Product End-of-Life Disassembly Instructions
Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP Compaq dc5800 Microtower Business PC Name / Model #2 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items included in product 2 to 3 (1 sys board, 1 or 2 P/S PCAs 1
Item Description Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
Notes With a surface greater than 10 sq cm
Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances EL-MF877-00 Template Revision A
All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps

2. 4, 6, or 7 in P/S

Include the cartridges, print heads, tubes, vent chambers, and service stations.

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1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name MAIN BEZEL Fan duct FAN DUCT
Plastic Part Description P_MAINBEZEL P_FAN_DUCT_01 P_FAN_DUCT_02
Weight (grams) 165 g 99.3 g 51
ISO 11469:2000 Plastic Part Mark >ABS< >PC+ABS FR(40)< >PC+ABS FR(40)<

Optional: Photo

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Phillips screwdriver Description #2 Dikes Description #3 Torx screwdriver T-15 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. To remove the access panel, loosen the captive thumbscrew (1) that secures the access panel to the computer chassis, slide the access panel back (2) about 1.3 cm (1/2 inch), and then lift it off the unit. (see Figure 1). To remove the front bezel, press outward on the two latches on the right side of the bezel and the single latch on the left side of the bezel (1) to release the bottom of the bezel, then swing the bottom of the bezel away from the chassis (2) to release the top of the bezel. (see Figure 2). Remove or cut all expansion cards, cables, and any other devices from the system board. To remove the battery: Locate the battery and battery holder on the system board. Depending on the type of battery holder on the system board, complete the following instructions to remove the battery. TYPE 1 BATTERY HOLDER (see Figure 3): Lift the battery out of the holder. TYPE 2 BATTERY HOLDER (see Figure 4): To release the battery from its holder, squeeze the metal clamp that extends above one edge of the battery. When the battery pops up, lift it out. TYPE 3 BATTERY HOLDER (see Figure 5): Pull back on the clip that holds the battery in place, and then remove the battery. To remove the system board (see Figure 6): a. Remove all expansion boards. b. Disconnect all cables connected to the system board. c. Remove the heatsink from the system board by loosening the four captive screws that secure the heatsink to the system board, and then lifting the heatsink from the system board. b. Remove the seven screws that secure the system board to the chassis. c. Slide the system board toward the front of the computer, and then lift the board up to remove it. To remove the power supply. a. Remove the four screws that secure the power supply to the chassis (see Figure 7). b. Press the tab in front of the power supply that holds it in place (1). c. Slide the power supply toward the front of the computer (2), rotate toward the fan so the power supply clears the lip on the top of the chassis (3), and then lift the power supply out of the chassis (4) (see Figure 8).

HP uses five different power supply vendors. See the instructions below to disassemble and remove required power supply components: POWER SUPPLY 1: a. Using dikes, cut the two plastic clamps that secure the wires to the power supply cover (see Figure 9). b. Using a phillips screwdriver, remove the six screws that secure the cover to the power supply chassis - two screws on top, two screws on the bottom, two screws on the left side (see Figures 10 & 11). NOTE: You do not need to remove the screws from the fan guard or the power connector. EL-MF877-00 Page 2 Template Revision A
c. Slide the cover off the power supply. d. Using dikes, cut all cables connecting the PCA to the power supply. e. From the bottom of the power supply, remove the three screws that secure the power supply PCA to the chassis (see Figure 12). f. Remove the power supply PCA from the power supply chassis. g. Cut the small PCA from the large power supply PCA (see Figure 13). h. Cut two capacitors from the PCA, as shown in Figure 13.
POWER SUPPLY 2: a. Using dikes, cut the plastic clamp that secures the wires to the power supply cover (see Figure 14). b. Using a phillips screwdriver, remove the six screws that secure the cover to the power supply chassis - all six screws are on top (see Figure 15). NOTE: You do not need to remove the screws from the fan guard or the power connector. c. Lift the cover off the power supply. d. Using dikes, cut all cables connecting the PCA to the power supply. e. From the inside, remove the four screws that secure the power supply PCA to the chassis (see Figure 16). f. Remove the PCA from the power supply chassis. g. Cut the small PCA from the large power supply PCA (see Figure 16) h. Cut four capacitors from the PCA, as shown in Figure 16. POWER SUPPLY 3: a. Using dikes, cut the plastic clamp that secures the wires to the power supply cover (see Figure 17). b. Using a phillips screwdriver, remove the four screws that secure the cover to the power supply chassis - two screws on top, two screws on the bottom (see Figure 17 & 18). NOTE: You do not need to remove the screws from the fan guard or the power connector. c. Slide the cover off the power supply. d. Using dikes, cut all cables connecting the PCA to the power supply. e. From the outside, remove the four screws that secure the power supply PCA to the chassis (see Figure 19). f. Remove the two screws that secure the PCA to the top of the power supply chassis (see Figure 20). g. Remove the power supply PCA from the power supply chassis. h. Cut seven capacitors from the PCA, as shown in Figure 21. POWER SUPPLY 4: a. Using dikes, cut the plastic clamp that secures the wires to the power supply cover (see Figure 22). b. Using a phillips screwdriver, remove the six screws that secure the cover to the power supply chassis - all six screws are on top (see Figure 23). NOTE: You do not need to remove the screws from the fan guard or the power connector. c. Slide the cover off the power supply. d. Remove the two screws that secure the top PCA to the power supply (see Figure 24). e. Using dikes, cut all cables connecting the PCA to the power supply. f. From the outside, remove the four screws that secure the power supply PCA to the chassis (see Figure 25). h. Remove the large PCA from the power supply chassis. i. Cut six capacitors from the PCA, as shown in Figure 26. POWER SUPPLY 5: a. Using dikes, cut the plastic clamp that secures the wires to the power supply cover (see Figure 27). b. Using a phillips screwdriver, remove the five screws that secure the cover to the power supply chassis - three screws are on top, two are on the bottom (see Figure 28 & 29). NOTE: You do not need to remove the screws from the fan guard or the power connector. c. Slide the cover off the power supply. d. Using dikes, cut all cables connecting the PCA to the power supply. e. From the outside, remove the four screws that secure the power supply PCA to the chassis (see Figure 30). f. Remove the large PCA from the power supply chassis. g. Cut the small PCA from the large power supply PCA (see Figure 31) h. Cut six capacitors from the PCA, as shown in Figure 31. EL-MF877-00 Template Revision A Page 3

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Template Revision A

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FIGURE 1: Removing the access panel.
FIGURE 2: Removing the front bezel
FIGURE 3: Type 1 battery holder

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FIGURE 4: Type 2 battery holder
FIGURE 5: Type 3 battery holder
FIGURE 6: Removing the system board screw locations

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FIGURE 7: Power supply screw locations
FIGURE 8: Removing the power supply tab location

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FIGURE 9: POWER SUPPLY 1: Plastic tie locations
FIGURE 10: POWER SUPPLY 1: Screw locations
FIGURE 11: POWER SUPPLY 1: Screw locations (screws on bottom not visible)

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FIGURE 12: POWER SUPPLY 1: Large PCA screw locations
FIGURE 13: POWER SUPPLY 1: Capacitors and small PCA to cut

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FIGURE 14: POWER SUPPLY 2: Plastic tie location
FIGURE 15: POWER SUPPLY 2: Screw locations
FIGURE 16: POWER SUPPLY 2: Large PCA screw locations; Capacitors and small PCA to cut

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FIGURE 17: POWER SUPPLY 3: Screw and plastic tie locations
FIGURE 18: POWER SUPPLY 3: Screw locations
FIGURE 19: POWER SUPPLY 3: Large PCA screw locations

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FIGURE 20: POWER SUPPLY 3: Small PCA screw locations
FIGURE 21: POWER SUPPLY 3: Capacitors to cut

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FIGURE 22: POWER SUPPLY 4: Plastic tie location
FIGURE 23: POWER SUPPLY 4: Screw locations
FIGURE 24: POWER SUPPLY 4: Top PCA screw locations

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FIGURE 25: POWER SUPPLY 4: Large PCA screw locations
FIGURE 26: POWER SUPPLY 4: Capacitors to cut

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FIGURE 27: POWER SUPPLY 5: Plastic tie location
FIGURE 28: POWER SUPPLY 5: Screw locations
FIGURE 29: POWER SUPPLY 5: Screw locations

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FIGURE 30: POWER SUPPLY 5: PCA screw locations
FIGURE 31: POWER SUPPLY 5: Small PCA and capacitor locations

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QuickSpecs

Overview

HP Compaq dc5800 Business PC
HP recommends Windows Vista Business

Microtower

1. 2. 3. 4.
(2) 5.25 external bays and (2) 3.5 internal bays (1) 3.5 external bay for optional HP 16-in-1 Media Card Reader, diskette drive, or other 3.5 device 300-watt power supply Optional: 85% efficient energy saving power supply Rear I/O: (6) USB 2.0, (1) standard serial port, (1) optional serial port, (1) optional parallel port, (2) PS/2, (1) RJ-45, (1) VGA, (1) audio in, (1) audio out

5. 6. 7. 8. 9.

(1) full-height PCI slot, (2) full-height PCIe x1 slots, (1) fullheight PCIe x16 (ADD2/SDVO) slot Front I/O: (2) USB 2.0, headphone and microphone, Dual Colour Diagnostic LEDs 2-Button Scroll Mouse (PS/2, Optical Scroll Mouse (PS/2 or USB), or USB Laser Mouse HP Standard Keyboard (PS/2 or USB) or HP USB Smartcard Keyboard Monitor (sold separately)

DA - 12863

Canada Version 26 October 28, 2009

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Small Form Factor
1. (1) 3.5 external bay for optional HP 16-in-1 Media Card Reader, diskette drive, or other 3.5 device; (1) 3.5 internal bay 2. (1) 5.25 external bay for optional optical drive, or other 5.25 device (bay tilts up for device removal and insertion) 3. 240-watt power supply Optional: 85% efficient energy saving power supply 4. Rear I/O: (6) USB 2.0, (1) standard serial port, (1) optional serial port, (1) optional parallel port, (2) PS/2, (1) RJ-45, (1) VGA, audio in/out
5. (1) low profile PCI slot, (2) low profile PCIe x1 slots, (1) low profile PCIe x16 (SDVO/ADD2) slot 6. Front I/O: (2) USB 2.0, headphone and microphone, Dual Colour Diagnostic LEDs 7. 2-Button Scroll Mouse (PS/2), Optical Scroll Mouse (PS/2 or USB), or USB Laser Mouse 8. HP Standard Keyboard (PS/2 or USB) or HP USB Smartcard Keyboard 9. Monitor (sold separately)

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At A Glance
The HP Compaq dc5800 offers a stable solution with mainstream features and flexibility that exceed basic business requirements Intel Q33 Express chipset, Intel Core 2 Duo processors, Intel Core 2 Quad processors, and Intel Graphics Media Accelerator 3100 integrated graphics Embedded TPM1.2 compliant security module* (Vista Bit-Locker ready) Support for up to 500-GB SATA 3.0Gb/s Smart IV hard drives Value-added software on select models HP Total Care Advisor HP Backup and Recovery Manager HP Software Agent Altiris Deployment Solution Agent McAfee Anti-Virus with 60 day Live Update Subscription HP Insight Diagnostics software Microsoft Office 2007 Verdiem Surveyor remote power management agent PDF Complete Computrace for Desktops (select countries) Value-added software available for free download from the Web (http://www.hp.com/go/easydeploy) HP Client Automation Starter Edition HP Client Manager for Altiris Altiris Out-of-Band Management Solution HP SoftPaq Download Manager HP System Software Manager HP Client Catalog for Microsoft SMS Verdiem Surveyor remote power management agent Fully compatible software OS image across all models (Microtower, Small Form Factor) HP BIOS for security, manageability and software image stability Standard 3-years parts, 3-years labour, and 3-years on-site warranty services (terms and conditions vary by country; certain restrictions and exclusions apply) HP Insight Diagnostics software Selected configurations with global availability easily set up and ordered through HP.com Business to Business portals (http://h10019.www1.hp.com/business-site/index.html) Tailored HP Factory Express deployment and lifecycle services available (http://h71028.www7.hp.com/enterprise/cache/97688-0-0-225-121.aspx) *TPM module disabled where use is restricted by law; for example, Russia.

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Configurable Components - Select Models (localized by Regions)
Model Key and Example NOTE: This diagram is an example that illustrates how to read the model number. It is not intended to give every available configuration choice specified in the body of this document and may include references to modules that are out of date and no longer available.

Chipset

Intel Q33 Express chipset

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Speed* Processor and Speed One of the following
Intel Celeron Processors: Intel Celeron 430 Processor (1.8-GHz, 512K L2 cache, 800-MHz FSB) Intel Celeron 450 Processor (2.2-GHz, 512K L2 cache, 800-MHz FSB) Intel Celeron Dual-Core Processors Intel Celeron E1200 Processor (1.6-GHz, 512K L2 cache, 800-MHz FSB) Intel Celeron E1400 Processor (2.0-GHz, 512K L2 cache, 800-MHz FSB) Intel Celeron E1500 Processor (2.2-GHz, 512K L2 cache, 800-MHz FSB) Intel Pentium Dual-Core Processors: Intel Pentium E2180 Processor (2.0-GHz, 1-MB L2 cache, 800-MHz FSB) Intel Pentium E2200 Processor (2.2-GHz, 1-MB L2 cache, 800-MHz FSB)

X X X X X X X

Intel Pentium E2220 Processor (2.4-GHz, 1-MB L2 cache, 800-MHz FSB) X X Intel Pentium dual-core E5300 Processor (2.6-GHz, 2MB L2 cache, 800-MHz FSB) X X Intel Pentium Dual Core E5400 Processor (2.70-GHz, 2MB L2 cache, 800-MHz FSB) X X Intel Core 2 Duo Processors: Intel Core 2 Duo E4600 Processor (2.40-GHz, 2 MB L2 cache, 800-MHz FSB) X X Intel Core 2 Duo E6550 Processor (2.33-GHz, 4 MB L2 cache, 1333-MHz FSB) X X Intel Core 2 Duo E6750 Processor (2.66-GHz, 4 MB L2 cache, 1333-MHz FSB) X X Intel Core 2 Duo E7200 Processor (2.53-GHz, 3 MB L2 cache, 1066-MHz FSB) X X Intel Core 2 Duo E7300 Processor (2.66-GHz, 3 MB L2 cache, 1066-MHz FSB) X X Intel Core 2 Duo E7400 Processor (2.80-GHz, 3 MB L2 cache, 1066-MHz FSB) X X Intel Core 2 Duo E7500 Processor (2.93-GHz, 3 MB L2 cache, 1066-MHz FSB) X X Intel Core 2 Duo E8300 Processor (2.83-GHz, 6 MB L2 cache, 1333-MHz FSB) X X Intel Core 2 Duo E8400 Processor (3.0-GHz, 6 MB L2 cache, 1333-MHz FSB) X X Intel Core 2 Duo E8500 Processor (3.16-GHz, 6 MB L2 cache,1333-MHz FSB) X X Intel Core 2 Duo E8600 Processor (3.33-GHz, 6 MB L2 Cache, 1333-MHz FSB) X X Intel Core 2 Quad Processors: Intel Core 2 Quad Q6700 Processor (2.66-GHz, 8 MB L2 cache, 1066-MHz FSB) X X Intel Core 2 Quad Q8200 Processor (2.33-GHz, 4 MB L2 cache, 1333-MHz FSB) X X Intel Core 2 Quad Q8300 Processor (2.50-GHz, 4 MB L2 cache, 1333-MHz FSB) X X Intel Core 2 Quad Q9300 Processor (2.50-GHz, 6 MB L2 cache, 1333-MHz FSB) X X Intel Core 2 Quad Q9400 Processor (2.66-GHz, 6 MB L2 cache, 1333-MHz FSB) X X Intel Core 2 Quad Q9650 Processor (3.0-GHz, 12 MB L2 cache, 1333-MHz FSB) X X * Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families.

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Memory
DDR2 SYNCH DRAM NON-ECC MEMORY Memory upgrades are accomplished by adding single or multiple DIMMs of the same or varied sizes. This chart does not represent all possible memory configurations. The Intel Q33 Express chipset supports non-ECC DDR2 PC2-6400 (800-MHz) memory. CAUTION: You must shut down the computer and disconnect the power cord before adding or removing memory modules. Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged in to an active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory modules or system board. HP recommends dual-channel symmetric configurations for maximum performance. For best performance, add the same amount of total memory to each channel and do not mix speeds. For dual-channel symmetric performance, the total amount of memory in each channel must be equal. If speeds are mixed, speed will default to the slowest DIMM.
Microtower and Small Form Factor
Maximum Memory* Supports up to 16-GB of DDR2 SYNCH DRAM. Slot 1 is black and must always be populated. Not all memory configurations possible are represented below. NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system. Slot Channel A 1 (black) 512-MB 1-GB 512-MB 2 (white) 3 (black) Channel B

DIMM Size

4 (white) 512-MB 1-GB 512-MB 1-GB (dual-channel symmetric) 1-GB 1-GB 2-GB (dual-channel symmetric) 512-MB 512-MB 512-MB 512-MB 2-GB (dual-channel symmetric) 1-GB 512-MB 1-GB 512-MB 3-GB (dual-channel symmetric) 1-GB 1-GB 1-GB 1-GB 4-GB (dual-channel symmetric) 2-GB 2-GB 2-GB 2-GB 8-GB (dual-channel symmetric) 4-GB 4-GB 4-GB 4-GB 16-GB (dual-channel symmetric) * The Intel Q33 Express chipset includes a built-in Management Engine (ME), which allocates memory for manageability functions. Management Engine memory is shared with system memory. If the PC contains a single DIMM, 16 MB of memory is pre-allocated for it at system startup. If the PC contains two DIMMs, 32 MB of memory is pre-allocated. This memory is not made available to the operating system, just as pre-allocated video memory is not available.

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Memory Configurations One of the following
512-MB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 512) 1-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 1GB) 1-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 512) 2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 2GB) 2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 1GB) 2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (4 x 512) 3-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (3 x 1GB) 4-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (4 x 1GB) 4-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 2GB) 8-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (4 x 2GB) 16-GB DDR2 Synch Dram PC2-6400 (800-Mhz) Non ECC (4 x 4GB)

MT X X X X X X X X X X X

SFF X X X X X X X X X X X
Expandability PCI slots Max power per slot PCIe x1 slot Max power per slot PCIe x16 slot (also functions as SDVO/ADD2 slot) Max power per slot External Bays 3.5 5.25 IDE Internal 3.5 HDD Bays Hard Drive Controller (SATA) Supported Hard Drive Interfaces Supported
Microtower 1 full-height 35W 2 10W 1 full-height
Small Form Factor 1 low-profile 35W 2 10W 1 low-profile

60W 2 SATA SATA 3.0Gb/s

25W 1 SATA SATA 3.0Gb/s

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Storage Drive Support Media Card Reader or Diskette Drive (optional) 1 Microtower 5.25 Serial ATA Devices 3.5 Serial ATA Devices Small Form Factor Media Card 5.25 Serial 3.5 Serial ATA Reader or ATA Devices Devices Diskette Drive (optional) 2 , SATA
Quantity Supported Position Supported Controller

2 , SATA

2 , , SATA

USB/Diskette

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Hard Drive One or two of the following
80-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 160-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 250-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 320-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 500-GB SATA 3.0-Gb/s Hard Drive (16MB Cache, 7200 RPM, NCQ, Smart IV) 80-GB SATA 3.0-Gb/s Hard Drive (16MB Cache,10,000 RPM, NCQ, Smart III) 160-GB SATA 3.0-Gb/s Hard Drive (16MB Cache, 10,000 RPM, NCQ, Smart III) 3.5 Removable 80-GB SATA 3.0 Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 3.5 Removable 160-GB SATA 3.0 Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 3.5 Removable 250-GB SATA 3.0 Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 2nd hard drive, 80-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 2nd hard drive, 250-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 2nd hard drive, 320-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV) 2nd hard drive, 500-GB SATA 3.0-Gb/s Hard Drive (16MB Cache, 7200 RPM, NCQ, Smart IV) 2nd hard drive, 80-GB SATA 3.0-Gb/s Hard Drive (16MB Cache,10,000 RPM, NCQ, Smart III) 2nd hard drive,160-GB SATA 3.0-Gb/s Hard Drive (16MB Cache, 10,000 RPM, NCQ, Smart III) NOTE: NCQ functionality requires a user set-up BIOS setting.
MT X X X X X X X X X X X X X X X X
SFF X X X X X X X X X X X X X
Removable Storage One or more of the following depending on form factor (see Storage Drive Support section above)
Diskette Drives 1.44-MB Diskette Drive Media Reader HP 16-in-1 Media Reader (USB connection on the system board) Optical Drives SATA DVD-ROM Drive1 SATA CD-RW/DVD-ROM Combo Drive1,2 SATA SuperMulti LightScribe DVD Writer Drive1,2,For playing DVDs, InterVideo WinDVD For writing CDs, choice of Sonic/Roxio DigitalMedia Plus 7.2 (Windows XP only) or Easy Media Creator For writing CDs and DVDs, video editing and authoring DVDs, choice of Sonic/Roxio DigitalMedia Plus 7.2 (Windows XP only) or Easy Media Creator 9

NQ604AT NQ605AT FH977AA AH060AA AH058AA KG274AA

Monitors

CRTs Value Series Monitors HP LV156w 15-inch Widescreen LCD Monitor Business LCD Monitors HP L1506 15-inch LCD Monitor HP w17e 17-inch LCD Monitor HP L1710 17-inch LCD Monitor HP L1910 19-inch LCD Monitor HP L1910i 19-inch LCD Monitor with Integrated Work Stand HP L1908w 19-inch Widescreen LCD Monitor HP L1908wm 19-inch Widescreen LCD Monitor with multimedia HP L1908wi 19-inch Widescreen LCD Monitor with Integrated Work Stand HP L2208w 22-inch Widescreen LCD Monitor Advantage Series Monitors HP L1745 17-inch LCD Monitor HP L1750 17-inch LCD Monitor HP L1750 17-inch LCD Monitor - TAA Compliant HP L1950g 19-inch LCD Monitor HP L1950g TAA 19-inch LCD Monitor - TAA Compliant HP L1945w 19-inch Widescreen LCD Monitor DA - 12863 Canada Version 26 October 28, 2009
3PO Offering NJ711AA#ABA PX848AA#ABA GV537AA#ABA GS917AA#ABA GS918AA#ABA GS581AA#ABA GP536AA#ABA KA214AA#ABA GP537AA#ABA GX007AA#ABA GE178AA#ABA GF904AA#ABA GF904A2#ABA KR145AA#ABA KR145A2#ABA KD286AA#ABA Page 16
HP L2045w 20-inch Widescreen LCD Monitor HP L2245wg 22-inch Widescreen LCD Monitor HP L2445w 24-inch Widescreen LCD Monitor Performance Series Monitors HP LP1965 19-inch LCD Monitor HP LP2065 20-inch LCD Monitor HP LP2275 22-inch Widescreen LCD Monitor HP LP2275 22-inch Widescreen LCD Monitor Bulk Pack (6 baseless units) HP LP2475w 24-inch Widescreen LCD Monitor HP LP2480zx 24-inch DreamColor Widescreen LCD Monitor HP LP3065 30-inch Widescreen LCD Monitor Digital Signage HP LD4200 42-inch LCD Monitor Touchscreen Monitor HP L5006tm 15-inch Touch Screen LCD Monitor Options HP USB 2.0MP Business WebCam HP Flat Panel Speaker Bar HP Quick Release Kit HP Integrated Work Stand (stand alone) HP DreamColor Advanced Profiling Solution (aka Puck) HP LCD Hood Kit 3M 17-in Privacy Screen Filter 3M 19-in Privacy Screen Filter Digital Signage Speaker Digital Signage Stand
RD125AA#ABA FL472AA#ABA KT931AA#ABA RA373AA#ABA EF227A4#ABA KE289A4#ABA KD289A6#ABA KD911A4#ABA GV546A4#ABA EZ320A4#ABA NH322AA#ABA RB146AA#ABA NX252AA EE418AA EM870AA GN783AA KZ300AA KZ301AA KM218AA KZ310AA NK352AA NK353AA

Power Supply

Operating Voltage Range Rated Voltage Range Rated Line Frequency Operating Line Frequency Range Rated Input Current Heat Dissipation
Power Supply Fan ENERGY STAR Compliant FEMP Standby Power Compliant (<2W in S5 Power Off)** Power Consumption in ES Mode Suspend to RAM (S3) (Instantly Available PC)

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* Energy efficient power supply is a requirement for ENERGY STAR qualification in conjunction with a select range of processors and module. ** Power consumption in the Off/Apparent Off mode is measured and reported with the network interface controller Wake on LAN feature disabled in F10 Setup (default is enabled). ROM BIOS Information Key features of the HP BIOS in the dc5800 include: Deployment and manageability HP BIOS provides several technologies that help integrate the HP Business desktop computer into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 12 languages. Stability HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification. Security HP BIOS offers a robust and flexible set of security features to help the system administrator secure their systems from removal of sensitive data, and help prevent access by unauthorized users. Tracking and tracing capabilities in case of theft available in select countries (subscription sold separately). Thermal and power management The HP BIOS provides and enables thermal and power management technologies to assist in operating the HP Business Desktop computer in any enterprise environment. Serviceability HP BIOS provides diagnostic and detailed service information. Upgrades and recovery HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS updates from within DOS (Flashlite), BIOS updates from within Windows (HPQFlash, SSM), HP Client Manager, and fail-safe recovery. In addition, the HP Business Desktop BIOS Utilities tool enables replicated BIOS setup throughout the Enterprise; it is available from within the BIOS software and from the support website. Additional HP BIOS Features Administrator password Also known as the setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS. Advanced Configuration and Power Interface (ACPI) Represents a significant innovation in power and configuration management, allowing operating systems and applications to manage power based on activity and usage. Provides power conservation features under Windows XP. Ability to mute the internal speaker Other Features ACPI-Ready Hardware Description Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode. Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system. System Management BIOS, previously known as DMI BIOS, for system management information Intel-driven, industry-wide initiative to make Intel architecture-based PCs, servers and mobile computers more inherently manageable right out of the box and over the network Power button acts as both an on/off button and suspend-to-sleep button

Operating temperature Storage temperature Humidity Operating voltage Power consumption Output power (approximately) Receive sensitivity Data transfer rate Spreading Security Antenna Throughput
Certifications Certifications for use by country

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HP 802.11b/g/n Wireless Dimensions (L x H) PCIe x1 Card Weight Controller System interface Network standard Frequency band Operating temperature Storage temperature Humidity Operating voltage Power consumption
Output power (approximately)

Receive sensitivity

3.3 x 4.7 inches (8.5 x 12 cm) 0.08 pounds (40 g) Ralink RT2790 PCIExpress x1 802.11 b/g/n 2.400 - 2.497 GHz 14 to 149F, operating (-10 to 65C, operating) -40 to 176F, non-operating (-40 to 80C, non-operating) 10-90% operating 5-95% non-operating 3.3V +/- 9% 12V +/- 8% Platform/WLAN Mode Power Consumption Maximum Power 10 Watts Consumption Transmit Only 4 Watts maximum averaged power over 1 second Transmit Packet or Active 1000 mA peak current for 100 microseconds or Scanning longer Receive Only Mode or Idle 3 Watts maximum averaged over 1 second without IEEE PSP mode enabled Idle, with IEEE PSP mode 1.0 Watts maximum averaged over 1 second enabled Transmit Disabled (turned 50 mW maximum, averaged over 1 second off in software) Platform in S3 or SmW maximum, averaged over 1 second (power removed from Low Profile PCI Express Card) 802.11b modes 802.11g modes EWC modes +19 dBm +/- 1.0 dB +17 dBm +/- 1.0 dB +17 dBm +/- 1.0 maximum maximum dB maximum (total power in all transmit chains) Mode Data rate Sensitivity 802.11b 1 Mbps -94 dBm 802.11b 11 Mbps -85 dBm 802.11g 6 Mbps -91 dBm 802.11g 18 Mbps -85 dBm 802.11g 48 Mbps -75 dBm 802.11g 54 Mbps -72 dBm EWC (2.4 GHz) 6.5 Mbps -87 dBm EWC (2.4 GHz) 54 Mbps -82 dBm EWC (2.4 GHz) 81 Mbps -78 dBm

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EWC (2.4 GHz) EWC (2.4 GHz) EWC (2.4 GHz) Data Rate (MCS) 1 Mbps (802.11 b) 2 Mbps (802.11 b) 5.5 Mbps (802.11 b) 11 Mbps (802.11 b) 12 Mbps (802.11 g) 18 Mbps (802.11 g)

Data transfer rate

162 Mbps 270 Mbps 300 Mbps Minimum Throughput 700 kbps 1.4 Mbps 3.5 Mbps 5.9 Mbps 6 Mbps 9 Mbps

-74 dBm -68 dBm -64 dBm

24 Mbps (802.11 g) 12 Mbps 36 Mbps (802.11 g) 18 Mbps 48 Mbps (802.11 g) 21 Mbps 54 Mbps (802.11 g) 22.5 Mbps 6.5 Mbps (20 MHz EWC) 4.5 Mbps 13 Mbps (20 MHz EWC) 9 Mbps 19.5 Mbps (20 MHz 13.5 Mbps EWC) 26 Mbps (20 MHz EWC) 18 Mbps 39 Mbps (20 MHz EWC) 27 Mbps 52 Mbps (20 MHz EWC) 36 Mbps 58.5 Mbps (20 MHz 40 Mbps EWC) 65 Mbps (20 MHz EWC) 45 Mbps 78 Mbps (20 MHz EWC) 54 Mbps 104 Mbps (20 MHz EWC) 72 Mbps 117 Mbps (20 MHz EWC) 81 Mbps 130 Mbps (20 MHz EWC) 91 Mbps 13.5 Mbps (40 MHz 8 Mbps EWC) 27 Mbps (40 MHz EWC) 16 Mbps 40.5 Mbps (40 MHz 24 Mbps EWC) 54 Mbps (40 MHz EWC) 32 Mbps 81 Mbps (40 MHz EWC) 48 Mbps 108 Mbps (40 MHz EWC) 64 Mbps 121.5 Mbps (40 MHz 72 Mbps EWC) 135 Mbps (40 MHz EWC) 81 Mbps IEEE and WiFi compliant 64 / 128 bit WEP encryption AES: CCM 802.1x authentication WPA: 802.1x. WPA-PSK and TKIP DA - 12863 Canada Version 26 October 28, 2009 Page 27

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Technical Specifications - Graphics
Integrated Graphics 3D/2D Controller Media Accelerator 3100 VGA Controller Bus Type

RAMDAC Memory

Microsoft DirectX 9 based with support for Pixel Shader 2.0, 4:1 anisotropic filtering, Gaussian texture filtering, shadow maps, volumetric textures, double-sided stencil buffers, and 4 pixel pipes. Integrated PCI Express x16 (If an external graphics card is installed in a PCI or PCIe x1 slot, the internal graphics can be enabled or disabled using the system's BIOS setup utility. If a graphics card other than an SDVO/ADD2 card is installed in the PCI Express x16 slot, the internal graphics cannot be enabled). Integrated, 350 MHz (2048x1536@75 Hz) Graphics memory is shared with system memory. Graphics memory usage varies depending on the amount of system memory installed and system load. 8 MB is pre-allocated for graphics use at system boot time. Additional memory is allocated for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an optimal balance between graphics and system memory use.
System memory equal or greater than 512 MB 8 MB pre-allocated + 248 MB DVMT = max frame buffer of 256 MB Single overlay support with 5x3 filtering Overlay Planes Maximum Colour Depth 32 bits/pixel Maximum Vertical Refresh 85 Hz at up to 1920x1440, 75 Hz at 2048x1536. Varies with mode and configuration. See table below. Rate Support for one CRT via the motherboard's VGA connector on SFF and MT. Multi-display Support Support for an additional display on SFF/MT can be accomplished with the addition of SDVO/ADD2 option installed in PCIe x16 slot. Graphics/Video API Microsoft DirectX9, DirectXVA, VMR9, GDI/GDI+; OpenGL 1.4. Support Resolutions Supported1 Maximum Refresh Rate (Hz) Analog Monitor Digital Monitor 640 x x x x x x x x N/A 2048 x N/A 1 Modes listed are supported with a single active display. The supported mode list for multiple active displays is a subset of this list. Not all modes will support video playback and some supported modes may use software MC (motion compensation) rather than hardware MC. Not all modes will support 3D acceleration depending on the system configuration (e.g., resolution selected, size of frame buffer, number of installed memory modules, etc.). NOTE: Other resolutions and refresh rates may be selectable but are not recommended. Resolution

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DVI ADD2 Graphics1 Models Form Factor DVI-D Connector Dual Head Support Display Devices Supported

Mechanical

Approvals Ergonomic compliance
Functionally compliant 38 available Low-profile design 55-g nominal peak force with tactile feedback 20 million keystrokes (using Hasco modified tester) Contamination-resistant switch membrane Switch type Key-leveling mechanisms For all double-wide and greater-length keys 6 ft (1.8 m) Cable length Microsoft PC Mechanically compliant 43-dBA maximum sound pressure level Acoustics 50 to 122 F (10 to 50 C) Operating temperature Non-operating -22 to 140 F (-30 to 60 C) temperature 10% to 90% (non-condensing at ambient) Operating humidity Non-operating humidity 20% to 80% (non-condensing at ambient) 40 g, six surfaces Operating shock 80 g, six surfaces Non-operating shock 2-g peak acceleration Operating vibration Non-operating vibration 4-g peak acceleration 26 in (66 cm) on carpet, six-drop sequence Drop (out of box) 42 in (107 cm) on concrete, 16-drop sequence Drop (in box) UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC ANSI HFS 100, ISO 9241-4, and TUVGS

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HP PS/2 Optical Scroll Mouse Dimensions (H x L x W) Weight Environmental
3.95 x 6.21 x 11.7 cm (1.56 x 2.44 x 4.61 in) 4.44 oz (126 g) -32 to 104F (0 to 40 C) Operating temperature -4 to 140F ( -20 to 60 C) Non-operating temperature 10% to 90% (non condensing at ambient) Operating humidity Non-operating humidity 10% to 90% non condensing 40 g, 6 surfaces Operating shock 80 g, 6 surfaces Non-operating shock 2 g peak acceleration Operating vibration Non-operating vibration 4 g peak acceleration Drop (out of box) 80 cm height onto asphalt tile over concrete or equivalent, 5-drop in 5 direction except the cable face 5 VDC 10% Operating voltage 100mA Power consumption PS/2 mini-din connector System consumption CE level 4, 15 kV air discharge ESD Conforms to FCC rules for a Class B computing EMI-RFI device Microsoft PCFunctionally compliant 400 20% DPI Resolution 10 in/s (25.4 cm/s) maximum Tracking speed 100 in/s/s (2.54 m/s/s) Acceleration 61 g nominal peak force Switch actuation 3,000,000 operations (using Hasco modified Switch life tester) Low force micro-switches Switch type Tracking mechanism life 155 mi (250 km) at average speed of 10 in/s 6 ft (1.8 m) Cable length Microsoft PCMechanically compliant 8 mm Width 1.01 in (25.6 mm) Diameter Maximum rotation speed 48 rats/sec Light force micro-switch Switch type 1 million operations Switch life Minimum 200,000 revolutions Mechanical life UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, Compliant BSMI, C-Tick, MIC

System Configuration

Energy Consumption Normal Operation OnIdle (ENERGY STAR Idle (S0)) ENERGY STAR Sleep (S3) (Wake On LAN (WOL) Enabled) ENERGY STAR Sleep (S3) (Wake On LAN (WOL) Disabled) ENERGY STAR Standby (Off) (S5) (Wake On LAN (WOL) Enabled) ENERGY STAR Standby (Off) (S5) (Wake On LAN (WOL) Disabled) Heat Dissipation* Normal Operation OnIdle (ENERGY STAR Idle (S0)) ENERGY STAR Sleep (S3) (Wake On LAN (WOL) Enabled) ENERGY STAR Sleep (S3) (Wake On LAN (WOL) Disabled) The configuration used for the Energy Consumption and Declared Noise Emissions data for the Small Form Factor Desktop model is based on a typically configured product. AC Input Voltage at 115 VAC AC Input Voltage at 230 VAC AC Input Voltage at 100 VAC +/- 5 VAC, 60 Hz +/- 3 Hz +/- 5 VAC, 50 Hz +/- 3 Hz +/- 5 VAC, 50 Hz +/- 3 Hz 56.48 W 55.47 W 57.01 W

3.28 W

3.56 W

3.27 W

1.87 W

1.58 W

1.16 W

0.88 W

AC Input Voltage at 115 VAC +/- 5 VAC, 60 Hz +/- 3 Hz 192.709 BTU/hr
AC Input Voltage at 230 VAC +/- 5 VAC, 50 Hz +/- 3 Hz 189.263 BTU/hr
AC Input Voltage at 100 VAC +/- 5 VAC, 50 Hz +/- 3 Hz 194.518 BTU/hr

11.191 BTU/hr

12.146 BTU/hr

11.147 BTU/hr

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ENERGY STAR Standby 5.459 BTU/hr 6.38 BTU/hr 5.39 BTU/hr (Off) (S5) (Wake On LAN (WOL) Enabled) ENERGY STAR Standby 3.07 BTU/hr 3.957 BTU/hr 3.002 BTU/hr (Off) (S5) (Wake On LAN (WOL) Disabled) * Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled. Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) System Fan Off Idle Fixed Disk (random writes) Sound Power (LWAd, bels) 3.8 3.9 Sound Pressure (LpAm, decibels) 27 28
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: Intel LGA775 processor socket 8 USB ports 1 empty PCI slot 2 empty PCIe x1 slots 1 empty PCIe x16 slot 1 internal drive slot 1 SATA optical drive slot 4 memory slots 1 Serial Port (optional) 1 external diskette drive (optional) Spare parts are available throughout the warranty period and or for up to 5 years after the end of production This product complies with ISO standards: EU Directive 91/ 157/ EEC EU Directive 93/ 86/ EEC EU Directive 98/ 101/ EEC Batteries used in the product do not contain: Mercury greater the 5ppm by weight Cadmium greater than 10ppm by weight Lead greater than 2000ppm by weight. Battery size: CR2032 (coin cell) Battery type: Lithium This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2002/95/EC. This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). DA - 12863 Canada Version 26 October 28, 2009 Page 48

Batteries

Additional Information
This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive - 2002/96/EC. This product is in compliance with the IEEE 1680 (EPEAT) standard at the GOLD level, see: www.epeat.net Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043. This product contains 0% recycled materials (by wt.) This product is 93% recyclable when properly disposed of at end of life. Corrugated Paper 1915 g Packaging Materials EPE Foam 135 g LDPE Bag 25 g The EPE foam packaging material is made from 30 to 60% industrial recycled content. The corrugated paper packaging materials contain at least 80% post consumer recycled content.

Minitower

Energy Consumption Normal Operation OnIdle (ENERGY STAR Idle (S0)) ENERGY STAR Sleep (S3) (Wake On LAN (WOL) Enabled) ENERGY STAR Sleep (S3) (Wake On LAN (WOL) Disabled) ENERGY STAR Standby (Off) (S5) (Wake On LAN (WOL) Enabled) ENERGY STAR Standby (Off) (S5) (Wake On LAN (WOL) Disabled) Heat Dissipation* Normal Operation OnIdle (ENERGY STAR Idle (S0)) ENERGY STAR Sleep (S3) (Wake On LAN (WOL) Enabled) ENERGY STAR Sleep (S3) (Wake On LAN (WOL) Disabled) ENERGY STAR Standby (Off) (S5) (Wake On LAN (WOL) Enabled) The configuration used for the Energy Consumption and Declared Noise Emissions data for the Minitower Desktop model is based on a typically configured product. AC Input Voltage at 115 VAC AC Input Voltage at 230 VAC AC Input Voltage at 100 VAC +/- 5 VAC, 60 Hz +/- 3 Hz +/- 5 VAC, 50 Hz +/- 3 Hz +/- 5 VAC, 50 Hz +/- 3 Hz 57.72 W 57.16 W 58.12 W

3.01 W

3.32 W

2.99 W

2.98 W

1.47 W

1.76 W

1.45 W

0.81 W

1.09 W

0.79 W
AC Input Voltage at 115 VAC +/- 5 VAC, 60 Hz +/- 3 Hz 196.94 BTU/hr
AC Input Voltage at 230 VAC +/- 5 VAC, 50 Hz +/- 3 Hz 195.029 BTU/hr
AC Input Voltage at 100 VAC +/- 5 VAC, 50 Hz +/- 3 Hz 198.305 BTU/hr

10.27 BTU/hr

11.327 BTU/hr

10.201 BTU/hr

Material Usage

Packaging
End-of-life Management and Recycling
Design packaging materials for ease of disassembly. Maximize the use of post-consumer recycled content materials in packaging materials. Use readily recyclable packaging materials such as paper and corrugated materials. Reduce size and weight of packages to improve transportation fuel efficiency. Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. For more information about HP's commitment to the environment: Hewlett-Packard Corporate Environmental Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Information Eco-label certifications http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html Copyright 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Intel and Pentium are U.S. registered trademarks of Intel Corporation. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.