Figures

Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 1. Major Board Components... 2. Block Diagram... 3. Back Panel Audio Connectors... 4. LAN Connector LED Locations.. 5. Thermal Sensors and Fan Headers.. 6. Location of the Standby Power Indicator LED. 7. Detailed System Memory Address Map.. 8. Back Panel Connectors... 9. Component-side Connectors and Headers.. 10. Connection Diagram for Front Panel Header. 11. Connection Diagram for Front Panel USB Headers.. 12. Location of the Jumper Block... 13. Board Dimensions... 14. Localized High Temperature Zones.. 50 53

Tables

Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. Feature Summary... Board Components Shown in Figure 1.. Supported Memory Configurations.. Audio Jack Retasking Support.. LAN Connector LED States... Effects of Pressing the Power Switch.. Power States and Targeted System Power.. Wake-up Devices and Events.. System Memory Map.. Component-side Connectors and Headers Shown in Figure 9. Front Panel Audio Header.. Serial ATA Connectors... Rear Chassis (3-Pin) Fan Header.. GMCH (3-Pin) Fan Header.. Main Power Connector... ATX12V Power Connector.. Front Panel Header... States for a One-Color Power LED.. States for a Two-Color Power LED.. BIOS Setup Configuration Jumper Settings. Recommended Power Supply Current Values.. Fan Header Current Capability.. Thermal Considerations for Components.. Desktop Board D945GCLF Environmental Specifications. BIOS Setup Program Menu Bar.. BIOS Setup Program Function Keys... Acceptable Drives/Media Types for BIOS Recovery.. Boot Device Menu Options... Supervisor and User Password Functions.. 63
Table Table Table Table Table Table Table Table Table Table
30. 31. 32. 33. 34. 35. 36. 37. 38. 39.
Front-panel Power LED Blink Codes... Beep Codes... BIOS Error Messages.. Port 80h POST Code Ranges.. Port 80h POST Codes.. Typical Port 80h POST Sequence.. Safety Standards... Lead-Free Board Markings... EMC Regulations... Product Certification Markings..

Product Description

What This Chapter Contains
1.1 Overview... 10 1.2 Legacy Considerations... 15 1.3 Online Support... 15 1.4 Processor.... 15 1.5 System Memory... 16 1.6 Intel 945GC Chipset... 17 1.7 Real-Time Clock Subsystem.. 21 1.8 Legacy I/O Controller... 22 1.9 Audio Subsystem.... 23 1.10 LAN Subsystem... 25 1.11 Hardware Management Subsystem.. 27 1.12 Power Management... 29

Overview

Feature Summary
Table 1 summarizes the major features of the Desktop Board D945GCLF. Table 1. Feature Summary
Form Factor Processor Memory Mini-ITX, compatible with microATX (6.75 inches by 6.75 inches [171.45 millimeters by 171.45 millimeters]) Support for the following: Soldered-down Intel Atom processor 230 with a 533 MHz system bus One 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) socket Support for DDRMHz and DDRMHz DIMMs (DDRMHz and DDR 667 MHz validated to run at 533 MHz only) Support for up to 2 GB of system memory Intel 945GC Chipset, consisting of: Intel 82945GC Graphics Memory Controller Hub (GMCH) Intel 82801GB I/O Controller Hub (ICH7) Audio Video Legacy I/O Control Peripheral Interfaces 4-channel (2+2) audio subsystem using the Realtek* ALC662 high definition audio codec Intel GMA950 onboard graphics subsystem SMSC LPC47M997 based Legacy I/O controller for hardware management, serial, parallel, and PS/2* ports Six USB 2.0 ports Two Serial ATA (SATA) headers One serial port One parallel port One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support PS/2 keyboard and mouse ports

The use of DVMT requires operating system driver support.

1.6.1.3

Configuration Modes
A list of supported modes for the Intel GMA950 graphics controller is available as a downloadable document.
For information about Supported video modes for the board Refer to Section 1.2, page 15
The board supports up to six USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers. The ICH7 provides the USB controller for all ports. The port arrangement is as follows: Four ports are implemented with dual stacked back panel connectors Two ports are routed to a separate front panel USB header
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
For information about The location of the USB connectors on the back panel The location of the front panel USB headers Refer to Figure 8, page 41 Figure 9, page 42

IDE Support

One parallel ATA IDE connector that supports two devices Two serial ATA IDE connectors that support one device per connector
The board provides three IDE interface connectors:

1.6.3.1

Parallel ATE IDE Interface
The ICH7s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: Programmed I/O (PIO): processor controls data transfer. 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec. ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling. The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

For information about The location of the Parallel ATA IDE connector Refer to Figure 9, page 42

1.6.3.2

Serial ATA Interfaces
The ICH7s Serial ATA controller offers two independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of two Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel. For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 2000 operating systems.
Many Serial ATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors. For more information, see: http://www.serialata.org/
For information about The location of the Serial ATA IDE connectors Refer to Figure 9, page 42
Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to 13 minutes/year at 25 C with 3.3 VSB applied.
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 12 shows the location of the battery.

Legacy I/O Controller

One serial port One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems PS/2-style mouse and keyboard interfaces Intelligent power management, including a programmable wake-up event interface PCI Conventional bus power management support
The I/O controller provides the following features:
The BIOS Setup program provides configuration options for the I/O controller.

Serial Port

The serial port A connector is located on the back panel. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
The location of the serial port A connector

Figure 8, page 41

Line in Line out Mic in

Figure 3. Back Panel Audio Connectors
The location of the front panel audio header The signal names of the front panel audio header The back panel audio connectors
Figure 9, page 42 Table 11, page 44 Section 2.2.1, page 41

1.10 LAN Subsystem

The LAN subsystem consists of the following: Intel 82801GB ICH7 Realtek RTL8102EL device for 10/100 Mbits/sec Ethernet LAN connectivity RJ-45 LAN connector with integrated status LEDs CSMA/CD protocol engine LAN connect interface that supports the 82562G PCI Conventional bus power management Supports ACPI technology Supports LAN wake capabilities
Additional features of the LAN subsystem include:

1.10.1

LAN Subsystem Software
LAN software and drivers are available from Intels World Wide Web site.
For information about Obtaining LAN software and drivers

1.10.2

RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).
Figure 4. LAN Connector LED Locations Table 5 describes the LED states when the board is powered up and the 10/100 Mbits/sec LAN subsystem is operating. Table 5. LAN Connector LED States
LED A B LED Color Green Yellow LED State Blinking Off On Condition LAN activity is occurring. 10 Mbits/sec data rate is selected. 100 Mbits/sec data rate is selected.
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: Thermal and voltage monitoring Chassis intrusion detection

1.11.1

Hardware Monitoring
The features of the hardware monitoring and fan control include: Internal ambient temperature sensor Remote thermal diode sensors for direct monitoring of processor temperature and ambient temperature sensing Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to detect levels above or below acceptable values SMBus interface

1.11.2

Thermal Monitoring
Figure 5 shows the locations of the thermal sensors and fan headers.

Remote thermal sensor Chassis fan header Thermal diode, located on processor die
Figure 5. Thermal Sensors and Fan Headers

1.12 Power Management

Power management is implemented at several levels, including: Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB Wake from PS/2 devices Power Management Event signal (PME#) wake-up support

1.12.1

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the board requires an operating system that provides full ACPI support. ACPI features include: Plug and Play (including bus and device enumeration) Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state A Soft-off feature that enables the operating system to power-off the computer Support for multiple wake-up events (see Table 8 on page 31) Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 6. Effects of Pressing the Power Switch
If the system is in this state
Off (ACPI G2/G5 Soft off) On (ACPI G0 working state) On (ACPI G0 working state) Sleep (ACPI G1 sleeping state) Sleep (ACPI G1 sleeping state)
and the power switch is pressed for
Less than four seconds Less than four seconds More than four seconds Less than four seconds More than four seconds
the system enters this state
Power-on (ACPI G0 working state) Soft-off/Standby (ACPI G1 sleeping state) Fail safe power-off (ACPI G2/G5 Soft off) Wake-up (ACPI G0 working state) Power-off (ACPI G2/G5 Soft off)

1.12.1.1

System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 7 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 7. Power States and Targeted System Power

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

1.12.2

Hardware Support
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB PME# signal wake-up support Wake from PS/2 devices
LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.
The use of Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support.

1.12.2.1

Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computers response can be set using the Last Power State feature in the BIOS Setup programs Boot menu.
The location of the main power connector The signal names of the main power connector
Figure 9, page 42 Table 15, page 45

1.12.2.2

Fan Headers
The function/operation of the fan headers is as follows: The fans are on when the board is in the S0 state. The fans are off when the board is off or in the S3, S4, or S5 state. The chassis fan header supports closed-loop fan control that can adjust the fan speed and is wired to a fan tachometer input. All fan headers have a +12 V DC connection.
Figure 5, page 28 Table 14, page 44 Table 13, page 44
The locations of the fan headers and thermal sensors The signal names of the GMCH fan header The signal names of the chassis fan header

1.12.2.3

LAN Wake Capabilities
For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways: The PCI bus PME# signal for PCI 2.3 compliant LAN designs By Ping Magic Packet The onboard LAN subsystem

1.12.2.4

Instantly Available PC Technology
For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 8 on page 31 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards and drivers.

1.12.2.5

Wake from USB
USB bus activity wakes the computer from ACPI S1 and S3 state.
Wake from USB requires the use of a USB peripheral that supports Wake from USB and support in the OS.

1.12.2.6

Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1, S3, S4, or S5 state. However, when the computer is in an S4 or S5 state, the only PS/2 activity that will wake the computer is the alt-PrtScrn key combination on the keyboard.

1.12.2.7

PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).

1.12.2.8

+5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 6 shows the location of the standby power indicator LED.
If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.
Figure 6. Location of the Standby Power Indicator LED

1.12.3

ENERGY STAR*
In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. Intel has worked directly with these two governmental agencies to define the new requirements. This Intel Desktop Board meets the Category A requirements.

Output Voltage Current

3.3 V 0.51 A 5V 7.75 A 12 V1 0.52 A 12 V2 0.32 A -12 V 0.018 A 5 VSB 0.3 A
Fan Header Current Capability
The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 22 lists the current capability of the fan headers. Table 22. Fan Header Current Capability

Fan Header

GMCH fan Rear chassis fan
Maximum Available Current

2.0 A 1.5 A

Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for the one add-in board. The total +5 V current draw for the one add-in board must not exceed 2 A.

Thermal Considerations

A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement.
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.
Ensure that the ambient temperature does not exceed the boards maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8.
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 14) can reach a temperature of up to 85 oC in an open chassis.
Figure 14 shows the locations of the localized high temperature zones.

A B C D

Processor voltage regulator area Processor Intel 82945GC GMCH Intel 82801GB ICH7
Figure 14. Localized High Temperature Zones Table 23 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 23. Thermal Considerations for Components

Table 34. Port 80h POST Codes

POST Code

Description of POST Operation Host Processor
Power-on initialization of the host processor (Boot Strap Processor) Host processor cache initialization (including APs) Starting Application processor initialization SMM initialization
21 Initializing a chipset component

Memory

28 Reading SPD from memory DIMMs Detecting presence of memory DIMMs Programming timing parameters in the memory controller and the DIMMs Configuring memory Optimizing memory settings Initializing memory, such as ECC init Testing memory

PCI Bus

57 Enumerating PCI busses Allocating resources to PCI bus Hot Plug PCI controller initialization Reserved for PCI Bus
Resetting USB bus Reserved for USB

ATA/ATAPI/SATA

5A 5B Resetting PATA/SATA bus and all devices Reserved for ATA
5C 5D Resetting SMBus Reserved for SMBus

Local Console

72 Resetting the VGA controller Disabling the VGA controller Enabling the VGA controller

Remote Console

7A Resetting the console controller Disabling the console controller Enabling the console controller
Table 34. Port 80h POST Codes (continued)
Description of POST Operation Keyboard (PS/2 or USB)
Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only)

Mouse (PS/2 or USB)

9A 9B Resetting mouse Disabling mouse Detecting presence of mouse Enabling mouse

Fixed Media

B0 B1 B2 B3 Resetting fixed media Disabling fixed media Detecting presence of a fixed media (IDE hard drive detection etc.) Enabling/configuring a fixed media

Removable Media

B8 B9 BA BC Resetting removable media Disabling removable media Detecting presence of a removable media (IDE, CD-ROM detection, etc.) Enabling/configuring a removable media
Dy Trying boot selection y (y=0 to 15)

PEI Core

E0 E2 E1, E3 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN EFI_SW_PEI_PC_HANDOFF_TO_NEXT) Permanent memory found Reserved for PEI/PEIMs

DXE Core

E4 E5 E6 Entered DXE phase Started dispatching drivers Started connecting drivers

E7 E8 E9 EB

Description of POST Operation
DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot

F4 F5 F8 F9 FA

Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called EFI runtime service ResetSystem ( ) has been called PEIMs/Recovery

This product follows the provisions of the European Directives 2004/108/EC and 2006/95/EC. etina Tento vrobek odpovd poadavkm evropskch smrnic 2004/108/EC a 2006/95/EC. Dansk Dette produkt er i overensstemmelse med det europiske direktiv 2004/108/EC & 2006/95/EC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC & 2006/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC kehtestatud nuetele. Suomi Tm tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC mryksi. Franais Ce produit est conforme aux exigences de la Directive Europenne 2004/108/EC & 2006/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie 2004/108/EC & 2006/95/EC. 2004/108/EC 2006/95/EC. Magyar E termk megfelel a 2004/108/EC s 2006/95/EC Eurpai Irnyelv elrsainak. Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer 2004/108/EC & 2006/95/EC. Italiano Questo prodotto conforme alla Direttiva Europea 2004/108/EC & 2006/95/EC. Latvieu is produkts atbilst Eiropas Direktvu 2004/108/EC un 2006/95/EC noteikumiem. Lietuvi is produktas atitinka Europos direktyv 2004/108/EC ir 2006/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC u 2006/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC & 2006/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Europia 2004/108/EC & 2006/95/EC.
Espaol Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv 2004/108/EC a 2006/95/EC. Slovenina Izdelek je skladen z dolobami evropskih direktiv 2004/108/EC in 2006/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC & 2006/95/EC. Trke Bu rn, Avrupa Birliinin 2004/108/EC ve 2006/95/EC ynergelerine uyar.
Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1

Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

Russian , Intel Intel (Product Recycling Program) Intel . , - http://www.intel.com/intel/other/ehs/product_ecology , , , , . Trke Intel, evre sorumluluuna bamllnn bir paras olarak, perakende tketicilerin Intel markal kullanlm rnlerini belirlenmi merkezlere iade edip uygun ekilde geri dntrmesini amalayan Intel rnleri Geri Dnm Programn uygulamaya koymutur. Bu programn rn kapsam, rn iade merkezleri, nakliye talimatlar, kaytlar ve artlar v.s dahil btn ayrntlarn grenmek iin ltfen http://www.intel.com/intel/other/ehs/product_ecology Web sayfasna gidin.

5.1.3.3

Lead Free Desktop Board
This Desktop Board is a European Union Restriction of Hazardous Substances (EU RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six materials. One of the six restricted materials is lead. This Desktop Board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability. This Desktop Board is referred to as Lead-free second level interconnect. The board substrate and the solder connections from the board to the components (second-level connections) are all lead free. China bans the same substances and has the same limits as EU RoHS; however it requires different product marking and controlled substance information. The required mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as the number of years for which controlled listed substances will not leak or chemically deteriorate while in the product. Table 37 shows the various forms of the Lead-Free 2nd Level Interconnect mark as it appears on the board and accompanying collateral.
Table 37. Lead-Free Board Markings
Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm).

EMC Regulations

Desktop Board D945GCLF complies with the EMC regulations stated in Table 38 when correctly installed in a compatible host system. Table 38. EMC Regulations

S. Korea MIC (Ministry of Information and Communication) mark. Includes adjacent MIC certification number: CPU- D945GCLF (B) Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturers recognition mark. Consists of a unique UL recognized manufacturers logo, along with a flammability rating (solder side). China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years. V-0
Battery Disposal Information
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

PRECAUTION

Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des piles usages doit respecter les rglementations locales en vigueur en matire de protection de l'environnement.

FORHOLDSREGEL

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i overensstemmelse med gldende miljlovgivning.
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier br kastes i henhold til gjeldende miljlovgivning.

VIKTIGT!

Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljvrdsbestmmelserna.
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten mukaisesti.

VORSICHT

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

AVVERTIMENTO

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

PRECAUCIN

Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

WAARSCHUWING

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

Intel Desktop Board D945GCLF

Specification Update

July 2008 Order Number: E47517-002US
The Intel Desktop Board D945GCLF may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update.

Revision History

Revision
This document is the first Specification Update for the Board D945GCLF Intel Desktop

July 2008

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Intel Desktop Board D945GCLF Specification Update

Contents

Specfication Update for the Intel Desktop Board D945GCLF. 4
Terminology.... 5 General Information... 5 Summary of Changes... 6 Documentation Changes... 7 2.5.1 Power Supply Considerations.. 7
Specfication Update for the Intel Desktop Board D945GCLF
This document is an update to the specifications contained in the Intel Desktop Board D945GCLF Technical Product Specification (Order Number E35968). It is intended for hardware system manufacturers and software developers of applications, operating systems, or tools. It will contain Specification Changes, Errata, Specification Clarifications, and Documentation Changes. For specification updates concerning the Intel processor that apply to this desktop board, refer to the following: Intel Atom Processor 200 Series Specification Update (Order Number 319978) Unless otherwise noted in this document, it should be assumed that any processor errata for a given stepping are applicable to the Altered Assembly (AA) revision(s) associated with that stepping. Refer to the Intel 945 Express Chipset Family Specification Update (Order Number 307503) for specification updates concerning the 82945GC GMCH Controller and that may apply to the desktop board D945GCLF. Unless otherwise noted in this document, it should be assumed that any MCH errata for a given stepping are applicable to the Altered Assembly (AA) revision(s) associated with that stepping. Refer to the Intel IO Controller Hub7 (ICH7) Family Specification Update (Order Number 307014) for specification updates concerning the 82801GB I/O Controller Hub and that may apply to the desktop board D945GCLF. Unless otherwise noted in this document, it should be assumed that any ICH7 errata for a given stepping are applicable to the Altered Assembly (AA) revision(s) associated with that stepping.

Terminology

Specification Changes are modifications to the current published specifications. These changes will be incorporated in the next release of the specifications. Errata are design defects or errors. Characterized errata may cause the desktop board behavior to deviate from published specifications. Hardware and software designed to be used with any given Altered Assembly (AA) and BIOS revision level must assume that all errata documented for that AA and BIOS revision level are present on all desktop boards. Specification Clarifications describe a specification in greater detail or further highlight a specifications impact to a complex design situation. These clarifications will be incorporated in the next release of the specifications. Documentation Changes include typos, errors, or omissions from the current published specifications. These changes will be incorporated in the next release of the specifications.

General Information

Basic Desktop Board D945GCLF Identification Information
AA Revision BIOS Revision Notes 1,2 1,2 1,2 1,2 1,2 1,2 1,2 1,2
E27042-301 E27044-303 E27042-302 E27044-304 E27042-303 E27044-305 E27042-304 E27044-306
LF94510J.86A.0038 LF94510J.86A.0038 LF94510J.86A.0038 LF94510J.86A.0038 LF94510J.86A.0038 LF94510J.86A.0038 LF94510J.86A.0038 LF94510J.86A.0038
Notes: 1. 2. The AA number is found on a small label on the component side of the board. The 945 Chipset kit used on this AA revision consists of two components as follows:

Device

82945GC 82801GB

Stepping

S-Spec Numbers

SLA9C SL8FX

Summary of Changes
The following table indicates the Specification Changes, Errata, Specification Clarifications, or Documentation Changes that apply to the Intel Desktop Board D945GCLF. Intel intends to fix some of the errata in a future revision of the desktop board, and to account for the other outstanding issues through documentation or specification changes as noted. The following notations are used in the table:

Doc: Plan Fix: Fixed: No Fix: Shaded: Document change or update that will be implemented. This erratum may be fixed in a future revision of the desktop board, driver, or BIOS. This erratum has been previously fixed. There are no plans to fix this erratum. This erratum is either new or modified from the previous version of the document.

Documentation Changes

Correction of a Table reference number in Section 2.5.1 of the Technical Product Specification

Errata

There are no characterized erratum for this product
Changes to the feature description in the board technical product specification. Typically the customer does not have to do anything to achieve proper device functionality as a result of the change. 1. Correction of a Table reference number in Section 2.5.1 of the Technical Specification.
2.5.1 Power Supply Considerations

CAUTION

The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor specification. The potential relation between 3.3 VDC and +5 VDC power rails The current capability of the +5 VSB line All timing parameters All voltage tolerances For example, for a system consisting of a D945GCLF board (with integrated Intel Atom processor at 4 W), 2 GB DDR2 RAM, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is 75 W. Table 21 lists the recommended power supply current values. Table 21. Recommended Power Supply Current Values

Output Voltage Current

3.3 V 0.51 A 5V 7.75 A 12 V1 0.52 A 12 V2 0.32 A -12 V 0.018 A 5 VSB 0.3 A