Dell OptiPlex 745 Tech Specs

MINITOWER

DESKTOP

SMALL FORM

ULTRA SMALL FORM FACTOR

CHIPSET OPERATING SYSTEM

Intel Q965 (ICH8) Express Chipset Dell Supports: Microsoft Windows XP Professional Microsoft Windows XP Home Edition

PROCESSOR

Intel Core 2 Duo 1066MHz FSB Socket T with Dual Core technology XD, EM64T, 2MB and up to 4MB L2 cache, EIST and VT (E6000 series) Intel Pentium D 800MHz FSB Socket T with Dual Core technology XD, EM64T, 2x2MB L2 cache, EIST, and VT on 950/960 (900 series) Intel Pentium D 800MHz FSB Socket T with Dual Core technology XD, EM64T, 2x1MB L2 cache (800 series) Intel Pentium 4 800MHz FSB Socket T with HT, XD, EM64T, and 1MB L2 cache (500 series) Intel Celeron D 533 MHz FSB Socket T with XD and EM64T (300 series)
NETWORK CONTROLLER SYSTEMS MANAGEMENT MEMORY DIMM Slots Type Speed Modules Types Supported Minimum memory Maximum memory Bandwidth
Broadcom 5754 Gigabit Ethernet LAN solution 10/100/1000 Ethernet with Remote Wake Up and PXE support Broadcom Full ASF 2.0

Two 533/667 MHz memory

Dual channel shared DDR2 SDRAM system memory. Unbuffered, non-ECC DIMMs only 533MHz (4-4-4 latency), 667MHz (5-5-5 latency), 800MHz (6-6-6 latency) 512-MB, 1-GB, or 2-GB (800MHz not available in 2GB DIMM) Dual-channel: 1GB Single-channel: 512 MB 8 GB (2GB per channel) 533MHz: Up to 8.5 GB/s in dual channel mode 667MHz: 10.7 GB/s with dual channel 800MHz: 12.8 GB/s with dual channel *USFF does not support 800MHz One One 0 One Two SATA connectors Supporting one device each One designated for hard drive One designated for optical SATA only drives One slim-line One slim-line 0 One Two SATA connectors Supporting one device One designated for hard drive One designated for optical Slim-line optical PATA drive D-mod PATA drive One One One SATA connector Supporting one device Designated for hard drive 4 GB (2GB per channel)
DRIVE BAYS AVAILABLE 3 1/2 bay 5 1/4 bay D-bay (notebook modules) Hard Drives Supported INTERFACES & CONNECTORS Connectors Four SATA connectors Supporting one device each Two designated for hard drives Two designated for optical Drive Interfaces SATA only drives One Two 0 Two
HARD DRIVE OPTIONS Supported Types Available Drives SMART Technology Burst Transfer Rate Partition Support SYSTEM BOARD CONNECTORS Serial ATA Floppy drive Serial Fan PCI 2.3 Front panel STANDARD I/O PORTS Display Port USB 2.0 Serial Port Optional Adapters Internal USB Parallel Port Ethernet Network Stereo line-in Speakers, line-out Microphone-in Headphone COMPUTER INFORMATION System Clock Data bus width Address bus width DMA channels Interrupt levels EXPANSION BUS INFORMATION PCI 2.3 PCI Express 1.0a SATA 1.0a and 2.0 USB 2.0 PCI-E x1 Available slots Connector Size Data Bus Voltage Power PCI Available slots
Serial ATA or Serial ATA 3.0

SMALL FORM FACTOR

7200RPM SATA 3.0Gb/s: 80GB, 160GB, 250GB4 7200RPM 10K RPM SATA 1.5Gb/s: 80GB SMART III 300 Mbit/s MS Windows XP Professional SP2: Support both FAT16 and FAT32. FAT32 will be the default configuration MS Windows XP Home SP2: Support both FAT16 a Four 7-pin connectors 34-pin connector 12-pin connector, optional second serial port card (not available on USFF) 5-pin connector 120-pin connector 40-pin connector Two 7-pin connectors Two 7-pin connectors One 7-pin connector
* Front ports may be disabled
1 VGA Out (15-hole) Two front and six rear One, rear. One, rear. 12-pin proprietary connector for PS/2 adapter or a second serial port. 10-pin connector for optional media bay device One, rear (25-hole, bi-directional) One, rear (RJ45) One minijack, rear One minijack, rear One minijack, front One minijack, front Utilizes the CK-505 clock synthesizer chip, which incorporates Intel specifications for clock generation 64 bits 36 bits Eight 24 PCI: 33 MHz PCI Express x1: 5 Gbps PCI Express x16: 80 Gbps SATA: 1.5 and 3.0 Gbps USB: 480 Mbps One full height 36 pins One bi-directional differential lane pair (2.5Gbs per lane) 5Gbs total 3.3V 10 W (x1) Two Full-Height Two Low-Profile on board Riser options: * - Dual PCI Riser - Combo x16/PCI Riser One Low-Profile Not available Not available Not available Not available DVI-I Out Two front and five rear One rear Not available on USFF
Connector size Data Bus Voltage PCI Express x16 Available slots Connector Size Data Bus Voltage Power
120 pins 32Bit/33MHz 3.3 Volt External Operation (some pins 5 Volt Tolerant); 1.8V internal regulation One Full-Height One Low-Profile Riser option: * Combo x16/PCI Riser 164 pins 16 bi-directional differential lane pair (2.5Gbs per lane) 80Gbs total 12V 75 W (x16) maximum One Low-Profile Not available

* One low-profile slot remains available on board when riser installed
Integrated Intel Graphics Media Accelerator 965 Graphics Core Memory Maximum Resolution RAMDAC Display Interface Dual Monitor Support Display Rotation Support Core Processor Speed 3D Setup & Render Engine Controller clock speed (MHz)
Intel Graphics Media Accelerator 3000 None dedicated. Uses up to 256MB shared with system memory Supports 640 x 480 up to 1920 x 1200 (refresh rates and additional resolutions are dependant on display) 400MHz, 24-bit VGA DB-15 (analog) Yes, in conjunction with discrete graphics card Yes 667MHz Supports D3D and OGL Pixilation Rules Core Frequency: 667MHZ sDVO Frequency: 270MHz DVI-I native. Optional Y-dongle Cable provides VGA output. Yes, with dual dongle
DVI (Digital) Adapter Card Memory Card Type Maximum Resolution Display Interface Dual Monitor Support Options Details 128MB ATI Radeon X1300 Memory Card Type Maximum Resolution RAMDAC Display Interface Dual Monitor Support Display Rotation Support Options 256MB ATI Radeon X1300 Pro Memory Card Type Maximum Resolution RAMDAC Display Interface Dual Monitor Support Display Rotation Support Options AUDIO Type Stereo conversion ADI 1983 High Definition Audio 20-bit analog-to-digital; 20-bit digital-to-analog 256MB DDR SDRAM PCI Express Xx 1200 @ 75Hz & 16.7 million colors Dual 400MHz Dual VGA (DB-15) or DVI via optional DMS-59 cables Yes Yes Full height or low profile Not available Integrated graphics only DVI-I output 128MB DDR SDRAM PCI Express Xx 1200 @ 75 Hz & 16.7 million colors Dual 400MHz Single DVI-I (VGA via included DVI to VGA Adapter) and S-Video TV-Out No Yes Full height or low profile Not available Integrated graphics only DVI-I output Uses integrated graphics. No memory dedicated Intel digital video output via PCI Express 1920 x 1200 @ 60 Hz & 16.7 million colors DVI-D Extended Desktop using two display adapters Clone and Twin display capabilities Full height or low profile Uses Integrated GraphicsIntel digital video output via PCI Express Not available Integrated graphics only DVI-I output
POWER DC Power Supply - Wattage Power Efficiency Heat Dissipation * Voltage - Manual selection Backup battery POWER MANAGEMENT ACPI Wake-Up Event Power Button RTC Alarm Wake On LAN PME Serial Port Ring USB Keyboard Mouse CHASSIS DIMENSIONS Height Width Depth Weight Volume PHYSICAL ATTRIBUTES Temperature Operating Storage Relative humidity Maximum vibration Operating Storage Maximum shock Operating Storage Altitude Operating Storage 305W 76%

280W 76%

275W 76% 939 BTU/hr
220W (External power brick) 80% 751 BTU/hr External - Auto sensing

1041 BTU/hr

956 BTU/hr
* NOTE: Heat dissipation is calculated based upon the power supply rating. Does not include peripherals. Manual selection power supplies: 90 to 135 V at 50/60 Hz; 180 to 265 V at 50/60 Hz 3-V CR2032 coin cell, Lithium ion
System Wakes From Suspend or soft-off Suspend or soft-off Suspend or soft-off Suspend or soft-off Suspend or soft-off Suspend only Suspend only Suspend only
41.4 cm (16.3 inches) 18.5 cm (7.3 inches) 43.8 cm (17.3 inches) 12.34 kg (27.2 lb) 33 Liters
11.4 cm (4.5 inches) 39.9 cm (15.7 inches) 35.3 cm (13.9 inches) 10.4 kg (23 lb) 15.7 Liters
9.26 cm (3.65 inches) 31.37 cm (12.35 inches) 34.03 cm (13.4 inches) 7.4 kg (16.4 lb) 9.97 Liters
26.4 cm (10.37 inches) 8.9 cm (3.5 inches) 25.3 cm (9.95 inches) 4.5 kg (10 lb) 6 Liters
10 to 35C (50 to 95F) 40 to 65C (40 to 149F) 20% to 80% (non-condensing) 0.25 G at 3 to 200 Hz at 0.5 octave/min 0.5 G at 3 to 200 Hz at 1 octave/min Bottom half-sine pulse with a change in velocity of 50.8 cm/sec (20 inches/sec) 27-G faired square wave with a velocity change of 508 cm/sec (200 inches/sec) 15.2 to 3048 m (50 to 10,000 ft) 15.2 to 10,668 m (50 to 35,000 ft)

10 to 30C (50 to 86F)

ENCLOSURE & VENTILATION REQUIREMENTS

Enclosure Ventilation

If your enclosure has doors, they need to be of a type that allows at least 30% airflow through the enclosure (front and back).
Enclosure Minimum Clearance
Leave a 10.2 cm (4 in.) minimum clearance on all vented sides of the computer to permit the airflow required for proper ventilation.

Recommended Enclosure

Do not install your computer in an enclosure that does not allow airflow. This restricts the airflow and impacts your computers performance, possibly causing it to overheat.
Open Desk Minimum Clearance
If your computer is installed in a corner, on a desk, or under a desk, leave at least 5.1 cm (2 in.) clearance from the back of the computer to the wall to permit the airflow required for proper ventilation.

STANDARDS

TCO99, Blue Angel, Green PC, Energy Star, BSMI, C-TICK, CE, FCC, IRAM, NEMKO, NFPA99, SABS, SASO, TCO, TUV, UL, VCCI, USB 2.0, WEEE
BIOS Factory Defaults (All Chassis) BIOS address BIOS chip (NVRAM) Setup Option Parallel Port mode Parallel Port address Wake on LAN EIST Onboard Audio Onboard Modem Flex bay Execute Disable Onboard NIC PS2 Mouse Onboard USB F0000h 8Mb Default Factory Value PS/Off Off On On On (no boot) On On (without PXE) On On USB front panel Module bay Serial #1 Port Keyboard Num lock Keyboard error report Onboard Video HD Acoustic mode Onboard Video buffer Primary Video Suspend mode Chassis intrusion TPM Smart drive error report A/C recovery On On Auto Report On Auto Bypass 8MB Add-in S3 On Off Off Off Low power mode Password POST hot keys SATA drives Floppy Limit CPUID ASF Settings HD Password Hyper-threading Auto Power on Auto Power time SERR Fast Boot Off Disabled Setup & Boot Menu On Internal Off Off Disabled On Off 12:00am On On

DISPLAYS CRT Dell Flat Panel Analog
17 E773s (16.0 viewable) Conventional CRT 17 E773MM (16.0 viewable) Multimedia CRT 15 E157FP Flat Panel 17 E177FP Flat Panel 19 E197FP Flat Panel
Dell UltraSharp Digital Flat Panel Adjustable Stand, VGA/DVI
17 UltraSharp 1707FP 17 UltraSharp 1707FPV 19 UltraSharp 1907FP 19 UltraSharp 1907FPV 20 UltraSharp 2007FP
Dell Widescreen UltraSharp Digital Flat Panel Dell All-In-One UltraSharp Solution PERIPHERALS Keyboard
20 Widescreen UltraSharp 2007FPW 24 Widescreen UltraSharp 2407FPW None UltraSharp 1706FP All-In-One
Dell USB Keyboard, No Hot Keys Dell USB Enhanced Multimedia Keyboard Smart Card Reader USB Keyboard Bluetooth Keyboard
Dell USB 2-Button Entry Mouse with Scroll, Black Dell USB 2-Button Optical Premium Mouse with Scroll, Black Bluetooth Mouse
Internal Dell Business Audio Speaker Dell A225 Stereo Speakers Dell A525 Speakers Dell AS501 Sound Bar - UltraSharp Flat Panel Attachable Speakers Dell AS501PA Sound Bar - Entry FP Attachable Speakers

Optical Storage Drive

48X CD-ROM SATA 16X DVD-ROM SATA 48X32 CDRW/DVD Combo SATA 16X DVD+/-RW SATA
24X Slimline CD-ROM Drive 8X Slimline DVD-ROM 24X Slimline CDRW/DVD Combo 8X Slimline DVD+/-RW Slimline 1.44MB FDD

Additional Storage

3.5" 1.44MB FDD USB 2.0 Memory Key: 256MB, 512MB Dell 13 in 1 USB Media Card Reader

Communications

Integrated Broadcom 10/10/10000Mb LOM Dell V.92 PCI Data/Fax Controllerless Modem Broadcom NetXtreme 10/100/1000 PCIe Gigabit Controller Card (Full Height or Low-profile) Dell Wireless 1450 (802.11 a/b/g) WLAN USB 2.0 DT Adapter, 13 Channel

1. 2. 3. 4. 5. 6. 7.

The term Gigabit Ethernet does not connote an actual operating speed of 1 GB/sec. For high speed transmission, connection to a Gigabit Ethernet server and network infrastructure is required. Up to 256MB of system memory may be allocated to support graphics, depending on system memory size and other factors. The total amount of usable memory available will be less than 4 GB, depending on the actual system configuration For hard drives, GB means 1 billion bytes; actual capacity varies with preloaded material and operating system and will be less. Discs burned with this drive may not be compatible with some existing drives and players; using DVD+R media provides maximum compatibility. For a copy of Dells guarantees or limited warranties, please write Dell USA L.P., Attn: Warranties, One Dell Way, Round Rock, TX 78682. For more information, visit www.dell.com/us/en/gen/services/service_service_plans.htm. Service may be provided by third-party. Technician will be dispatched if necessary following phone based troubleshooting. Subject to parts availability, geographical restrictions and terms of service contract. Service timing dependent upon time of day call placed to Dell. U.S. only.

Dell OptiPlex is a trademark of Dell Inc. Intel, Intel inside logo and Pentium are registered trademarks of Intel Corporation. Microsoft Windows XP is a registered trademarks of Microsoft Corporation. Other trademarks and trade names are used to identify the entities claiming the marks and names of their products. Dell Inc. disclaims any proprietary interest in trademarks and trade names other than its own. Copyright 2005 Dell Inc. All rights reserved.

ENVIRONMENTAL DATA SHEET PRODUCT: OptiPlex 745 Mini Tower Effective Date: 9/11/2006 SYSTEM DIMENSION AND WEIGHT
Depth, cm 43.8 Width, cm 18.7 Height, cm 41.1 Weight, kg 14.3 depending on options installed

Dell Inc. www.dell.com

DECLARATIONS AND CERTIFICATIONS
This system received the following approvals and may be labeled with one or more of these marks depending on point of purchase: Approvals Certificate # Yes / No / N/A N/A yes USA: Energy Star capable N/A yes USA: FEMP Executive Order 1322 N/A Silver USA: EPEAT registered TBD TBD Nordic: TCO 05 (desktops only) TBD TBD Germany: Blue Angel Through internal design controls and supply chain declarations, this system1 has been verified to comply with the EU RoHS Directive2. One or more components in this system may be available as factory installed options that do not meet EU RoHS requirements. For details, please see www.dell.com/rohsinfo.
The Energy Consumption and Declared Noise Emissions data is based on a configuration including an IntelE660 processor, 2 GB of memory, 160 GB hard drive, DVD, and Floppy drive.
PERFORMANCE DATA System Configuration

Energy Consumption3

Service Level
*Maximum Idle ACPI-S3 Standby mode ACPI-S4 Hibernate mode Off Low Power Mode disabled Off Low Power Mode enabled
Energy Consumption (Wattage)
113.79 75.99 2.71 1.92 1.87.78
Description of Service Level
The data provided is the highest wattage reading while running the complete 3DMark 2003 Pro (Benchmark) suite of tests. As specified by the EPA Computer spec 4.0 or system is sitting at the main Windows screen. Suspend-to-RAM (low power mode) Suspend-to-Disk (a lower power mode) The system is turned off with the Low power Mode feature disabled via the BIOS The system is turned off with the Low power Mode feature enabled via the BIOS.
Energy consumption is tested at 230 Volts / 50 Hz. When applicable, Dell product information related to US Executive Order 13221 may be obtained at: http://oahu.lbl.gov/index.html. *Maximum Energy Consumption results are based solely upon the laboratory testing of the System Configuration listed above.
Options from Dell Custom Factory Integration (CFI), Software and Peripherals (S&P) and Customer Kits may not be RoHS compliant. EU Directive on the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment (2002/95/EC) dated January 27, 2003. 3 This document is informational only and reflects laboratory performance. Your product may perform differently, depending on the software, components and peripherals you ordered. Accordingly, the customer should not rely upon this information in making decisions about electrical tolerances or otherwise. No warranty as to accuracy or completeness is expressed or implied. The information in this document may change without notice; please note the revision number on the last page.
Environmental Data Sheet Page 1
Declared Noise Emissions in accordance with ISO 9296
Service Level Floppy Drive Accessing Hard Drive Accessing CD Drive Accessing Idle Sound Power (LWAd, bels) (1 bel=10 decibels, re 10-12

Watts)

4.8 3.8 5.1 3.8
Sound Pressure Operator Position (LpAm, decibels) (re 2x10-5 Pa) 46 32
Sound Pressure Bystander Position (LpAm, decibels) (re 2x10-5 Pa) 39 27
This Dell product does NOT contain any of the following substances (in concentrations exceeding legal threshold limits): Asbestos Azo dyes/colorants in components that come into direct contact with human skin Cadmium and its compounds (except for use in applications exempted by the EU RoHS Directive) Class I and Class II CFCs (chlorofluorocarbons) and HCFCs (hydrofluorocarbons) Chloroparaffins, short chained (10-13 carbon chain) Chromium VI and its compounds (except for use in applications exempted by the EU RoHS Directive) Halogenated dioxins or furans (i.e. polychlorinated dibenzodioxines, polychlorinated dibenzofurans) Lead and its compounds (except for use in applications exempted by the EU RoHS Directive) Mercury (except for use in applications exempted by the EU RoHS Directive) Nickel and its compounds in components that are likely to result in prolonged skin exposure PCBs (polychlorobiphenyls) or PCTs (polychloroterphenyls) PBBs (polybromobiphenyls) or PBDEs (polybrominated diphenylethers) PVC (polyvinyl chloride) in plastic parts greater than 25 grams Polychlorinated naphthalenes (PCNs) Tributyl tin (TBT) and triphenyl tin (TPT) compounds For information on Japan RoHS (J-MOSS) chemical disclosures: www.dell.com/japan_rohs.
PRODUCT MATERIALS INFORMATION4 Restricted Substances
Additional Materials Information
The cables may use PVC as an insulating material to ensure product safety The case material is sheet metal, ABS Product may contain post-industrial recycled content (plastics, metal, glass)

Flame Retardants Used in Mechanical Plastic Parts > 25 grams, Keycaps, and Motherboards Part Flame Retardant ISO 1043-4 Motherboard TBBPA FR(16) Mechanical Plastic Parts > 25 grams PC+ABS Triaryl Phosphate Ester FR(40) Mechanical Plastic Parts > 25 grams PC-GF Triaryl Phosphate Ester FR(40) Mechanical Plastic Parts > 25 grams ABS N/A
Waste Handling. Local regulations should be observed when disposing of this product due to the presence of the materials and substances as listed above.
Environmental Data Sheet Page 2

Packaging

No CFCs (chlorofluorocarbons), HCFCs (hydrofluorocarbons) or other ozone depleting substances are used in packaging material. Chromium, lead, mercury, or cadmium are not intentionally added to packaging materials and are not present in a cumulative concentration greater than 100 ppm as incidental impurities. No halogenated plastics or polymers are used for packaging material. Dell complies with the EU Directive 94/62/EEC. Packaging Materials Weight, kg PE 0.27 Corrugated Cardboard 2.61 Printed user documentation is bleached in a chlorine-free process. (Europe Only)

Batteries

Batteries in this product are not based on mercury, lead or cadmium technologies. The batteries used in this product are in compliance with EU Directive 91/ 157/ EEC, EU Directive 93/ 86/ EEC and EU Directive 98/ 101/ EEC. The product documentation includes instructional information on the proper removal and disposal of the batteries used in this product. Below is a listing of batteries present in the product: Battery Description Internal Batteries Battery Type 3-V CR2032 coin cell Lithium
Dell systems are, when applicable, designed for easy assembly, disassembly, and servicing. To extend the life of your system, you can install or upgrade certain system components (e.g., microprocessor, memory, expansion cards, and storage devices). Spare parts are available after the end of production for up to five years, or otherwise through the warranty period.
DESIGN FOR ENVIRONMENT Longevity and Upgrading

Recyclability

For recyclability, this system incorporates the following design guidelines: EU WEEE mark is applied to products sold in Europe, EU recycling information can be found at www.euro.dell.com/recycling Minimal use of non-separable connections, such as gluing and welding between different materials. Minimal use of composite structure materials. Mechanical plastic parts greater than 100 grams consist of one material or of easily separable materials.

Take back and recycling services are offered for this product in certain countries. If you want to dispose of system components, contact Dell for instructions by emailing recycling_emea@dell.com or visit www.dell.com/recyclingworldwide and select the relevant country.
RECYCLING/ END-OF-LIFE SERVICE INFORMATION
DELL CORPORATE ENVIRONMENTAL INFORMATION
Information on Dells Environmental initiatives, policies, programs and goals can be found at www.dell.com/environment.
Document Version 1 posted 9/7/06

4.4 (7/31/2006)

Environmental Data Sheet Page 3