Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] HP Compaq nx6310 Notebook PC HP Compaq nx6320 Notebook PC HP Compaq nc6310 Notebook PC HP Compaq nc6320 Notebook PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries With a surface greater than 10 sq cm Mother board, PCMCIA board All types including standard alkaline and lithium coin or button style batteries 6 cell battery and RTC battery For example, mercury in lamps, display backlights, scanner lamps, switches, batteries LCD lamp Includes background illuminated displays with gas discharge lamps 2 2
Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing EL-MF877-00 Template Revision A
Include the cartridges, print heads, tubes, vent chambers, and service stations.

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radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 screw driver Description #2 screw driver Description #3 screw driver Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. Remove primary battery module Remove HDD module (contains PCA) Remove expansion memory module (contains PCA) Remove minicard module (contains PCA) Remove ODD assembly (contains PCA) Remove Bluetooth module (contains PCA) Remove Keyboard Remove strip cover Remove LCD cable and antenna Divide LCD assembly from base assembly Remove FAN assembly from base assembly Remove thermal assembly from base assembly Divide logic-up assembly(with RTC coin cell Battery) from base assembly Remove RTC coint cell battery Remove PCMCIA PCA Remove speaker Remove modem module and RJ-11 wire from logic-lower PCA Divide M/B(with CPU and memory) and logic-lower PCA Dismantling LCD module: tear off cover film and tape Unscrew and remove PCA on the panel Tear off fixing tape Dismantle the panel Separate sheet Dismantle lamp unit and remove mercury lamp for selective treatment T8 philip #0 #1 philip 4.0 mm

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Template Revision A

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QuickSpecs

Overview
HP Compaq nx6310 Notebook PC

1. 2. 3. 4. 5. 6. 7. 8.

Stereo Speakers Touchpad with Scroll Zone Hard Drive Activity LED Battery Charging LED Power/Standby LED Wireless On/Off LED PC Card Eject Button PC Card Slot
9. 10. 11. 12. 13. 14. 15. 16.
Microphone Jack Headphone Jack 2 USB 2.0 Ports VGA/External Monitor Connector RJ-45 Port (NIC) Power Button with LED Wireless On/Off Button with LED Dual-band Wireless LAN Antennas

DA - 12432

North America Version 5 May 3, 2006

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1. 2. 3.
IEEE 1394a Port RJ-11 Port (Modem) Optical Drive Button

4. 5. 6.

Optical Drive DC Power Connector Kensington Lock Slot

At A Glance

Genuine Microsoft Windows XP Professional, Genuine Microsoft Windows XP Home Edition, or FreeDOS Intel Core Duo Processors T2300 to T2600*, Intel Core Solo Processor T1300* Intel Celeron M Processors 410 to 430 (available May 2006)* Sleek industrial design starting at 6.1 lb/2.77 kg and 1.2-inch/30.3 mm thin at front Mobile Intel 945GM Express Chipset or Mobile Intel 940GML Express Chipset Supports up to 4GB** of 533- or 667-MHz DDR2 SDRAM, dual channel memory support Up to 100-GB SATA 5400 rpm, user-removable hard drive Intel Graphics Media Accelerator 950 with up to 128 MB shared system memory Optional integrated 802.11 a/b/g or 802.11 b/g wireless LAN module and Bluetooth Broadcom 10/100 Ethernet PCI Controller Touchpad with scroll zone Protected by one-year standard parts and labor warranty certain restrictions and exclusions apply * Intel's numbering system is not a measurement of higher performance. Intel Core Duo and Core Solo processors available with Intel 945GM Express Chipset only. ** 4-GB memory available with Intel 945GM Express Chipset only; up to 2GB supported on Intel 940GM Express Chipset. Above 3GB, all memory may not be available due to system resource requirements.

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Standard Features

Processors

Intel Core Duo Processor T2600* (2.16-GHz, 667-MHz FSB, 2-MB L2 cache) Intel Core Duo Processor T2500* (2.00-GHz, 667-MHz FSB, 2-MB L2 cache) Intel Core Duo Processor T2400* (1.83-GHz, 667-MHz FSB, 2-MB L2 cache) Intel Core Duo Processor T2300* (1.66-GHz, 667-MHz FSB, 2-MB L2 cache) Intel Core Solo Processor T1300* (1.66-GHz, 667-MHz FSB, 2-MB L2 cache) Intel Celeron M Processor 430* (1.73-GHz, 533-MHz FSB, 1-MB L2 cache) Intel Celeron M Processor 420* (1.60-GHz, 533-MHz FSB, 1-MB L2 cache) Intel Celeron M Processor 410* (1.46-GHz, 533-MHz FSB, 1-MB L2 cache) * Intel's numbering is not a measurement of higher performance. Intel Core Duo and Core Solo processors available with Intel 945GM Express Chipset only. Intel Celeron M Processors available in May 2006. NOTE: Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.

Operating System

Preinstalled

Supported Certified

Genuine Microsoft Windows XP Professional SP2 Genuine Microsoft Windows XP Home Edition SP2 FreeDOS Genuine Microsoft Windows 2000 (drivers downloadable from http://www.hp.com) Novell Linux Desktop 9

Chipset

Mobile Intel 945GM Express Chipset with 667-MHz front side bus or Mobile Intel 940GML Express Chipset with 533-MHz front side bus available May 2006

Graphics

Intel Graphics Media Accelerator 950 with up to 128-MB shared system memory

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Keyboard
The 101/102-key compatible keyboard features an industry standard, full-pitch key layout with desktop keyboard features, such as the isolated inverted-T cursor control keys, editing keys, both left and right control and alt keys, and 12 function keys. US and International key layouts are available. Other features include an integrated numeric keypad, hotkeys for instant access to power conservation, brightness, and other features, 19-mm x 19-mm key pitch (center-to-center spacing), 2.5-mm stroke, comfort-dished keycaps, and bright key legends for improved visibility in low light conditions.
One-Touch Productivity Buttons
Provides one-touch access to control Wireless On/Off, with LED indicator

Pointing Device

Touchpad with scroll zone, two soft-touch pick buttons

Expansion Card Slots

One Type I/II PC Card slot
Supports 32-bit CardBus and 16-bit PC Cards

Storage

SATA 60-, 80-, 100-GB 5400 rpm SMART SATA Hard Drives NOTE: These hard drives are customer removable and will withstand multiple insertion/removal cycles. Up to 8 GB is reserved for the system recovery software. Hard drive is mounted directly to the notebook frame, reducing the HP Mobile Data transmission of shock to the hard drive and protecting it during normal use Protection System from shock and vibration. DVD/CD-RW Combo Fixed Optical Drives DVD+/-RW SuperMulti with Double Layer LightScribe DVD+/-RW with Double Layer

Interfaces

PC Card Slot External Monitor IEEE 1394a Port External Microphone Headphone/Line out Power Connector RJ-11 (Modem) RJ-45 (NIC) USB 2.0 Extended Life Battery Connector LED Status Indicators
One Type I/II One VGA One One One One One One Two One Ten
ADI High Definition CODEC Integrated 16-bit Sound Blaster Pro compatible audio Integrated stereo speakers Stereo headphone/line out Stereo microphone in

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Software Preloaded Software Microsoft Windows XP
Adobe Acrobat Reader HP Backup and Recovery Manager HP Help and Support Center HP Mobile Print Driver HP ProtectTools Security Manager: BIOS Configuration for HP ProtectTools Credential Manager for HP ProtectTools HP Quick Launch Buttons HP Wireless Assistant Sonic Digital Media Plus: RecordNow! (for optional DVD+/-RW and DVD/CDRW drives) MyDVD (DVD Authoring for optional DVD+/-RW drives) Synaptics Touchpad Driver Symantec Norton Internet Security with complimentary 60-day live update Intervideo WinDVD DVD Player (for optional DVD+/-RW, DVD/CDRW and DVD drives)
HP Backup and Recovery Each unit is shipped with HP Backup and Recovery Manager. HP Backup and Recovery Manager can provide data and system file protection for HP business PCs to enable fast recovery if the system Manager becomes corrupted or if important information is accidentally deleted. HP Backup and Recovery Manager can perform scheduled or manual backups of the entire drive or individual files and folders. Up to 8 GB of the hard drive is reserved for the system recovery software. HP Backup and Recovery Manager can also create software recovery CDs or DVDs (requires optional hardware).

Power Conservation

Supports enhanced Intel SpeedStep technology on models with Mobile Intel 945GM Express Chipset that have Intel Core Duo processors (allows Battery Optimized Mode, Maximum Performance Mode, or Automatic mode) Intel Display Power Saving technology Hibernation Standby ACPI compliance

Service and Support

HP Services includes a one-year standard parts and labor warranty, pick-up or carry-in, and toll-free 7 x 24 hardware technical phone support. On-site service and warranty upgrades are also available. NOTE: Certain restrictions and exclusions apply. Consult the HP Customer Support Center for details. http://h20000.www2.hp.com/bizsupport/TechSupport/ProductRoot.jsp.

Select Model(s)

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nx6310 PZ902UA#ABA Processor Operating System System Memory Hard Drive Optical Drive Display Graphics Audio Communications Integrated Wireless TPM Embedded Security Chip Pointing Device Battery Power Warranty
Intel Core Solo Processor T1300* (1.66-GHz, 667-MHz FSB, 2-MB L2 cache) Microsoft Windows XP Professional Edition 512-MB 533-MHz DDR2 SDRAM (1 DIMM) 60-GB 5400 rpm SATA 24x DVD/CD-RW Combo (Fixed) 15.0-inch XGA BrightView (1024 x 768 resolution and 16 M colors) Intel Graphics Media Accelerator 950 with up to 128-MB shared system memory ADI1981HD High Definition CODEC, Line out/headphone and microphone jacks 56K Fax/Modem, Broadcom 10/100 Ethernet Controller Intel Pro/Wireless 802.11 a/b/g No Touchpad with scroll zone, two soft-touch pick buttons 6-cell high capacity Lithium-Ion (52Wh) External 65W adapter 1 Year Worldwide Limited Warranty

nx6310 PZ903UA#ABA

Processor Operating System System Memory Hard Drive Optical Drive Display Graphics Audio Communications Integrated Wireless TPM Embedded Security Chip Pointing Device Battery Power Warranty
Intel Core Solo Processor T1300* (1.66-GHz, 667-MHz FSB, 2-MB L2 cache) Microsoft Windows XP Professional Edition 512-MB 533-MHz DDR2 SDRAM (1 DIMM) 60-GB 5400 rpm SATA 24x DVD/CD-RW Combo (Fixed) 15.0-inch XGA (1024 x 768 resolution and 16 M colors) Intel Graphics Media Accelerator 950 with up to 128-MB shared system memory ADI1981HD High Definition CODEC, Line out/headphone and microphone jacks 56K Fax/Modem, Broadcom 10/100 Ethernet Controller Intel Pro/Wireless 802.11 a/b/g Integrated Bluetooth No Touchpad with scroll zone, two soft-touch pick buttons 6-cell high capacity Lithium-Ion (52Wh) External 65W adapter 1 Year Worldwide Limited Warranty

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nx6310 PZ904UA#ABA Processor Operating System System Memory Hard Drive Optical Drive Display Graphics Audio Communications Integrated Wireless
TPM Embedded Security Chip Touchpad with scroll zone, two soft-touch pick buttons Pointing Device 6-cell high capacity Lithium-Ion (52Wh) Battery External 65W adapter Power 1 Year Worldwide Limited Warranty Warranty * Intel's numbering is not a measurement of higher performance.
Intel Core Duo Processor T2400* (1.83-GHz, 667-MHz FSB, 2-MB L2 cache) Microsoft Windows XP Professional Edition 512-MB 533-MHz DDR2 SDRAM (1 DIMM) 80-GB 5400 rpm SATA DVD+/-RW SuperMulti with Double Layer (Fixed) 15.0-inch SXGA+ wide viewing angle (1400 x 1050 resolution and 16 M colors) Intel Graphics Media Accelerator 950 with up to 128-MB shared system memory ADI1981HD High Definition CODEC, Line out/headphone and microphone jacks 56K Fax/Modem, Broadcom 10/100 Ethernet Controller Intel Pro/Wireless 802.11 a/b/g Integrated Bluetooth No

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Options
Memory 256-MB 533-MHz DDR2 SDRAM 512-MB 533-MHz DDR2 SDRAM 1024-MB 533-MHz DDR2 SDRAM 512-MB 667-MHz DDR2 SDRAM 1024-MB 667-MHz DDR2 SDRAM 2048-MB 667-MHz DDR2 SDRAM
PE830A PE831A PE832A EM993AA EM994AA EM995AA

Other Storage

80-GB 5400 rpm Primary SATA Hard Drive HP USB Digital Drive + 256-MB Secure Digital Card HP USB Diskette Drive

ET354AA DL702AA DC361B

Intel PRO/Wireless 3945ABG 802.11 a/b/g WLAN option kit

EX150AA#ABA

Expansion Solutions

HP 4-port USB 2.0 Hub

DG954A
HP 2-bay Battery Charging Station HP 10-bay Battery Charging Station Battery Adapter kit #1 65W Smart AC Adapter 90W Smart AC Adapter 90W Smart Auto Adapter 65W Air/Auto/AC Combo Adapter 90W Aircraft Cables Primary 6-cell Battery Pack HP 8-cell Extended Life Battery HP 12-cell Ultra-Capacity Battery
DT533A#ABA DT534A#ABA PK402A ED494AA#ABA ED495AA#ABA ED493AA ED993AA#ABA DC899A PB994A PB993A EJ092AA#ABA

Carrying Cases

HP Entry Value Case HP Top Load Nylon HP Executive Leather case HP Sport Backpack
DL617A DC915A PA847A DG102A

HP/Kensington Cable Lock

PC766A

Input/Output Devices

USB/PS2 Keyboard USB/PS2 Optical Mouse HP USB Optical Travel Mouse

DC852A#ABA DC369A F2100A

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Memory

Support for up to 4096 MB* of 533- or 667-MHz DDR2 SDRAM Two DIMM slots DIMM sizes supported: 256 MB, 512 MB, 1024 MB, and 2048 MB Standard Memory 256 MB (256 MB x 1) 512 MB (512 MB x 1 or 256 MB x 2) 1024 MB (1024 MB x 1 or 512 MB x 2) 2048 MB (1024 MB x 2)

Optional Memory Upgrades

Support for up to 4096 MB* of memory is available (with the installation of optional DDR2 SDRAM memory kits). Both memory slots are user accessible. Please refer to the Hardware and Software Guide for installation procedures. Maximized dual-channel performance requires SODIMMs of the same size and speed in both memory slots. Slot MB 1024 MB 512 MB 1024 MB 1024 MB 1024 MB 2048 MB Slot MB Empty 512 MB 256 MB 512 MB 1024 MB 2048 MB

Up to 768 MB 1024 MB 1024 MB 1280 MB 1536 MB 2048 MB 4096 MB*
NOTE: This chart does not represent all possible memory configurations. Due to the non-industry standard nature of some third-party memory modules, we strongly recommend using only HP branded memory modules to ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.

Memory Upgrades

256-MB 533-MHz DDR2 SDRAM 512-MB 533-MHz DDR2 SDRAM 1024-MB 533-MHz DDR2 SDRAM 512-MB 667-MHz DDR2 SDRAM 1024-MB 667-MHz DDR2 SDRAM 2048-MB 667-MHz DDR2 SDRAM
* 4-GB memory available with Intel 945GM Express Chipset only. Above 3-GB, all memory may not be available due to system resource requirements.

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Removable Media Drive Support
Quantity Supported One One One Drive Bay Fixed optical drive bay Fixed optical drive bay Fixed optical drive bay
LightScribe DVD+/-RW Drive with Double Layer DVD+/-RW SuperMulti Drive with Double Layer DVD/CD-RW Combo Drive

Hard Drive Support

Quantity Supported Primary Hard Drives 100-GB 5400 rpm SMART SATA Hard Drive 80-GB 5400 rpm SMART SATA Hard Drive 60-GB 5400 rpm SMART SATA Hard Drive One One One Drive Bay Dedicated hard drive bay Dedicated hard drive bay Dedicated hard drive bay

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Technical Specifications

System Unit

1.2 (at front) x 12.9 x 10.8 in (30.3 (at front) x 328.6 x 247.3 mm) Dimensions (HxWxD) with 15.0-inch display 6.1 lb (2.77 kg) Weight NOTE: Height varies depending upon where on the notebook the measurement is made. Weight varies by configuration and components. Weight includes 6-cell battery, 60-GB hard drive, 256-MB memory, and CD-ROM drive. Weight varies by configuration and components. Normal Operating 18.5 V Stand-Alone Power Voltage Requirements Average Operating Power 12.5 W Max Operating Power < 65 W Operating 32 to 95 F (0 to 35 C) (not writing optical) Temperature 41 to 95 F (5 to 35 C) (writing optical) Non-operating -4 to 140 F (-20 to 60 C) Operating 10% to 90%, non-condensing Relative Humidity Non-operating 5% to 95%, 101.6 F (38.7 C) maximum wet bulb temperature Operating 125 G, 2 ms, half-sine Shock Non-operating 200 G, 2 ms, half-sine Operating 0.75 grms Random Vibration Non-operating 1.50 grms Operating -50 to 10,000 ft (-15.24 to 3,048 m) Altitude (unpressurized) Non-operating -50 to 40,000 ft (-15.24 to 12,192 m) UL Yes Industry Standard Certifications CSA Yes FCC Compliance Yes Energy Star Compliant Yes ICES Yes GS Yes Australia / NZ A-Tick Yes Compliance CCC Yes Japan VCCI Compliance Yes MIC Yes BSMI Yes CE Marking Compliance Yes BNCI or BELUS Yes CIT Yes GOST Yes Saudi Arabian Yes Compliance (ICCP) SABS Yes UKRSERTCOMPUTER Yes

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HP 65W Smart AC Adapter Dimensions Weight Input

Output

Connector Environmental Design
EMI and Safety Certifications

Option Kit Contents

4.17 x 1.85 x 1.1 in (10.6 x 4.7 x 2.8 cm) 0.62 lb (280 g) 100 to 240 VAC Input Efficiency 83% min at 115 VAC Input frequency range 47 to 63 Hz Input AC current 1.7 A at 90 VAC, 0.85 A at 180 VAC Output power 65W 65W DC output 18.5V Hold-up time 5 msec at 115 VAC input Output current limit <11A, Over voltage protection- 29V max automatic shutdown 3 pin/grounded, mates with interchangeable cords Operating temperature 32 to 104 F (0 to 40 C) Non-operating (storage) -4 to 149 F (-20 to 65 C) temperature Altitude 0 to 10,000 ft (0 to 3,048 m) Humidity 20% to 80% Storage Humidity 10% to 90% CE Mark full compliance with LVD and EMC directives; Worldwide safety standards IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE; MTBF over 200,000 hours at 25C ambient condition. 65W AC Adapter, power cable, warranty booklet
Optional HP 12-Cell Ultra-Capacity Battery
Dimensions (H x W x L) Weight Cells/Type Energy

Temperature

Battery Re-Charge Time

Fuel Gauge

1.3 x 6.0 x 10.6 in (3.33 x 15.25 x 26.88 cm) 1.77 lb (0.803 kg) 12-cell Lithium-Ion Voltage 14.8V Watt-hour Capacity 95Wh Amp-hour Capacity 6.45Ah Operating (Charging) 32 to 113 F (0 to 45 C) Operating (Discharging) 14 to 140 F (10 to 60 C) Non-operating 4 to 140 F (20 to 60 C) Smart Adapter 3 to 4 hours System ON 4 to 5 hours (depending on system power consumption) When pressed, LEDs light indicating level of charge remaining on battery

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Optional HP 8-Cell Extended Life Battery Dimensions (H x W x L) Weight Cells/Type Energy
1.0 x 3.9 x 8.7 in (2.5 x 10.0 x 22.0 cm) 1.00 lb (0.455 kg) 8-cell Lithium-Ion Voltage 14.4V Watt-hour Capacity 52Wh Amp-hour Capacity 3.6Ah Operating (Charging) 32 to 113 F (0 to 45 C) Operating (Discharging) 14 to 140 F (10 to 60 C) Non-operating 4 to 140 F (20 to 60 C) System in OFF mode or 3 hours Standby System ON 3 to 5 hours (depending on system power consumption) HP Fast Charge Charges the battery up to 90% within 90 minutes Technology when system is OFF When pressed, LEDs light indicating level of charge remaining on battery
52Wh Primary 6-Cell Battery
0.8 x 2.1 x 8.0 in (2.0 x 5.3 x 20.3 cm) 0.737 lb (0.335 kg) 6-cell Lithium-Ion Voltage 10.8V Watt-hour Capacity 52Wh Amp-hour Capacity 4.8Ah Operating (Charging) 32 to 113 F (0 to 45 C) Operating (Discharging) 14 to 140 F (10 to 60 C) Non-operating 4 to 140 F (20 to 60 C) System in OFF Mode or 2.5 hours Standby System ON 3 to 5 hours (depending on system power consumption) HP Fast Charge Charges the battery up to 90% within 1.5 hours Technology when system is OFF

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43Wh Primary 6-Cell Battery Dimensions (H x W x L) Weight Cells/Type Energy
0.8 x 2.1 x 8.0 in (2.0 x 5.3 x 20.3 cm) 0.715 lb (0.325 kg) 6-cell Lithium-Ion Voltage 10.8V Watt-hour capacity 43Wh Amp-hour capacity 4.0Ah Operating (Charging) 32 to 113 F (0 to 45 C) Operating (Discharging) 14 to 140 F (10 to 60 C) Non-operating 4 to 140 F (20 to 60 C) System in OFF mode or 2.5 hours Standby System ON 3 to 5 hours (depending on system power consumption) HP Fast Charge Charges the battery up to 90% within 1.5 hours Technology when system is OFF
15.0-Inch Color TFT SXGA+ Wide Viewing Angle Display
Active Area (W x H) Diagonal Size Surface Treatment Number of Colors Contrast Ratio Refresh Rate Brightness Pixel Resolution
Backlight PPI Viewing Angle
12.0 x 9.0 in (30.4 x 22.8 cm) 15.0 in (38.0 cm) Anti-glare Up to 16M 300:1 (typical) 60 Hz 170 nit (typical) 0.217 mm Pitch 1400 x 1050 Format RGB Stripe Configuration CCFL Horizontal, +40/-45 Vertical (typical)

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15.0-Inch Color TFT XGA Display Active Area (W x H) Diagonal Size Surface Treatment Number of Colors Contrast Ratio Refresh Rate Brightness Pixel Resolution
12.0 x 9.0 in (30.4 x 22.8 cm) 15.0 in (38.0 cm) Anti-glare Up to 16M 300:1 (typical) 60 Hz 150 nit (typical) 0.296 mm Pitch 1024 x 768 Format RGB Stripe Configuration CCFL Horizontal, 25 Vertical (typical)
15.0-Inch Color TFT XGA BrightView Display
12.0 x 9.0 in (30.4 x 22.8 cm) 15.0 in (38.0 cm) BrightView Up to 16M 300:1 (typical) 60 Hz 150 nit (typical) 0.296 mm Pitch 1024 x 768 Format RGB Stripe Configuration CCFL Horizontal, 25 Vertical (typical)

Hard Drives

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100-GB 5400 rpm SATA Drive Weight Capacity Height Width Interface Transfer Rate Seek Time (typical reads, including settling) Rotational Speed Logical Blocks Operating Temperature Features
0.22 lb (101 g) 100 GB 0.37 in (9.5 mm) 2.75 in (70 mm) ATA-7 / SATA 1.0a Synchronous (maximum) 100 MB/s (Drive Capability) Single Track 3 ms Average 13 ms Maximum 24 ms 5400 rpm 195,371,to 140 F (5 to 60 C) [case temp] ATA Security

80-GB 5400 rpm SATA

Drive Weight Capacity Height Width Interface Transfer Rate Seek Time (typical reads, including settling) Rotational Speed Logical Blocks Operating Temperature Features

Broadcom 4311AG 802.11a/b/g WiFi Adapter

Wireless LAN Standards

Interoperability

Frequency Band

IEEE 802.11a IEEE 802.11b IEEE 802.11g Wi-Fi certified Cisco Compatible Extensions Program compliant (details at www.hp.com/go/notebooks/WLAN) 2.4 GHz and 5 GHz

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Data Rates Modulation Security1
802.11b: 1, 2, 5.5, 11 Mbps 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps Direct Sequence Spread Spectrum DBPSK, DQPSK, CCK, OFDM Supports 64- and 128-bit WEP, WPA, WPA2, hardware-accelerated AES, 802.1x authentication types EAP-TLS, EAP-TTLS, PEAP-GTC, PEAPMSCHAPv2, LEAP, EAP-FAST, EAP-SIM. Support for Cisco Security Features (proven compatibility with Cisco Aironet infrastructure products through the Cisco Compatible Extensions Program Version 4). Multinational support with frequency bands and channels compliant to local regulations. CSMA/CA (Collision Avoidance) with ACK Ad-hoc (Peer to Peer) Infrastructure (Access Point Required) IEEE 802.11 compliant roaming between access points 17.5 dBm 15 dBm
Sub-channels Media Access Protocol Network Architecture Models Roaming Output Power (for CKK)2 Output Power (for OFDM; power varies by data rate)2 Power Consumption
Power Management Receiver Sensitivity4 Antenna type Range
Form Factor Weight Dimensions Operating Voltage Temperature Humidity Altitude
Transmit: 2.0 W (max) Receive: 1.5 W (max) Idle mode3: 390 mW (nominal) Sleep mode: 20 mW (max) ACPI compliant power management 802.11 compliant power saving mode 54 Mbps: -72 dBm, 11 Mbps: -88 dBm , 1 Mbps: -97 dBm High efficiency dual band antenna with spatial diversity, mounted in the display enclosure 802.11 a Typical 600 feet Outdoor Open Area (@6 Mbps) 150 feet Indoor, Office environment 802.11 b Typical 1200 feet Outdoor Open Area (@1 Mbps) 300 feet Indoor, Office environment 802.11 g Typical 1200 feet Outdoor Open Area (@1 Mbps) 300 feet Indoor, Office environment PCI-Express MiniCard 0.026 lb (12 g) 0.19 x 1.2 x 2.0 in (4.75 x 29.85 x 50.8 mm) 3.3v +/- 10% Operating 32 to 176 F (0 to 80 C) Non-operating -40 to 176 F (-40 to 80 C) Operating 10% to 90% (non-condensing) Non-operating 5% to 95% (non-condensing) Operating 0 to 10,000 ft (3,048 m) Non-operating 0 to 50,000 ft (15,240 m)

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Configuration Utility5 Choice of Configuration Utility:
Microsoft Windows XP Wireless Network Connection Manager Broadcom Wireless Configuration Utility (required for Cisco Compatible Extensions support) LED Off Radio OFF; Solid LED On Radio ON LED Activity 1. Check latest software/driver release for updates on supported security features. 2. Maximum output power may vary by country according to local regulations. 3. In Power Save Polling mode. 4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation). 5. WLAN supplier's client utility is required for Cisco Compatible Extensions support. WLAN may also be compatible with certain third-party software supplicants.

Broadcom 4311BG Wireless LAN Standards 802.11b/g WiFi Adapter Interoperability
Frequency Band Data Rates Modulation Security1
IEEE 802.11b IEEE 802.11g Wi-Fi certified Cisco Compatible Extensions Program compliant (details at www.hp.com/go/notebooks/WLAN) 2.4 GHz 802.11b: 1, 2, 5.5, 11 Mbps 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps Direct Sequence Spread Spectrum DBPSK, DQPSK, CCK, OFDM Supports 64- and 128-bit WEP, WPA, WPA2, hardware-accelerated AES, 802.1x authentication types EAP-TLS, EAP-TTLS, PEAP-GTC, PEAPMSCHAPv2, LEAP, EAP-FAST, EAP-SIM.
Support for Cisco Security Features (proven compatibility with Cisco Aironet infrastructure products through the Cisco Compatible Extensions Program Version 4). Multinational support with frequency bands and channels compliant to local Sub-channels regulations. CSMA/CA (Collision Avoidance) with ACK Media Access Protocol Ad-hoc (Peer to Peer) Network Architecture Infrastructure (Access Point Required) Models IEEE 802.11 compliant roaming between access points Roaming 2 17.5 dBm Output Power (for CKK) Output Power (for OFDM; 15 dBm power varies by data rate)2 Transmit: 2.0 W (max) Power Consumption Receive: 1.5 W (max) Idle mode3: 390 mW (nominal) Sleep mode: 20 mW (max) ACPI compliant power management Power Management 802.11 compliant power saving mode Mbps: -72 dBm, 11 Mbps: -88 dBm , 1 Mbps: -97 dBm Receiver Sensitivity

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Antenna type Range
Form Factor Weight Dimensions Operating Voltage Temperature Humidity Altitude Configuration Utility5
High efficiency dual band antenna with spatial diversity, mounted in the display enclosure 802.11 b Typical 1200 feet Outdoor Open Area (@1 Mbps) 300 feet Indoor, Office environment 802.11 g Typical 1200 feet Outdoor Open Area (@1 Mbps) 300 feet Indoor, Office environment PCI-Express MiniCard 0.026 lb (12 g) 0.19 x 1.2 x 2.0 in (4.75 x 29.85 x 50.8 mm) 3.3v +/- 10% Operating 32 to 176 F (0 to 80 C) Non-operating -40 to 176 F (-40 to 80 C) Operating Non-operating Operating Non-operating 10% to 90% (non-condensing) 5% to 95% (non-condensing) 0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
Choice of Configuration Utility:
Intel PRO/Wireless 3945ABG 802.11a/b/g Network Connection
IEEE 802.11a IEEE 802.11b IEEE 802.11g Wi-Fi certified Cisco Compatible Extensions Program compliant (details at www.hp.com/go/notebooks/WLAN) 2.4 GHz and 5 GHz 802.11b: 1, 2, 5.5, 11 Mbps 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps Direct Sequence Spread Spectrum DBPSK, DQPSK, CCK, OFDM Supports 64- and 128-bit WEP, WPA, WPA2, hardware-accelerated AES, 802.1x authentication types EAP-TLS, EAP-TTLS, PEAP-GTC, PEAPMSCHAPv2, LEAP, EAP-FAST, EAP-SIM. Support for Cisco Security Features (proven compatibility with Cisco Aironet infrastructure products through the Cisco Compatible Extensions Program Version 4).

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Sub-channels
Multinational support with frequency bands and channels compliant to local regulations. CSMA/CA (Collision Avoidance) with ACK Media Access Protocol Ad-hoc (Peer to Peer) Network Architecture Infrastructure (Access Point Required) Models IEEE 802.11 compliant roaming between access points Roaming dBm Output Power (for CKK) Output Power (for OFDM; 15 dBm power varies by data rate)2 Transmit: 1.8 Watts (max) Power Consumption Receive: 1.4 Watts (max) Idle mode3: 150 mW (nominal) Sleep mode: 30 mW (max) ACPI compliant power management Power Management 802.11 compliant power saving mode Mbps: -72 dBm, 11 Mbps: -88 dBm , 1 Mbps: -97 dBm Receiver Sensitivity High efficiency dual band antenna with spatial diversity, mounted in the Antenna type display enclosure 802.11 a Typical 600 feet Outdoor Open Area Range (@6 Mbps) 150 feet Indoor, Office environment 802.11 b Typical 1200 feet Outdoor Open Area (@1 Mbps) 300 feet Indoor, Office environment 802.11 g Typical 1200 feet Outdoor Open Area (@1 Mbps) 300 feet Indoor, Office environment PCI-Express MiniCard Form Factor 0.013 lb (6 g) Weight 0.19 x 1.2 x 2.0 in (4.75 x 29.85 x 50.8 mm) Dimensions 3.3v +/- 10% Operating Voltage Operating 32 to 176 F (0 to 80 C) Temperature Non-operating -40 to 176 F (-40 to 80 C) Operating 10% to 90% (non-condensing) Humidity Non-operating 5% to 95% (non-condensing) Operating 0 to 10,000 ft (3,048 m) Altitude Non-operating 0 to 50,000 ft (15,240 m) Configuration Utility5 Choice of Configuration Utility:
Microsoft Windows XP Wireless Network Connection Manager Intel PROSet (required for Cisco Compatible Extensions support) LED Off Radio OFF; Solid LED On Radio ON LED Activity 1. Check latest software/driver release for updates on supported security features. 2. Maximum output power may vary by country according to local regulations. 3. In Power Save Polling mode. 4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation). 5. WLAN supplier's client utility is required for Cisco Compatible Extensions support. WLAN may also be compatible with certain third-party software supplicants.

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HP Integrated Module with Bluetooth Wireless Technology Bluetooth Specification Dimensions Frequency Band Number of Available Channels Data Rates and Throughput
2.0 Compliant 1.02 x 0.55 x 0.22 in (26 x 14 x 5.7 mm) 2402 to 2480 MHz 79 (1 MHz) available channels 3 Mbps data rate; throughput up to 2.17 Mbps Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric or 1306.9 kbps symmetric -6 dBm to 4 dBm (Bluetooth Class II) Better than -80 dBM at 0.1 % raw bit error rate Peak (Tx) 264 mW Peak (Rx) 231 mW Sleep <1 mW Internally integrated within module Up 33 ft (10 m) USB 2.0 compliant Microsoft Windows Plug and Play compliant Microsoft Windows XP Professional and Home Microsoft Windows 2000 Broadcom Bluetooth for Windows Microsoft Windows XP Bluetooth Software Point to Point, Multipoint Pico Nets up to 7 slaves Full support of Bluetooth Security Provisions Microsoft Windows ACPI, and USB Bus Support Self configurable to optimize power conservation in all operating modes, including Standby, Hold, Park, and Sniff All necessary regulatory approvals for supported countries, including: FCC (47 CFR) Part 15C, Section 15.247 & 15.249 ETS 300 328, ETS Low Voltage Directive IEC950 UL, CSA, and CE Mark Operating -4 to 158 F (-20 to 70 C) Non-operating -40 to 176 F (-40 to 80 C) Operating 10% to 90% Non-operating 5% to 95% Operating 15,000 ft (4,572 m) Non-operating 40,000 ft (12,192 m)

Transmit Power Receiver Sensitivity Power Consumption
Antenna Range Electrical Interface OS Support Bluetooth Software Supported Link Topology Security Power Management

Certifications

Temperature Humidity Altitude

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Bluetooth Profiles Supported
(with Bluetooth for Windows 4.0 software) Serial Port Profile (SPP)* Dial-Up Networking (DUN)* Generic Object Exchange Profile (GOEP) Object Push Profile (OPP)* File Transfer Profile (FTP) Synchronization Profile (SYNC) Hard Copy Cable Replacement (HCRP)* Personal Area Networking Profile (PAN)* Human Interface Device Profile (HID)* FAX Profile (FAX) Basic Imaging Profile (BIP)
Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP) * indicates the profile is also supported by Microsoft Windows XP SP2

Environmental Data

Eco-Label Certifications & This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks: declarations US Energy Star US Federal Energy Management Program (FEMP) IT ECO declaration Taiwan Green-Mark China Energy Conservation Program This product complies with ISO standards: EU Directive 91/ 157/ EEC EU Directive 93/ 86/ EEC EU Directive 98/ 101/ EEC Batteries used in the product do not contain: Mercury greater than 5ppm by weight Cadmium greater than 10ppm by weight Lead greater than 4000 ppm by weight. This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2002/95/EC. This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.

Batteries

Additional Information

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Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/ supplychain/gen_specifications.html): Asbestos Certain Azo Colorants Certain Brominated Flame Retardants may not be used as flame retardants in plastics Cadmium Chlorinated Hydrocarbons Chlorinated Paraffins Formaldehyde Halogenated Diphenyl Methanes Lead carbonates and sulfates Lead and Lead compounds Mercuric Oxide Batteries Nickel finishes must not be used on the external surface designed to be frequently handled or carried by the user. Ozone Depleting Substances Polybrominated Biphenyls (PBBs) Polybrominated Biphenyl Ethers (PBBEs) Polybrominated Biphenyl Oxides (PBBOs) Polychlorinated Biphenyl (PCB) Polychlorinated Terphenyls (PCT) Polyvinyl Chloride (PVC) except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. Radioactive Substances Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) HP follows these guidelines to decrease the environmental impact of product packaging: Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. Eliminate the use of ozone-depleting substances (ODS) in packaging materials. Design packaging materials for ease of disassembly. Maximize the use of post-consumer recycled content materials in packaging materials. Use readily recyclable packaging materials such as paper and corrugated materials. Reduce size and weight of packages to improve transportation fuel efficiency. Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

Packaging

End-of-life Management and Recycling

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For more information about HP's commitment to the environment: Hewlett-Packard Corporate Environmental Global Citizenship Report Information http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www.hp.com/hpinfo/globalcitizenship/environment/ productdesign/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/ operations/envmanagement.html Copyright 2006 Hewlett-Packard Development Company, L.P. All rights reserved. Microsoft, Windows and Windows XP are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Core Duo, Centrino, and SpeedStep are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. Bluetooth is a registered trademark of Bluetooth SIG, Inc., in the U.S. and other countries. All other product names mentioned herein may be trademarks of their respective companies. The information contained herein is subject to change without notice and is provided "as is" without warranty of any kind. The warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

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