Intel Desktop Board D815EEA2/D815EPEA2
Technical Product Specification
May 2001 Order Number A46399-002
The Intel Desktop Boards D815EEA2 and D815EPEA2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D815EEA2/D815EPEA2 Specification Update.

Revision History

Revision -001 -002 Revision History First release of the Desktop Board D815EEA2/D815EPEA2 Technical Product Specification Second release of the Intel Desktop Board D815EEA2/D815EPEA2 Technical Product Specification Intel Date February 2001 May 2001
This product specification applies to only standard D815EEA2 and D815EPEA2 boards with BIOS identifier EA81520A.86A. Changes to this specification will be published in the Intel Desktop Board D815EEA2/ D815EPEA2 Specification Update before being incorporated into a revision of this document.
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intels Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The Intel Desktop Board D815EEA2 and the Intel Desktop Board D815EPEA2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, Pentium, Celeron, and LANDesk are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Other names and brands may be claimed as the property of others.
Copyright 2001, Intel Corporation. All rights reserved.

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for these Intel Desktop Boards: D815EEA2 and D815EPEA2. It describes the standard product and available manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the D815EEA2 and D815EPEA2 boards and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

4.5 4.6

4.8 5.1 5.2 5.3 5.4 5.5 5.6 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16.
5 Error Messages and Beep Codes

Figures

17. 18. 19. 20. 21. 22. 23. 24. 25. 26.
Locations of the Jumper Blocks....82 Board Dimensions....84 I/O Shield Dimensions (for D815EEA2 Universal Boards with Onboard LAN Subsystem)....86 I/O Shield Dimensions (for D815EPEA2 Universal Boards with Onboard LAN Subsystem)....87 I/O Shield Dimensions (for D815EPEA2 Universal Boards without Onboard LAN Subsystem)....88 I/O Shield Dimensions (for D815EEA2 Boards with Onboard LAN Subsystem)..89 I/O Shield Dimensions (for D815EPEA2 Boards with Onboard LAN Subsystem).90 I/O Shield Dimensions (for D815EPEA2 Boards without Onboard LAN Subsystem)....91 Localized High Temperature Zones...96 Diagnostic LEDs...144 Summary of Board Differences...12 Feature Summary...14 Manufacturing Options...15 Specifications....20 Supported Processors...23 Supported Memory Configurations....25 Supported Graphics Refresh Frequencies...39 LAN Connector LED States...45 Effects of Pressing the Power Switch...49 Power States and Targeted System Power...50 Wake Up Devices and Events...51 Fan Connector Descriptions....53 System Memory Map...57 I/O Map....58 DMA Channels....60 PCI Configuration Space Map...60 Interrupts....61 PCI Interrupt Routing Map...62 Overcurrent Protection for Back Panel Connectors...65 PS/2 Mouse/Keyboard Connectors....65 USB Connectors....65 VGA Port Connector (Present Only on D815EEA2 Boards)..65 Parallel Port Connector....66 Serial Port A Connector....66 LAN Connector (Optional)...67 Mic In Connector....67 Audio Line Out Connector...67 Audio Line In Connector...67 Auxiliary Line In Connector (J6B4)...70 Front Panel Audio Connector (J6B2) (Optional)...70 ATAPI CD-ROM Connector (J6B3)....70 Digital Video Out Connector (J5C1) (Optional; present only on D815EEA2 boards)....71

Tables

1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32.
33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. 47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. 71. 72. 73. 74. 75. 76. 77. 78. 79. 80.

Table 2 summarizes the D815EEA2 and D815EPEA2 boards major features.

Table 2.

Processor Memory

Form Factor

SST 49LF004A 4 Mbit Firmware Hub (FWH) SMSC LPC47M132 LPC bus I/O controller
The D815EEA2 board includes: Intel 82815 integrated graphics support AGP universal connector supporting 1x, 2x, and 4x AGP cards or a Graphics Performance Accelerator (GPA) The D815EPEA2 board includes an AGP universal connector supporting 1x, 2x, and 4x AGP cards Intel 82801BA ICH2 digital controller (AC link output) Analog Devices AD1885 Audio Codec Four Universal Serial Bus (USB) ports Two serial ports One parallel port Two IDE interfaces with Ultra DMA, ATA-66/100 support One diskette drive interface PS/2 keyboard and mouse ports
Audio Peripheral Interfaces
Expansion Capabilities BIOS
Five PCI bus add-in card connectors (SMBus routed to PCI bus connector 2) One AGP universal connector Intel/AMI BIOS (stored in an SST 49LF004A 4 Mbit FWH) Support for Advanced Power Management (APM), Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS continued
Feature Summary (continued)
Support for PCI Local Bus Specification Revision 2.2 Suspend to RAM support Wake on PS/2 keyboard and USB ports Voltage sense to detect out of range values Two fan sense inputs used to monitor fan activity Allows add-in SCSI host bus adapters to use the same LED as the onboard I/O controller Refer to Table 4, page 20

Instantly Available PC

Hardware Monitor Subsystem SCSI LED Connector For information about
The boards compliance level with APM, ACPI, Plug and Play, and SMBIOS

Manufacturing Options

Table 3 describes the D815EEA2 and D815EPEA2 boards manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you.
Table 3. Manufacturing Options
Connector for an additional chassis fan Detects chassis intrusion One CNR connector (slot shared with PCI bus connector 3)
Chassis fan connector Chassis Intrusion Connector Communication and Networking Riser (CNR) Connector Diagnostic LEDs Front Panel Audio Connector Front Panel USB Connector I/O Control LAN Subsystem Video Wake on LAN Technology Connector
Four dual-color LEDs on the back panel Routes mic in and line out to the front panel Provides access to two additional USB ports, routed through the optional SMSC LPC47M142 I/O controller SMSC LPC47M142 LPC bus I/O controller Intel 82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device Digital Video Output (DVO) connector Support for system wake up using an add-in network interface card with remote wake up capability

The optional Wake on LAN technology connector is present only on boards that do not have the Intel 82562ET PLC device, which is part of the optional onboard LAN subsystem. Wake on LAN technology enables remote wakeup of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet frame, the LAN subsystem asserts a wakeup signal that powers up the computer. Depending on the LAN implementation, the D815EEA2 and D815EPEA2 boards support Wake on LAN technology in the following ways: Through the optional Wake on LAN technology connector (APM only) Through the PCI bus PME# signal for PCI 2.2 compliant LAN designs (ACPI only) Through the onboard LAN subsystem when enabled in Setup (ACPI only)
The Wake on LAN technology connector can be used with PCI bus network adapters that have a remote wake up connector, as shown in Figure 11. Network adapters that are PCI 2.2 compliant assert the wakeup signal through the PCI bus signal PME# (pin A19 on the PCI bus connectors).

Network Interface Card

Remote Wake up connector

PCI Slot

Wake on LAN technology connector Desktop Board

OM09129

Figure 11. Using the Wake on LAN Technology Connector
For information about The location of the optional Wake on LAN technology connector The signal names of the optional Wake on LAN technology connector Refer to Figure 14, page 69 Table 38, page 72

1.15.2.4

Instantly Available Technology
For Instantly Available technology, the 5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available technology can damage the power supply. Refer to Section 2.11.3 on page 94 for additional information. Instantly Available technology enables the D815EEA2 and D815EPEA2 boards to enter the ACPI S3 (suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, the fans are off, and the front panel LED is amber if dual-color, or off if single-color.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. The D815EEA2 and D815EPEA2 boards support the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available technology requires operating system support and PCI 2.2 compliant add-in cards and drivers. The standby power indicator LED (at location CR6E1) shows that power is still present at the DIMM and PCI bus connectors, even when the computer appears to be off. Figure 12 shows the location of the standby power indicator LED on the D815EEA2 and D815EPEA2 boards.

OM11462

Figure 12. Location of Standby Power Indicator LED

Signal Name +12 V TYPEDET# Reserved Not connected Ground INTA# RST# GNT1# Vcc3.3 ST1 Reserved PIPE# Ground WBF# SBA1 Vcc3.3 SBA3 SBSTB# Ground SBA5 SBA7 Reserved Ground Reserved Vcc3.3 AD30 AD28 Vcc3.3 AD26 AD24 Ground AD_STB1# C/BE3#

Table 42.

Pin 33
Diskette Drive Connector (J6H2)
Signal Name Ground Ground Key Ground Ground Ground Ground Ground Not connected Ground Ground Ground Ground Not connected Ground Ground Ground Pin 34 Signal Name DENSEL Reserved FDEDIN FDINDX# (Index) FDM00# (Motor Enable A) Not connected FDDS0# (Drive Select A) Not connected FDDIR# (Stepper Motor Direction) FDSTEP# (Step Pulse) FDWD# (Write Data) FDWE# (Write Enable) FDTRK0# (Track 0) FDWPD# (Write Protect) FDRDATA# (Read Data) FDHEAD# (Side 1 Select) DSKCHG# (Diskette Change)

Table 43.

IDE Connectors (J6H1, Primary and J6G2, Secondary)
Pin Signal Name Ground Data 8 Data 9 Data 10 Data 11 Data 12 Data 13 Data 14 Data 15 Key Ground Ground Ground Ground Ground Reserved GPIO_DMA66_Detect_Pri (GPIO_DMA66_Detect_Sec) DAG2 (Address 2) Chip Select 3P# [Chip Select 3S#] Ground
Signal Name Reset IDE Data 7 Data 6 Data 5 Data 4 Data 3 Data 2 Data 1 Data 0 Ground DDRQ0 [DDRQ1] I/O Write# I/O Read# IOCHRDY DDACK0# [DDACK1#] IRQ 14 [IRQ 15] DAG1 (Address 1) DAG0 (Address 0) Chip Select 1P# [Chip Select 1S#] Activity#
Signal names in brackets ([ ]) are for the secondary IDE connector.

External I/O Connectors

Figure 16 shows the locations of the external I/O connectors on the D815EEA2 and D815EPEA2 boards.

OM11466

Item A B C D E
Description Auxiliary front panel power LED Front panel SCSI LED Serial port B Front panel USB (optional)
Reference Designator J9H2 J9H3 J8H2 J8H1 J8F1
For more information see: Table 46 Table 48 Table 47 Table 44 Table 45
Figure 16. External I/O Connectors

Table 44.

Serial Port B Connector (J8H1)
Signal Name DCD2# TXD2 (Transmit Data) Ground RTS2# RI2# Pin 10 Signal Name RXD2 (Receive Data) DTR2# DSR2# CTS2# Key (no pin)

Table 45.

Front Panel USB Connector (J8F1) (Optional)
Signal Name VREG_FP_USB_PWR ICH_FP0# ICH_FP0 Ground Key (no pin) Pin 10 Signal Name VREG_FP_USB_PWR ICH_FP1# ICH_FP1 Ground ICH_U_OC1_2#

Table 49.

LED State Off Steady Green Blinking Green
States for a Single-Colored Power LED
Description Power off/sleeping Running Running/message waiting

Table 50.

LED State Off
States for a Dual-Colored Power LED
Description Power off Running Running/message waiting Sleeping Sleeping/message waiting
Steady Green Blinking Green Steady Yellow Blinking Yellow
To use the message waiting function, ACPI must be enabled in the operating system and a messagecapturing application must be invoked.

2.8.3.3.4

Power Switch Connector
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the D815EEA2 and D815EPEA2 boards.) At least two seconds must pass before the power supply will recognize another on/off signal.

2.9 Jumper Blocks

Do not move any jumpers with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 17 shows the locations of the jumper blocks on the D815EEA2 and D815EPEA2 boards.

OM11781

Item A B
Description Front panel audio connector / jumper block BIOS Setup configuration jumper block
Reference Designator J6B2 J9G2
Figure 17. Locations of the Jumper Blocks
Front Panel Audio Connector/Jumper Block
With jumpers installed, the audio line out signals are routed to the back panel audio line out connector. With jumpers removed, the connector provides audio line out and mic in signals for front panel audio connectors.
The connector at location J6B2 has two functions:
Table 51 describes the two configurations of this connector/jumper block.
Do not place jumpers on this block in any configuration other than the one described in Table 51. Other jumper configurations are not supported and could damage the board.

Table 51.

Front Panel Audio Connector / Jumper Block (J6B2)
Configuration Audio line out signals are routed to the back panel audio line out connector. The back panel audio line out connector is shown in Figure 13 on page 64.

Jumper Setting

5 and 6, 9 and 10
Audio line out and mic in signals are available for front panel audio connectors. Table 30 on page 70 lists the names of the signals available on this connector when no jumpers are installed.

No jumpers installed

When the jumpers are removed and this connector is used for front panel audio, the back panel audio line out and Mic in connectors are disabled.
BIOS Setup Configuration Jumper Block
This 3-pin jumper block determines the BIOS Setup programs mode. Table 52 describes the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configuration mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match.

Actual system power consumption depends upon system configuration. The power supply should comply with the recommendations found in the ATX Form Factor Specification document (see Table 4 on page 20 for specification information).
Table 53 lists the power usage for a D815EEA2 board with the configuration listed on the previous page and including the optional onboard LAN subsystem.

Table 53.

Mode Windows 98 SE APM full on Windows 98 SE APM standby Windows 98 SE ACPI S0 Windows 98 SE ACPI S1 Windows 98 SE ACPI S3
Power Usage for a D815EEA2 Board with Onboard LAN
DC Current at: AC Power 54 W 29 W 33 W 28 W 1W +3.3 V 2.02 A 1.58 A 1.68 A 1.58 A 0.00 A +5 V 3.22 A 0.50 A 0.26 A 0.48 A 0.00 A +12 V 0.18 A 0.18 A 0.18 A 0.18 A 0.00 A -12 V 0.00 A 0.00 A 0.00 A 0.00 A 0.00 A +5 V (standby) 0.26 A 0.04 A 0.26 A 0.18 A 0.22 A
Table 54 lists the power usage for a D815EPEA2 board with the configuration listed on the previous page, but without the optional onboard LAN subsystem and with an add-in 2x 4 MB AGP graphics card.
Table 54. Power Usage for a D815EPEA2 Board with Add-in Graphics Card, without Onboard LAN
DC Current at: Mode Windows 98 SE APM full on Windows 98 SE APM standby Windows 98 SE ACPI S0 Windows 98 SE ACPI S1 Windows 98 SE ACPI S3 AC Power 55 W 34 W 35 W 29 W 1W +3.3 V 2.45 A 2.28 A 2.42 A 2.28 A 0.00 A +5 V 3.40 A 0.50 A 0.51 A 0.49 A 0.00 A +12 V 0.20 A 0.20 A 0.20 A 0.20 A 0.00 A -12 V 0.00 A 0.00 A 0.00 A 0.00 A 0.00 A +5 V (standby) 0.12 A 0.09 A 0.11 A 0.09 A 0.12 A

2.11.2

Add-in Board Considerations
The D815EEA2 and D815EPEA2 boards are designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards in a fully-loaded D815EEA2 and D815EPEA2 boards (all six expansion slots filled) must not exceed 12 A.

2.11.3

Standby Current Requirements
Power supplies used with the board must provide enough standby current to support the Instantly Available (ACPI S3 sleep state) configuration. If the standby current necessary to support multiple wake events from the PCI and/or USB buses exceeds power supply capacity, the board may lose register settings stored in memory and may not awaken properly. To estimate the standby current required for a specific system configuration, the standby current requirements of all installed components must be combined. Refer to Table 55 and follow these steps: 1. List the boards +5 V standby current requirement (810 mA). 2. List the PS/2 ports standby current requirement (see note below). 3. List, from the AGP and PCI 2.2 slots (wake-enabled devices) row, the total number of wakeenabled devices installed and multiply by the standby current requirement. 4. List, from the AGP and PCI 2.2 slots (non-wake-enabled devices) row, the total number of wake-enabled devices installed and multiply by the standby current requirement. 5. List all additional wake-enabled devices and non-wake-enabled devices standby current requirements as applicable. 6. Add all the listed standby current totals from steps 1 through 5 to determine the total estimated standby current power supply requirement.

Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged 30 g trapezoidal waveform Velocity change of 170 inches/second Half sine 2 millisecond Product Weight (pounds) <20 21-40 41-80 81-100 Vibration Unpackaged Packaged 5 Hz to 20 Hz : 0.01 g Hz sloping up to 0.02 g Hz 20 Hz to 500 Hz: 0.02 g Hz (flat) 10 Hz to 40 Hz: 0.015 g Hz (flat) 40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz Free Fall (inches) Velocity Change (inches/sec) -40 C to +70 C 0 C to +55 C
D815EEA2 and D815EPEA2 Board Environmental Specifications

Specification

2.15 Regulatory Compliance
This section describes the D815EEA2 and D815EPEA2 boards compliance with U.S. and international safety and electromagnetic compatibility (EMC) regulations.

2.15.1

Safety Regulations
Table 58 lists the safety regulations the D815EEA2 and D815EPEA2 boards comply with when correctly installed in a compatible host system.

Table 58.

Regulation UL 1950/CSA C22.2 No. 950, rd 3 edition EN 60950, 2 Edition, 1992 (with Amendments 1, 2, 3, and 4) IEC 60950, 2 Edition, 1991 (with Amendments 1, 2, 3, and 4) EMKO-TSE (74-SEC) 207/94
Title Bi-National Standard for Safety of Information Technology Equipment including Electrical Business Equipment. (USA and Canada) The Standard for Safety of Information Technology Equipment including Electrical Business Equipment. (European Union) The Standard for Safety of Information Technology Equipment including Electrical Business Equipment. (International) Summary of Nordic deviations to EN 60950. (Norway, Sweden, Denmark, and Finland)

2.15.2

EMC Regulations
Table 59 lists the EMC regulations the D815EEA2 and D815EPEA2 boards comply with when correctly installed in a compatible host system.

Table 59.

Regulation FCC (Class B) ICES-003 (Class B) EN55022: 1994 (Class B)
Title Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radiofrequency Devices. (USA) Interference-Causing Equipment Standard, Digital Apparatus. (Canada) Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union) Information Technology Equipment Immunity Characteristics Limits and methods of measurement. (European Union) Australian Communications Authority, Standard for Electromagnetic Compatibility. (Australia and New Zealand) Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment. (International) Information Technology Equipment Immunity Characteristics Limits and Methods of Measurements. (International)
EN55024: 1998 AS/NZS 3548 (Class B) CISPR 22, 2 Edition (Class B) CISPR 24: 1997

2.15.3

Product Certification Markings (Board Level)
The D815EEA2 and D815EPEA2 desktop boards have the following product certification markings: UL joint US/Canada Recognized Component mark: Consists of lower case c followed by a stylized backward UR and followed by a small US. Includes adjacent UL file number for Intel desktop boards: E210882 (component side). FCC Declaration of Conformity logo mark for Class B equipment; to include Intel name and D815EEA2 and D815EPEA2 model designation (solder side). CE mark: Declaring compliance to European Union (EU) EMC directive (89/336/EEC) and Low Voltage directive (73/23/EEC) (component side). The CE mark should also be on the shipping container. Australian Communications Authority (ACA) C-Tick mark: consists of a stylized C overlaid with a check (tick) mark (component side), followed by Intel supplier code number, N-232. The C-tick mark should also be on the shipping container. Korean EMC certification logo mark: consists of MIC lettering within a stylized elliptical outline. Printed wiring board manufacturers recognition mark: consists of a unique UL recognized manufacturers logo, along with a flammability rating (94V-0) (solder side). PB part number: Intel bare circuit board part number (solder side) A45133-002. Also includes SKU number starting with AA followed by additional alphanumeric characters. Battery + Side Up marking: located on the component side of the board in close proximity to the battery holder.

Intel Rapid BIOS Boot

There are several BIOS settings that, if adjusted, can reduce the execution time of the POST: Set the hard disk drive as the first boot device. As a result, the POST will not seek a diskette drive (saving about one second from the POST time) or a CD-ROM drive (saving about two seconds). Make sure that Quiet Boot is disabled, to eliminate the logo splash screen. This could save several seconds of painting complex graphic images and changing video modes. Make sure the Intel Rapid BIOS Boot option (in the Boot menu of the BIOS Setup Program) is enabled (this is typically the default setting). This feature bypasses memory count and floppy seek. Disable the LAN feature PXE (Preboot eXecutable Environment) if it will not be used. Doing so can reduce up to four seconds of option ROM boot time.
It is possible to optimize the boot process to the point where the system boots so quickly that the Intel Logo Screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. If this should occur, it is possible to introduce a programmable delay ranging from 3 to 30 seconds using the Hard Disk Pre-Delay feature in the IDE Configuration Submenu of the BIOS Setup Program.
For information about IDE Configuration Submenu in the BIOS Setup Program Refer to Table 70, page 120
Operating System Selection
The Microsoft Windows Me operating system has built-in capabilities for making PCs boot more quickly. To speed operating system availability at boot time, limit the number of applications that load into the system tray or the task bar.
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode. The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode. If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted access to Setup. If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered. Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer. Table 60 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen.

SDRAM RAS# to CAS# Delay

Auto (default) Auto (default)
Selects the number of clock cycles between addressing a row and addressing a column.

SDRAM RAS# Precharge

Selects the length of time required before accessing a new row.

4.3 Main Menu

To access this menu, select Main on the menu bar at the top of the screen.
Table 65 describes the Main Menu. This menu reports processor and memory information and is for configuring the system date and system time.

Table 65.

Feature BIOS Version Processor Type Processor Speed System Bus Frequency Cache RAM Total Memory Memory Bank 0 Memory Bank 1 Memory Bank 2 Language

Main Menu

Options No options No options No options No options No options No options No options Description Displays the version of the BIOS. Displays processor type. Displays processor speed. Displays the system bus frequency. Displays the size of second-level cache. Displays the total amount of RAM. Displays the amount and type of RAM in the memory banks. Selects the current default language used by the BIOS. Enables and disables the processor serial number. (Present only when a Pentium III processor is installed) Specifies the current time. Specifies the current date.
English (default) Espanol
Processor Serial Number Disabled (default) Enabled System Time System Date Hour, minute, and second Day of week month/day/year

4.4 Advanced Menu

To access this menu, select Advanced on the menu bar at the top of the screen.
PCI Configuration Boot Configuration Peripheral Configuration IDE Configuration Diskette Configuration Event Log Configuration Video Configuration
Table 66 describes the Advanced Menu. This menu is used for setting advanced features that are available through the chipset.

Table 66.

Feature Extended Configuration PCI Configuration Boot Configuration

Advanced Menu

Options No options No options No options Description If Used is displayed, User-Defined has been selected in Extended Configuration under the Maintenance Menu. Configures individual PCI slots IRQ priority. When selected, displays the PCI Configuration submenu. Configures Plug and Play and the Numlock key, and resets configuration data. When selected, displays the Boot Configuration submenu. Configures peripheral ports and devices. When selected, displays the Peripheral Configuration submenu. Specifies type of connected IDE device. When selected, displays the Diskette Configuration submenu. Configures Event Logging. When selected, displays the Event Log Configuration submenu. Configures video features. When selected, displays the Video Configuration submenu.

Maximum Capacity LBA Mode Control Multi-Sector Transfers
None Disabled Enabled (default) Disabled 2 Sectors 4 Sectors 8 Sectors 16 Sectors (default)
Displays the capacity of the drive. Enables or disables LBA mode control. Specifies number of sectors per block for transfers from the hard disk drive to memory. Check the hard disk drives specifications for optimum setting.

Feature PIO Mode

Primary/Secondary IDE Master/Slave Submenus (continued)

Options

Description Specifies the PIO mode.

Auto (default) 4

Ultra DMA
Disabled Mode 0 Mode 1 Mode 2 (default) Mode 3 Mode 4
Specifies the Ultra DMA mode for the drive.

Cable Detected (Note)

Displays the type of cable connected to the IDE interface: 40-conductor or 80-conductor (for ATA-66/100 devices).
These configuration options appear only if an IDE device is installed.
Diskette Configuration Submenu
To access this menu, select Advanced on the menu bar, then Diskette Configuration.
The submenu represented by Table 72 is used for configuring the diskette drive.

Table 72.

Feature Diskette Controller Floppy A
Options Disabled Enabled (default) Not Installed 360 KB 1.2 MB 720 KB 2.88 MB 5" 5" 3" 3" Disables or enables write-protect for the diskette drive. Description Disables or enables the integrated diskette controller. Specifies the capacity and physical size of diskette drive A.
1.44/1.25 MB 3" (default) Diskette Write Protect Disabled (default) Enabled
Event Log Configuration Submenu
To access this menu, select Advanced on the menu bar, then Event Log Configuration.
The submenu represented by Table 73 is used to configure the event logging features.

Table 73.

Feature Event log Event log validity View event log Clear all event logs Event Logging Mark events as read
Options No options No options [Enter] No (default) Yes Disabled Enabled (default) Yes (default) No Marks all events as read. Enables logging of events. Description Indicates if there is space available in the event log. Indicates if the contents of the event log are valid. Displays the event log. Clears the event log after rebooting.

Intel UNDI, PXE Disabled

Notes: 1. After the predefined boot device types (removable devices, hard drives, and ATAPI CD-ROM drives), the entries in this list will reflect as many boot entry vector (BEV) boot devices (for example, Intel UNDI, PXE devices) and SCSI CD-ROM drives as are installed, up to the five BEV boot devices supported by the BIOS. While the predefined boot device types are listed individually in submenus by type, the BEV devices and SCSI CD-ROM drives are all listed at this level.

Hard Disk Drives Submenu

To access this menu, select Boot on the menu bar, then Hard Disk Drives.
The submenu represented in Table 81 is for setting hard disk drive priority.

Table 81.

Feature 1 Hard Disk Drive
Options Dependent on installed hard drives Description Specifies the boot sequence from the available hard disk drives. To specify boot sequence: 1. Select the boot device with <> or <>. 2. Press <Enter> to set the selection as the intended boot device.
This boot device submenu appears only if at least one boot device of this type is installed. This list will display up to twelve hard disk drives, the maximum number of hard disk drives supported by the BIOS.
Removable Devices Submenu
To access this menu, select Boot on the menu bar, then Removable Devices.
The submenu represented in Table 82 is for setting removable device priority.

Table 82.

Feature 1 Removeable Device
Removeable Devices Submenu
Options Dependent on installed removable devices Description Specifies the boot sequence from the available removable devices. To specify boot sequence: 1. Select the boot device with <> or <>. 2. Press <Enter> to set the selection as the intended boot device.
This boot device submenu appears only if at least one boot device of this type is installed. This list will display up to four removable devices, the maximum number of removable devices supported by the BIOS.
ATAPI CDROM Drives Submenu
To access this menu, select Boot on the menu bar, then ATAPI CDROM Drives.
The submenu represented in Table 83 is for setting ATAPI CDROM drive priority.

Table 83.

Feature 1 ATAPI CDROM Drive
Options Dependent on installed ATAPI CDROM drives Description Specifies the boot sequence from the available ATAPI CDROM drives. To specify boot sequence: 1. Select the boot device with <> or <>. 2. Press <Enter> to set the selection as the intended boot device.

Code 8B 8C 8D 8F 9A 9B 9C 9D 9E A2 A3 A4 A5 A7 A8 A9 AA AB AC AD
Description of POST Operation Lock-key checking over. To check for memory size mismatch with CMOS. Memory size check done. To display soft error and check for password or bypass setup. Password checked. About to do programming before setup. Programming before setup complete. To uncompress SETUP code and execute CMOS setup. Returned from CMOS setup program and screen is cleared. About to do programming after setup. Programming after setup complete. Going to display power-on screen message. First screen message displayed. <WAIT.> message displayed. PS/2 Mouse check and extended BIOS data area allocation to be done. Setup options programming after CMOS setup about to start. Going for hard disk controller reset. Hard disk controller reset done. Floppy setup to be done next. Floppy setup complete. Hard disk setup to be done next. Init of different buses optional ROMs from C800 to start. (See Section 5.3 for details of different buses.) Going to do any init before C800 optional ROM control. Any init before C800 optional ROM control is over. Optional ROM check and control will be done next. Optional ROM control is done. About to give control to do any required processing after optional ROM returns control and enable external cache. Any initialization required after optional ROM test over. Going to setup timer data area and printer base address. Return after setting timer and printer base address. Going to set the RS-232 base address. Returned after RS-232 base address. Going to do any initialization before Coprocessor test. Required initialization before Coprocessor is over. Going to initialize the Coprocessor next. Coprocessor initialized. Going to do any initialization after Coprocessor test. Initialization after Coprocessor test is complete. Going to check extended keyboard, keyboard ID and num-lock. Going to display any soft errors. Soft error display complete. Going to set keyboard typematic rate. Keyboard typematic rate set. To program memory wait states. Going to enable parity/NMI. NMI and parity enabled. Going to do any initialization required before giving control to optional ROM at E000. Initialization before E000 ROM control over. E000 ROM to get control next. Returned from E000 ROM control. Going to do any initialization required after E000 optional ROM control. Initialization after E000 optional ROM control is over. Going to display the system configuration. Put INT13 module runtime image to shadow. Generate MP for multiprocessor support (if present). Put CGA INT10 module (if present) in Shadow. continued

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Order Number: A52560-002

Revision History

Revision -001 Revision History First release of the Desktop Boards D815EEA2, D815EPEA2, D815EFV, and D815EPFV Product Guide Intel Date March 2001
If an FCC declaration of conformity marking is present on the board, the following statement applies: FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation 5200 N.E. Elam Young Parkway Hillsboro, OR 97124 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.
Canadian Department of Communications Compliance Statement: This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications. Le prsent appareil numerique nmet pas de bruits radiolectriques dpassant les limites applicables aux appareils numriques de la classe B prescrites dans le Rglement sur le broullage radiolectrique dict par le ministre des Communications du Canada. Disclaimer Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intels Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The Intel D815EEA2, D815EPEA2, D815EFV, and D815EPFV desktop boards may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from Intel Corporation by going to the World Wide Web site at: http://www.intel.com or by calling 1-800-548-4725.
Third-party brands and names are the property of their respective owners.
Copyright 2001, Intel Corporation

Contents

1 Desktop Board Features
Manufacturing Options....11 Components....12 Processors....14 Main Memory.....15 Chipsets....16 Intel 82815E Graphics Memory Controller Hub (GMCH)..17 Intel 82815EP Memory Controller Hub (MCH)...17 Intel 82801BA I/O Controller Hub (ICH2)...17 Firmware Hub (FWH)....18 Input/Output (I/O) Controller...18 Real-Time Clock....18 USB Support....18 PCI Enhanced IDE Interface....19 Add-in Card Connectors....19 AGP Universal Connector....19 Audio Subsystem....20 BIOS.....20 PCI Auto Configuration....20 IDE Auto Configuration....20 Security Passwords....21 Speaker....21 LAN Subsystem (Optional)...21 Intel 82562ET Platform LAN Connect Device...21 LAN Subsystem Software...22 RJ-45 LAN Connector LEDs....22 Battery....22 Power Management Features...22 Wake on LAN Technology (Optional)...23 Instantly Available Technology...23 Resume on Ring....24

25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36.
ACPI Submenu....73 Boot Menu....74 Boot Device Priority Submenu...75 Hard Disk Drives Submenu...76 Removeable Devices Submenu...76 ATAPI CDROM Drives Submenu....77 Exit Menu.....77 Interrupts.....86 Beep Codes....87 BIOS Error Messages....88 Safety Regulations....91 EMC Regulations....91
Table 1 describes the major differences between the boards.
Table 1. Board Differences Features Features the Intel 815E chipset, which includes the Intel 82815E Graphics and Memory Controller Hub (GMCH) Supports the AGP universal connector and optional Digital Video Output (DVO) connector D815EPEA2 and D815EPFV Features the Intel 815EP chipset, which includes the Intel 82815EP Memory Controller Hub (MCH) Supports the AGP universal connector
Board Name D815EEA2 and D815EFV
Table 2 describes the major features of the boards.

Table 2. Feature Summary

Specification ATX at 11.55 inches by 8.20 inches (D815EEA2 and D815EPEA2) microATX at 9.6 inches by 8.2 inches (D815EFV and D815EPFV) Processors Intel Pentium III processor family with FC-PGA (Flip Chip Pin Grid Array) package supporting 100 MHz and 133 MHz system bus frequency Intel Celeron processor family with FC-PGA package supporting 66 MHz and 100 MHz system bus frequency Memory Three 168-pin Dual Inline Memory Module (DIMM) sockets supporting: 100 MHz PC100 SDRAM (all system bus frequencies) 133 MHz PC133 SDRAM (only with 133 MHz system bus frequency processors) Chipsets The D815EEA2 and D815EFV boards include the Intel 815E Chipset, consisting of: Intel 82815E Graphics Memory Controller Hub (GMCH) Intel 82801BA I/O Controller Hub (ICH2)
Characteristic Form Factors
4 Mbit Firmware Hub (FWH)
The D815EPEA2 and D815EPFV boards include the Intel 815EP Chipset, consisting of: Intel 82815EP Memory Controller Hub (MCH) I/O Control Audio Intel 82801BA I/O Controller Hub (ICH2)
4 Mbit Firmware Hub (FWH) SMSC LPC47M132 LPC bus I/O controller
An audio subsystem that includes the: Intel 82801BA ICH2 digital controller (AC link output) Analog Devices Inc. AD1885 audio codec continued

Table 2.

Feature Summary (continued)
Specification The D815EEA2 and D815EFV boards include: Intel 82815E integrated graphics support AGP universal connector supporting 1x, 2x, or 4x AGP cards or a Graphics Performance Accelerator (GPA)

Characteristic

Rear panel VGA connector The D815EPEA2 and D815EPFV boards include an AGP universal connector supporting 1x, 2x, or 4x AGP cards Peripheral Interfaces Two serial ports: one back panel and one internal connector Four USB ports: four back panel and two optional front panel One parallel port Two IDE interfaces with Ultra DMA (33 MB/sec) and ATA-66/100 support One diskette drive interface PS/2 keyboard and mouse ports Expansion Capabilities For D815EEA2 and D815EPEA2 boards: Five PCI add-in card connector (SMBus routed to PCI bus connector 2, S5 wake from PCI bus connector 2) One AGP universal connector For D815EFV and D815EPFV boards: Three PCI add-in card connectors (SMBus routed to PCI bus connector 2, S5 wake from PCI bus connector 2)
One AGP universal connector Intel/AMI BIOS
4 Mbit Firmware Hub (FWH) Support for Advanced Power Management (APM), Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS ACPI S3 Suspend to RAM (STR) sleep state Support for PCI Local Bus Specification Revision 2.2 Wake on PS/2 keyboard and USB ports Support for both ACPI Rev. 2.0 and APM Rev. 1.2 PC 99 and PC 99A Heceta 4 supporting: Remote diode temperature sense Voltage sense to detect out of range values Fan tachometer Allows add-in SCSI controllers to use the same LED as the onboard I/O controller
Instantly Available Technology Power Management PC Design Compliance Hardware Monitor

SCSI LED Connector

Desktop Board Features

Manufacturing Options

Table 3 describes the manufacturing options of the boards.
Table 3. Manufacturing Options
Specification One CNR connector: Slot shared with PCI bus connector 5 on D815EEA2 and D815EPEA2 boards. Slot shared with PCI bus connector 3 on D815EFV and D815EPFV boards. Interface for optional Digital Visual Interface (DVI) card to support Flat Panel, Digital CRT, or TV out (D815EEA2 and D815EFV boards only). Routes mic in and line out to the front panel. Provides access to two additional USB ports, routed through the optional SMSC LPC47M142 LPC bus I/O controller. Intel 82562ET that provides a basic interface to the RJ-45 connector with integrated LEDs located on the back panel. SMSC LPC47M142 LPC bus I/O controller Support for system wake up using an add-in network interface card with remote wake up capability.
Characteristic Communication and Networking Riser (CNR) Connector Digital Video Output (DVO) Front Panel Audio Connector Front Panel USB Connector Integrated LAN Subsystem I/O Controller Wake on (WOL) Technology Connector LAN

IDE Auto Configuration

If you install an IDE device (such as a hard drive) in your computer, the IDE auto-configuration utility in the BIOS automatically detects and configures the device for your computer. You do not need to run the BIOS Setup program after installing an IDE device. You can override the autoconfiguration options by specifying manual configuration in the BIOS Setup program. To use ATA-66/100 features, the following items are required: An ATA-66/100 peripheral device An ATA-66/100 compatible cable ATA-66/100 operating system device drivers

Security Passwords

The BIOS includes security features that restrict whether the BIOS Setup program can be accessed and who can boot the computer. A supervisor password and a user password can be set for the Setup and for booting the computer, with the following restrictions: The supervisor password gives unrestricted access to view and change all Setup options. If only the supervisor password is set, pressing <Enter> at the password prompt of Setup gives the user restricted access to Setup. If both the supervisor and user passwords are set, you must enter either the supervisor password or the user password to access Setup. Setup options are then available for viewing and changing depending on whether the supervisor or user password was entered. Setting a user password restricts who can boot the computer. The password prompt is displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, you can enter either password to boot the computer.

Speaker

A 47 inductive speaker is mounted on the desktop boards. The speaker provides audible error code (beep code) information during the Power-On Self-Test (POST).

LAN Subsystem (Optional)

The Intel 82562ET (in conjunction with the Intel 82801BA ICH2) provides a Fast Ethernet Wired for Management (WfM) PCI LAN subsystem providing both 10Base-T and 100Base-TX connectivity. Features include: 32-bit, 33-MHz direct bus mastering on the PCI bus Shared memory structure in the host memory that copies data directly to/from host memory 10Base-T and 100Base-TX capability using a single RJ-45 connector with connection and activity status LEDs IEEE 802.3u Auto-Negotiation for the fastest available connection Jumperless configuration; the LAN subsystem is completely software configurable
Intel 82562ET Platform LAN Connect Device
The Intel 82562ET LAN component provides an interface to the back panel RJ-45 connector with integrated LEDs. The physical interface may alternatively be provided through the CNR connector. The Intel 82562ET provides the following functions: Basic 10/100 Ethernet LAN connectivity Supports RJ-45 connector with status indicator LEDs Full driver compatibility Advanced Power Management (APM) support Programmable transit threshold Configurable EEPROM that contains the MAC address

Installing and Removing the AGP Card Retention Mechanism
The AGP universal connector supports AGP (1x, 2x, and 4x) and GPA (on D815EEA2 and D815EFV boards only) cards. Newer cards have a retention notch as shown in Figure 5. The AGP card retention mechanism is not used with unnotched cards.
Installing the AGP Card Retention Mechanism
Install the retention mechanism (RM) only when using a card with a retention notch as shown in the figure below. Use of the RM with an unnotched card may impair operation. If you need to remove the RM, follow the instructions on page 30.

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Figure 5. Retention Notch Shown on an AGP Card
The RM encloses the desktop boards AGP connector and provides additional mechanical stability to installed cards.
Observe the precautions in Before You Begin on page 25. Place the desktop board on top of an ESD safe surface, component-side up. Follow the steps outlined below to attach the RM (A) to the AGP universal connector (B): 1. Locate the AGP connector (J6C1) on the desktop board as shown in Figure 6. Note that the desktop boards silkscreen (C) indicates the correct final position of the lever (E) on the RM.

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Figure 6. AGP Connector Location and Retention Mechanism (RM) Placement (Inset) (the D815EEA2 Board Is Shown)
2. Position the RM over the AGP universal connector as shown below.

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3. Push the lever end of the RM in the direction of the arrow until the two rearmost tabs (D) spread over the end of the AGP universal connector.

OM10180

4. Push the free end of the RM over the other end of the AGP connector and press down evenly on both ends of the RM until all four tabs click underneath the AGP universal connector. Do not apply unnecessary pressure to avoid damaging the board.

OM10181

Removing the AGP Card Retention Mechanism
The removal instructions below are for AGP card retention mechanisms that cannot easily be snapped off the board.
Once removed using this method, the AGP RM cannot be reused. Follow these instructions to remove the AGP card retention mechanism (see Figure 7): 1. Using side-cutters (A), cut the loop (B) joining the two sides of the retention mechanism. 2. Spread the sides of the retention mechanism (C) and lift the retention mechanism off of the AGP universal connector.

6. Replace the cover, plug in the computer, turn on the computer, and allow it to boot. 7. The computer starts the Setup program. Setup displays the maintenance menu. 8. Press <Enter> and Setup displays a pop-up screen requesting that you confirm clearing the password. Select Yes and press <Enter>. Setup displays the maintenance menu again. 9. Press <F10> to save the current values and exit Setup. 10. Turn off the computer. Disconnect the computers power cord from the ac power source. 11. Remove the computer cover. 12. To restore normal operation, place the jumper on pins 1-2 as shown below.
13. Replace the cover, plug in the computer, and turn on the computer.
This chapter tells you how to update the BIOS by either using the Intel Express BIOS Update utility or the Intel Flash Memory Update Utility, and recovering the BIOS if an update fails.
Updating the BIOS with the Intel Express BIOS Update Utility
With the Intel Express BIOS Update utility you can update the system BIOS while in the Windows environment. The BIOS file is included in an automated update utility which combines the functionality of the Intel Flash Memory Update utility and the ease-of use of Windows-based installation wizards. To update the BIOS with the Intel Express BIOS Update utility: 1. Go to the Intel World Wide Web site: http://support.intel.com/support/motherboards/desktop/ 2. Navigate to the D815EEA2, D815EPEA2, D815EFV, or D815EPFV page and click the Express BIOS Update utility file for the boards BIOS. 3. Download the file to your hard drive. (You can also save this file to a diskette. This is useful if you are updating the BIOS for multiple identical systems.) 4. Close all other applications. This step is required. Your system will be rebooted at the last Express BIOS Update window. 5. Double-click the executable file from the location on your hard drive where it was saved. This runs the update program. 6. Follow the instructions provided in the dialog boxes to complete the BIOS update.
Updating the BIOS with the Intel Flash Memory Update Utility
Follow the steps described below to update the BIOS using the Intel Flash Memory Update Utility: Prepare for the update Update the BIOS Recover the BIOS if an update fails

Preparing for the Update

Before you update the BIOS, prepare by: Obtaining the BIOS update file Saving the current BIOS settings Creating a bootable media Creating the BIOS upgrade media
Obtaining the BIOS Update File
You can update to a new version of the BIOS by using the BIOS update file. The BIOS update file is a compressed self-extracting archive that contains all the files you need to update the BIOS. The BIOS update file contains: New BIOS files BIOS recovery files Intel Flash Memory Update utility

You can obtain the BIOS update file through your computer supplier or from the Intel World Wide Web site: http://support.intel.com/support/motherboards/desktop/
Review the instructions distributed with the update utility before attempting a BIOS update. The Intel Flash Memory Update utility allows you to: Update the BIOS in flash memory. Update the language section of the BIOS.
Saving the Current BIOS Settings
1. Boot the computer and press <F2> when you see the message:
Press <F2> Key if you want to run SETUP
2. Save the current settings in the BIOS Setup program.

Creating Bootable Media

You can create bootable media with a: CD writer Normal diskette drive or an LS-120 diskette drive
Creating a Bootable CD Follow the instructions provided with your CD writer to make a bootable CD using floppy emulation and bootable files.

Updating the BIOS

Creating a Bootable Diskette
If your drive A is an LS-120 diskette drive, you must use a 1.44-MB diskette as the bootable BIOS update diskette. The computer is unable to recover a BIOS from an LS-120 diskette. To create a bootable diskette using a DOS system: Place an unformatted diskette in the diskette drive and format the diskette using the /s option. Example: format a: /s Alternatively, place a formatted diskette in the diskette drive and use the sys command. Example: sys a:
To create a bootable diskette using a non-DOS system: 1. Obtain the BIOS update file through your computer supplier or from the Intel World Wide Web site: http://support.intel.com/support/motherboards/desktop/ 2. Copy the BIOS update file to a temporary directory on your hard disk. 3. Change to the temporary directory. 4. To extract the files, double click on the BIOS update file, for example, EABIOSxx.EXE. 5. One of the extracted files is MK_BOOTZ.EXE. Double click on this file to extract the README.TXT file. 6. Follow the directions in the README.TXT file.
Creating BIOS Update Media
1. Obtain the BIOS update file through your computer supplier or from the Intel World Wide Web site: http://support.intel.com/support/motherboards/desktop/ 2. Copy the BIOS update file to a temporary directory on your hard disk. 3. From the C:\ prompt, change to the temporary directory. 4. To extract the file, type the name of the BIOS upgrade file, for example, EABIOSxx. 5. Press <Enter>. The extracted file contains the following files: LICENSE.TXT BIOINSTR.TXT BIOS.EXE MK_BOOTZ.EXE 6. Read the LICENSE.TXT file, which contains the software license agreement, and the BIOINSTR.TXT file, which contains the instructions for the BIOS update. 7. Insert the bootable media into the drive. 8. If using a diskette drive: Extract the BIOS.EXE file to the diskette by changing to the temporary directory that holds the BIOS.EXE file and typing: BIOS A: Press <Enter>.

Because of the small amount of code available in the boot block area, there is no video support. You will not see anything on the screen during this procedure. Monitor the procedure by listening to the speaker and looking at the diskette drive LED. 1. Turn off the computer, disconnect the computers power cord, and disconnect all external peripherals. 2. Remove the computer cover and locate the configuration jumper block (J9G2) (see Figure 26). 3. Remove the jumper from all pins as shown below to set recovery mode for Setup.
4. Insert the bootable BIOS update diskette into diskette drive A. 5. Replace the computer cover, connect the power cord, turn on the computer, and allow it to boot. (The recovery process will take a few minutes. Listen to the speaker and watch for drive A activity.) Upon applying power, drive A will begin to show activity. In about a minute, two beeps are heard and drive A activity ceases (temporarily) indicating the successful recovery of the BIOS core. Drive A activity will begin again followed by two more beeps indicating the successful recovery of the boot block. This sequence of events indicates that successful BIOS recovery has taken place. A series of continuous beeps indicates that BIOS recovery has failed. 6. If recovery fails, return to step 1 and repeat the recovery process. 7. If recovery is successful, turn off the computer, and disconnect its power cord. 8. Remove the computer cover and continue with the following steps. 9. On the jumper block (J9G2), reinstall the jumper back on pins 1-2 as shown below to set normal mode for Setup.
10. Leave the update diskette in drive A, replace the computer cover, and connect the computers power cord. 11. Turn on the computer and continue with the BIOS update (see page 53).
You can use the BIOS Setup program to change the configuration information and boot sequence for the computer. This chapter tells you how to access the BIOS Setup program and lists Setup features, options, and default settings.
For reference purposes, you should write down the current Setup settings. When you make changes to the settings, update this record.

BIOS Setup Program Modes

The BIOS Setup program has three modes of operation: Normal mode for normal operations Configure mode for clearing passwords (see Chapter 2 for instructions) Recovery mode for BIOS recovery
The BIOS Setup Program Operating mode is controlled by the setting of the configuration jumper block. The jumper is set to normal mode at the factory.
The Setup menus described in this section apply to the desktop boards with BIOS identifier EA815.20A.86A. Desktop boards with other BIOS identifiers might have differences in some of the Setup menu screens. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.

Video Memory Cache Mode

UC (default)
SDRAM Auto-Configuration CAS# Latency
Auto (default) User Defined Auto (default)

SDRAM RAS# to CAS# Delay

Auto (default) Auto (default)
Selects the number of clock cycles between addressing a row and addressing a column.

SDRAM RAS# Precharge

Selects the length of time required before accessing a new row.

Main Menu

To access this menu, select Main on the menu bar at the top of the screen.
Table 12 describes the Main Menu. This menu reports processor and memory information and is for configuring the system date and system time.

Table 12.

Feature BIOS Version Processor Type Processor Speed System Bus Frequency Cache RAM Total Memory Memory Bank 0 Memory Bank 1 Memory Bank 2 Language Processor Serial Number System Time System Date
Options No options No options No options No options No options No options No options Description Displays the version of the BIOS. Displays processor type. Displays processor speed. Displays the system bus frequency. Displays the size of second-level cache and whether it is ECC-capable. Displays the total amount of RAM. Displays the amount and type of RAM in the memory banks. Selects the current default language used by the BIOS.
English (default) Espanol
Disabled (default) Enables and disables the processor serial number. (Present only when a Pentium III processor is installed.) Enabled Hour, minute, and second Day of week Month/day/year Specifies the current time. Specifies the current date.

Advanced Menu

To access this menu, select Advanced on the menu bar at the top of the screen.
PCI Configuration Boot Configuration Peripheral Configuration IDE Configuration Diskette Configuration Event Log Configuration Video Configuration
Table 13 describes the Advanced Menu. This menu is used for setting advanced features that are available through the chipset.

Table 13.

Feature Extended Configuration PCI Configuration Boot Configuration
Options No options No options No options Description If Used is displayed, User-Defined has been selected in Extended Configuration under the Maintenance Menu. Configures individual PCI slots IRQ priority. When selected, displays the PCI Configuration submenu. Configures Plug and Play and the Numlock key, and resets configuration data. When selected, displays the Boot Configuration submenu. Configures peripheral ports and devices. When selected, displays the Peripheral Configuration submenu. Specifies type of connected IDE device. When selected, displays the Diskette Configuration submenu. Configures Event Logging. When selected, displays the Event Log Configuration submenu. Configures video features. When selected, displays the Video Configuration submenu.

IDE Configuration Submenu
To access this submenu, select Advanced on the menu bar, then IDE Configuration.
The menu represented in Table 17 is used to configure IDE device options.

Table 17.

Feature IDE Controller
Options Disabled Primary Secondary Both (default) Description Specifies the integrated IDE controller. Primary enables only the primary IDE controller. Secondary enables only the secondary IDE controller. Both enables both IDE controllers.

Hard Disk Pre-Delay

Disabled (default) Specifies the hard disk drive pre-delay. 3 Seconds 6 Seconds 9 Seconds 12 Seconds 15 Seconds 21 Seconds 30 Seconds
Primary IDE Master Primary IDE Slave Secondary IDE Master
No options No options No options
Reports type of connected IDE device. When selected, displays the Primary IDE Master submenu. Reports type of connected IDE device. When selected, displays the Primary IDE Slave submenu. Reports type of connected IDE device. When selected, displays the Secondary IDE Master submenu. Reports type of connected IDE device. When selected, displays the Secondary IDE Slave submenu.
Secondary IDE Slave No options
Primary/Secondary IDE Master/Slave Submenus
To access these submenus, select Advanced on the menu bar, then IDE Configuration, and then the master or slave to be configured.
PCI Configuration Boot Configuration Peripheral Configuration IDE Configuration Primary IDE Master Primary IDE Slave Secondary IDE Master Secondary IDE Slave Diskette Configuration Event Log Configuration Video Configuration
There are four IDE submenus: primary master, primary slave, secondary master, and secondary slave. Table 18 shows the format of the IDE submenus. For brevity, only one example is shown.

Table 18.

Feature Drive Installed Type
Options None None User Auto (default) CD-ROM ATAPI Removable Other ATAPI IDE Removable None Disabled Enabled (default) Disabled 2 Sectors 4 Sectors 8 Sectors 16 Sectors (default) Auto (default) 4 Description Displays the type of drive installed. Specifies the IDE configuration mode for IDE devices. User allows capabilities to be changed. Auto fills-in capabilities from ATA/ATAPI device.
Maximum Capacity LBA Mode Control Multi-Sector Transfers
Displays the capacity of the drive. Enables or disables LBA mode control. Specifies number of sectors per block for transfers from the hard disk drive to memory. Check the hard disk drives specifications for optimum setting. Specifies the PIO mode.

PIO Mode

Note: These configuration options appear only if an IDE device is installed.

Feature Ultra DMA

Primary/Secondary IDE Master/Slave Submenus (continued)
Options Disabled (default) Mode 0 Mode 1 Mode 2 Mode 3 Mode 4 None Description Specifies the Ultra DMA mode for the drive.

Cable Detected (Note)

Displays the type of cable connected to the IDE interface: 40-conductor or 80-conductor (for ATA-66/100 devices).

Discard Changes

Desktop Board Connectors
Many of the midboard and front panel connectors provide operating voltage (+5 V dc and +12 V dc, for example) to devices inside the computer chassis, such as fans and internal peripherals. These connectors are not overcurrent protected. Do not use these connectors for powering devices external to the computer chassis. A fault in the load presented by the external devices could cause damage to the computer, the interconnecting cable, and the external devices themselves. The desktop board connectors can be divided into three groups, as shown in Figure 27.
Back panel connectors (see page 80)
Midboard connectors (see page 81)

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Front panel connectors (see page 85)
Figure 27. Connector Groups (the D815EEA2 Board Is Shown)

Back Panel Connectors

Figure 28 shows the back panel connectors on the desktop board. The back panel connectors are color-coded in compliance with PC 99 recommendations. The figure legend below lists the colors used.

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A B C D E F G
PS/2 mouse, green PS/2 keyboard, purple USB port 0 USB port 1 Parallel port, burgundy VGA port, blue (D815EEA2 and D815EFV only) Serial port A, teal

H I J K L M

RJ-45 LAN connector with LED display (optional) USB port 2 USB port 3 Mic in, pink Audio line out, lime green Audio line in, light blue
Figure 28. Back Panel Connectors (the D815EEA2 Board Is Shown)
The line out connector, located on the back panel, is designed to power either headphones or amplified speakers only. Poor audio quality may occur if passive (non-amplified) speakers are connected to this output.

Technical Reference

Midboard Connectors

Audio Connectors

Figure 29 shows the location of the audio connectors.

OM11638

Item A B C
Description ATAPI-style auxiliary line in Front panel audio (optional) ATAPI-style CD-ROM
Figure 29. Audio Connectors (the D815EEA2 Board Is Shown)
Power and Hardware Control Connectors
Figure 30 shows the power and hardware connectors.

Item A B C D E F G H

Description Processor fan (fan 1) Power Chassis fan (fan 3) Front panel USB (optional) SCSI LED Chassis fan (fan 2) Chassis intrusion

OM11631

Wake on LAN technology (optional)
Figure 30. Power and Hardware Control Connectors (the D815EEA2 Board Is Shown)
Add-In Board and Peripheral Interface Connectors for the D815EEA2 and D815EPEA2 Boards
Figure 31 shows the add-in board and peripheral interface connectors.

A B C D E F G H

Product Certification Markings
The desktop boards have the following product certification markings: UL joint US/Canada Recognized Component mark: consists of small c followed by a stylized backward UR and followed by a small US. Includes adjacent UL file number for Intel desktop boards: E210882 (component side). FCC Declaration of Conformity logo mark for Class B equipment; includes Intel name and model designation (solder side). CE mark: declaring compliance to European Union (EU) EMC directive (89/336/EEC) and Low Voltage directive (73/23/EEC) (component side). Australian Communications Authority (ACA) C-Tick mark: consists of a stylized C overlaid with a check (tick) mark (component side), followed by Intel supplier code number, N-232. Printed wiring board manufacturers recognition mark: consists of a unique UL recognized manufacturers logo, along with a flammability rating (94V-0) (solder side). PB part number: Intel bare circuit board part number (solder side): A45133-007 (for D815EEA2 and D815EPEA2 boards)
A44507-007 (for D815EFV and D815EPFV boards) Also includes SKU number starting with AA followed by additional alphanumeric characters. Battery + Side Up marking: located on the component side of the board in close proximity to the battery holder. Korean MIC logo mark: denotes Korean EMC certification (component side). Additional certification information is provided below: 1. Product Name (model) 2. Certificate ID 3. Applicant: Intel Korea Ltd. 4. Date of manufacture as separate marking on product 5. Manufacturer (country of origin) D815EEA2 and D815EPEA2 boards
D815EFV and D815EPFV boards

Regulatory Compliance

Installation Precautions
When you install and test the desktop board, observe all warnings and cautions in the installation instructions. To avoid injury, be careful of: Sharp pins on connectors Sharp pins on printed circuit assemblies Rough edges and sharp corners on the chassis Hot components (like processors, voltage regulators, and heat sinks) Damage to wires that could cause a short circuit
Observe all warnings and cautions that instruct you to refer computer servicing to qualified technical personnel.
Installation Instructions
Follow these guidelines to meet safety and regulatory requirements when installing this board assembly. Read and adhere to all of these instructions and the instructions supplied with the chassis and associated modules. If the instructions for the chassis are inconsistent with these instructions or the instructions for associated modules, contact the suppliers technical support to find out how you can ensure that your computer meets safety and regulatory requirements. If you do not follow these instructions and the instructions provided by chassis and module suppliers, you increase safety risk and the possibility of noncompliance with regional laws and regulations.

Ensure Electromagnetic Compatibility (EMC) Compliance
Before computer integration, make sure that the power supply and other modules or peripherals, as applicable, have passed Class B EMC testing and are marked accordingly. In the installation instructions for the host chassis, power supply, and other modules pay close attention to the following: Product certifications or lack of certifications External I/O cable shielding and filtering Mounting, grounding, and bonding requirements Keying connectors when mating the wrong connectors could be hazardous
If the power supply and other modules or peripherals, as applicable, are not Class B EMC compliant before integration, then EMC testing is required on a representative sample of the newly completed computer.
Chassis and Component Certifications
Ensure that the chassis and certain components; such as the power supply, peripheral drives, wiring, and cables; are components certified for the country or market where used. Agency certification marks on the product are proof of certification. Typical product certifications include: In Europe The CE marking signifies compliance with all applicable European requirements. If the chassis and other components are not properly CE marked, a suppliers Declaration of Conformity statement to the European EMC directive and Low Voltage directive (as applicable), should be obtained. Additionally, other directives, such as the Radio and Telecommunications Terminal Equipment (R&TTE) directive may also apply depending on product features. In the United States A certification mark by a Nationally Recognized Testing Laboratory (NRTL) such as UL, CSA, or ETL signifies compliance with safety requirements. Wiring and cables must also be UL listed or recognized and suitable for the intended use. The FCC Class B logo for home or office use signifies compliance with electromagnetic interference (EMI) requirements. In Canada A nationally recognized certification mark such as CSA or cUL signifies compliance with safety requirements. The Industry Canada statement at the front of this product guide demonstrates compliance with Canadian EMC regulations. Industry Canada recognizes and accepts FCC certification as denoting compliance with national electromagnetic interference (emissions) requirements.
Prevent Power Supply Overload
Do not overload the power supply output. To avoid overloading the power supply, make sure that the calculated total current loads of all the modules within the computer is less than the output current rating of each of the power supplies output circuits.

Place Battery Marking

There is insufficient space on this desktop board to provide instructions for replacing and disposing of the Lithium ion coin cell battery. For system safety certification, the following statement or equivalent statement is required to be permanently and legibly marked on the chassis near the battery.