AcBel, PC8041 VGA+DVI 1920*1200/60Hz #2 Vertical #1
M/N 3029 Temperature 20 Humidity 68

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For 1GHz-18GHz frequency range: The EUT with the following test mode was performed during this section testing and all the test results and all the test results are listed in section 4.6.2. Test Date Dec. 03, 2009 The details are as follows
Reference Test Data No. Mode CPU Power Supply Operation, Resolution Horizontal Peak 1. Average #4 Vertical Peak #5 Average #6

Temperature 20

Humidity 68

Intel, 3.46G

AcBel, PC8041

VGA+DVI 1920*1200/60Hz

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4.6.1. Radiated Emission Measurement Results at Open Area Test Site Setup

Diagram (30 ~ 1000MHz)

3. The worst emission was detected at 667.415MHz with corrected signal level of 30.98dBV/m (limit is 37.0dBV/m) when the antenna was at horizontal polarization and was at 4m high and the turn table was at 325. 4. 0was the table front facing the antenna. Degree is calculated from 0clockwise facing the antenna.

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3. The worst emission was detected at 134.986MHz with corrected signal level of 25.63dBV/m (limit is 30.0dBV/m) when the antenna was at vertical polarization and was at 1m high and the turn table was at 180. 4. 0was the table front facing the antenna. Degree is calculated from 0clockwise facing the antenna.

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4.6.2. Radiated Emission Measurement Results at Open Area Test Site Setup

Diagram (1GHz-18GHz)

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5. PHOTOGRAPHS
5.1. Photos of Powerline Conducted Emission Measurement
FRONT VIEW OF CONDUCTED MEASUREMENT
BACK VIEW OF CONDUCTED MEASUREMENT

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5.2. Photos of Radiated Emission Measurement at Open Area Test Site (30-1000MHz)
FRONT VIEW OF RADIATED MEASUREMENT
BACK VIEW OF RADIATED MEASUREMENT

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SETUP WITH MAXIMUM DETECTED EMISSION AT HORIZONTAL POLARIZATION
SETUP WITH MAXIMUM DETECTED EMISSION AT VERTICAL POLARIZATION

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5.3. Photos of Radiated Emission Measurement at Open Area Test Site (Above 1GHz)

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Partner System

APPENDIX I

(Photos of EUT)

(Total Pages: 17 Pages)

APPENDIX I - Page 1 of 17
Figure 1 General Appearance of the EUT
Figure 2 General Appearance of the EUT
APPENDIX I - Page 2 of 17
Figure 3 General Appearance of the EUT
Figure 4 General Appearance of the EUT
APPENDIX I - Page 3 of 17
Figure 5 Inside of the EUT
Figure 6 Inside of the EUT
APPENDIX I - Page 4 of 17

Figure 7 DVD ROM

Figure 8 DVD ROM
APPENDIX I - Page 5 of 17

Figure 9 DVD ROM

Figure 10 Hard Drive
APPENDIX I - Page 6 of 17

Figure 11 Hard Drive

Figure 12 Hard Drive
APPENDIX I - Page 7 of 17

Figure 13 Power

Figure 14 Power
APPENDIX I - Page 8 of 17

Figure 15 Power

Figure 16 I/O Ports of the MIC & Audio & USB
APPENDIX I - Page 9 of 17

Figure 17 CPU

Figure 18 CPU
APPENDIX I - Page 10 of 17

Figure 19 Heat Sink

Figure 20 Motherboard
APPENDIX I - Page 11 of 17

Figure 21 Motherboard

Figure 22 Motherboard
APPENDIX I - Page 12 of 17

Figure 23 Graphic Card

Figure 24 Graphic Card
APPENDIX I - Page 13 of 17

Figure 25 Graphic Card

Figure 26 Memory Card
APPENDIX I - Page 14 of 17

Figure 27 Memory Card

Figure Card
APPENDIX I - Page 15 of 17

Figure 30 Modem Card

APPENDIX I - Page 16 of 17

Figure 31 Modem Card

Figure 32 Dongle
APPENDIX I - Page 17 of 17
Figure 33 Inside of the EUT

 

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